Flexible OLED encapsulation material structure for bendable smart displays

Abstract

This utility model discloses a flexible OLED encapsulation material structure for bendable smart displays, relating to the field of OLED encapsulation structure technology. The flexible OLED encapsulation material structure for bendable smart displays includes mounting disks above a buffer strip, with two mounting disks arranged in a group. Damping rotating shafts are rotatably connected to both sides of the mounting disks. An array of mounting disks is mounted on the buffer strip, and a lever arm is fixedly connected to the damping rotating shaft. The other end of the lever arm is fixedly connected to a damping rotating shaft on another group of mounting disks. This connection is repeated until the length matches the length of the encapsulation module. A T-shaped slider is fixedly connected below the mounting disks, and the T-shaped slider slides in a groove, providing stable support and guidance when the device is bent. Under the constraint of the damping rotating shaft, the lever arm evenly distributes bending stress, avoiding excessive local stress. Simultaneously, the damping characteristic slows down the bending speed, preventing instantaneous stress impact and ensuring the flexible OLED maintains structural stability during repeated bending.

Description

Technical Field

[0001] This utility model relates to the field of OLED packaging structure technology, and in particular to the structure of flexible OLED packaging materials for bendable smart displays. Background Technology

[0002] With the rapid development of the information age, people's requirements for display technology are increasing day by day. Flexible organic light-emitting diode (OLED) display technology has emerged as a result. With its outstanding characteristics such as being thin, light and flexible, flexible OLED has shown great application potential in cutting-edge fields such as wearable devices and foldable screen phones, becoming the core development direction of the next generation of display technology. In wearable devices, it can conform to the complex curvature of the human body, providing a more convenient and comfortable display experience; foldable screen phones use flexible OLED to realize the folding and unfolding of the screen, bringing users a brand-new interaction mode and a larger screen field of view. However, flexible OLED technology faces many severe challenges in its development, with encapsulation issues being particularly prominent. The organic light-emitting materials in OLED devices are extremely sensitive to water and oxygen. Once external water and oxygen molecules invade, they will quickly react chemically with the organic materials in the light-emitting layer, leading to a sharp drop in luminous efficiency, color distortion, and a severe reduction in the lifespan of the device. Related studies have shown that for every order of magnitude increase in water vapor transmittance, the lifespan of an OLED may be shortened by several times. For example, in a high humidity environment, the lifespan of a conventionally encapsulated OLED device may only be a few thousand hours. At the same time, the frequent bending of flexible OLEDs places stringent mechanical requirements on the encapsulation structure. During repeated bending, the uneven stress distribution in different parts of the encapsulation layer can easily cause cracks. These cracks not only damage the integrity of the encapsulation layer and open channels for water and oxygen molecules to invade, but may also directly damage the internal circuitry, resulting in a deterioration of the display effect and the appearance of bright spots, dark spots, or even black screens. For example, in some early flexible OLED products, after thousands of bends, obvious cracks began to appear at the edges of the screen, which in turn affected the display quality. In addition, traditional packaging processes suffer from problems such as excessive internal stress and insufficient adhesion between film layers during production, which greatly reduces the structural stability and reliability of the packaging layer and severely restricts the widespread application of flexible OLEDs in complex application scenarios. There is an urgent need to develop innovative packaging material structures and technologies to break through existing bottlenecks. Utility Model Content

[0003] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to provide a flexible OLED encapsulation material structure for bendable smart displays, which can solve the above-mentioned problems.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a flexible OLED encapsulation material structure for bendable smart displays, comprising a screen, a flexible base layer fixedly connected to the screen, a light-emitting layer fixedly connected to the flexible base layer; an organic layer fixedly connected to the light-emitting layer, an inorganic layer fixedly connected to the organic layer, the inorganic layer being composed of several segments, epoxy resin fixedly connected between the segments, and a self-healing polymer layer fixedly connected to the inorganic layer; The structure consists of five layers in total, including three organic layers and two inorganic layers. The organic and inorganic layers are stacked alternately. The organic layers in the middle layer are fixedly connected to both sides of the organic layer, and the repair polymer layer is fixedly connected to the inorganic layers on both sides. The above structure constitutes a packaging module. The packaging module is fixedly connected to a sealant on its periphery. Fixing strips are fixedly connected to the periphery of the sealant on the left and right sides of the packaging module. Buffer strips are fixedly connected to the periphery of the sealant at the top and bottom of the packaging module.

[0005] Preferably, the buffer strip has zigzag grooves on both sides, and a shape memory alloy composite strip is fixedly connected inside the buffer strip.

[0006] Preferably, a mounting plate is provided above the buffer bar, with two mounting plates forming a group, and a damping rotating shaft is rotatably connected to both sides between the mounting plates. A T-shaped slider is fixedly connected below the mounting plate, and the T-shaped slider is slidably connected to the slide groove.

[0007] Preferably, a lever arm is fixedly connected to the damping rotation shaft, and the other end of the lever arm is fixedly connected to a damping rotation shaft on another set of mounting plates.

[0008] Preferably, the buffer strip is embedded with a sliding groove.

[0009] Preferably, a mounting plate is provided above the buffer bar, and two mounting plates are arranged in a group, one above the other, and a damping rotating shaft is rotatably connected to the two sides of the mounting plates.

[0010] Compared with the prior art, the beneficial effects of this utility model are: 1. The flexible OLED encapsulation material structure for bendable smart displays features a linkage structure consisting of a mounting plate, a damping rotation shaft, and a lever arm. Through the sliding cooperation of the T-shaped slider and the buffer strip groove, it provides stable support and guidance when the device is bent. Under the constraint of the damping rotation shaft, the lever arm evenly distributes bending stress, avoiding excessive local stress. At the same time, the damping characteristics can slow down the bending speed and prevent instantaneous stress impact, ensuring that the flexible OLED maintains structural stability during repeated bending. When subjected to bending stress, the built-in shape memory alloy composite strip generates a shape memory effect due to the martensitic phase transformation, actively releasing stress and restoring its initial shape, further inhibiting crack propagation.

[0011] 2. The flexible OLED encapsulation material structure for bendable smart displays: In this encapsulation material structure, the flexible substrate and the light-emitting layer constitute the basic structure of the flexible OLED display. Organic and inorganic layers are alternately stacked to form a core protective layer. The organic layer, with its own flexibility, buffers stress when the device is bent, and fills the defects such as pinholes and microcracks caused by the deposition process in the inorganic layer, preventing the propagation of internal cracks. The inorganic layer, through its dense physical structure, effectively blocks external water and oxygen molecules, reduces water vapor permeability and oxygen permeability, and protects the internal light-emitting layer from corrosion. Attached Figure Description

[0012] The present invention will be further described below with reference to the accompanying drawings and embodiments: Figure 1 This is a schematic diagram of the flexible OLED encapsulation material for bendable smart displays according to this utility model; Figure 2 This is a cross-sectional schematic diagram of the flexible OLED encapsulation material for bendable smart displays according to this utility model; Figure 3 This is a partial schematic diagram of the structure of the flexible OLED encapsulation material for bendable smart displays according to this utility model; Figure 4 This is an exploded view of the structure of the flexible OLED encapsulation material for bendable smart displays according to this utility model.

[0013] Reference numerals: 1. Screen; 2. Flexible base layer; 3. Light-emitting layer; 4. Organic layer; 5. Inorganic layer; 6. Epoxy resin; 7. Self-healing polymer layer; 8. Buffer strip; 9. Sealant; 10. Fixing strip; 11. Zigzag groove; 12. Mounting plate; 13. Damping rotating shaft; 14. Lever arm; 15. Slide groove; 16. T-shaped slider; 17. Shape memory alloy composite strip. Detailed Implementation

[0014] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0015] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0016] In the description of this utility model, terms such as greater than, less than, and exceeding are understood to exclude the stated number, while terms such as above, below, and within are understood to include the stated number. The use of terms like "first" and "second" is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the quantity or sequence of the indicated technical features.

[0017] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0018] Please see Figures 1-4 This utility model provides a technical solution: a flexible OLED encapsulation material structure for bendable smart displays, including a screen 1, a flexible base layer 2 fixedly connected to the screen 1, and a light-emitting layer 3 fixedly connected to the flexible base layer 2; An organic layer 4 is fixedly connected to the light-emitting layer 3, and an inorganic layer 5 is fixedly connected to the organic layer 4. The inorganic layer 5 is composed of several segments, and epoxy resin 6 is fixedly connected between the segments. A self-healing polymer layer 7 is fixedly connected to the inorganic layer 5. There are five layers in total, including organic layer 4 and inorganic layer 5. There are three organic layers 4 and two inorganic layers 5. The organic layers 4 and inorganic layers 5 are stacked alternately. The organic layer 4 in the middle layer is fixedly connected to the two sides of the self-healing polymer layer 7. The self-healing polymer layer 7 is fixedly connected to the inorganic layers 5 on both sides. In this encapsulation material structure, the flexible base layer 2 and the light-emitting layer 3 constitute the basic structure of the flexible OLED display. The organic layer 4 and the inorganic layer 5 are alternately stacked to form the core protective layer. The organic layer 4, with its own flexibility, buffers stress when the device is bent, and fills the defects such as pinholes and microcracks caused by the deposition process in the inorganic layer 5, thus preventing the propagation of internal cracks. The inorganic layer 5, through its dense physical structure, effectively blocks external water and oxygen molecules, reduces water vapor permeability and oxygen permeability, and protects the internal light-emitting layer 3 from corrosion. Organic layer 4 is used to buffer bending stress and fill micro-defects in inorganic layer 5 to prevent crack propagation. The main function of inorganic layer 5 is to physically block water and oxygen molecules. The core function of self-healing polymer layer 7 is to restore structural integrity through reversible chemical reactions or molecular rearrangement when the device is subjected to mechanical stress, thermal stress or environmental erosion, thereby extending the device life. The above structure constitutes the encapsulation module. The outer periphery of the encapsulation module is fixedly connected with sealant 9. The outer periphery of the sealant 9 on the left and right sides of the encapsulation module is fixedly connected with fixing strips 10. The outer periphery of the sealant 9 at the top and bottom of the encapsulation module is fixedly connected with buffer strips 8. The buffer strip 8 has curved grooves 11 on both sides, and a shape memory alloy composite strip 17 is fixedly connected inside the buffer strip 8. When bending causes stress concentration, the alloy layer releases stress through shape memory effect and inhibits crack propagation. A sliding groove 15 is embedded in the buffer strip 8. The sealant 9 around the encapsulation module forms the first waterproof and dustproof barrier, preventing external pollutants from entering. The fixing strips 10 on the left and right sides and the buffer strips 8 at the top and bottom together form a rigid-flexible composite frame. The curved grooves 11 on both sides of the buffer strip 8 provide deformation space during bending, avoiding stress concentration at the edge of the encapsulation layer. When subjected to bending stress, the built-in shape memory alloy composite strip 17 generates a shape memory effect due to the martensitic phase transformation, actively releasing stress and restoring the initial shape, further inhibiting crack propagation. A mounting plate 12 is provided above the buffer bar 8. The mounting plates 12 are arranged in two groups, one above the other. A damping rotating shaft 13 is rotatably connected to both sides of the mounting plates 12. An array of mounting plates 12 is provided on the buffer bar 8. A lever arm 14 is fixedly connected to the damping rotating shaft 13. The other end of the lever arm 14 is fixedly connected to the damping rotating shaft 13 on another set of mounting plates 12. This connection is repeated until the length is consistent with the length of the encapsulation module. A T-shaped slider 16 is fixedly connected to the bottom of the mounting plate 12, and the T-shaped slider 16 is slidably connected to the slide groove 15; The linkage structure consisting of mounting plate 12, damping rotation shaft 13 and lever arm 14 provides stable support and guidance when the device is bent through the sliding cooperation between T-shaped slider 16 and buffer bar 8 groove 15. Under the constraint of damping rotation shaft 13, lever arm 14 evenly distributes bending stress and avoids excessive local stress. At the same time, the damping characteristics can slow down the bending speed and prevent instantaneous stress impact, ensuring that the flexible OLED maintains structural stability during repeated bending. Working principle: In this encapsulation material structure, the flexible base layer 2 and the light-emitting layer 3 constitute the basic structure of the flexible OLED display. The organic layer 4 and the inorganic layer 5 are alternately stacked to form the core protective layer. The organic layer 4, with its own flexibility, buffers stress when the device is bent, and fills the defects such as pinholes and microcracks caused by the deposition process in the inorganic layer 5, preventing the propagation of internal cracks. The inorganic layer 5, through its dense physical structure, effectively blocks external water and oxygen molecules, reduces water vapor permeability and oxygen permeability, and protects the internal light-emitting layer 3 from corrosion. When the device develops microcracks due to mechanical bending, temperature changes, or environmental corrosion, the self-healing polymer layer 7 promotes the rearrangement of molecular chains and the breaking and recombination of chemical bonds through thermal activation, ultraviolet light triggering, or stress induction, thereby achieving automatic crack healing and restoring the integrity and barrier performance of the encapsulation layer. The sealant 9 around the encapsulation module forms the first waterproof and dustproof barrier, preventing external pollutants from entering. The fixing strips 10 on the left and right sides and the buffer strips 8 at the top and bottom together form a rigid-flexible composite frame. The curved grooves 11 on both sides of the buffer strip 8 provide deformation space during bending, avoiding stress concentration at the edge of the encapsulation layer. When subjected to bending stress, the built-in shape memory alloy composite strip 17 generates a shape memory effect due to the martensitic phase transformation, actively releasing stress and restoring the initial shape, further inhibiting crack propagation. The linkage structure consisting of mounting plate 12, damping rotation shaft 13 and lever arm 14 provides stable support and guidance when the device is bent through the sliding cooperation between T-shaped slider 16 and buffer bar 8 groove 15. Under the constraint of damping rotation shaft 13, lever arm 14 evenly distributes bending stress and avoids excessive local stress. At the same time, the damping characteristics can slow down the bending speed and prevent instantaneous stress impact, ensuring that the flexible OLED maintains structural stability during repeated bending. Highly efficient water and oxygen barrier: Organic layer 4 and inorganic layer 5 are alternately stacked. Organic layer 4 fills the defects of inorganic layer 5, and inorganic layer 5 achieves physical barrier, significantly reducing water and oxygen permeability, effectively protecting light-emitting layer 3, and extending device lifespan. Self-healing function: The self-healing polymer layer 7 can automatically repair cracks when the device is damaged, reduce performance degradation caused by microcracks, and improve the reliability and durability of the packaging structure; Excellent stress buffering: The linkage structure of buffer strip 8, shape memory alloy composite strip 17 and damping rotation shaft 13-lever arm 14 works together to effectively disperse and absorb bending stress, avoid stress concentration, and enhance the stability of the device under frequent bending. Stable structure: The composite frame consisting of sealant 9, fixing strip 10 and buffer strip 8, combined with the internal multi-layer protective structure, provides a solid encapsulation protection for flexible OLED and adapts to a variety of complex usage scenarios. Structural Description: Screen 1: As the core component of flexible OLED displays, it is the carrier of images and information display, responsible for converting electrical signals into light signals to present the content we see. Flexible base layer 2: Fixedly connected to screen 1, it provides a basic flexible support structure for the entire flexible OLED encapsulation material. It enables the entire display component to have bendable physical properties, meeting the usage requirements of flexible display devices in different forms, such as bending operations in scenarios like foldable screen phones and rollable electronic posters. Light-emitting layer 3: Fixedly connected to the flexible substrate 2, it is the key functional layer for realizing the self-emission of OLED. Driven by current, the organic materials in the light-emitting layer 3 will undergo electroluminescence, thereby producing light of different colors such as red, green, and blue, which is the basis for forming the colors of the displayed image. Organic layer 4: In the entire encapsulation structure, three organic layers 4 are set, alternating with two inorganic layers 5. Its main function is to buffer bending stress. When the flexible OLED display device is bent, the organic layer 4 can absorb and disperse the stress, avoiding stress concentration that could damage the device. At the same time, the organic layer 4 can also fill the micro-defects present in the inorganic layer 5, preventing these micro-defects from further expanding and forming cracks under stress, thereby ensuring the integrity and stability of the device structure. Inorganic layer 5: Composed of several segmented structures, the segments are fixedly connected by epoxy resin 6. The main function of inorganic layer 5 is to physically block water and oxygen molecules. The intrusion of water and oxygen molecules can cause oxidation and corrosion to organic materials and electrodes in OLED devices, seriously affecting the performance and lifespan of the devices. Inorganic layer 5, through its dense structure, effectively prevents water and oxygen molecules from entering the device interior, thus providing protection.

[0019] Epoxy resin 6: Used to connect the segmented structure of inorganic layer 5. Epoxy resin has good bonding properties and can firmly connect each segment of inorganic layer 5 together, ensuring the stability and integrity of the overall structure of inorganic layer 5, thereby ensuring its barrier effect against water and oxygen molecules. The self-healing polymer layer 7's core function is to restore structural integrity through reversible chemical reactions or molecular rearrangement when the device is subjected to mechanical stress, thermal stress, or environmental corrosion. For example, when the device suffers micro-cracks or structural damage from external impact, the self-healing polymer layer 7 can automatically repair itself, thereby extending the device's lifespan and improving the reliability and durability of flexible OLED display devices. In this structure, the self-healing polymer layer 7 is fixedly connected to both sides of the organic layer 4 in the middle layer, and the self-healing polymer layer 7 is fixedly connected to the inorganic layers 5 on both sides, forming multiple layers of protection. Buffer strip 8: Fixedly connected to the outer periphery of the sealant 9 at the upper and lower ends of the encapsulation module. Bending grooves 11 are formed on both sides of the buffer strip 8, with shape memory alloy composite strips 17 fixedly connected inside, and a sliding groove 15 embedded at the top. When the flexible OLED display device is bent, causing stress concentration, the shape memory alloy composite strip 17 releases stress through shape memory effect, inhibiting crack propagation; the design of the bending grooves 11 further enhances the buffer strip 8's ability to absorb and disperse stress; the sliding groove 15 is used to cooperate with the T-shaped slider 16 below the mounting plate 12 to achieve a sliding connection of the mounting plate 12, providing an installation foundation for the subsequent lever arm structure.

[0020] Sealant 9: It is used to fix and connect the outer periphery of the encapsulation module. Its main function is to seal the entire encapsulation module, further preventing water and oxygen molecules, dust and other impurities from the external environment from entering the encapsulation module. Together with inorganic layer 5 and other structures, it forms a multi-layer protection system to ensure the stable working environment of OLED devices. Fixing strip 10: It is fixedly connected to the outer periphery of the sealant 9 on the left and right sides of the encapsulation module, and is used to fix and support the encapsulation module, enhance the stability of the entire flexible OLED encapsulation material structure, and prevent displacement or loosening during use. The zigzag groove 11 is located on both sides of the buffer strip 8. Its zigzag shape design can absorb and disperse stress through its own deformation when the flexible OLED display device is bent, further improving the buffer effect of the buffer strip 8 against stress and protecting the internal components from stress damage. Mounting discs 12: Two discs are arranged in a group, with multiple groups on the buffer strip 8. The two sides of the mounting discs 12 are rotatably connected by a damping rotating shaft 13, and a T-shaped slider 16 is fixedly connected at the bottom, which is slidably connected to the groove 15 on the buffer strip 8. The mounting discs 12 are the mounting carriers for components such as the lever arm 14. Through their sliding connection with the buffer strip 8 and their rotational connection with each other, they can adapt to the bending action of the flexible OLED display device and ensure the normal operation of the lever arm structure during the bending process. Damping rotation shaft 13: Rotatably connected between the two sides of the mounting plate 12, with lever arm 14 fixedly connected to the damping rotation shaft 13. The damping rotation shaft 13 provides a certain rotational damping, making the lever arm 14 more stable and controllable during rotation. When the flexible OLED display device is bent, it can effectively transfer and disperse stress, avoiding stress concentration that could damage the device. Lever arm 14: Both ends are fixedly connected to the damping rotation shafts 13 on different mounting plates 12, and are interconnected until their length matches the length of the encapsulation module. During the bending process of the flexible OLED display device, the lever arm 14 plays a role in transmitting and dispersing stress, evenly distributing the stress generated by bending throughout the entire structure, and protecting the internal OLED devices. Slide 15: Embedded and connected to the buffer strip 8, and slidably connected to the T-shaped slider 16 below the mounting plate 12, providing a track for the sliding of the mounting plate 12, so that the mounting plate 12 can move flexibly on the buffer strip 8, thereby adapting to the bending action of the flexible OLED display device and ensuring the coordination and stability of the entire structure during the bending process. T-shaped slider 16: Fixedly connected below the mounting plate 12, it cooperates with the groove 15 on the buffer strip 8 to achieve a sliding connection between the mounting plate 12 and the buffer strip 8. The special shape design of the T-shaped slider 16 can prevent the mounting plate 12 from disengaging from the groove 15 during sliding, ensuring the reliability and stability of the connection. Shape memory alloy composite strip 17: It is fixedly connected inside the buffer strip 8. When the flexible OLED display device is bent, causing stress concentration, the shape memory alloy composite strip 17 can automatically restore its original shape by utilizing the shape memory effect, thereby releasing stress, inhibiting crack propagation, effectively protecting the internal OLED device, and improving the bending resistance and service life of the entire flexible OLED encapsulation material.

[0021] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A flexible OLED encapsulation material structure for bendable smart displays, comprising a screen (1), characterized in that: A flexible base layer (2) is fixedly connected to the screen (1), and a light-emitting layer (3) is fixedly connected to the flexible base layer (2). An organic layer (4) is fixedly connected to the light-emitting layer (3), and an inorganic layer (5) is fixedly connected to the organic layer (4). The inorganic layer (5) is composed of several segments. Epoxy resin (6) is fixedly connected between the segments, and a self-healing polymer layer (7) is fixedly connected on the inorganic layer (5). The organic layer (4) and inorganic layer (5) consist of five layers in total, with three organic layers (4) and two inorganic layers (5). The organic layers (4) and inorganic layers (5) are stacked alternately. The organic layer (4) in the middle layer is fixedly connected to the two sides of a self-healing polymer layer (7), which is fixedly connected to the inorganic layers (5) on both sides. The above structure constitutes a packaging module. A sealant (9) is fixedly connected to the periphery of the packaging module. A fixing strip (10) is fixedly connected to the periphery of the sealant (9) on the left and right sides of the packaging module. A buffer strip (8) is fixedly connected to the periphery of the sealant (9) at the top and bottom of the packaging module.

2. The flexible OLED encapsulation material structure for bendable smart displays according to claim 1, characterized in that: The buffer strip (8) has zigzag grooves (11) on both sides, and a memory alloy composite strip (17) is fixedly connected inside the buffer strip (8).

3. The flexible OLED encapsulation material structure for bendable smart displays according to claim 2, characterized in that: An installation plate (12) is provided above the buffer strip (8). The two installation plates (12) are arranged in a group. A damping rotating shaft (13) is rotatably connected between the two sides of the installation plates (12). A T-shaped slider (16) is fixedly connected below the installation plate (12). The T-shaped slider (16) is slidably connected to the slide groove (15).

4. The flexible OLED encapsulation material structure for bendable smart displays according to claim 3, characterized in that: A lever arm (14) is fixedly connected to the damping rotating shaft (13), and the other end of the lever arm (14) is fixedly connected to the damping rotating shaft (13) on another set of mounting plates (12).

5. The flexible OLED encapsulation material structure for bendable smart displays according to claim 4, characterized in that: The buffer bar (8) is embedded with a groove (15).

6. The flexible OLED encapsulation material structure for bendable smart displays according to claim 5, characterized in that: An installation plate (12) is provided above the buffer strip (8). The two installation plates (12) are arranged in a group, and a damping rotating shaft (13) is rotatably connected between the two sides of the installation plates (12).

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