A universal support structure for IC LED chips and IC LED chips

Abstract

This application relates to a universal support structure for IC LED chips and the IC LED chips themselves. By setting VDD pads, GND pads, data transmission pad 1, data transmission pad 2, additional pad 1, and additional pad 2 on the support body, and configuring circuit components 1 and 2, wherein one end of circuit component 1 is connected to additional pad 1 and the other end is connected to data transmission pad 1, and one end of circuit component 2 is connected to additional pad 2 and the other end is connected to data transmission pad 2, so that when the IC chip is connected to each pad in different ways, the signal input (DIN) and signal output (DOT) functions can be achieved through the cooperation of the aforementioned pads and embedded circuits. This allows the support body to be adapted to both A and B LED chips, eliminating the need to develop separate dedicated support structures for A and B IC LED chips, reducing development costs and time, and improving the versatility and utilization of the support body.

Description

Technical Field

[0001] This application relates to the field of light-emitting diodes, specifically to a general-purpose support structure for IC lamp beads and IC lamp beads. Background Technology

[0002] Currently, the field of IC (Integrated Circuit Light-Emitting Diode Lamp Bead) display device technology is developing rapidly. It is an integrated light-emitting device that combines integrated circuit (IC) and light-emitting diode (LED). With its advantages such as high integration, precise control and stable light emission, it has been widely used in various display and lighting products such as LED light strips, display screen backlights, and decorative lighting.

[0003] In related technologies, IC-type LED beads are differentiated into several different types. Taking A and B as examples, to adapt to the transmission interface requirements of IC beads A and B respectively, the industry generally adopts a technical solution of "one LED bead corresponding to one dedicated bracket (or substrate)". For the interface logic of LED bead A, a dedicated A-bead bracket (or substrate) is designed and manufactured; for the interface logic of LED bead B, a dedicated B-bead bracket (or substrate) is designed and manufactured separately. Then, the core components such as integrated circuit chips and light-emitting diode chips are assembled onto their respective dedicated brackets (or substrates), ultimately forming two IC bead products, A and B, that can adapt to the front and rear rotation requirements of the light strip.

[0004] However, developing dedicated brackets (or substrates) for IC LEDs A and B separately has the problems of high development costs, long development cycles, and the ability to only adapt to a single type of LED, resulting in poor versatility and low utilization. Summary of the Invention

[0005] This application provides a universal support structure for IC LEDs and IC LEDs, which can solve the problems of high development costs and long development cycles, and the fact that the support (or substrate) can only be adapted to a single type of LED, resulting in poor versatility and low utilization rate, which are problems of traditionally developing dedicated brackets (or substrates) for two types of IC LEDs, A and B.

[0006] In a first aspect, embodiments of this application provide a universal support structure for IC LED chips, comprising: The support body is equipped with VDD pad, GND pad, data transmission pad one, data transmission pad two, and at least one set of additional pad one and additional pad two; A circuit component one is installed on the support body, one end of the circuit component one is connected to the newly added pad one, and the other end is connected to the data transmission pad one; Line component two is installed on the support body. One end of line component two is connected to the newly added pad two, and the other end is connected to the data transmission pad two.

[0007] In conjunction with the first aspect, in one embodiment, the first circuit assembly and the second circuit assembly are embedded in the support body.

[0008] In conjunction with the first aspect, in one embodiment, the support body is a CHIP substrate; The line component one includes: A groove is formed on the back side of the CHIP substrate; Line 1 is embedded in the groove 1, and one end of Line 1 is connected to the pin of the newly added pad 1, and the other end is connected to the pin of the data transmission pad 1. The second line component includes: Groove 2 is formed on the back side of the CHIP substrate; Line 2 is embedded in the groove 2, and one end of line 2 is connected to the pin of the newly added pad 2, and the other end is used to connect with the pin of the data transmission pad 2.

[0009] In conjunction with the first aspect, in one embodiment, the universal support structure for IC LED beads further includes: An ink layer that at least partially covers the surfaces of line one and line two.

[0010] In conjunction with the first aspect, in one embodiment, the support body is a CHIP substrate; The line component one includes: Recess 1 is formed on the front side of the CHIP substrate; Line 1 is embedded in the groove 1, and one end of Line 1 is connected to the newly added pad 1, and the other end of Line 1 is connected to the data transmission pad 1. The second line component includes: Groove 2 is formed on the back side of the CHIP substrate; Line 2 is embedded in the groove 2, and one end of Line 2 is connected to the pin of the newly added pad 2, and the other end is connected to the pin of the data transmission pad 2.

[0011] In conjunction with the first aspect, in one embodiment, the universal support structure for IC LED beads further includes: A resin layer that at least partially covers the surface of the first circuit; An ink layer that at least partially covers the surface of the second line.

[0012] In conjunction with the first aspect, in one embodiment, the supporting body is a TOP bracket; The line component one includes: Recess 1 is formed on the front of the TOP bracket; Line 1 is embedded in the groove 1, and one end of Line 1 is connected to the newly added pad 1, and the other end of Line 1 is connected to the data transmission pad 1. The second line component includes: Recess 2 is formed on the front of the TOP bracket; Line 2 is embedded in the groove 2, and one end of Line 2 is connected to the newly added pad 2, and the other end is connected to the data transmission pad 2.

[0013] In conjunction with the first aspect, in one embodiment, the universal support structure for IC LED beads further includes: A resin layer that at least partially covers the surfaces of line one and line two.

[0014] In conjunction with the first aspect, in one embodiment, the first data transmission pad is a DIN pad, and the second data transmission pad is a DOT pad; Alternatively, the first data transmission pad may be a DOT pad, and the second data transmission pad may be a DIN pad.

[0015] Secondly, embodiments of this application provide an IC lamp bead, which includes the general-purpose support structure for IC lamp beads as described in some of the above embodiments.

[0016] The beneficial effects of the technical solutions provided in this application include: By setting VDD pads, GND pads, data transmission pad 1, data transmission pad 2, and at least one additional pad 1 and additional pad 2 on the support body, and configuring circuit component 1 and circuit component 2, wherein one end of circuit component 1 is connected to additional pad 1 and the other end is connected to data transmission pad 1, and one end of circuit component 2 is connected to additional pad 2 and the other end is connected to data transmission pad 2, when the IC chip is connected to each pad in different ways, the function conversion of signal input (DIN) and signal output (DOT) can be realized through the cooperation of the above-mentioned pads and the embedded circuit, so that the support body can be adapted to both LED chips A and B, without the need to develop dedicated support structures for each type of IC chip A and B, reducing development costs and cycle, and improving the versatility and utilization of the support body. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the front structure of the first CHIP substrate; Figure 2 for Figure 1 A schematic diagram of the rear structure; Figure 3 A schematic diagram of the front structure of the first CHIP substrate used for LED chip A; Figure 4 A schematic diagram of the front structure of the first CHIP substrate used for B-type LEDs; Figure 5 This is a schematic diagram of the front structure of the second CHIP substrate; Figure 6 for Figure 5 A schematic diagram of the rear structure; Figure 7 A schematic diagram of the front structure of the second CHIP substrate used for LED chip A; Figure 8 A schematic diagram of the front structure of the second CHIP substrate used for the B-type lamp bead; Figure 9 This is a schematic diagram of the front structure of the TOP support; Figure 10 A schematic diagram of the front structure of using the TOP bracket for LED bead A; Figure 11 A schematic diagram of the front structure of the TOP bracket used for B LED beads.

[0019] In the diagram: 1. Support body; 2. VDD pad; 3. GND pad; 4. Data transmission pad 1; 5. Data transmission pad 2; 6. New pad 1; 7. New pad 2; 8. Circuit assembly 1; 9. Circuit assembly 2; 10. Ink layer; 11. IC driver chip; 12. Light-emitting chip 1; 13. Light-emitting chip 2; 14. Light-emitting chip 3; 15. Resin layer. Detailed Implementation

[0020] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0021] It is important to understand that the field of IC (Integrated Circuit Light-Emitting Diode LampBead) display device technology is developing rapidly. It is an integrated light-emitting device that combines integrated circuits (ICs) and light-emitting diodes (LEDs). With its advantages of high integration, precise control, and stable light emission, it has been widely used in various display and lighting products such as LED light strips, display screen backlights, and decorative lighting.

[0022] In practical applications, LED light strips often need to be rotated according to the installation layout (such as interior decoration, outdoor advertising screen splicing, smart furniture lighting wiring, etc.). When the light strip is rotated, the signal input interface (DIN, Data Input) and signal output interface (DOT, Data Output) of the IC lamp beads must be swapped accordingly to ensure normal signal transmission and continuous lighting of the light strip. This requirement has led to IC-type LED lamp beads being divided into two different types, A and B.

[0023] Without altering the design of the integrated circuit chip within the IC LED bead, IC-based LED beads are differentiated into several different types. Taking types A and B as examples, to adapt to the transmission interface requirements of IC LED beads A and B respectively, the industry generally adopts a technical solution of "one LED bead corresponding to one dedicated bracket (or substrate)". Specifically, for the interface logic of LED bead A, a dedicated A-bead bracket (or substrate) is designed and manufactured; for the interface logic of LED bead B, a dedicated B-bead bracket (or substrate) is designed and manufactured separately. Then, the core components such as the integrated circuit chip and the light-emitting diode chip are assembled onto their respective dedicated support bodies 1, ultimately forming two IC LED bead products, A and B, that can respectively adapt to the requirements of the LED strip's forward and backward rotation.

[0024] However, traditional solutions require the development of dedicated brackets (or substrates) for the two IC LED chips, A and B, which results in high development costs and long development cycles. Furthermore, the brackets (or substrates) can only be used with a single type of LED chip, leading to poor versatility and low utilization.

[0025] This application provides a universal support structure for IC LED chips, which can solve the problems of high development costs and long development cycles, and the fact that the support (or substrate) can only be adapted to a single type of LED chip, resulting in poor versatility and low utilization rate, which are caused by the traditional development of dedicated brackets (or substrates) for two types of IC LED chips, A and B.

[0026] Firstly, such as Figure 1 , Figure 2 , Figure 5 , Figure 6 and Figure 9 As shown, this application provides a universal support structure for IC LED chips, comprising: a support body 1, which is equipped with a VDD pad 2, a GND pad 3, a data transmission pad 4, a data transmission pad 5, and at least one set of additional pads 6 and 7; a circuit component 8, which is mounted on the support body 1, with one end of the circuit component 8 connected to the additional pad 6 and the other end connected to the data transmission pad 4; and a circuit component 9, which is mounted on the support body 1, with one end of the circuit component 9 connected to the additional pad 7 and the other end connected to the data transmission pad 5.

[0027] In this embodiment, by setting VDD pad 2, GND pad 3, data transmission pad 1 4, data transmission pad 2 5, and at least one set of additional pad 1 6 and additional pad 2 7 on the support body 1, and configuring circuit component 1 8 and circuit component 2 9, wherein one end of circuit component 1 8 is connected to additional pad 1 6 and the other end is connected to data transmission pad 1 4, and one end of circuit component 2 9 is connected to additional pad 2 7 and the other end is connected to data transmission pad 2 5, when the IC chip is wired to each pad in different ways, the function conversion of signal input (DIN) and signal output (DOT) can be realized through the cooperation of the above-mentioned pads and the embedded circuit, so that the support body 1 can be adapted to both LED A and LED B, without the need to develop dedicated support structures for each of the two types of IC LEDs, reducing development costs and cycle, and improving the versatility and utilization of the support body 1.

[0028] In this embodiment, a set of data input and output (data transmission pad 1 4 and data transmission pad 2 5) is used as an example. When there are other functional requirements, such as resume from interruption, the number of newly added pad 1 6 and newly added pad 2 7 will increase accordingly.

[0029] In conjunction with the first aspect, in one embodiment, line assembly 8 and line assembly 9 are embedded within the support body 1.

[0030] In this embodiment, the fact that circuit component 8 and circuit component 9 are embedded in the support body 1 can enhance the reliability of the circuit connection and avoid the IC lamp beads being affected by external factors.

[0031] In conjunction with the first aspect, in one implementation, such as Figure 1 , Figure 2 and Figure 3 As shown, the support body 1 is a CHIP substrate, data transmission pad 4 is a DIN pad, and data transmission pad 5 is a DOT pad; the circuit assembly 8 includes: a groove 1, which is formed on the back of the CHIP substrate; a circuit 1, which is embedded in the groove 1, and one end of the circuit 1 is connected to the pin of the newly added pad 6, and the other end of the circuit 1 is connected to the pin of the data transmission pad 4; the circuit assembly 9 includes: a groove 2, which is formed on the back of the CHIP substrate; a circuit 2, which is embedded in the groove 2, and one end of the circuit 2 is connected to the pin of the newly added pad 7, and the other end of the circuit 2 is used to connect to the pin of the data transmission pad 5.

[0032] In this embodiment, the support body 1 is a CHIP substrate, the data transmission pad 4 is a DIN pad, and the data transmission pad 5 is a DOT pad. The circuit assembly 8 includes a groove 1 formed on the back of the CHIP substrate and a circuit 1 embedded in the groove 1. One end of the circuit 1 is connected to the pin of the newly added pad 6, and the other end is connected to the pin of the data transmission pad 4. The circuit assembly 9 includes a groove 2 formed on the back of the CHIP substrate and a circuit 2 embedded in the groove 2. One end of the circuit 2 is connected to the pin of the newly added pad 7, and the other end is connected to the pin of the data transmission pad 5. The electrical connection between the DIN pad, the DOT pad and the corresponding newly added pad pin is realized through the circuit in the groove on the back of the CHIP substrate. Different wire bonding methods are used to adapt to the use of the A-type LED on the first CHIP substrate.

[0033] In conjunction with the first aspect, in one implementation, such as Figure 1 , Figure 2 and Figure 4 As shown, the support body 1 is a CHIP substrate, data transmission pad 4 is a DOT pad, and data transmission pad 5 is a DIN pad; the circuit assembly 8 includes: a groove 1, which is formed on the back of the CHIP substrate; a circuit 1, which is embedded in the groove 1, and one end of the circuit 1 is connected to the pin of the newly added pad 6, and the other end of the circuit 1 is connected to the pin of the data transmission pad 4; the circuit assembly 9 includes: a groove 2, which is formed on the back of the CHIP substrate; a circuit 2, which is embedded in the groove 2, and one end of the circuit 2 is connected to the pin of the newly added pad 7, and the other end of the circuit 2 is used to connect to the pin of the data transmission pad 5.

[0034] In this embodiment, the support body 1 is a CHIP substrate, the data transmission pad 4 is a DOT pad, and the data transmission pad 5 is a DIN pad. The circuit assembly 8 includes a groove 1 formed on the back of the CHIP substrate and a circuit 1 embedded in the groove 1. One end of the circuit 1 is connected to the pin of the newly added pad 6, and the other end is connected to the pin of the data transmission pad 4. The circuit assembly 9 includes a groove 2 formed on the back of the CHIP substrate and a circuit 2 embedded in the groove 2. One end of the circuit 2 is connected to the pin of the newly added pad 7, and the other end is connected to the pin of the data transmission pad 5. The electrical connection between the DOT pad, the DIN pad and the corresponding newly added pad pin is realized through the circuit in the groove on the back of the CHIP substrate. Different wire bonding methods are used to adapt to the B-type LEDs using the first CHIP substrate.

[0035] In the previous embodiments and this embodiment, the pin definitions of the IC chip remain unchanged. For the LED turning scenario, only the direction of data input and data output needs to be reversed. The following will combine... Figure 3 , Figure 4 The principle of this embodiment will be explained in detail.

[0036] See Figure 3 External data is transmitted to the IC chip's data input pins via transfer pad 4, i.e., the DIN pad. Figure 3 The first pin in the first row of the IC chip is used for data input; the data output pin of the IC chip is used for data output. Figure 3 The second pin in the second row (the second pin in the circuit) is connected to the data transmission pad 25, i.e., the DOT pad, based on the pin definition. This enables data output and transmits the data to the DIN pad of the next IC chip. Figure 3 Enables data to be transmitted from left to right.

[0037] See Figure 4 External data is transmitted via pad 2.5, i.e., DIN pad, in combination. Figure 2 Due to the design of the circuit components, the data transfer pad 25 transmits data to the data input pin of the IC chip via the back circuit component 29 and the newly added pad 17. Figure 4 The first pin in the first row); IC chip data output pin ( Figure 4 The second pin in the second row (in the diagram) is connected to the newly added pad 6 based on the pin definition. This newly added pad 6 is then connected to the data transmission pad 4 via the back panel wiring assembly 8, defined as a DOT pad, to achieve data output. The data is then output to the DIN pad of the next IC LED chip. Figure 4 This enables data transmission from right to left. For the same support structure, this is achieved through... Figure 3 and Figure 4 Two connection methods enable compatibility with both A and B LED chips.

[0038] In conjunction with the first aspect, in one implementation, such as Figure 2 As shown, the general-purpose support structure for IC LED beads also includes an ink layer 10, which at least partially covers the surfaces of line one and line two.

[0039] In this embodiment, the ink layer 10 at least partially covers the surfaces of line one and line two. The ink layer 10 forms an insulating protection for line one and line two, which can prevent short circuits caused by solder bridging between line one and line two, and ensure the signal transmission stability of the back circuit of the CHIP substrate during the process of realizing the electrical connection between the data transmission pad and the newly added pad pin.

[0040] In conjunction with the first aspect, in one implementation, such as Figure 5 , Figure 6 and Figure 7 As shown, the support body 1 is a CHIP substrate, data transmission pad 4 is a DIN pad, and data transmission pad 5 is a DOT pad; the circuit assembly 8 includes: a groove 1, which is formed on the front side of the CHIP substrate; a circuit 1, which is embedded in the groove 1, and one end of the circuit 1 is connected to the newly added pad 6, and the other end of the circuit 1 is connected to the data transmission pad 4; the circuit assembly 9 includes: a groove 2, which is formed on the back side of the CHIP substrate; a circuit 2, which is embedded in the groove 2, and one end of the circuit 2 is connected to the pin of the newly added pad 7, and the other end of the circuit 2 is connected to the pin of the data transmission pad 5.

[0041] In this embodiment, the support body 1 is a CHIP substrate, the data transmission pad 4 is a DIN pad, and the data transmission pad 5 is a DOT pad. The circuit assembly 8 includes a groove 1 on the front side of the CHIP substrate and a circuit 1 embedded in the groove 1. One end of the circuit 1 is connected to the new pad 6, and the other end is connected to the data transmission pad 4. The circuit assembly 9 includes a groove 2 on the back side of the CHIP substrate and a circuit 2 embedded in the groove 2. One end of the circuit 2 is connected to the pin of the new pad 7, and the other end is connected to the pin of the data transmission pad 5. The DIN pad and the new pad 6 are directly connected through the circuit in the groove on the front side of the CHIP substrate, and the DOT pad and the pin of the new pad 7 are connected through the circuit in the groove on the back side. Different wire bonding methods are combined to adapt to the use of the A-type LED on the second CHIP substrate.

[0042] In conjunction with the first aspect, in one implementation, such as Figure 5 , Figure 6 and Figure 8As shown, the support body 1 is a CHIP substrate, data transmission pad 4 is a DOT pad, and data transmission pad 5 is a DIN pad; the circuit assembly 8 includes: a groove 1, which is formed on the front side of the CHIP substrate; a circuit 1, which is embedded in the groove 1, and one end of the circuit 1 is connected to the newly added pad 6, and the other end of the circuit 1 is connected to the data transmission pad 4; the circuit assembly 9 includes: a groove 2, which is formed on the back side of the CHIP substrate; a circuit 2, which is embedded in the groove 2, and one end of the circuit 2 is connected to the pin of the newly added pad 7, and the other end of the circuit 2 is connected to the pin of the data transmission pad 5.

[0043] In this embodiment, the support body 1 is a CHIP substrate, the data transmission pad 4 is a DOT pad, and the data transmission pad 5 is a DIN pad. The circuit assembly 8 includes a groove 1 on the front side of the CHIP substrate and a circuit 1 embedded in the groove 1. One end of the circuit 1 is connected to the new pad 6, and the other end is connected to the data transmission pad 4. The circuit assembly 9 includes a groove 2 on the back side of the CHIP substrate and a circuit 2 embedded in the groove 2. One end of the circuit 2 is connected to the pin of the new pad 7, and the other end is connected to the pin of the data transmission pad 5. The DOT pad and the new pad 6 are directly connected through the circuit in the groove on the front side of the CHIP substrate, and the DIN pad and the pin of the new pad 7 are connected through the circuit in the groove on the back side. Different wire bonding methods are combined to adapt to the B-type LEDs using the second CHIP substrate.

[0044] In the previous embodiments and this embodiment, the pin definitions of the IC chip remain unchanged. For the LED turning scenario, only the direction of data input and data output needs to be reversed. The following will combine... Figure 7 , Figure 8 The principle of this embodiment will be explained in detail.

[0045] See Figure 7 External data is transmitted to the IC chip's data input pins via transfer pad 4, i.e., the DIN pad. Figure 7 The first pin in the first row of the IC chip is used for data input; the data output pin of the IC chip is used for data output. Figure 7 The second pin of the second row (the second pin) is connected to the data transmission pad 25, i.e., the DOT pad, based on the pin definition, to realize data output and transmit the data to the DIN pad of the next IC bead. Figure 3 Enables data to be transmitted from left to right.

[0046] See Figure 8 External data is transmitted via pad 2.5, i.e., DIN pad, in combination. Figure 6 Due to the design of the circuit components, the data transfer pad 25 transmits data to the data input pin of the IC chip via the back circuit component 29 and the newly added pad 17. Figure 8The first pin in the first row); IC chip data output pin ( Figure 8 The second pin in the second row (in the diagram) is connected to the newly added pad 6 based on the pin definition. This newly added pad 6 is then connected to the data transmission pad 4 via the front-side wiring assembly 8, defined as a DOT pad, to achieve data output. The data is then output to the DIN pad of the next IC LED chip. Figure 8 This enables data transmission from right to left. For the same support structure, this is achieved through... Figure 7 and Figure 8 Two connection methods enable compatibility with both A and B LED chips.

[0047] In conjunction with the first aspect, in one embodiment, the IC lamp bead universal support structure further includes: a resin layer 15, which at least partially covers the surface of line one; and an ink layer 10, which at least partially covers the surface of line two.

[0048] In this embodiment, a resin layer 15 is at least partially covering the surface of line one, and an ink layer 10 is at least partially covering the surface of line two. The resin layer 15 protects line one in the groove on the front side of the CHIP substrate, preventing line one from oxidizing or being damaged by external forces, and also smoothing the area where line one is located to facilitate stable fixing of the IC chip and subsequent wire bonding operations. The ink layer 10 provides insulation protection for line two in the groove on the back side of the CHIP substrate, preventing short circuits between line two and other structures. Through the cooperation of the resin layer 15 and the ink layer 10, stable electrical connections between the data transmission pads and the newly added pads (or their pins) of line one and line two are ensured.

[0049] In conjunction with the first aspect, in one implementation, such as Figure 9 and Figure 10 As shown, the support body 1 is a TOP bracket, the data transmission pad 4 is a DIN pad, and the data transmission pad 5 is a DOT pad; the circuit assembly 8 includes: a groove 1, which is formed on the front of the TOP bracket; a circuit 1, which is embedded in the groove 1, and one end of the circuit 1 is connected to the newly added pad 6, and the other end of the circuit 1 is connected to the data transmission pad 4; the circuit assembly 9 includes: a groove 2, which is formed on the front of the TOP bracket; a circuit 2, which is embedded in the groove 2, and one end of the circuit 2 is connected to the newly added pad 7, and the other end of the circuit 2 is connected to the data transmission pad 5.

[0050] In this embodiment, the support body 1 is a TOP bracket, the data transmission pad 4 is a DIN pad, and the data transmission pad 5 is a DOT pad. The circuit assembly 8 includes a groove 1 on the front of the TOP bracket and a circuit 1 embedded in the groove 1. One end of the circuit 1 is connected to the new pad 6, and the other end is connected to the data transmission pad 4. The circuit assembly 9 includes a groove 2 on the front of the TOP bracket and a circuit 2 embedded in the groove 2. One end of the circuit 2 is connected to the new pad 7, and the other end is connected to the data transmission pad 5. The direct connection between the DIN pad and the new pad 6, and the DOT pad and the new pad 7, are achieved through the circuit in the groove on the front of the TOP bracket. Different wiring methods are combined to adapt to the A-type LEDs using this TOP bracket.

[0051] In conjunction with the first aspect, in one implementation, such as Figure 9 and Figure 11 As shown, the support body 1 is a TOP bracket, the data transmission pad 4 is a DOT pad, and the data transmission pad 5 is a DIN pad; the circuit assembly 8 includes: a groove 1, which is formed on the front of the TOP bracket; a circuit 1, which is embedded in the groove 1, and one end of the circuit 1 is connected to the newly added pad 6, and the other end of the circuit 1 is connected to the data transmission pad 4; the circuit assembly 9 includes: a groove 2, which is formed on the front of the TOP bracket; a circuit 2, which is embedded in the groove 2, and one end of the circuit 2 is connected to the newly added pad 7, and the other end of the circuit 2 is connected to the data transmission pad 5.

[0052] In this embodiment, the support body 1 is a TOP bracket, the data transmission pad 4 is a DOT pad, and the data transmission pad 5 is a DIN pad. The circuit assembly 8 includes a groove 1 on the front of the TOP bracket and a circuit 1 embedded in the groove 1. One end of the circuit 1 is connected to the new pad 6, and the other end is connected to the data transmission pad 4. The circuit assembly 9 includes a groove 2 on the front of the TOP bracket and a circuit 2 embedded in the groove 2. One end of the circuit 2 is connected to the new pad 7, and the other end is connected to the data transmission pad 5. The DOT pad and the new pad 6, and the DIN pad and the new pad 7 are directly connected through the circuit in the groove on the front of the TOP bracket, respectively. Different wiring methods are combined to adapt to the B-type LEDs using this TOP bracket.

[0053] In the previous embodiments and this embodiment, the pin definitions of the IC chip remain unchanged. For the LED turning scenario, only the direction of data input and data output needs to be reversed. The following will combine... Figure 10 , Figure 11 The principle of this embodiment will be explained in detail.

[0054] See Figure 10External data is transmitted to the IC chip's data input pins via transfer pad 4, i.e., the DIN pad. Figure 10 The first pin in the second row of the IC chip is used for data input; the data output pin of the IC chip ( Figure 10 The third pin in the second row (of the IC) is connected to the data transmission pad 25 (DOT pad) based on the pin definition. This enables data output and transmits the data to the DIN pad of the next IC chip. Figure 3 Enables data to be transmitted from left to right.

[0055] See Figure 11 External data is transmitted via pad 2.5, i.e., DIN pad, in combination. Figure 9 Due to the design of the circuit components, the data transfer pad 25 transmits data to the data input pin of the IC chip via the newly added pad 7 through the front circuit component 29. Figure 11 The first pin in the second row); IC chip data output pin ( Figure 11 The third pin in the second row of the circuit is connected to the newly added pad 6 based on the pin definition. At this time, the newly added pad 6 is connected to the data transmission pad 4 through the front circuit assembly 8, defined as the DOT pad, to realize data output, and the data is output to the DIN pad of the next IC bead. Figure 11 This enables data transmission from right to left. For the same support structure, this is achieved through... Figure 10 and Figure 11 Two connection methods enable compatibility with both A and B LED chips.

[0056] In conjunction with the first aspect, in one embodiment, the IC lamp bead universal support structure further includes: a resin layer 15, which at least partially covers the surfaces of line one and line two.

[0057] In this embodiment, a resin layer 15 is also included, which at least partially covers the surfaces of Line 1 and Line 2. The resin layer 15 protects Line 1 and Line 2 in the groove on the front of the TOP bracket, preventing oxidation of the lines or short circuits caused by external contact. At the same time, it can flatten the area where the lines are located to ensure the stable fixation of the IC chip and the reliability of the wire bonding. It ensures that Line 1 and Line 2 respectively achieve stable electrical connection between the data transmission pads and the corresponding newly added pads, and combines different wire bonding methods to adapt to the interface configuration of IC LEDs A and B.

[0058] In conjunction with the first aspect, in the above embodiments, both resin and ink at least partially cover the circuit. When other components need to be covered with insulation protection, the coverage area of ​​resin and ink can be expanded for insulation protection.

[0059] In conjunction with the first aspect, in one implementation, such as Figure 3 , Figure 4 , Figure 7 , Figure 8 , Figure 10 and Figure 11 As shown, the general-purpose support structure for IC LED beads also includes: an IC driver chip 11, a light-emitting chip one 12, a light-emitting chip two 13, and a light-emitting chip three 14 mounted on the front of the support body 1.

[0060] In this embodiment, the IC driver chip 11 receives signals and controls the lighting state of the first light-emitting chip 12, the second light-emitting chip 13, and the third light-emitting chip 14 by connecting to each pad. In conjunction with the pad assembly and embedded circuit on the support body 1, the signal driving and light-emitting functions are integrated while realizing the interface configuration adaptation of the two IC lamp beads A and B.

[0061] In summary, an IC LED chip with a shared bracket structure for both A and B LEDs allows for easy switching of inputs and outputs on the same bracket (or substrate) without altering the bracket (or substrate). This reduces development costs and time, and improves the utilization rate of the bracket (or substrate) while enabling the sharing of A and B LEDs.

[0062] ① By adding two more pads and two more pins, and through the connection between the pins and different bonding methods, LEDs A and B can be shared – a chip substrate design (e.g. Figure 1 and Figure 2 (as shown) and a TOP bracket design (such as) Figure 9 (as shown) ② By adding two more pads and one more pin, and connecting the two pads and the two pins with different bonding methods, the A and B lamps can be shared – the second CHIP substrate design (e.g. Figure 5 and Figure 6 (as shown) ③ The connection lines of the front pads and the back pins are all slotted and then electroplated, which saves space. In particular, the front line adopts this method to fix the IC driver chip 11 on the line, which has a high space utilization rate. ④ The front connection lines are covered and filled with BT resin material. Since the BT resin material is hard after hardening, it is easy to wire bond after fixing the IC driver chip 11, avoiding the problem of wire bonding not sticking (the ink is soft and easily causes the wire bonding not to stick, so the pin connection lines on the back are covered with ink).

[0063] In addition, the following is a complete description of the first CHIP substrate structure for IC LED chips (AB lamps): like Figure 1 and Figure 2 As shown, the pins of the newly added pad 6 and the data transmission pad 4 are connected via the back wiring, and the pins of the data transmission pad 5 and the newly added pad 7 are connected. This allows for the sharing of LEDs A and B through different wiring methods (e.g., ...). Figure 3 and Figure 4(as shown) Among them, electroplating is used to fill holes to improve airtightness, and new pads 1-6, 2-7 and pins of new pad 1-6 and 2-7 are added. The pins of new pad 1-6 and data transmission pad 1-4 are connected through the back circuit, and the pins of data transmission pad 2-5 and new pad 2-7 are connected. By combining different wiring methods, A and B lamps can be shared. The circuits connecting the pins on the back are first grooved on the back of the support body 1 (CHIP substrate), then the circuits are electroplated in the grooves, and finally an ink layer 10 is covered on the circuits to avoid short circuits between the circuits.

[0064] In addition, the following is a complete description of a second CHIP substrate structure for IC LED chips (AB lamps): like Figure 5 and Figure 6 As shown, the newly added pad 6 and data transmission pad 4 are connected by wiring, and the pins of the newly added pad 7 and data transmission pad 5 are connected by wiring. In addition, different wire bonding methods are used to achieve the sharing of A and B lamps. Compared with the first CHIP substrate design, one less hole is drilled, which reduces costs. Among them, by electroplating to fill holes (improving airtightness, reducing space, and improving utilization), new pad 1 6 and new pad 2 7 are added to the front side. Before the new pad 1 6 and data transmission pad 1 4, the front side is grooved and the circuit is electroplated in the groove. A resin layer 15 is covered on the circuit. After hardening, it is relatively hard and will not cause the IC driver chip to not stick to the wire bonding. The ink hardens relatively softly and is easy to cause the wire bonding to not stick. The lines connecting the pins of the newly added pad 2 7 on the back and the pins of the data transmission pad 2 5 are first grooved on the back of the substrate, then the lines are electroplated in the grooves, and finally the ink layer 10 is covered on the lines to avoid short circuits between the pin lines.

[0065] Additionally, the following is a complete description of a single TOP bracket structure for a type of IC LED chip (AB LEDs): like Figure 9 As shown, two additional pads are designed in the TOP bracket, namely pad 6 and pad 7. The front side of pad 6 and data transmission pad 4, and pad 7 and data transmission pad 5 are grooved, and the groove is filled with a resin layer 15 to prevent the IC driver chip 11 from not sticking during wire bonding. This prevents short circuits and oxidation of the circuits, and fills the groove to stabilize the IC driver chip 11. The circuits are electroplated in the groove.

[0066] Among them, the newly added pad 6 and data transmission pad 4, as well as the newly added pad 7 and data transmission pad 5, will be connected, and with different wiring methods, the A and B lamps can share this TOP bracket.

[0067] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0068] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0069] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A universal support structure for IC LED chips, characterized in that, It includes: The support body (1) is equipped with VDD pad (2), GND pad (3), data transmission pad one (4), data transmission pad two (5) and at least one set of additional pad one (6) and additional pad two (7). Line component 1 (8) is installed on the support body (1), one end of the line component 1 (8) is connected to the new pad 1 (6), and the other end is connected to the data transmission pad 1 (4); Line component two (9) is installed on the support body (1). One end of the line component two (9) is connected to the newly added pad two (7), and the other end is connected to the data transmission pad two (5).

2. The universal support structure for IC LED beads as described in claim 1, characterized in that, The first line component (8) and the second line component (9) are embedded in the support body (1).

3. The universal support structure for IC LED beads as described in claim 2, characterized in that, The supporting body (1) is a CHIP substrate; The line component one (8) includes: A groove is formed on the back side of the CHIP substrate; Line 1 is embedded in the groove 1, and one end of Line 1 is connected to the pin of the newly added pad 1 (6), and the other end is connected to the pin of the data transmission pad 1 (4). The second line component (9) includes: Groove 2 is formed on the back side of the CHIP substrate; Line 2 is embedded in the groove 2, and one end of Line 2 is connected to the pin of the newly added pad 2 (7), and the other end is used to connect to the pin of the data transmission pad 2 (5).

4. The universal support structure for IC LED beads as described in claim 3, characterized in that, The general-purpose support structure for IC LED chips also includes: An ink layer (10) at least partially covers the surfaces of line one and line two.

5. The universal support structure for IC LED beads as described in claim 2, characterized in that, The supporting body (1) is a CHIP substrate; The line component one (8) includes: Recess 1 is formed on the front side of the CHIP substrate; Line 1 is embedded in the groove 1, and one end of Line 1 is connected to the newly added pad 1 (6), and the other end is connected to the data transmission pad 1 (4); The second line component (9) includes: Groove 2 is formed on the back side of the CHIP substrate; Line 2 is embedded in the groove 2, and one end of Line 2 is connected to the pin of the newly added pad 2 (7), and the other end is connected to the pin of the data transmission pad 2 (5).

6. The universal support structure for IC LED beads as described in claim 5, characterized in that, The general-purpose support structure for IC LED chips also includes: A resin layer (15) at least partially covers the surface of the first circuit; An ink layer (10) at least partially covers the surface of the second line.

7. The universal support structure for IC LED beads as described in claim 2, characterized in that, The supporting body (1) is a TOP bracket; The line component one (8) includes: Recess 1 is formed on the front of the TOP bracket; Line 1 is embedded in the groove 1, and one end of Line 1 is connected to the newly added pad 1 (6), and the other end is connected to the data transmission pad 1 (4); The second line component (9) includes: Recess 2 is formed on the front of the TOP bracket; Line 2 is embedded in the groove 2, and one end of Line 2 is connected to the newly added pad 2 (7), and the other end is connected to the data transmission pad 2 (5).

8. The universal support structure for IC LED beads as described in claim 7, characterized in that, The general-purpose support structure for IC LED chips also includes: A resin layer (15) at least partially covers the surfaces of the first and second lines.

9. The universal support structure for IC LED beads as described in claim 1, characterized in that, The data transmission pad one (4) is a DIN pad, and the data transmission pad two (5) is a DOT pad; Alternatively, the data transmission pad one (4) may be a DOT pad, and the data transmission pad two (5) may be a DIN pad.

10. An IC lamp bead, characterized in that, It includes the IC lamp bead universal support structure as described in any one of claims 1-9.

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