A surface mount light-emitting diode

Abstract

This utility model relates to a surface-mount LED in the field of light-emitting diodes (LEDs), comprising a bracket, a chip, a package, and leads. The chip has a solder layer on its bottom, through which it is soldered to the bracket. A groove is formed at the center of the top of the bracket, and a heat sink is vertically arranged inside the groove. The chip is attached to the heat sink. Leads are provided at both ends of the bracket. The two ends of the leads are soldered to the chip electrodes and the leads, respectively. The package includes a bottom shell and a top shell, and the package encloses the bracket. This utility model provides efficient heat dissipation and extended lifespan, comprehensive protection and stable performance, and stable power transmission to ensure normal LED illumination, solving many problems of traditional products.

Description

Technical Field

[0001] This utility model relates to the field of light-emitting diodes, and specifically to a surface-mount light-emitting diode. Background Technology

[0002] Surface mount LEDs are commonly used light-emitting elements and are widely used in electronic displays, lighting equipment and various consumer electronics products. Their performance and stability directly affect the use effect of the end products and they occupy an important position in the light display and lighting systems of various electronic devices.

[0003] Traditional surface-mount LEDs have significant shortcomings in their structural design. On the one hand, they lack a targeted and efficient heat dissipation structure, so the heat generated during chip operation cannot be quickly and effectively conducted away. Long-term heat accumulation can easily lead to chip performance degradation, thereby shortening the lifespan of the entire LED. On the other hand, traditional packaging methods do not provide comprehensive protection for the support, chip, and leads. Under the influence of external environmental factors, structural stability is prone to decline, which in turn damages the LED's performance and fails to guarantee normal light emission. Utility Model Content

[0004] The purpose of this invention is to address the above-mentioned defects by providing a surface-mount LED with a groove at the center of the top of the support and a vertically arranged heat dissipation column. It adopts a combination structure of a bottom shell and a top shell of the package, which solves the technical problems of poor chip heat dissipation leading to shortened lifespan and insufficient package protection leading to performance degradation in the prior art.

[0005] The objective of this utility model is achieved through the following means:

[0006] A surface-mount light-emitting diode (LED) includes a support, a chip, a package, and leads. The chip is a flip-chip structure made of GaN material and has an embedded InGaN light-emitting layer. A gold-tin alloy solder layer is provided on the bottom of the chip, and the chip is soldered to the support through the gold-tin alloy solder layer. A groove is formed at the center of the top of the support, and a heat sink is vertically arranged inside the groove. The chip is attached to the heat sink. Leads are provided at both ends of the support. The two ends of the leads are soldered to the chip electrode and the lead, respectively. The package includes a bottom shell and a top shell, and the package encloses the support.

[0007] By bonding the chip to the heat sink, the heat generated during chip operation can be quickly conducted to the heat sink, achieving efficient heat dissipation and preventing the chip from being damaged by overheating and shortening its lifespan. This solves the problem of poor heat dissipation performance of traditional surface-mount LEDs. By using the bottom and top shells of the package to enclose the support structure, all-round protection can be provided for the support structure, chip, and leads, improving the stability of the overall structure and its ability to resist external impacts, moisture, and other interference. This solves the problem of insufficient protection in traditional packaging, which makes the device performance susceptible to environmental influences. By connecting the chip electrodes and pins with leads, it is possible to ensure stable current transmission to the chip, ensuring normal chip light emission and solving the problem of unstable current transmission affecting the light emission effect.

[0008] Furthermore, the bottom of the heat dissipation column extends through and to the bottom of the bracket, and four limiting ribs are evenly arranged in a ring along the inner wall of the groove, and the limiting ribs are integrally formed with the groove. The heat dissipation column is used for heat dissipation of the chip.

[0009] Furthermore, a limiting groove is formed on the side of the chip near the limiting rib, and the limiting groove and the limiting rib are integrally formed. The limiting rib extends along the depth direction of the groove, and the top of the limiting rib is flush with the opening of the groove. The limiting rib improves the stability of chip fixation.

[0010] Furthermore, a protective protrusion ring is provided at the connection between the top shell and the bottom shell of the package, and the protective protrusion ring is integrally formed with the top shell and the bottom shell of the package, and the protective protrusion ring is used to increase the protection range.

[0011] Furthermore, the outer surface of the bottom shell of the package is provided with eight light prisms evenly distributed in a ring, and the light prisms are integrally formed with the bottom shell of the package, with the light prisms extending downward along the outer wall of the bottom shell of the package.

[0012] Furthermore, the top shell of the package is a hemispherical protrusion, and the bottom shell of the package is a conical structure, with the top shell and the bottom shell of the package being integrally formed.

[0013] The beneficial effects of this utility model are:

[0014] This utility model features a groove at the center of the top of the support, with a heat dissipation column vertically positioned within the groove. The chip is attached to the heat dissipation column, enabling rapid heat conduction and efficient heat dissipation. This solves the problem of poor heat dissipation in traditional surface-mount LED chips, which can lead to shortened lifespan. The package employs a combination of a bottom shell and a top shell to enclose the support, providing comprehensive protection for the support, chip, and leads. This enhances structural stability and resistance to external environmental interference, addressing the issue of insufficient protection in traditional packaging methods that can lead to performance degradation due to environmental influences. Furthermore, the leads are soldered to the chip electrodes and pins at both ends, ensuring stable current transmission and guaranteeing normal LED illumination. This solves the problem of unstable current transmission affecting the luminous effect. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a surface-mount light-emitting diode according to the present invention;

[0016] Figure 2 This is a cross-sectional view of the support structure of this utility model;

[0017] Figure 3 This is a cross-sectional view of the packaging structure of this utility model;

[0018] In the diagram, 1 is the bracket; 2 is the groove; 3 is the limiting rib; 4 is the chip; 5 is the heat sink; 6 is the solder layer; 7 is the pin; 8 is the lead wire; 9 is the bottom shell of the package; 10 is the top shell of the package; 11 is the protective protrusion ring; and 12 is the optical prism. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. This embodiment refers to... Figures 1-3 The specific implementation of this surface-mount light-emitting diode includes a support 1, a chip 4, a package and leads 8. The chip 4 is a flip-chip structure, made of GaN material and with an InGaN light-emitting layer. The bottom of the chip 4 is provided with a gold-tin alloy solder layer 6, and the chip 4 is soldered to the support 1 through the gold-tin alloy solder layer 6. A groove 2 is provided at the center of the top of the support 1, and a heat sink 5 is vertically arranged inside the groove 2. The chip 4 is attached to the heat sink 5. Both ends of the support 1 are provided with leads 7. The two ends of the leads 8 are soldered to the electrodes of the chip 4 and the leads 7, respectively. The package includes a bottom shell 9 and a top shell 10, and the package wraps around the support 1.

[0020] like Figure 2 As shown, the bottom of the heat dissipation column 5 extends through and to the bottom of the bracket 1. Four limiting ribs 3 are evenly arranged in a ring along the inner wall of the groove 2, and the limiting ribs 3 are integrally formed with the groove 2. The heat dissipation column 5 is used for heat dissipation of the chip 4.

[0021] like Figure 2 As shown, a limiting groove is formed on the side of the chip 4 near the limiting rib 3, and the limiting groove and the limiting rib 3 are integrally formed. The limiting rib 3 extends along the depth direction of the groove 2, and the top of the limiting rib 3 is flush with the opening of the groove 2. The limiting rib 3 improves the stability of the chip 4.

[0022] like Figure 1 and Figure 3 As shown, a protective protrusion ring 11 is provided at the connection between the top shell 10 and the bottom shell 9 of the package, and the protective protrusion ring 11 is integrally formed with the top shell 10 and the bottom shell 9 of the package.

[0023] like Figure 1 and Figure 3 As shown, the outer side of the bottom shell 9 of the package body is provided with eight light prisms 12 evenly distributed along a ring, and the light prisms 12 are integrally formed with the bottom shell 9 of the package body, and the light prisms 12 extend downward along the outer wall of the bottom shell 9 of the package body.

[0024] like Figure 1 and Figure 3 As shown, the top shell 10 of the package is a hemispherical protrusion, and the bottom shell 9 of the package is a conical structure. The top shell 10 and the bottom shell 9 of the package are integrally formed.

[0025] The working principle of a surface-mount LED in this embodiment is as follows: external current is input through pins 7 at both ends of the bracket 1, and the current is conducted to the electrodes of chip 4 by leads 8 to provide working power to chip 4; chip 4 is a flip-chip structure, made of GaN material and with an InGaN light-emitting layer built in. After being powered on, the InGaN light-emitting layer is excited to emit photons, completing the core conversion of electrical energy to light energy.

[0026] During the process, the groove 2 at the top center of the bracket 1 plays multiple roles: the heat dissipation column 5 vertically arranged inside the groove 2 fits with the chip 4, and the bottom of the heat dissipation column 5 extends through to the bottom of the bracket 1, which can quickly dissipate the heat generated by the chip 4 during operation, and avoid high temperature affecting the luminous efficiency and lifespan; at the same time, the four limiting ribs 3 evenly distributed in a ring on the inner wall of the groove 2 precisely match the groove on the side of the chip 4 near the limiting rib 3, which can firmly restrict the position of the chip 4, prevent it from shifting during operation or assembly, and ensure the stability of current conduction and heat dissipation fit.

[0027] Finally, the package, consisting of the bottom shell 9 and the top shell 10, encapsulates the support 1, providing dust and moisture protection for the internal support 1, chip 4, and other core components. The hemispherical protrusion of the top shell 10 optimizes the light emission angle, while the eight light prisms 12 evenly distributed along the annular shape on the outside of the bottom shell 9 further regulate the emitted light, improving the uniformity and utilization of light emission. The protective protrusion 11 at the connection between the top shell 10 and the bottom shell 9 enhances the sealing of the package connection, further strengthening the protective effect.

[0028] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A surface-mount light-emitting diode (LED), comprising a support, a chip, a package, and leads, wherein a solder layer is provided on the bottom of the chip, and the chip is soldered to the support through the solder layer, characterized in that: The top center of the bracket has a groove, and a heat dissipation column is vertically arranged inside the groove. The bottom of the heat dissipation column extends through and to the bottom of the bracket. The chip is attached to the heat dissipation column. Both ends of the bracket are provided with pins. The two ends of the lead wire are respectively soldered to the chip electrode and the pin. The package includes a bottom shell and a top shell. The package wraps around the bracket. The bottom shell of the package is provided with light prisms evenly distributed in a ring on the outside.

2. The surface-mount light-emitting diode according to claim 1, characterized in that: The inner wall of the groove is uniformly provided with four limiting ribs along the circumference, and the limiting ribs are integrally formed with the groove.

3. A surface-mount light-emitting diode according to claim 2, characterized in that: The chip has a limiting groove on the side near the limiting rib, and the limiting groove and the limiting rib are integrally formed. The limiting rib extends along the depth direction of the groove, and the top of the limiting rib is flush with the opening of the groove.

4. A surface-mount light-emitting diode according to claim 1, characterized in that: A protective protruding ring is provided at the connection between the top shell and the bottom shell of the package, and the protective protruding ring is integrally formed with the top shell and the bottom shell of the package.

5. A surface-mount light-emitting diode according to claim 1, characterized in that: The optical prism is integrally formed with the bottom shell of the package, and the optical prism extends downward along the outer wall of the bottom shell of the package.

6. A surface-mount light-emitting diode according to claim 1, characterized in that: The top shell of the package is a hemispherical protrusion, and the bottom shell of the package is a conical structure. The top shell and the bottom shell of the package are integrally formed.

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