A die expander for LED chips

Abstract

This utility model provides a wafer expansion machine for LED chips, relating to the field of LED chip technology. The utility model includes a wafer expansion machine with a fixed frame and a wafer expansion disc on its surface. A pressure plate is hinged to one side of the fixed frame. A button is provided on one side of the wafer expansion machine. A cylinder is installed at the top of the wafer expansion machine, with a pressure disc installed at the cylinder's output end. A locking pin is provided on one side of the wafer expansion machine. A reinforcing device is provided on the surface of the fixed frame, which improves the stability of the wafer film. The reinforcing device includes a fixing ring, with four locking plates fixedly connected to its surface. In the LED chip processing during lamp bead production, this utility model uses the wafer expansion machine body for wafer diffusion and separation, which better ensures the stability of the thin film, reduces the likelihood of abnormal slippage, and makes wafer separation and diffusion more uniform, thus improving equipment performance and work efficiency.

Description

Technical Field

[0001] This utility model relates to the field of LED chip technology, and in particular to a die expansion machine for LED chips. Background Technology

[0002] The die expander is a key piece of equipment used in LED chip manufacturing, especially in the epitaxial growth process. The die expander separates several wafers from the wafer film during the LED chip production process, making it easier for subsequent implantation and welding processes.

[0003] In traditional wafer expanders, the process involves first installing the inner wafer ring on the wafer expander plate, then placing the wafer film on the plate. Next, the pressure plate is rotated to press against the surface of the mounting frame, and the locking pin is used to fix the plate in place. Then, the outer wafer ring is placed on top of the film. Pressing the button heats the wafer expander plate, softening the film and causing it to rise. Simultaneously, a cylinder moves, causing the pressure plate to descend and press against the outer wafer ring. The inner and outer wafer rings then clamp and fix the film, completing the wafer expander process. However, in actual use, it has been found that the wafer film is only limited by the pressure between the pressure plate and the mounting frame. This limiting method is prone to slippage and displacement of the film when the expander plate rises and lifts it, making it difficult to maintain a taut state and affecting the wafer expander effect and the practicality of the equipment. Utility Model Content

[0004] The technical problem this invention aims to solve is that the wafer's thin film is limited only by the squeezing between the pressure plate and the fixing frame. This limiting method is prone to causing the thin film to slide and shift when the expansion disk rises and lifts the film, making it difficult to maintain a tight state and affecting the expansion effect and the practicality of the equipment.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a die expansion machine for LED chips, including a die expansion machine body, a fixing frame and a die expansion disk are provided on the surface of the die expansion machine body, wherein a pressure plate is hinged to one side of the fixing frame, a button is provided on one side of the surface of the die expansion machine body, a cylinder is installed at the top of the die expansion machine body, wherein a pressure plate is installed at the output end of the cylinder, a locking pin is provided on one side of the surface of the die expansion machine body, and a reinforcing device is provided on the surface of the fixing frame, wherein the reinforcing device contacts and squeezes the wafer film for fixing.

[0006] The effect achieved by the above components is as follows: When the wafer expander body is used to diffuse and separate several wafers on the film during the LED chip production process, the inner wafer ring is first installed on the wafer expander plate, then the wafer film is placed on the wafer expander plate, then the reinforcing device is set on the surface of the fixing frame, then the pressure plate is rotated to press the pressure plate against the surface of the fixing frame, then the locking pin is operated to fix the position of the pressure plate, then the outer wafer ring is placed above the film, and then the button is operated. At this time, the wafer expander plate will be heated, making the film soft, and the wafer expander plate will rise. Then the cylinder will run to drive the pressure plate to descend and contact and squeeze the outer wafer ring. At this time, the inner and outer wafer rings will clamp and fix the film, completing the wafer expander.

[0007] Preferably, the reinforcing device includes a fixing ring, wherein four clamping plates are fixedly connected to the surface of the fixing ring, and fixing frames are fixedly connected to the four sides of the fixing frame, wherein the clamping plates are inserted into the inner wall of the fixing frame, and a plurality of evenly distributed protrusions are fixedly connected to one side surface of the fixing ring, and a fixing groove is formed on the surface of the fixing frame, wherein the fixing ring is engaged with the inner wall of the fixing groove.

[0008] The effect achieved by the above components is that the inner and outer crystal rings clamp and fix the film, completing the crystal expansion. At this time, when the crystal expansion machine body is used to diffuse and separate the wafers during the production of LED beads, the stability of the film can be better guaranteed, and abnormal slippage is less likely to occur. This makes the separation and diffusion of the wafers more uniform, improving the equipment's performance and work efficiency.

[0009] Preferably, the reinforcing device further includes a reinforcing ring installed on one side of the fixing ring, wherein the reinforcing ring improves the connection strength between the pressure plate and the fixing ring.

[0010] The effect achieved by the above components is that, through the setting of the rubber reinforcing ring, the friction is further increased when the fixing ring and the clamping plate come into contact and are squeezed, thereby making the thin film position of the wafer better maintain stability.

[0011] Preferably, the reinforcing device further includes a reinforcing block installed on the inner wall of the card plate, wherein the reinforcing block improves the connection stability between the card plate and the fixed frame.

[0012] The effect achieved by the above components is that, by setting up the sponge material reinforcement block, when the card plate is attached to the surface of the fixing frame, it is not easy for gaps to be generated, thereby further improving the limiting strength of the card plate and the fixing ring.

[0013] Preferably, positioning grooves are provided at the four corners of the surface of the fixing frame, wherein positioning rods are inserted into the inner walls of the positioning grooves, and the positioning rods are connected and fixed to the surface of the fixing ring.

[0014] The aforementioned components achieve the following effect: through the insertion of the positioning groove and the positioning rod, the film can be further clamped when placed on the surface of the fixing frame, thereby better maintaining the stability of the film's position.

[0015] Preferably, a safety device is provided on the surface of the die expander body at the position of the button. The safety device includes a protective cover, wherein a connecting plate is fixedly connected to the surface of the protective cover, and the connecting plate is rotatably connected to the mounting shaft installed on the surface of the die expander body.

[0016] The effect achieved by the above components is that the buttons are less likely to be accidentally touched by staff standing around when the crystal expander is running, thus ensuring the normal operation of the equipment and allowing the LED chips on the film to be better diffused and separated.

[0017] Preferably, a fixing block is fixedly connected to one side surface of the protective cover, wherein the fixing block is engaged with the positioning frame on the surface of the crystal expander body.

[0018] The effect achieved by the above components is that the locking mechanism between the fixing block and the positioning frame makes the protective cover more stably cover the surface of the button, making it less prone to shaking, thereby making the operation of the crystal expander body more stable.

[0019] Preferably, the safety device further includes a handle mounted on one side of the protective cover, wherein the handle improves the ease of use of the protective cover.

[0020] The effect achieved by the above components is that the grip design makes it easier and faster to flip the protective cover, thereby making the operation and protection of the buttons faster.

[0021] The beneficial effects of this utility model are: In the LED chip processing during the lamp bead production process, this utility model uses a wafer expander body to perform wafer diffusion separation, which can better ensure the stability of the thin film and prevent abnormal slippage, thereby making the wafer separation and diffusion more uniform, improving the equipment's performance and work efficiency. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a structural schematic diagram of the fixing frame position of this utility model; Figure 3 This is a schematic diagram of the reinforcing device of this utility model; Figure 4 This is a schematic diagram of the structure of the safety device of this utility model; Figure 5 This is an operation flowchart for the crystal expansion machine of this utility model.

[0024] Legend: 1. Die expander body; 2. Reinforcing device; 21. Fixing ring; 22. Fixing groove; 23. Clamping plate; 24. Fixing frame; 25. Protrusion; 26. Reinforcing ring; 27. Reinforcing block; 28. Positioning rod; 29. ​​Positioning groove; 3. Safety device; 31. Protective cover; 32. Connecting plate; 33. Mounting shaft; 34. Fixing block; 35. Positioning frame; 36. Handle; 4. Button; 5. Fixing frame; 6. Die expander tray; 7. Cylinder; 8. Pressure plate; 9. Pressure plate; 10. Locking pin. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" or "linked" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a mechanical connection or an electrical connection; it can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] Figure 1 and Figure 2 The diagram shows a die expander for LED chips, including a die expander body 1. The surface of the die expander body 1 is provided with a fixing frame 5 and a die expander disk 6. A pressure plate 9 is hinged to one side of the fixing frame 5. A button 4 is provided on one side of the surface of the die expander body 1. A cylinder 7 is installed at the top of the die expander body 1. A pressure plate 8 is installed at the output end of the cylinder 7. A locking pin 10 is provided on one side of the surface of the die expander body 1. A reinforcing device 2 is provided on the surface of the fixing frame 5. The reinforcing device 2 improves the stability of the die film. A safety device 3 is provided on the surface of the die expander body 1 at the position of the button 4.

[0028] Figure 1 , Figure 3 and Figure 5The reinforcing device 2 shown includes a fixing ring 21, on the surface of which four clamping plates 23 are fixedly connected. Fixing frames 24 are fixedly connected to the four sides of the fixing frame 5, with the clamping plates 23 interlocking with the inner walls of the fixing frames 24. Several evenly distributed protrusions 25 are fixedly connected to one side of the fixing ring 21. A fixing groove 22 is formed on the surface of the fixing frame 5, with the fixing ring 21 interlocking with the inner wall of the fixing groove 22. During the LED chip production process, when the wafer expander body 1 is used to diffuse and separate several wafers on the thin film, the inner wafer ring is first installed on the wafer expander disk 6, then the wafer thin film is placed on the wafer expander disk 6, and then the fixing ring 21 is placed in the fixing groove 22 on the surface of the fixing frame 5. The clamping plates 23 fixedly connected to the surface of the fixing ring 21 will insert into the fixing frames 25 on the surface of the fixing frame 5. 4. Inside the inner wall, several silicone protrusions 25 fixedly connected to the surface of the fixing ring 21 will contact and press against the wafer film. Then, rotate the pressure plate 9 to press it against the surface of the fixing frame 5. Then, operate the locking pin 10 to fix the position of the pressure plate 9. Then, place the outer crystal ring above the film. Then, operate the button 4. At this time, the expansion plate 6 will heat up, making the film soft. At the same time, the expansion plate 6 will rise. Then, the cylinder 7 will run to drive the pressure plate 8 to descend and contact and press against the outer crystal ring. At this time, the inner and outer crystal rings will clamp and fix the film, completing the expansion. At this time, when using the expansion machine body 1 to perform wafer diffusion and separation during the LED bead production process, the stability of the film can be better guaranteed, and abnormal slippage is less likely to occur. This makes the wafer separation and diffusion more uniform, improving the equipment's performance and work efficiency.

[0029] Figure 1 , Figure 2 and Figure 4 The reinforcing device 2 shown also includes a reinforcing ring 26 installed on one side of the fixing ring 21. The reinforcing ring 26 improves the connection strength between the pressure plate 9 and the fixing ring 21. The rubber reinforcing ring 26 further increases the friction when the fixing ring 21 and the clamping plate 23 come into contact and are squeezed, thereby better maintaining the position of the wafer film. The reinforcing device 2 also includes a reinforcing block 27 installed on the inner wall of the clamping plate 23. The reinforcing block 27 improves the connection stability between the clamping plate 23 and the fixing frame 24. The sponge reinforcing block 27 makes it less likely for gaps to occur when the clamping plate 23 is clamped onto the surface of the fixing frame 5, thereby further improving the limiting strength between the clamping plate 23 and the fixing ring 21. Positioning grooves 29 are respectively opened at the four corners of the surface of the fixing frame 4. Positioning rods 28 are inserted into the inner wall of the positioning grooves 29. The positioning rods 28 are connected and fixed to the surface of the fixing ring 21 through the insertion of the positioning grooves 29 and the positioning rods 28. When the film is placed on the surface of the holder 5, it can be further clamped, thereby better maintaining the stability of the film's position.

[0030] Figure 1 and Figure 4The safety device 3 shown includes a protective cover 31, wherein a connecting plate 32 is fixedly connected to the surface of the protective cover 31. The connecting plate 32 is rotatably connected to the mounting shaft 33 mounted on the surface of the die expander body 1. When the button 4 is operated and the die expander body 1 is debugged and set, the protective cover 31 is released. At this time, the connecting plate 32 fixedly connected to the surface of the protective cover 31 will rotate on the arc surface of the mounting shaft 33 fixedly connected to the surface of the die expander body 1 until the protective cover 31 rotates to the position of covering the button 4. At this time, when the die expander body 1 is running, the button 4 is not easily touched by the staff standing around, thereby ensuring the normal operation of the equipment and allowing the several LED chips on the film to be better diffused and separated.

[0031] Figure 1 and Figure 4 A fixing block 34 is fixedly connected to one side surface of the protective cover 31 shown. The fixing block 34 is engaged with the positioning frame 35 on the surface of the die expander body 1. The engagement between the fixing block 34 and the positioning frame 35 makes the protective cover 31 more stably cover the surface of the button 4, making it less prone to shaking. This makes the operation of the die expander body 1 more stable. The safety device 3 also includes a handle 36 installed on one side of the protective cover 31. The handle 36 improves the ease of use of the protective cover 31. The handle 36 makes it easier and faster to flip the protective cover 31, thus making the operation and protection of the button 4 faster.

[0032] Working principle: During the LED chip production process, when the wafer expander body 1 diffuses and separates several wafers on the thin film, firstly, the inner wafer ring is installed on the wafer expander disk 6, then the wafer thin film is placed on the wafer expander disk 6, and then the fixing ring 21 is placed in the fixing groove 22 on the surface of the fixing frame 5. The clamping plate 23 fixedly connected to the surface of the fixing ring 21 will be inserted into the inner wall of the fixing frame 24 on the surface of the fixing frame 5. At this time, several silicone protrusions 25 fixedly connected to the surface of the fixing ring 21 will contact and press against the wafer thin film, and the positioning rod 28 fixedly connected to the surface of the fixing ring 21 will be inserted into the inner wall of the positioning groove 29 on the surface of the fixing frame 5. Then, the pressure plate 9 is rotated to press the pressure plate 9 against the fixing frame. On the surface of 5, the pressure plate 9 will press against the reinforcing ring 26 fixed on the surface of the fixing ring 21. Then, the locking pin 10 will be operated to fix the position of the pressure plate 9. Then, the outer crystal ring will be placed above the film. Then, the button 4 will be operated. At this time, the crystal expansion disk 6 will be heated to soften the film. At the same time, the crystal expansion disk 6 will rise. Then, the cylinder 7 will run to drive the pressure plate 8 to descend and contact the outer crystal ring to press. At this time, the inner and outer crystal rings will clamp and fix the film, completing the crystal expansion. At this time, when using the crystal expansion machine body 1 to perform the diffusion and separation of the wafer during the production of LED beads, the stability of the film can be better guaranteed, and abnormal slippage is less likely to occur. This makes the separation and diffusion of the wafer more uniform, improving the equipment's performance and work efficiency.

[0033] When button 4 is used and the die expander body 1 is debugged and set, the protective cover 31 is released. At this time, the connecting plate 32 fixedly connected to the surface of the protective cover 31 will rotate on the arc surface of the mounting shaft 33 fixedly connected to the surface of the die expander body 1 until the protective cover 31 rotates to the position covering button 4. At this time, when the die expander body 1 is running, button 4 is not easily touched by the staff standing around, thus ensuring the normal operation of the equipment and allowing the several LED chips on the film to be better diffused and separated.

[0034] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A die expander for LED chips, comprising a die expander body (1), characterized in that: The surface of the die expander body (1) is provided with a fixing frame (5) and a die expander plate (6), wherein a pressure plate (9) is hinged to one side of the fixing frame (5), a button (4) is provided on one side of the surface of the die expander body (1), a cylinder (7) is installed at the top of the die expander body (1), wherein a pressure plate (8) is installed at the output end of the cylinder (7), a locking pin (10) is provided on one side of the surface of the die expander body (1), and a reinforcing device (2) is provided on the surface of the fixing frame (5), wherein the reinforcing device (2) contacts and squeezes the wafer film for fixing; the reinforcing device (2) includes The device includes a fixing ring (21), on which four clamping plates (23) are fixedly connected to the surface of the fixing ring (21). The fixing frame (5) is fixedly connected to the four sides of the fixing frame (5). The clamping plates (23) are inserted into the inner wall of the fixing frame (24). A number of evenly distributed protrusions (25) are fixedly connected to one side of the fixing ring (21). The fixing frame (5) has a fixing groove (22) on its surface. The fixing ring (21) is engaged with the inner wall of the fixing groove (22). The reinforcing device (2) also includes a reinforcing ring (26) installed on one side of the fixing ring (21). The reinforcing ring (26) improves the connection strength between the pressure plate (9) and the fixing ring (21); the strengthening device (2) also includes a reinforcing block (27) installed on the inner wall of the clamping plate (23), wherein the reinforcing block (27) improves the connection stability between the clamping plate (23) and the fixing frame (24); positioning grooves (29) are respectively opened at the four corners of the surface of the fixing frame (5), wherein a positioning rod (28) is inserted into the inner wall of the positioning groove (29), and the positioning rod (28) is fixedly connected to the surface of the fixing ring (21); a safety device is provided on the surface of the crystal expansion machine body (1) at the position of the button (4). The safety device (3) includes a protective cover (31), wherein a connecting plate (32) is fixedly connected to the surface of the protective cover (31), and the connecting plate (32) is rotatably connected to the mounting shaft (33) installed on the surface of the crystal expander body (1); a fixing block (34) is fixedly connected to one side surface of the protective cover (31), wherein the fixing block (34) is engaged with the positioning frame (35) on the surface of the crystal expander body (1); the safety device (3) also includes a handle (36) installed on one side of the protective cover (31), wherein the handle (36) improves the ease of use of the protective cover (31).

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