A photosensitive element and industrial sensor

Abstract

This invention discloses a photosensitive element and an industrial sensor, including a socket, a light-receiving chip, and an encapsulation layer. The socket is made of ceramic material. The light-receiving chip is disposed on the socket and connected to one end of a metal pin. The other end of the metal pin passes through the socket and is located on the side opposite to the light-receiving chip. A light-transmitting encapsulation layer is disposed on the socket and encapsulates the light-receiving chip. This invention provides excellent insulation properties and thermal stability through the ceramic socket, while ensuring a reliable sealing state in complex environments. The ceramic socket combined with through-hole pins reduces production costs. The light-receiving chip is fixed to the surface of the socket with silver paste and forms a stable electrical connection with the metal pin using gold wire bonding technology. The transparent epoxy resin encapsulation layer achieves omnidirectional encapsulation of the chip, maintaining the miniaturization characteristics of the device while ensuring a wide angular response range.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, specifically to a photosensitive element and an industrial sensor. Background Technology

[0002] With the improvement of industrial automation and manufacturing development, the demand for high-precision and high-reliability industrial photodetectors is increasing. In order to ensure that industrial photodetectors can maintain stable performance under harsh conditions, sensors pursue higher resolution, faster response speed and stronger anti-interference ability. However, the cost is high and it is difficult to achieve miniaturization while ensuring the accuracy and reliability of the sensor. This utility model proposes a new solution to the above problems. Utility Model Content

[0003] To overcome at least one of the aforementioned drawbacks, this invention provides a photosensitive element and an industrial sensor. The objective of this invention can be achieved by employing the following technical solution: A first aspect of this application provides a photosensitive element, comprising: The tube base is made of ceramic material; A light-receiving chip is disposed on the tube socket and connected to one end of a metal pin, the other end of which passes through the tube socket and is located on the side away from the light-receiving chip; An encapsulation layer, which is transparent, is disposed on the tube socket and encapsulates the light-receiving chip.

[0004] In one possible implementation, a first copper foil and a second copper foil are spaced apart on one end face of the tube base, and the light-receiving chip is fixed to the first copper foil by silver paste.

[0005] In one possible implementation, the metal pin includes: The first pin has a first end connected to the first copper foil, and the second end of the first pin is exposed through the tube socket. The second pin has a first end connected to the second copper foil, which is connected to the PAD point of the light-receiving chip via a bonding wire, and the second end of the second pin is exposed through the socket.

[0006] In one possible implementation, the tube seat has an axial first through hole and a second through hole, the first through hole being used for the first pin to pass through, and the second through hole being used for the second pin to pass through.

[0007] In one possible implementation, the tube seat is a cylindrical structure, and the diameter of the tube seat is no greater than 4 mm.

[0008] In one possible implementation, the diameter of the photosensitive element is in the range of 2mm-3mm.

[0009] In one possible implementation, the encapsulation layer is injection molded from a transparent epoxy resin colloid.

[0010] In one possible implementation, the encapsulation layer encapsulates the light-receiving chip, bonding wires, silver paste, a first copper foil, and a second copper foil to form an integral structure.

[0011] In one possible implementation, the light-receiving chip is an infrared spectral light-receiving chip.

[0012] A second aspect of this application provides an industrial sensor, including any of the photosensitive elements described in the first aspect.

[0013] The beneficial technical effects of this utility model are as follows: According to the present disclosure, the photosensitive element and industrial sensor provide excellent insulation characteristics and thermal stability through the ceramic tube socket, while ensuring a reliable sealing state in complex environments. The ceramic tube socket combined with through-hole pins reduces production costs. The light-receiving chip is fixed to the surface of the tube socket with silver paste and forms a stable electrical connection with the metal pins through gold wire bonding. Combined with a transparent epoxy resin encapsulation layer, the chip is fully encapsulated, which can maintain the miniaturization characteristics of the device and ensure a wide angular response range. Attached Figure Description

[0014] The following are given by way of example and without limitation in the accompanying drawings: Figure 1 A schematic diagram of the structure of the photosensitive element according to an embodiment of the present invention is shown.

[0015] In the diagram: 1. Tube socket; 2. First metal pin; 3. Second metal pin; 4. Light-receiving chip; 5. Bonding wire; 6. Silver paste; 7. Encapsulation layer; 8. First copper foil; 9. Second copper foil. Detailed Implementation

[0016] In the following detailed disclosure, these embodiments are fully described with reference to the accompanying drawings. In order to enable those skilled in the art to understand and clarify the technical solution of this utility model more clearly, the embodiments described below are not limited thereto. The present utility model will be further described in detail below with reference to the embodiments and the accompanying drawings.

[0017] In this utility model, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "join," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "join" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0018] In the description of this utility model, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0019] The first aspect of this application, as Figure 1 As shown, a photosensitive element is provided, including a socket, a light-receiving chip 4 and an encapsulation layer 7. The socket is made of ceramic material. The light-receiving chip 4 is disposed on the socket and connected to one end of a metal pin. The other end of the metal pin passes through the socket and is located on the side away from the light-receiving chip 4. The light-transmitting encapsulation layer 7 is disposed on the socket and encapsulates the light-receiving chip 4.

[0020] The photosensitive element provided in this embodiment offers excellent insulation and thermal stability through a ceramic socket, while ensuring a reliable sealed state in complex environments. The ceramic socket 1, combined with through-hole pins, reduces production costs. The light-receiving chip 4 is fixed to the surface of the socket by silver paste 6 and forms a stable electrical connection with the metal pins using gold wire bonding technology. The transparent epoxy resin encapsulation layer 7 achieves omnidirectional encapsulation of the chip, maintaining the miniaturization characteristics of the device while ensuring a wide angular response range.

[0021] In one possible implementation, such as Figure 1 As shown, a first copper foil 8 and a second copper foil 9 are spaced apart on one end face of the tube base, and the light-receiving chip 4 is fixed to the first copper foil 8 by silver paste 6.

[0022] Among them, the first copper foil sheet 8 undertakes the main mechanical fixing function, and the silver paste 6 achieves precise positioning and stable attachment of the light-receiving chip 4, ensuring the positional stability of the light-receiving chip 4 during operation.

[0023] The second copper foil 9 and the first copper foil 8 are arranged in an alternating pattern, which provides sufficient operating space for subsequent gold wire bonding and effectively reduces signal interference through reasonable distribution of circuit connection points.

[0024] Understandably, the double copper foil spacing combined with the silver paste 6 fixing method not only improves the firmness of the light-receiving chip 4 installation, but also provides a more balanced thermal stress distribution for the overall packaging structure, thereby enhancing the durability and measurement accuracy stability of the photosensitive element under long-term operating conditions.

[0025] In one possible implementation, such as Figure 1 As shown, the metal pins include a first pin and a second pin. The first end of the first pin is connected to the first copper foil 8, and the second end of the first pin is exposed through the socket. The first end of the second pin is connected to the second copper foil 9, and the second copper foil 9 is connected to the PAD point of the light-receiving chip 4 through the bonding wire 5. The second end of the second pin is exposed through the socket.

[0026] The first pin is directly connected to the first copper foil 8 that carries the light-receiving chip 4, forming a stable power supply and basic signal path. The second pin is connected to the PAD point of the light-receiving chip 4 through the second copper foil 9 and gold wire bonding to form a loop, realizing efficient transmission of detection signals. The split pin structure effectively reduces common-mode interference and enhances mechanical insertion and removal stability. The independent protrusion of the two pins through the socket simplifies the external circuit connection process. The ceramic socket 1 forms physical isolation between the two pins, which has good insulation, sealing and thermal stability, enabling the photosensitive element to maintain excellent anti-interference ability and long-term connection reliability in complex industrial electromagnetic environments.

[0027] In one possible implementation, such as Figure 1 As shown, the tube seat has an axial first through hole and a second through hole. The first through hole is used for the first pin to pass through, and the second through hole is used for the second pin to pass through.

[0028] By opening two independent axial through holes on the ceramic tube base 1, the physical isolation between the first and second pins is achieved, effectively avoiding the risk of electrical short circuit between the pins. This not only ensures the isolation of the transmission paths of strong and weak electrical signals and reduces the impact of electromagnetic interference on detection accuracy, but also ensures the positioning accuracy during pin insertion and assembly through the precisely aligned through hole structure. Thanks to the mechanical strength of the ceramic material itself, the overall package structure maintains excellent deformation resistance during pin insertion, removal, and soldering.

[0029] In one possible implementation, the tube seat is a cylindrical structure with a diameter not exceeding 4 mm.

[0030] Among them, the compact design with a tube base diameter of no more than 4mm significantly reduces the overall size of the photosensitive element, enabling it to fit into the narrow installation space inside precision instruments, while maintaining sufficient structural strength to resist external mechanical stress.

[0031] Among them, the cylindrical tube seat structure is stable and can evenly distribute stress when subjected to external pressure or mechanical vibration. It also enhances the positioning accuracy during assembly, enabling the sensor to maintain reliable electrical connection characteristics under vibration or impact environments.

[0032] In one possible implementation, the diameter of the photosensitive element is in the range of 2mm-3mm. The miniaturized design reduces material consumption and production costs, meeting the needs of small and precision products in the market.

[0033] In one embodiment, the encapsulation layer 7 is injection molded from a transparent epoxy resin colloid. Through the injection molding process of the transparent epoxy resin colloid, a uniform and dense sealed protective structure can be formed, effectively isolating moisture, dust and chemical corrosion in the external environment, ensuring that the internal electronic components are protected from physical damage and oxidation. The high transparency facilitates optical signal transmission, while also possessing excellent electrical insulation properties to avoid short circuits and signal interference. The epoxy resin is cooled and cured to enhance the overall mechanical strength, withstand vibration and impact, and optimizes heat dissipation efficiency through thermal stability, extending the device life. It has good protection, reliability and process compatibility, and is suitable for the long-term stable operation of various precision electronic components.

[0034] Furthermore, such as Figure 1 As shown, the encapsulation layer 7 encapsulates the light-receiving chip 4, bonding wires 5, silver paste 6, first copper foil 8, and second copper foil 9 to form an integrated structure.

[0035] Among them, the encapsulation layer 7 integrates the optical chip, bonding wire 5, silver paste 6 and two copper foil sheets into one, forming a high-density interconnect structure, which significantly improves mechanical stability.

[0036] Among them, the solid-phase bonding characteristics of silver paste 6 enhance thermal and electrical conductivity, effectively disperse the thermal stress of the light-receiving chip 4, and avoid performance degradation caused by local overheating.

[0037] Meanwhile, the copper foil sheet covering the through holes on the tube seat forms electromagnetic shielding, reducing interference from external signals and improving anti-interference capability.

[0038] In one possible implementation, the light-receiving chip 4 is an infrared spectral light-receiving chip 4, which has stronger sensitivity and faster sensing speed.

[0039] The second aspect of this application, as Figure 1 As shown, an industrial sensor is provided, including any of the photosensitive elements in the first aspect.

[0040] The industrial sensor provided in this embodiment integrates the aforementioned photosensitive element. The ceramic tube socket has better insulation, sealing, and thermal stability. The ceramic tube socket 1, combined with the through-hole pin, reduces production costs. The small size design meets the needs of small and precision products in the market. It adopts an infrared spectral light-receiving chip 4, which has stronger sensitivity and faster sensing, significantly improving the ability to capture weak light signals. The transparent epoxy resin adhesive surface provides tight wrapping and stability while having a wide angular response range, enabling accurate detection even in complex industrial environments and enhancing long-term stability.

[0041] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0042] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

[0043] In view of the detailed description above, these and other changes can be made to these embodiments. This written description includes embodiments of the best mode disclosed in this utility model. The patent scope of this utility model is defined by the claims, which are not limited by this disclosure. The protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope disclosed in this utility model, based on the technical solution and concept of this utility model, are within the protection scope of this utility model.

Claims

1. A photosensitive element, characterized in that, include: The tube base (1) is made of ceramic material; A light-receiving chip (4) is disposed on the tube socket (1) and connected to one end of a metal pin. The other end of the metal pin passes through the tube socket (1) and is located on the side away from the light-receiving chip (4). The light-transmitting encapsulation layer (7) is disposed on the tube socket (1) and encapsulates the light-receiving chip (4).

2. The photosensitive element according to claim 1, characterized in that, The tube base (1) is provided with a first copper foil (8) and a second copper foil (9) at intervals on one end face, and the light-receiving chip (4) is fixed on the first copper foil (8) by silver paste (6).

3. The photosensitive element according to claim 2, characterized in that, The metal pins include: The first pin (2) has its first end connected to the first copper foil (8), and its second end is exposed through the tube seat (1). The second pin (3) has its first end connected to the second copper foil (9), and the second copper foil (9) is connected to the PAD point of the light-receiving chip (4) through the bonding wire (5). The second end of the second pin (3) is exposed through the tube socket (1).

4. The photosensitive element according to claim 3, characterized in that, The tube seat (1) has an axial first through hole and a second through hole. The first through hole is used for the first pin (2) to pass through, and the second through hole is used for the second pin (3) to pass through.

5. The photosensitive element according to claim 3, characterized in that, The tube seat (1) is a cylindrical structure, and the diameter of the tube seat (1) is no greater than 4mm.

6. The photosensitive element according to claim 5, characterized in that, The diameter of the photosensitive element is in the range of 2mm-3mm.

7. The photosensitive element according to claim 1, characterized in that, The encapsulation layer (7) is injection molded from a transparent epoxy resin colloid.

8. The photosensitive element according to claim 7, characterized in that, The encapsulation layer (7) encapsulates the light-receiving chip (4), bonding wires (5), silver paste (6), first copper foil (8), and second copper foil (9) to form an integrated structure.

9. The photosensitive element according to claim 1, characterized in that, The light-receiving chip (4) is an infrared spectrum light-receiving chip (4).

10. An industrial sensor, characterized in that, Includes the photosensitive element as described in any one of claims 1-9.

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