bonding equipment and chip mounting equipment

Abstract

This application discloses a bonding apparatus and a chip mounting device. The bonding apparatus includes a base, a bonding component, a driving component, and a control component. The bonding component is movably disposed on the base along a first direction, a second direction, or a third direction, and is used to attach a chip to a circuit board. The first direction, the second direction, and the third direction intersect each other. The driving component is connected to the base and the bonding component, and is used to drive the bonding component to move along the first direction, the second direction, or the third direction. The control component includes a force sensor and a controller. The force sensor is disposed on the bonding component and electrically connected to the controller. The force sensor is used to receive the bonding force signal of the bonding component and transmit the signal to the controller. The controller controls the driving component to operate according to the received signal. Thus, the controller performs feedback adjustment of the driving component based on the signal, thereby realizing closed-loop control of the bonding pressure.

Description

Technical Field

[0001] This application relates to the field of chip mounting technology, and in particular to a bonding device and chip mounting equipment. Background Technology

[0002] In the field of electronic manufacturing technology, the bonding process between chips and circuit boards is a crucial step affecting the quality and performance of electronic products. As electronic products become increasingly miniaturized and high-density, the requirements for chip bonding precision and quality are constantly rising. The pressure applied during the bonding process has a significant impact on the bonding strength and quality between the chip and the circuit board.

[0003] However, in related technologies, bonding devices generally lack real-time monitoring and control of bonding pressure. This can lead to excessive pressure during bonding, which may damage the chip, or insufficient pressure, which may result in weak bonding and affect product yield. Utility Model Content

[0004] This application provides a bonding device and a chip mounting equipment, which can solve at least one of the above-mentioned technical problems.

[0005] In a first aspect, embodiments of this application provide a bonding device, the bonding device comprising:

[0006] Base;

[0007] A bonding assembly is movably disposed on a base along a first direction, a second direction, or a third direction, and the bonding assembly is used to attach a chip to a circuit board, wherein the first direction, the second direction, and the third direction intersect each other;

[0008] A driving component, connected to the base and the bonding component, and used to drive the bonding component to move along a first direction, a second direction, or a third direction; and

[0009] The control component includes a force sensor and a controller. The force sensor is disposed on the bonding component and electrically connected to the controller. The force sensor is used to receive the bonding force signal of the bonding component and transmit the signal to the controller. The controller controls the drive component to work according to the received signal.

[0010] In some embodiments, the bonding assembly includes a bonding head module and a vacuum module. The bonding head module is movably disposed on the base along a first direction, a second direction, or a third direction, and the bonding head module is used to attach the chip to the circuit board. The vacuum module provides vacuum adsorption force for the bonding head module.

[0011] In some embodiments, the driving component includes a first moving module disposed on the base, and an adhesion head module disposed on the first moving module. The first moving module is used to drive the adhesion head module to move along a first direction.

[0012] In some embodiments, the driving assembly further includes a second moving module disposed on the base, and a first moving module disposed on the second moving module. The second moving module is used to drive the bonding head module and the first moving module to move along a second direction.

[0013] In some embodiments, the driving component further includes a third moving module disposed on the base, and a second moving module disposed on the third moving module. The third moving module is used to drive the bonding head module, the first moving module and the second moving module to move in a third direction.

[0014] In some implementations, the first direction is vertical, and the controller controls the first moving module to work based on the received signal.

[0015] In some implementations, the first moving module is a lead screw motor moving module, and the second and third moving modules are linear motor moving modules.

[0016] Secondly, embodiments of this application provide a mounting device, including:

[0017] Casing; and

[0018] The bonding device in any of the above embodiments is disposed inside the housing.

[0019] In some embodiments, the chip mounting equipment further includes an adhesive application device, a clean air supply device, a guide rail feeding device, and a bonding vision device, all of which are housed within a housing.

[0020] In some embodiments, the chip mounting equipment further includes a loading device and a unloading device, which are respectively disposed outside the housing and on opposite sides of the housing.

[0021] The bonding apparatus and chip mounting equipment provided in this application include a base, a bonding component, a driving component, and a control component. The bonding component is movably disposed on the base along a first direction, a second direction, or a third direction, and is used to attach the chip to the circuit board. The first direction, the second direction, and the third direction intersect each other. The driving component is connected to the base and the bonding component, and is used to drive the bonding component to move along the first direction, the second direction, or the third direction. The control component includes a force sensor and a controller. The force sensor is disposed on the bonding component and electrically connected to the controller. The force sensor is used to receive the bonding force signal of the bonding component and transmit the signal to the controller. The controller controls the driving component to work according to the received signal. Thus, by setting a force sensor on the bonding component, the bonding force signal applied between the chip and the circuit board during the bonding process can be collected in real time. The controller adjusts the driving component based on this signal, thereby achieving closed-loop control of the bonding pressure. This design avoids chip damage due to excessive pressure or weak bonding due to insufficient pressure, significantly improving the stability and reliability of the bonding process. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the bonding device provided in an embodiment of this application.

[0024] Figure 2 for Figure 1 A schematic diagram of the bonding device from another perspective.

[0025] Figure 3 for Figure 1 A schematic diagram of the bonding device from another perspective.

[0026] Figure 4 This is a schematic diagram of the chip mounting equipment provided in an embodiment of this application.

[0027] Figure 5 for Figure 4 A schematic diagram of part of the structure of a chip mounting equipment.

[0028] Explanation of icon numbers:

[0029] 10. Bonding device; 20. Chip mounting equipment; 100. Base; 200. Bonding assembly; 210. Bonding head module; 220. Vacuum module; 300. Drive assembly; 310. First moving module; 320. Second moving module; 330. Third moving module; 400. Housing; 510. Adhesive application device; 520. Clean air supply device; 530. Guide rail feeding device; 540. Bonding vision device; 550. Loading device; 560. Unloading device.

[0030] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0032] Where the following description relates to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0033] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, in the description of this application, unless otherwise stated, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0035] In the field of electronic manufacturing technology, the bonding process between chips and circuit boards is a crucial step affecting the quality and performance of electronic products. As electronic products become increasingly miniaturized and high-density, the requirements for chip bonding precision and quality are constantly rising. The pressure applied during the bonding process has a significant impact on the bonding strength and quality between the chip and the circuit board.

[0036] However, in related technologies, bonding devices generally lack real-time monitoring and control of bonding pressure. This can lead to excessive pressure during bonding, which may damage the chip, or insufficient pressure, which may result in weak bonding and affect product yield.

[0037] In view of this, please refer to Figures 1 to 3 This application provides a bonding device 10, which includes a base 100, a bonding component 200, a driving component 300, and a control component.

[0038] The base 100 serves as the supporting structure for the entire device, providing an installation foundation for the bonding component 200 and the drive component 300, and ensuring the stability and rigidity of the device during operation.

[0039] The bonding component 200 is movably disposed on the base 100 along a first direction Z, a second direction X, or a third direction Y, and is used to attach the chip to the circuit board. The first direction Z, the second direction X, and the third direction Y intersect each other, thereby achieving precise positioning of the chip in three-dimensional space. The bonding component 200 is used to grasp the chip and move it to a designated position on the circuit board along a predetermined trajectory to complete the bonding operation.

[0040] The driving component 300 is connected to the base 100 and the bonding component 200, and is used to drive the bonding component 200 to move along a first direction Z, a second direction X, or a third direction Y. The driving component 300 includes multiple driving units, such as servo motors or linear motors, each corresponding to motion control in different directions. The driving component 300 can achieve high-precision displacement adjustment according to control signals, ensuring accurate positioning of the chip during the bonding process.

[0041] The control component includes a force sensor and a controller. The force sensor is disposed in the bonding assembly 200 and electrically connected to the controller. The force sensor receives the bonding force signal from the bonding assembly 200 and transmits the signal to the controller. The controller controls the drive assembly 300 to operate based on the received signal. The force sensor is disposed inside the bonding assembly 200 or in direct contact with it, and is used to collect the bonding force signal applied between the chip and the circuit board during the bonding process in real time. This signal is transmitted to the controller in the form of an electrical signal. The controller receives the signal from the force sensor and performs feedback control on the drive assembly 300 according to a preset pressure range. For example, when the bonding force exceeds the set upper limit, the controller can automatically reduce the output force of the drive assembly 300 to prevent the chip from being damaged due to excessive force; conversely, when the bonding force is insufficient, the controller can adjust the drive assembly 300 to increase the bonding force and ensure the bonding strength between the chip and the circuit board.

[0042] Thus, by installing a force sensor on the bonding component 200, the bonding force signal applied between the chip and the circuit board during the bonding process can be collected in real time. The controller adjusts the drive component 300 based on this signal, thereby achieving closed-loop control of the bonding pressure. This design avoids chip damage due to excessive pressure or weak bonding due to insufficient pressure, significantly improving the stability and reliability of the bonding process.

[0043] In some embodiments, the bonding assembly 200 includes a bonding head module 210 and a vacuum module 220. The bonding head module 210 is movably disposed on the base 100 along a first direction Z, a second direction X, or a third direction Y, for precisely attaching the chip to a designated location on the circuit board. The bonding head module 210 has a contact end face adapted to the chip, enabling stable gripping and release of the chip. The movement of the bonding head module 210 is driven by the driving assembly 300, allowing for precise displacement in the first direction Z, the second direction X, or the third direction Y to adapt to the requirements of different bonding paths and bonding positions.

[0044] Vacuum module 220 is connected to bonding head module 210 and provides vacuum adsorption force to bonding head module 210. Vacuum module 220 includes a vacuum generator, a gas path control system, and connecting pipes. By creating negative pressure at the adsorption end face of bonding head module 210, it achieves adsorption and fixation of the chip. During chip handling and bonding, vacuum adsorption force ensures that the chip is stably attached to bonding head module 210, preventing displacement or detachment during movement, thereby improving the stability and reliability of the bonding process.

[0045] The vacuum module 220 is also equipped with a pressure regulating unit, which can adjust the adsorption force according to the size, material, and weight of the chip to avoid damage to the chip surface due to excessive adsorption force or chip gripping failure due to insufficient adsorption force. A sealing structure is provided between the vacuum module 220 and the bonding head module 210 to ensure the stability of the gas path system and improve adsorption efficiency.

[0046] By combining the bonding head module 210 with the vacuum module 220, the bonding assembly 200 not only possesses high-precision spatial movement capabilities but also reliable chip adsorption and release functions, enabling precise positioning and stable operation during chip bonding. This structural design effectively improves the bonding accuracy, operational flexibility, and automation level of the bonding device 10, making it suitable for various chip and circuit board bonding process requirements.

[0047] Understandably, the first direction Z, the second direction X, and the third direction Y correspond to different coordinate axes in three-dimensional space to achieve multi-degree-of-freedom movement and precise positioning of the fitting head module 210 in space. Specifically, the first direction Z can be the Z-axis direction, and the drive component 300 is used to realize the vertical movement of the fitting head module 210; the second direction X can be the X-axis direction, and the drive component 300 is used to realize the lateral movement of the fitting head module 210 in the horizontal plane; the third direction Y can be the Y-axis direction, and the drive component 300 is used to realize the longitudinal displacement of the fitting head module 210 in the horizontal plane. The first direction Z, the second direction X, and the third direction Y can be perpendicular to each other or approximately perpendicular to each other.

[0048] In some embodiments, the drive assembly 300 includes a first moving module 310. The first moving module 310 is disposed on the base 100 and connected to the bonding head module 210 for driving the bonding head module 210 to move along a first direction Z.

[0049] The first moving module 310 includes a guide structure, a drive unit, and a transmission assembly. The guide structure consists of a guide rail and a slider, ensuring smooth and linear movement of the bonding head module 210 in the first direction Z. The drive unit is preferably a servo motor or a stepper motor, capable of providing high-precision, programmable motion control. The transmission assembly includes transmission elements such as a lead screw, synchronous belt, or linear motor, efficiently transmitting the power of the drive unit to the bonding head module 210, achieving precise displacement of it in the first direction Z.

[0050] With the first moving module 310 in place, the bonding head module 210 can move with high precision along the first direction Z under the command of the controller, thereby accurately transporting the chip to the designated bonding position on the circuit board. The motion accuracy of this moving module can reach the micrometer level, meeting the requirements of high-density, high-precision electronic packaging processes.

[0051] In addition, the first moving module 310 is also equipped with a position detection device, such as a grating ruler or encoder, to provide real-time feedback of the position information of the bonding head module 210 in the first direction Z to the controller, forming a closed-loop control, and further improving the positioning accuracy and stability of the bonding process.

[0052] In some embodiments, the drive assembly 300 further includes a second moving module 320. The second moving module 320 is disposed on the base 100, and the first moving module 310 is disposed on the second moving module 320, forming a multi-level linkage structure. The second moving module 320 is used to drive the bonding head module 210 and the first moving module 310 to move together along the second direction X.

[0053] The second moving module 320 includes a guide assembly, a drive unit, and a transmission mechanism. The guide assembly consists of a high-precision linear guide rail and a slider, ensuring smooth and deviation-free movement throughout the entire process. The drive unit is preferably a servo motor or a linear motor, providing stable and controllable power output. The transmission mechanism includes a ball screw, a synchronous pulley, or a linear drive module, transmitting the power from the drive unit to the moving platform to achieve high-precision displacement control in the second direction X.

[0054] By configuring the second moving module 320, the bonding head module 210 can not only move precisely in the first direction Z, but also make synchronous adjustments in the second direction X, thereby enabling the chip to be bonded at any position in the planar space. This structural design greatly improves the flexibility and bonding range of the bonding device 10, making it suitable for bonding circuit boards of different sizes and layouts.

[0055] In addition, the second moving module 320 is also equipped with a position feedback device, such as a high-resolution optical encoder or rotary encoder, to collect the position information of the moving platform in the second direction X in real time and feed this information back to the controller to achieve closed-loop control. This closed-loop control system can effectively improve the positioning accuracy of the bonding head module 210 in the two-dimensional plane, ensuring the accuracy and consistency of the chip bonding position.

[0056] In some embodiments, the drive assembly 300 further includes a third moving module 330. The third moving module 330 is disposed on the base 100 and serves as the support and driving basis for the first moving module 310 and the second moving module 320. The second moving module 320 is disposed on the third moving module 330 and achieves overall displacement under the drive of the third moving module 330. The third moving module 330 is used to drive the bonding head module 210, the first moving module 310, and the second moving module 320 to move as a whole along the third direction Y.

[0057] The third moving module 330 includes a guide structure, a drive device, and a transmission mechanism. The guide structure consists of a high-rigidity linear guide rail and a slider, ensuring smooth and wobbly movement of the bonding assembly 200 in the vertical direction. The drive device is preferably a servo motor or a pneumatic / electric composite drive mechanism, capable of outputting precise power according to control signals to meet the adjustment requirements of different bonding heights. The transmission mechanism includes components such as ball screws, linear modules, or electric push rods, efficiently transmitting the power of the drive device to the moving platform to achieve stable lifting and lowering of the bonding head module 210 in the third direction Y.

[0058] By configuring the third moving module 330, the bonding head module 210 can be precisely adjusted in the vertical direction under the control of the controller, thereby achieving contact pressure control and bonding action between the chip and the circuit board. The motion accuracy of this moving module can reach the micrometer level, ensuring the consistency of contact between the chip and the circuit board during the bonding process and avoiding poor bonding or chip damage due to height errors.

[0059] In addition, the third moving module 330 is equipped with a position detection and feedback device, such as a linear grating ruler or a high-precision encoder, to collect the position information of the bonding head module 210 in the third direction Y in real time, and feed this information back to the controller to realize closed-loop control. This closed-loop control system further improves the height control accuracy and response speed in the bonding process, and enhances the intelligence and automation level of the bonding device 10.

[0060] In some implementations, the first direction Z is the vertical direction, that is, the bonding head module 210 is displaced in the vertical direction by the first moving module 310, so as to realize the precise control of the contact pressure between the chip and the circuit board by the bonding head module 210.

[0061] The controller uses the bonding force signal collected by the force sensor to determine in real time whether the pressure applied during the bonding process is within a preset range, and issues control commands to the first moving module 310 based on the determination result. When the bonding force exceeds the set upper limit, the controller controls the first moving module 310 to reduce the downward pressure of the bonding head module 210 to prevent the chip from cracking or deforming due to excessive force; when the bonding force is insufficient, the controller controls the first moving module 310 to increase the downward stroke to enhance the bonding effect and ensure a stable and reliable connection between the chip and the circuit board.

[0062] The first moving module 310 includes components such as a servo motor, a ball screw, and a linear guide, and can achieve high-precision vertical displacement according to the controller's instructions. The servo motor serves as the drive unit, with fast response speed and high control precision. The ball screw is responsible for converting rotational motion into linear motion, and the linear guide ensures that the fitting head module 210 moves smoothly and without deviation in the vertical direction.

[0063] By setting the first direction Z to the vertical direction and combining it with the feedback control mechanism of the force sensor and controller, the bonding device 10 achieves dynamic adjustment and closed-loop control of the bonding pressure. This structural design not only improves the intelligence level of the bonding process, but also effectively avoids problems such as chip damage or poor bonding caused by improper pressure control, significantly improving the stability of the bonding process and product yield.

[0064] In some embodiments, the first moving module 310 is a lead screw motor moving module, and the second moving module 320 and the third moving module 330 are linear motor moving modules. This structural design employs different types of driving methods according to the motion functions undertaken by each moving module in three-dimensional space, in order to achieve optimal matching of performance and accuracy.

[0065] Specifically, the first moving module 310 adopts a ball screw motor structure, including a servo motor, a ball screw, and a linear guide assembly. This structure has high positioning accuracy and load capacity, and is suitable for vertical movements requiring precise control of bonding pressure. Under the control of the controller, the ball screw motor moving module can fine-tune the downward displacement of the bonding head module 210 based on the bonding force signal fed back by the force sensor, thereby achieving closed-loop control of the bonding pressure. This structure operates stably and has strong resistance to off-center loads, making it particularly suitable for bonding operations with high pressure control requirements.

[0066] The second moving module 320 and the third moving module 330 employ linear motor moving modules to achieve high-speed, high-precision positioning of the bonding head module 210 in the horizontal direction. The linear motor moving module consists of a stator, a mover, a magnetic scale, and a drive controller. It features fast response, high acceleration, and contactless transmission, enabling rapid movement and precise positioning of the bonding head module 210 in the planar direction, significantly improving bonding efficiency and motion accuracy.

[0067] The second moving module 320 is mounted on the third moving module 330, which is mounted on the base 100, forming a multi-level linkage structure. Through the coordinated operation of the three moving modules, the bonding head module 210 can move independently in the X, Y, and Z directions, achieving precise positioning and bonding of the chip in three-dimensional space.

[0068] By adopting the above-mentioned structural combination, not only is the advantage of the lead screw motor in pressure control fully utilized, but the performance advantage of the linear motor in high-speed and high-precision positioning is also taken advantage of, which significantly improves the bonding device 10 in terms of bonding accuracy, response speed and control stability.

[0069] Please see Figures 1 to 5 This application also provides a chip mounting device 20, which includes a housing 400 and a bonding device 10, the bonding device 10 being disposed within the housing 400. The housing 400 provides structural support and external protection for the entire device, and has an internal mounting cavity for accommodating the bonding device 10 and related functional components.

[0070] In some embodiments, the chip mounting equipment 20 further includes an adhesive application device 510, a clean air supply device 520, a guide rail feeding device 530, and a bonding vision device 540. All of these devices are located inside the housing 400 or in a designated area of ​​the housing 400, and work in conjunction with the bonding device 10 to form a complete chip mounting system, achieving fully automated operation from chip loading, adhesive application, positioning to bonding.

[0071] The adhesive application device 510 is located at a designated station inside the housing 400 and is used to apply adhesive material to the bonding area of ​​the chip or circuit board before chip bonding. The adhesive application device 510 includes an adhesive tray, an adhesive application head assembly, and a drive mechanism. It can control the amount of adhesive applied by the adhesive application head and the application path according to a preset program to ensure uniform and controllable adhesive application and avoid affecting the bonding quality and subsequent packaging reliability due to excessive or insufficient adhesive.

[0072] The clean air supply device 520 is located inside the housing 400 at the top or side to provide clean airflow to critical operating areas within the equipment. The clean air supply device 520 includes a high-efficiency filter, a fan system, and an air duct structure, continuously purifying the air inside the equipment and preventing dust particles from contaminating chips and circuit boards. This improves the cleanliness of the mounting process and increases product yield, making it particularly suitable for high-precision electronic manufacturing processes with stringent cleanliness requirements.

[0073] The guide rail feeding device 530 is located in the bottom or middle area inside the housing 400 and is used to carry and transport the circuit board to be mounted. The guide rail feeding device 530 includes a pair of parallel guide rails, a support platform, and a drive mechanism. The drive mechanism can be a servo motor or a pneumatic component, which can drive the support platform to move precisely along the guide rail direction, transporting the circuit board to the bonding station below the bonding device 10. The guide rail feeding device 530 is also equipped with a positioning and clamping mechanism to fix the circuit board during the bonding process, preventing it from shifting during bonding, thereby improving bonding accuracy and stability.

[0074] A bonding vision device 540 is disposed inside the housing 400 or near the bonding device 10, and is used for visual positioning and position correction of the chip and the circuit board. The bonding vision device 540 includes an industrial camera, an illumination source, and an image processing module, which can acquire image information of the chip and the circuit board before bonding and transmit the image data to the control system. The control system corrects the movement path of the bonding device 10 in real time based on the image data, ensuring that the chip can be accurately bonded to the designated position on the circuit board, significantly improving bonding accuracy and consistency.

[0075] The aforementioned devices and bonding device 10 are organically integrated within the housing 400, and coordinated through a unified control system to achieve fully automated operation of the chip mounting process. This structural design not only enhances the functional integrity and intelligence level of the equipment, but also effectively improves mounting efficiency, mounting accuracy, and product yield, meeting the comprehensive needs of modern electronic manufacturing for high-precision, high-efficiency, and high-cleanliness mounting equipment.

[0076] In some embodiments, the chip mounting equipment 20 further includes a loading device 550 and a unloading device 560. The loading device 550 and the unloading device 560 are respectively disposed outside the housing 400 and arranged on opposite sides of the housing 400, forming a reasonable material entry and exit layout, which is conducive to realizing continuous and automated operation of the chip mounting process.

[0077] The loading device 550 is located on one side of the housing 400 and is used to transport the chips to be mounted or the trays carrying the chips from the outside to the designated workstation inside the equipment. The loading device 550 includes components such as a tray storage rack, a lifting platform, a picking robot, and a guiding mechanism. The tray storage rack is used to store multiple trays of chips to be mounted. The lifting platform transports the trays to the picking height layer by layer according to instructions. Under the control of the controller, the picking robot accurately grabs the chip and places it below the bonding head module 210 of the bonding device 10 or on the transfer platform, completing the loading action.

[0078] The unloading device 560 is located on the other side of the housing 400, opposite to the loading device 550. It is used to receive circuit boards that have completed the mounting operation or trays carrying mounted chips and transport them outside the equipment. The unloading device 560 includes components such as a carrying platform, a conveyor belt or roller conveyor line, and a stacking mechanism. After the mounted circuit boards are transported to the unloading station by the guide rail feeding device 530, the unloading device 560 automatically transfers them to a designated position, facilitating the connection of subsequent processes or manual removal operations.

[0079] The feeding device 550 and the unloading device 560 are connected by core functional modules such as the guide rail feeding device 530 and the bonding device 10 inside the housing 400 to achieve orderly material flow and form a complete bonding operation process. This layout not only improves the space utilization of the equipment, but also facilitates docking with external automated production lines to achieve fully automated operation of the entire line.

[0080] In addition, both the feeding device 550 and the unloading device 560 are equipped with sensor components to detect whether the material exists and whether it is in place, and to feed the detection signal back to the control system to realize linkage control with the main control system of the mounting equipment, so as to ensure that the various devices are coordinated and orderly and operate safely and reliably.

[0081] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0082] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A bonding device, characterized in that, The bonding device is used to attach a chip to a circuit board, and includes: Base; A bonding assembly is movably disposed on the base along a first direction, a second direction, or a third direction, and the bonding assembly is used to attach a chip to a circuit board, wherein the first direction, the second direction, and the third direction intersect each other; A driving component, connected to the base and the bonding component, wherein the driving component is used to drive the bonding component to move along the first direction, the second direction, or the third direction; and A control component, comprising a force sensor and a controller, wherein the force sensor is disposed on the bonding component and electrically connected to the controller, the force sensor is used to receive the bonding force signal of the bonding component and transmit the signal to the controller, and the controller controls the drive component to operate according to the received signal.

2. The bonding device according to claim 1, characterized in that, The bonding assembly includes a bonding head module and a vacuum module. The bonding head module is movably disposed on the base along the first direction, the second direction, or the third direction, and the bonding head module is used to attach the chip to the circuit board. The vacuum module provides vacuum adsorption force for the bonding head module.

3. The bonding device according to claim 2, characterized in that, The driving component includes a first moving module disposed on the base, and the bonding head module disposed on the first moving module. The first moving module is used to drive the bonding head module to move along the first direction.

4. The bonding device according to claim 3, characterized in that, The driving component further includes a second moving module, which is disposed on the base, and the first moving module is disposed on the second moving module. The second moving module is used to drive the bonding head module and the first moving module to move along the second direction.

5. The bonding device according to claim 4, characterized in that, The driving component further includes a third moving module, which is disposed on the base. The second moving module is disposed on the third moving module. The third moving module is used to drive the bonding head module, the first moving module, and the second moving module to move along the third direction.

6. The bonding device according to claim 5, characterized in that, The first direction is the vertical direction, and the controller controls the first moving module to work according to the received signal.

7. The bonding device according to claim 6, characterized in that, The first moving module is a lead screw motor moving module, and the second and third moving modules are linear motor moving modules.

8. A chip mounting device, characterized in that, include: case; as well as The bonding device according to any one of claims 1 to 7 is disposed within the housing.

9. The chip mounting equipment according to claim 8, characterized in that, The chip mounting equipment also includes an adhesive application device, a clean air supply device, a guide rail feeding device, and a bonding vision device, all of which are housed within the housing.

10. The chip mounting equipment according to claim 8, characterized in that, The chip mounting equipment further includes a loading device and a unloading device, which are respectively disposed outside the housing and on opposite sides of the housing.

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