An automatic chip mounting adsorption device for power board processing

Abstract

This utility model relates to the field of power board processing technology and discloses an automatic chip-mounting adsorption device for power board processing. It includes a base, an electronic component storage box on the front side of the base surface, a perforated adsorption worktable fixedly embedded in the inner side of the base, a power board body on the surface of the perforated adsorption worktable, an adjustment mechanism on the outer side of the base, and an adsorption mechanism at the front end of the adjustment mechanism. This novel solution uses a retainer sleeved on the outside of a flexible suction nozzle. When negative pressure is released, an electric push rod effectively drives the retainer and the retainer to descend, thereby forming a gentle and precise auxiliary detachment force on the micro-components adsorbed by the flexible suction nozzle. This avoids the situation where micro-components cannot detach due to insufficient gravity or adhesive friction between the micro-components and the flexible suction nozzle, improving chip-mounting efficiency. Pulling the retainer rod effectively detaches the end of the retainer rod from the retainer, allowing for quick release of the restriction between the retainer and the retainer, facilitating maintenance and replacement of the retainer.

Description

Technical Field

[0001] This utility model belongs to the field of power board processing technology, specifically an automatic patch adsorption device for power board processing. Background Technology

[0002] As the "energy center" of electronic devices, power boards need to integrate a large number of micro-components, which are densely packed and vary greatly in size. Traditional manual placement cannot meet the requirements of accuracy and efficiency. Therefore, an automated surface mount device is needed to accurately pick up, transfer, and mount the micro-electronic components onto the pads of the power board.

[0003] Existing power board fabrication surface mount adsorption devices are affected by the flexible nozzle and the ultra-light weight of the micro-components themselves when adsorbing micro-components. When the negative pressure is interrupted, the micro-components are not easy to detach from the flexible nozzle, thus reducing the placement efficiency. To address this, we propose an automatic surface mount adsorption device for power board fabrication. Utility Model Content

[0004] In view of the above situation and to overcome the defects of the prior art, this utility model provides an automatic chip adsorption device for power board processing. It effectively solves the problem that the existing power board processing chip adsorption device is affected by the flexible nozzle and the ultra-light weight of the micro-components when adsorbing micro-components. When the negative pressure is interrupted, the micro-components are not easy to detach from the flexible nozzle, thus reducing the chip placement efficiency.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an automatic patch adsorption device for power board processing, comprising a base, an electronic component storage box on the front side of the base surface, a hollow adsorption worktable fixedly fitted inside the base, a power board body on the surface of the hollow adsorption worktable, an adjustment mechanism on the outside of the base, an adsorption mechanism at the front end of the adjustment mechanism, the adsorption mechanism comprising a negative pressure generating component, a flexible suction nozzle screwed to the bottom outside of the negative pressure generating component, a support frame fitted on the outside of the flexible suction nozzle, a set of limiting frames symmetrically fitted on the outer sides of both ends of the support frame, a set of electric push rods symmetrically provided on the top of the set of limiting frames, and a set of cylindrical frames symmetrically fixed on the front surface of the set of limiting frames.

[0006] Preferably, the adsorption mechanism further includes a limiting rod, which passes through a set of cylindrical frames. A set of limiting ring plates are symmetrically fixedly sleeved on the surface of the limiting rod, and a spring is provided on one side of the limiting ring plates.

[0007] Preferably, the bottom of the flexible nozzle, the bottom of the abutment, and the bottom of the limiting frame are flush, and the two ends of the abutment are matched and engaged inside the limiting frame.

[0008] Preferably, the support frame forms a lifting structure through a limiting frame, an electric push rod, and an adjustment mechanism, and the limiting frame is connected to the cylindrical frame.

[0009] Preferably, the limiting rod is U-shaped, and the end of the limiting rod passes through the inside of the abutment and the limiting frame.

[0010] Preferably, the limiting rod is formed into an elastic structure by a limiting ring plate, a spring, and a cylindrical frame, and the outer wall of the limiting ring plate is in contact with the inner wall of the cylindrical frame.

[0011] Preferably, the adjustment mechanism includes a bracket 1, a motor 1 is provided on one side of the bracket 1, a lead screw 1 is connected to the movable end of the motor 1, a set of guide slide rods symmetrically provided above and below the lead screw 1, a bracket 2 is sleeved on the outside of the lead screw 1 and the guide slide rods 1, a motor 2 is provided on the top of the bracket 2, a lead screw 2 is connected to the movable end of the motor 2, a set of guide slide rods symmetrically provided on both sides of the lead screw 2, a bracket 3 is sleeved on the outside of the lead screw 2 and the guide slide rods 2, a motor 3 is provided on the rear side of the base, a lead screw 3 is connected to the movable end of the motor 3, a set of guide slide rods symmetrically provided on both sides of the lead screw 3, and the bracket is sleeved on the outside of the lead screw 3 and the guide slide rods 3.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] 1. By installing a retainer on the outside of the flexible nozzle, when the negative pressure is released, the electric push rod can effectively drive the limiting frame and the retainer to descend, thereby forming a gentle and precise auxiliary detachment force for the micro-components adsorbed by the flexible nozzle. This avoids the situation where the micro-components cannot detach due to insufficient gravity or adhesive friction between them and the flexible nozzle, thus improving the patching efficiency. By pulling the limiting rod outward, the end of the limiting rod can be effectively disengaged from the limiting frame. At this time, the restriction between the retainer and the limiting frame can be quickly released, facilitating the maintenance and replacement of the retainer. Based on pulling the limiting rod outward, the maintained or replaced retainer can be re-clamped into a set of limiting frames. After releasing the limiting rod, the end of the limiting rod will quickly pop out and effectively clamp into the retainer and the limiting frame due to the spring rebound force, realizing the rapid installation of the retainer.

[0014] 2. By driving the lead screw three to rotate via motor three, and with the limiting action of guide slide three, bracket one can move smoothly forward and backward along the base. Motor one on bracket one drives lead screw one, which, in conjunction with guide slide one, can drive bracket two to achieve precise left and right adjustments. Meanwhile, motor two at the top of bracket two, through the cooperation of lead screw two and guide slide two, can drive bracket three to achieve height control in the up and down direction. Together, they form a complete three-axis adjustment system, allowing the adsorption mechanism to flexibly cover any mounting position of the power board body on the hollow adsorption workbench. It can easily adapt to the processing needs of power board bodies of different sizes and component layouts, without the need for frequent adjustments to the fixed position of the power board body, greatly improving production flexibility. Attached Figure Description

[0015] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0016] In the attached diagram:

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the overall structure of the present invention from another perspective;

[0019] Figure 3 This is a partial three-dimensional structural diagram of the present invention;

[0020] Figure 4 This is a partial three-dimensional structural schematic diagram of the present invention from another perspective;

[0021] Figure 5 This is a partial cross-sectional structural diagram of the present invention.

[0022] In the diagram: 1. Base; 2. Electronic component storage box; 3. Hollowed-out adsorption worktable; 4. Power board body; 5. Adjustment mechanism; 501. Bracket 1; 502. Motor 1; 503. Lead screw 1; 504. Guide slide rod 1; 505. Bracket 2; 506. Motor 2; 507. Lead screw 2; 508. Guide slide rod 2; 509. Bracket 3; 510. Motor 3; 511. Lead screw 3; 512. Guide slide rod 3; 6. Adsorption mechanism; 601. Negative pressure generating component; 602. Flexible suction nozzle; 603. Support frame; 604. Limiting frame; 605. Electric push rod; 606. Cylindrical frame; 607. Limiting rod; 608. Limiting ring plate; 609. Spring. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-5An automatic chip attaching and adsorption device for power board processing includes a base 1, an electronic component storage box 2 on the front side of the base 1, a perforated adsorption worktable 3 fixedly fitted inside the base 1, a power board body 4 on the surface of the perforated adsorption worktable 3, an adjustment mechanism 5 on the outside of the base 1, and an adsorption mechanism 6 at the front end of the adjustment mechanism 5. The adsorption mechanism 6 includes a negative pressure generating component 601, a flexible suction nozzle 602 screwed to the bottom outer side of the negative pressure generating component 601, a support frame 603 fitted around the flexible suction nozzle 602, and a set of limiting frames 604 symmetrically fitted around both ends of the support frame 603. The bottom of the flexible suction nozzle 602 and the support frame 604 are connected to the support frame 603. The bottom of the 03 and the bottom of the limiting frame 604 are flush. The two ends of the abutment 603 are matched and engaged inside the limiting frame 604. A set of electric push rods 605 are symmetrically provided on the top of a set of limiting frames 604. A set of cylindrical frames 606 are symmetrically fixed on the front surface of a set of limiting frames 604. The abutment 603 forms a lifting structure with the limiting frame 604, the electric push rods 605 and the adjusting mechanism 5. The limiting frame 604 and the cylindrical frame 606 are connected. The adsorption mechanism 6 also includes a limiting rod 607. The limiting rod 607 passes through the inside of a set of cylindrical frames 606. The limiting rod 607 is U-shaped. The end of the limiting rod 607 passes through the abutment 603 and the limiting frame 604. Inside, a set of limiting ring plates 608 are symmetrically fixedly sleeved on the surface of the limiting rod 607. A spring 609 is provided on one side of the limiting ring plate 608. The limiting rod 607 forms an elastic structure with the cylinder frame 606 through the limiting ring plate 608, the spring 609, and the limiting rod 607. The outer wall of the limiting ring plate 608 fits against the inner wall of the cylinder frame 606. By sleeved with a retainer 603 on the outside of the flexible suction nozzle 602, when the negative pressure is released, the electric push rod 605 can effectively drive the limiting frame 604 and the retainer 603 to descend, thereby forming a gentle and precise auxiliary detachment force for the micro-components adsorbed by the flexible suction nozzle 602, avoiding the micro-components from detaching from the flexible suction nozzle 602 due to insufficient gravity. The adhesive friction between 02 cannot be removed, which improves the patching efficiency. By pulling the limiting rod 607, the end of the limiting rod 607 can be effectively disengaged from the limiting frame 604. At this time, the restriction between the abutment 603 and the limiting frame 604 can be quickly released, which facilitates the maintenance and replacement of the abutment 603. Based on pulling the limiting rod 607, the maintained or replaced abutment 603 can be re-clamped into a set of limiting frames 604. Then, the limiting rod 607 is released. Under the influence of the spring 609, the end of the limiting rod 607 quickly pops out and effectively clamps into the abutment 603 and the limiting frame 604, realizing the rapid installation of the abutment 603.

[0025] Adjustment mechanism 5 includes a bracket 501, a motor 502 on one side of bracket 501, a lead screw 503 connected to the movable end of motor 502, a set of guide slides 504 symmetrically arranged above and below lead screw 503, a bracket 505 sleeved on the outside of lead screw 503 and guide slides 504, a motor 506 on the top of bracket 505, a lead screw 507 connected to the movable end of motor 506, a set of guide slides 508 symmetrically arranged on both sides of lead screw 507, a bracket 509 sleeved on the outside of lead screw 507 and guide slides 508, a motor 510 on the rear side of base 1, a lead screw 511 connected to the movable end of motor 510, a set of guide slides 512 symmetrically arranged on both sides of lead screw 511, and bracket 501 sleeved on the outside of lead screw 511 and guide slides 512. The motor 3510 drives the lead screw 3511 to rotate, and with the limit of the guide slide rod 3512, the bracket 1 501 can move smoothly in the front and back direction along the base 1. The motor 1502 on the bracket 1 501 drives the lead screw 1 503, and with the guide slide rod 1 504, the bracket 2 505 can be precisely adjusted in the left and right direction. The motor 2506 at the top of the bracket 2 505, through the cooperation of the lead screw 2507 and the guide slide rod 2508, can drive the bracket 3 509 to achieve height control in the up and down direction. Together, they form a complete three-axis adjustment system, allowing the adsorption mechanism 6 to flexibly cover any mounting position of the power board body 4 on the hollow adsorption worktable 3, easily adapting to the processing needs of power board bodies 4 of different sizes and component layouts, without the need for frequent adjustment of the fixed position of the power board body 4, greatly improving production flexibility.

Claims

1. An automatic chip mounting and adsorption device for power board processing, characterized in that: The device includes a base (1), an electronic component storage box (2) on the front side of the base (1), a hollow adsorption worktable (3) fixedly fitted inside the base (1), a power board body (4) on the surface of the hollow adsorption worktable (3), an adjustment mechanism (5) on the outside of the base (1), an adsorption mechanism (6) at the front end of the adjustment mechanism (5), and a negative pressure generating component (601) including a negative pressure generating component (601), a flexible suction nozzle (602) screwed to the bottom outside of the negative pressure generating component (601), a support frame (603) fitted on the outside of the flexible suction nozzle (602), a set of limiting frames (604) symmetrically fitted on the outer sides of both ends of the support frame (603), a set of electric push rods (605) symmetrically provided on the top of the set of limiting frames (604), and a set of cylindrical frames (606) symmetrically fixed on the front surface of the set of limiting frames (604).

2. The automatic patch adsorbing device for power board processing according to claim 1, characterized in that: The adsorption mechanism (6) further includes a limiting rod (607), which passes through the inside of a set of cylindrical frames (606). A set of limiting ring plates (608) are symmetrically fixedly sleeved on the surface of the limiting rod (607), and a spring (609) is provided on one side of the limiting ring plate (608).

3. The automatic patch adsorbing device for power board processing according to claim 2, characterized in that: The bottom of the flexible nozzle (602), the bottom of the abutment (603), and the bottom of the limiting frame (604) are flush, and the two ends of the abutment (603) are matched and engaged inside the limiting frame (604).

4. The automatic patch adsorbing device for power board processing according to claim 2, characterized in that: The support frame (603) forms a lifting structure through the limiting frame (604), the electric push rod (605) and the adjusting mechanism (5), and the limiting frame (604) is connected to the cylinder frame (606).

5. The automatic patch adsorbing device for power board processing according to claim 2, characterized in that: The limiting rod (607) is U-shaped, and the end of the limiting rod (607) passes through the inside of the abutment (603) and the limiting frame (604).

6. The automatic patch adsorbing device for power board processing according to claim 2, characterized in that: The limiting rod (607) forms an elastic structure with the limiting ring plate (608), the spring (609) and the cylinder frame (606), and the outer wall of the limiting ring plate (608) is in contact with the inner wall of the cylinder frame (606).

7. The automatic patch adsorbing device for power board processing according to claim 2, characterized in that: The adjusting mechanism (5) includes a bracket (501), a motor (502) on one side of the bracket (501), a lead screw (503) connected to the movable end of the motor (502), a set of guide slides (504) symmetrically arranged above and below the lead screw (503), a bracket (505) sleeved on the outside of the lead screw (503) and the guide slides (504), a motor (506) on the top of the bracket (505), and a lead screw (504) connected to the movable end of the motor (506). 07), a set of guide slide rods 2 (508) are symmetrically arranged on both sides of the lead screw 2 (507), and a bracket 3 (509) is sleeved on the outside of the lead screw 2 (507) and the guide slide rod 2 (508). A motor 3 (510) is provided on the rear side of the base (1). The movable end of the motor 3 (510) is connected to the lead screw 3 (511). A set of guide slide rods 3 (512) are symmetrically arranged on both sides of the lead screw 3 (511). The bracket 1 (501) is sleeved on the outside of the lead screw 3 (511) and the guide slide rod 3 (512).

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