High-yield, high-efficiency, space-saving hydrogen passivation curing furnace

Abstract

The utility model discloses high -yield high -efficient space's hydrogen passivation solidification furnace, including the piece collector, hydrogen passivation solidification furnace and piece separator who set up in proper order along the conveying direction, hydrogen passivation solidification furnace bottom is installed with the lower layer basket backflow circulation device and is sent to the piece collector with the empty basket of piece separator, and the top of hydrogen passivation solidification furnace is installed with visual camera respectively in the position close to piece collector and piece separator, and the furnace cavity of hydrogen passivation solidification furnace is isolated through the gate structure between every station, and the air return area in the furnace cavity is in proper order along the silicon wafer conveying direction and is transition chamber, preheating drying chamber, constant temperature drying chamber, cooling chamber and cooling chamber. The utility model reduces the space length of equipment, optimizes the site limit, reduces the equipment cost, reduces the energy consumption loss, and the whole adopts servo control, camera photographing and positioning pin combination to realize accurate positioning transportation, and improves the production capacity simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of low-temperature drying technology for battery cells, and in particular to a high-yield, high-efficiency, and space-saving hydrogen passivation curing furnace. Background Technology

[0002] Photovoltaic silicon wafers are the core and most valuable component of a solar power generation system. Their function is to convert solar energy into electrical energy, which is then stored in batteries or used directly as a power source. Hydrogen passivation and curing ovens play a crucial role in low-temperature drying processes such as HIT and BC. They are primarily used in designs requiring high production capacity, long drying times, and high temperature uniformity, and offer the advantage of being compatible with both full and half wafers from 182-230 mm.

[0003] Existing drying and curing ovens can only hold single silicon wafers, resulting in extremely low production efficiency. Furthermore, their long length and high cost are due to the time constraints of the process. Additionally, the front inlet and rear outlet easily allow heat to escape from the equipment, affecting the internal drying effect and increasing energy consumption. Utility Model Content

[0004] To address the aforementioned technical challenges, a high-yield, high-efficiency, and space-saving hydrogen passivation curing oven is provided. This oven is a conveyor system that integrates a conveying basket, an upper transition zone, a drying zone, a cooling zone, and a lower return zone. Through a stable hot air circulation system and precise PID temperature control, the oven ensures uniform temperature, achieving high-yield and high-efficiency hydrogen passivation curing of solar cells and improving cell efficiency.

[0005] To achieve the above objectives, this utility model discloses a high-yield, high-efficiency, and space-saving hydrogen passivation curing furnace, comprising a wafer receiving machine, a hydrogen passivation curing furnace, and a wafer sorting machine arranged sequentially along the conveying direction. The bottom of the hydrogen passivation curing furnace is equipped with a lower basket return circulation device to return empty baskets from the wafer sorting machine to the wafer receiving machine. Vision cameras are respectively installed on the top of the hydrogen passivation curing furnace near the wafer receiving machine and the wafer sorting machine. Each station in the furnace cavity is isolated by a gate structure. The return air area in the furnace cavity, along the silicon wafer conveying direction, consists of a transition cavity, a preheating and drying cavity, a constant temperature drying cavity, a cooling cavity, and a cooling chamber.

[0006] Furthermore, the lower-level flower basket return circulation device includes a double-speed chain driven by a lower-level drive motor. The double-speed chain includes roller chains on both sides and a support crossbar horizontally installed between the roller chains. Transport trays with positioning posts are equidistantly installed on the surface of the support crossbar for positioning the flower basket structure.

[0007] Furthermore, the flower basket structure can be selected as a transport carrier for silicon wafers by choosing one of the following: a single half flower basket, a double half flower basket, or a whole flower basket, according to actual production needs. The bottom of the flower basket structure is provided with positioning holes that match the positioning posts on the surface of the transport pallet.

[0008] Furthermore, the gate structure includes a double gate installed between the transition chamber and the preheating and drying chamber, and a single gate installed between the cooling chamber and the cooling cavity. The single gate includes a transverse module driven by a motor installed on the top of the hydrogen passivation curing furnace. The movable end of the transverse module is connected to a first gate plate located below the transverse module via a first connecting plate. Each plate of the first gate plate is fixed by at least two first connecting plates, and the transverse module controls the synchronous movement of the first connecting plates in opposite directions to realize the opening and closing action of the first gate plate.

[0009] Furthermore, the double-opening gate also includes a transverse sliding module. The movable end of the transverse sliding module is connected to a first gate plate located below the transverse sliding module via a first connecting plate. A second connecting plate is fixed on the first connecting plate. The end of the second connecting plate away from the first connecting plate is connected to the second gate plate via a vertically arranged third connecting plate. The bottom of the second connecting plate is mounted on a linear slide rail located at the top of the hydrogen passivation curing furnace via a slider. The second gate plate opens and closes synchronously with the first gate plate.

[0010] Furthermore, heating plates are vertically installed on both sides of the inner cavity of the basket conveying channel inside the hydrogen passivation curing furnace. The heating plates use stainless steel heating wires to provide a heat source. A K-type thermocouple is installed inside the furnace cavity to collect the temperature, and the power of the heating wire is adjusted by controlling the voltage through a solid-state relay. A return air channel is installed between two adjacent heating plates. Holes are opened on the surface of both the heating plates and the return air channel. The heating plates and the blower installed on the surface of the hydrogen passivation curing furnace form a return air area.

[0011] Furthermore, a set of blowers is provided and installed on the top of the hydrogen passivation curing oven. The impeller of the blower drives the gas to flow to both sides and blows the gas into the oven cavity through the holes of the heating plate to provide heat to the silicon wafer. The resulting negative pressure pushes the rising hot gas back down.

[0012] Furthermore, the blower is provided in three sets: blower A and blower B installed on the front and rear sides of the hydrogen passivation curing furnace, and blower C on the top. Blower A, installed on the side of the hydrogen passivation curing furnace, drives the gas to flow into the furnace cavity and blows the gas into the furnace cavity through the holes of the heating plate to provide heat to the silicon wafer. Blower B on the opposite side draws the hot gas in the furnace cavity to increase the gas flow and then sends it to blower A for circulation. Blower C pushes the rising hot gas back down.

[0013] Furthermore, the heating plate includes an outer heating aluminum base plate, a heating wire is embedded in the inner surface of the heating aluminum base plate and a heating aluminum cover plate is covering the surface of the heating wire, and heat insulation cotton, heat insulation plate and adjustment sealing plate are arranged sequentially on the surface of the heating aluminum cover plate, and a temperature measuring probe with a protective cover is installed between the two adjustment sealing plates at the bottom. The heating wire is selected as a heat source from one of the following: full heating wire, half heating wire and heating wire module to adapt to different size and power requirements.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model discloses a high-yield, high-efficiency, and space-saving hydrogen passivation curing oven. In the same process time, the space length of the equipment is shortened by 5.5 times compared with the traditional flat drying oven, which greatly optimizes the site limitations and reduces equipment costs. The oven cavity is designed with K-type thermocouples to collect temperature, and the power of the heating wire is adjusted by controlling the voltage through a solid-state relay. The software uses PID to accurately position the holes, so that the oven cavity temperature is uniform and energy loss is reduced. The whole system adopts servo control, camera photography and positioning pins to achieve precise positioning and transportation, while improving production capacity. Attached Figure Description

[0015] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0016] Figure 1 This is the main view of the production line layout of this utility model.

[0017] Figure 2 This is a perspective view of the present invention.

[0018] Figure 3 This is a schematic diagram of the lower layer flower basket recirculation device of this utility model.

[0019] Figure 4 This is a schematic diagram of the single half flower basket of this utility model.

[0020] Figure 5 This is a schematic diagram of the double-half flower basket of this utility model.

[0021] Figure 6 This is a schematic diagram of the entire flower basket of this utility model.

[0022] Figure 7 This is a schematic diagram of the single-opening gate structure of this utility model.

[0023] Figure 8 This is a schematic diagram of the installation position of the single-opening gate of this utility model.

[0024] Figure 9 This is a schematic diagram of the double-opening gate structure of this utility model.

[0025] Figure 10This is a schematic diagram of the installation position of the double-opening gate of this utility model.

[0026] Figure 11 This is a schematic diagram of the flow direction of the flower basket structure of this utility model.

[0027] Figure 12 This is a schematic diagram of the interior of the return air area of ​​this utility model.

[0028] Figure 13 This is the airflow direction in the return air area of ​​Embodiment 1 of this utility model.

[0029] Figure 14 This is the airflow direction in the return air area of ​​Embodiment 2 of this utility model.

[0030] Figure 15 This is a schematic diagram of the single heating plate structure of this utility model.

[0031] Figure 16 This is a schematic diagram of the internal structure of the heating plate of this utility model.

[0032] Figure 17 This is a schematic diagram of the full heating wire of this utility model.

[0033] Figure 18 This is a schematic diagram of the semi-heating wire of this utility model.

[0034] Figure 19 This is a schematic diagram of the heating wire module of this utility model.

[0035] In the diagram: 1 is the film receiving machine; 2 is the hydrogen passivation curing oven; 21 is the transition chamber; 22 is the preheating and drying chamber; 23 is the constant temperature drying chamber; 24 is the cooling chamber; 25 is the cooling chamber; 26 is the lower basket return circulation device; 261 is the roller chain; 262 is the support crossbar; 263 is the transport pallet; 3 is the film separator; 4 is the vision camera; 5 is the gate structure; 51 is the transverse moving module; 52 is the first connecting plate; 53 is the first gate plate; 54 is the second connecting plate; 55 is the third connecting plate; 56 is the second gate plate; 57 is the linear slide rail; 6 is the heating plate; 61 is the heating aluminum base plate; 62 is the heating wire; 63 is the heating aluminum cover plate; 64 is the heat insulation cotton; 65 is the heat insulation board; 66 is the adjusting sealing plate; 67 is the temperature probe; 7 is the return air channel. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] One embodiment of this utility model is as follows: Figure 1 , Figure 2 and Figure 11 As shown, a wafer receiving machine 1, a hydrogen passivation curing furnace 2, and a wafer sorting machine 3 are arranged sequentially along the conveying direction. The hydrogen passivation curing furnace 2 is characterized by having a lower-level basket return circulation device 26 installed at its bottom to return empty baskets from the wafer sorting machine 3 to the wafer receiving machine 1. Vision cameras 4 are installed at the top of the hydrogen passivation curing furnace 2 near the wafer receiving machine 1 and the wafer sorting machine 3, respectively, for precise positioning via image capture. Each station within the furnace cavity of the hydrogen passivation curing furnace 2 is isolated by a gate structure 5. The return air areas within the furnace cavity, along the silicon wafer conveying direction, are sequentially a transition chamber 21, a preheating and drying chamber 22, a constant-temperature drying chamber 23, a cooling chamber 24, and a cooling cavity. 25. Within the same processing time, the equipment's spatial length is shortened by 5.5 times compared to traditional flat drying ovens, greatly optimizing site limitations and reducing equipment costs. The oven cavity is designed with K-type thermocouples to collect temperature, and the power of the heating wire is adjusted by controlling the voltage through a solid-state relay. The software uses PID for precise hole positioning, ensuring uniform oven cavity temperature and reducing energy loss. The entire system adopts a combination of servo control, camera photography, and positioning pins to achieve precise positioning and transportation, enabling a production speed of ≥4500 PCS / H for 182-230 whole sheets and ≥9000 PCS / H for 182-230 half sheets, significantly increasing production capacity.

[0038] like Figure 3 As shown, the lower-level flower basket return circulation device 26 includes a double-speed chain driven by a lower-level drive motor. The double-speed chain includes roller chains 261 on both sides and support crossbars 262 horizontally installed between the roller chains 261. Transport pallets 263 with positioning posts are equidistantly installed on the surface of the support crossbars 262 for positioning the flower basket structure. A servo driver controls the transport to ensure smooth operation and consistent distances at each station. Figure 4 , Figure 5 and Figure 6 As shown, the basket structure can be selected as a single half basket, double half basket, or full basket as the transport carrier for silicon wafers according to actual production needs. The bottom of the basket structure is provided with positioning holes that match the positioning posts on the surface of the transport pallet 263. It has strong versatility and can adapt to the drying of silicon wafers of different specifications. The empty metal basket is returned to the wafer receiving machine through the double-speed chain conveyor in the lower layer of the hydrogen passivation curing oven, forming a recycling.

[0039] like Figure 7 and Figure 8As shown, the gate structure 5 includes a double gate installed between the transition chamber 21 and the preheating drying chamber 22, and a single gate located between the cooling chamber 24 and the cooling chamber 25. The single gate includes a transverse module 51 driven by a motor installed on the top of the hydrogen passivation curing furnace 2. The movable end of the transverse module 51 is connected to a first gate plate 53 located below the transverse module 51 through a first connecting plate 52. Each plate of the first gate plate 53 is fixed by at least two first connecting plates 52, and the transverse module 51 controls the first connecting plates 52 to move synchronously in opposite directions to realize the opening and closing action of the first gate plate 53.

[0040] like Figure 9 and Figure 10 As shown, the double gate is based on the single gate. A second connecting plate 54 is fixed on the first connecting plate 52. The end of the second connecting plate 54 away from the first connecting plate 52 is connected to the second gate plate 56 through a vertically arranged third connecting plate 55. The bottom of the second connecting plate 54 is mounted on a linear slide rail 57 located at the top of the hydrogen passivation curing furnace 2 via a slider. The second gate plate 56 and the first gate plate 53 open and close synchronously. The gate structures on both sides open and close once every time the flower basket passes through a station, allowing new flower baskets in the receiving machine to enter the transition chamber and cooled flower baskets to enter the slitting machine. The slitting flower baskets are transferred to the lower flower basket return circulation device through a lifting structure.

[0041] like Figure 12 As shown, heating plates 6 are vertically installed on both sides of the inner cavity of the basket conveying channel inside the hydrogen passivation curing oven 2. The heating plates 6 use stainless steel heating wires to provide a heat source. A K-type thermocouple is installed inside the oven cavity to collect the temperature, and the power of the heating wire is adjusted by controlling the voltage through a solid-state relay. A return air channel 7 is installed between two adjacent heating plates 6. Holes are opened on the surface of both the heating plates 6 and the return air channel 7. The heating plates 6 and the blower installed on the surface of the hydrogen passivation curing oven 2 form a return air area.

[0042] Embodiment 1 of this application, as follows Figure 13 As shown, a set of blowers is installed on the top of the hydrogen passivation curing oven 2. The impeller of the blower drives the gas to flow to both sides and blows the gas into the oven cavity through the holes of the heating plate 6 to provide heat to the silicon wafer. The generated negative pressure pushes the rising hot gas back down, ensuring the temperature uniformity in the oven cavity. The gas circulates under the negative pressure and the rotation of the blower. Only one set of blowers is needed to realize the return air function of the return air area at this location.

[0043] Embodiment two of this application, such as Figure 14As shown, the difference from Embodiment 1 is that there are three sets of blowers: blower A and blower B installed on the front and rear sides of the hydrogen passivation curing furnace 2, and blower C on the top. Blower A, installed on the side of the hydrogen passivation curing furnace 2, drives the gas to flow into the furnace cavity and blows the gas through the holes of the heating plate 6 to provide heat to the silicon wafer. Blower B on the opposite side draws the hot gas in the furnace cavity to increase the gas flow and then sends it to blower A for circulation. All pipes are insulated. Blower C pushes the rising hot gas back down. The number of blowers is increased compared to Embodiment 1, but the gas flow effect is better.

[0044] like Figures 15 to 19 As shown, the heating plate 6 includes a heating aluminum base plate 61 located on the outer side. A heating wire 62 is embedded in the inner surface of the heating aluminum base plate 61, and a heating aluminum cover plate 63 covers the surface of the heating wire 62. The surface of the heating aluminum cover plate 63 is sequentially provided with heat insulation cotton 64, heat insulation plate 65, and adjusting sealing plate 66. A temperature measuring probe 67 with a protective cover is installed between the two adjusting sealing plates 66 at the bottom. As a preferred embodiment of this application, in embodiment one, the heating wire 62 is a stainless steel full heating wire. The heating aluminum base plate and the heating aluminum cover plate tightly fit and fix the stainless steel heating wire. The stainless steel heating wire is energized and heated to conduct heat to the aluminum plate. The fan rotates and blows heat from the holes of the heating plate to the furnace cavity. The heat insulation cotton and heat insulation plate can adjust the heat insulation. The adjusting sealing plate is used to adjust the air volume to control the temperature and airflow. The temperature measuring probe cover protects the temperature measuring probe from the opening and closing of the gate. The temperature measured by the temperature measuring probe is fed back to the PLC for temperature regulation and output power control to ensure the stability of the furnace temperature.

[0045] The working principle of this embodiment is as follows: After silicon wafer printing, the wafer receiving machine automatically loads the silicon wafers into metal baskets. Through vision camera photography and precise positioning pins, a robotic arm accurately places the full metal baskets into the transport pallet of the hydrogen passivation curing oven. A double-pitch mesh chain connected to the motor gear drive drives the transport pallet into the oven for drying. The drying area uses stainless steel heating wires to provide a heat source. A blower disperses the heat into the oven cavity, and the hot air circulates and is blown back into the oven cavity. The oven cavity is designed with K-type thermocouples to collect temperature. The power of the heating wires is adjusted by controlling the voltage through a solid-state relay. PID control is used in the software for precise temperature control, ensuring uniform temperature in the oven cavity and improving the drying quality of the silicon wafers. A servo driver is used to control the transport, ensuring smooth operation and consistent distance at each station. The transition chamber gate opens and closes once for each workstation to reduce heat loss. After drying, the wafers enter the cooling section, where they are precisely positioned using a camera and positioning pins. A robotic arm then grabs the cooled metal baskets and automatically transfers them to the next wafer slitting machine. The silicon wafers in the metal baskets flow out sequentially, and the empty metal baskets are then transported back to the wafer receiving machine via a double-speed chain conveyor in the lower layer of the hydrogen passivation curing oven, thus forming a recycling system.

[0046] Several points need to be clarified: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly, and can refer to mechanical or electrical connections, or internal connections between two components, or direct connections. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships, and the relative positional relationships may change when the absolute position of the described objects changes. Second, in this document, relational terms such as "first" and "second" are only used to distinguish one entity from another entity, and do not necessarily require or imply any such actual relationship or order between these entities.

[0047] The examples above are merely illustrative of this utility model and do not constitute a limitation on the scope of protection of this utility model. All designs that are the same as or similar to this utility model are within the scope of protection of this utility model.

Claims

1. A high-yield, high-efficiency, and space-saving hydrogen passivation curing oven, comprising a sheet receiving machine (1), a hydrogen passivation curing oven (2), and a sheet separating machine (3) arranged sequentially along the conveying direction, characterized in that, The bottom of the hydrogen passivation curing oven (2) is equipped with a lower basket return circulation device (26) to return the empty basket at the wafer slitter (3) to the wafer receiver (1). The top of the hydrogen passivation curing oven (2) near the wafer receiver (1) and the wafer slitter (3) is equipped with vision cameras (4). Each station in the furnace cavity of the hydrogen passivation curing oven (2) is isolated by a gate structure (5). The return air area in the furnace cavity is sequentially the transition cavity (21), the preheating drying cavity (22), the constant temperature drying cavity (23), the cooling cavity (24), and the cooling cavity (25) along the silicon wafer conveying direction.

2. The high-yield, high-efficiency, and space-saving hydrogen passivation curing furnace according to claim 1, characterized in that, The lower-level flower basket return circulation device (26) includes a double-speed chain driven by a lower-level transmission motor. The double-speed chain includes roller chains (261) on both sides and a support crossbar (262) horizontally installed between the roller chains (261). Transport pallets (263) with positioning columns are equidistantly installed on the surface of the support crossbar (262) for positioning the flower basket structure.

3. The high-yield, high-efficiency, and space-saving hydrogen passivation curing furnace according to claim 2, characterized in that, The basket structure can be selected as a transport carrier for silicon wafers by choosing one of the following: a single half basket, a double half basket, or a whole basket, depending on actual production needs. The bottom of the basket structure is provided with positioning holes that match the positioning posts on the surface of the transport pallet (263).

4. The high-yield, high-efficiency, and space-saving hydrogen passivation curing oven according to claim 1, characterized in that, The gate structure (5) includes a double gate installed between the transition chamber (21) and the preheating drying chamber (22), and a single gate installed between the cooling chamber (24) and the cooling chamber (25). The single gate includes a transverse module (51) installed on the top of the hydrogen passivation curing furnace (2) and driven by a motor. The movable end of the transverse module (51) is connected to a first gate plate (53) located below the transverse module (51) through a first connecting plate (52). Each plate of the first gate plate (53) is fixed by at least two first connecting plates (52), and the first gate plate (53) is opened and closed by the transverse module (51) controlling the synchronous movement of the first connecting plates (52) in opposite directions.

5. The high-yield, high-efficiency, and space-saving hydrogen passivation curing furnace according to claim 4, characterized in that, The double-opening gate also includes a transverse module (51). The movable end of the transverse module (51) is connected to the first gate plate (53) located below the transverse module (51) via the first connecting plate (52). A second connecting plate (54) is fixed on the first connecting plate (52). The end of the second connecting plate (54) away from the first connecting plate (52) is connected to the second gate plate (56) via a vertically arranged third connecting plate (55). The bottom of the second connecting plate (54) is mounted on a linear slide rail (57) located at the top of the hydrogen passivation curing furnace (2) via a slider. The second gate plate (56) and the first gate plate (53) open and close synchronously.

6. The high-yield, high-efficiency, and space-saving hydrogen passivation curing furnace according to claim 1, characterized in that, Heating plates (6) are vertically installed on both sides of the inner cavity of the flower basket conveying channel inside the hydrogen passivation curing furnace (2). The heating plates (6) use stainless steel heating wires to provide heat. A K-type thermocouple is installed in the furnace cavity to collect the temperature and the power of the heating wire is adjusted by controlling the voltage through a solid-state relay. A return air channel (7) is installed between two adjacent heating plates (6). Holes are opened on the surface of both the heating plates (6) and the return air channel (7). The heating plates (6) and the blower installed on the surface of the hydrogen passivation curing furnace (2) form a return air area.

7. The high-yield, high-efficiency, and space-saving hydrogen passivation curing furnace according to claim 6, characterized in that, The blower is provided in a set and installed on the top of the hydrogen passivation curing oven (2). The impeller of the blower drives the gas to flow to both sides and blows the gas into the furnace cavity through the holes of the heating plate (6) to provide heat to the silicon wafer. The negative pressure generated pushes the hot gas that is rising upwards back downwards.

8. The high-yield, high-efficiency, and space-saving hydrogen passivation curing furnace according to claim 6, characterized in that, The blower is provided in three sets, namely blower A and blower B on the front and back sides of the hydrogen passivation curing furnace (2) and blower C on the top. Blower A installed on the side of the hydrogen passivation curing furnace (2) drives the gas to flow into the furnace cavity and blows the gas through the holes of the heating plate (6) to provide heat to the silicon wafer. Blower B on the opposite side draws the hot gas in the furnace cavity to increase the gas flow and then sends it to blower A for circulation. Blower C pushes the hot gas that rises upward back downward.

9. The high-yield, high-efficiency, and space-saving hydrogen passivation curing furnace according to claim 6, characterized in that, The heating plate (6) includes an outer heating aluminum base plate (61), a heating wire (62) is embedded in the inner surface of the heating aluminum base plate (61), and a heating aluminum cover plate (63) is covering the surface of the heating wire (62). The surface of the heating aluminum cover plate (63) is provided with heat insulation cotton (64), heat insulation plate (65) and adjustment sealing plate (66) in sequence. A temperature probe (67) with a protective cover is installed between the two adjustment sealing plates (66) at the bottom. The heating wire (62) can be selected as a heat source of full heating wire, half heating wire and heating wire module to adapt to different size and power requirements.

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