A support ring protection device and a wafer cleaning machine

Abstract

A support ring protection device and a wafer cleaning machine are disclosed, relating to the field of semiconductor technology. The support ring protection device includes a suction device and a protective sleeve. The protective sleeve is adapted to fit the support ring of the wafer cleaning machine and can be fitted onto the outer surface of the support ring to shield its sidewalls and top. The protective sleeve is formed by assembling multiple sub-protective sleeves. The suction device communicates with the inner cavity of each sub-protective sleeve to remove corrosive media that has seeped into the protective sleeve. This support ring protection device reduces the possibility of support ring corrosion, minimizing problems such as equipment contamination, pipeline blockage, and frequent component replacement caused by corrosion, thereby improving product yield, production efficiency, and operational safety.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and more specifically, to a support ring protection device and a wafer cleaning machine. Background Technology

[0002] In semiconductor wafer manufacturing processes, wafer cleaning is a critical step in ensuring product quality. During the wafer cleaning process, the wafer must be fixed to a metal support ring for processing. This metal support ring is typically made of iron.

[0003] The wafer cleaning process requires the use of highly corrosive hydrofluoric acid, but the metal support ring lacks corrosion protection and is directly exposed to the corrosive environment. This causes the hydrofluoric acid to continuously corrode the surface of the iron ring, and the resulting metal byproducts contaminate the wafer transport box and the interior of the machine, leading to a decrease in product yield. Furthermore, the metal byproducts can easily clog precision pipelines with the flow of the cleaning solution, increasing the frequency of replacement of the metal support ring and other components of the wafer cleaning machine, severely reducing production efficiency. Additionally, residual chemicals may endanger the safety of operators. Utility Model Content

[0004] The purpose of this invention is to provide a support ring protection device and a wafer cleaning machine, which can protect the support ring, reduce the possibility of the support ring being corroded by the cleaning solution, and improve product yield, production efficiency and operational safety.

[0005] The embodiments of this utility model are implemented as follows: In one aspect, this utility model provides a support ring protection device, including a suction device and a protective sleeve. The protective sleeve is adapted to the support ring of a wafer cleaning machine and can be fitted onto the outer surface of the support ring to cover the side walls and top of the support ring. The protective sleeve is formed by assembling multiple sub-protective sleeves. The suction device is connected to the inner cavity of the sub-protective sleeves and is used to remove corrosive media that have penetrated into the protective sleeve.

[0006] Optionally, the suction device includes a main body and a water-gas separator, with the inner cavity of the main body and the sub-protective sleeve connected by a pipe; the water-gas separator is installed on the pipe between the main body and the sub-protective sleeve and is used to separate the solution and gas in the corrosive medium.

[0007] Optionally, a buffer gap is provided between the inner wall of the protective sleeve and the outer wall of the support ring.

[0008] Optionally, the support ring protection device further includes a drive unit, which is drivenly connected to the sub-protective sleeve and is used to drive the sub-protective sleeve to move closer to or away from the support ring.

[0009] Optionally, one end of the drive unit is connected to the protective sleeve, and the other end is hinged to the side wall of the support unit of the wafer cleaning machine, with the support ring located on the end face of the support unit; the drive unit can drive the sub-protective sleeve to rotate around the hinge point to a horizontal state and cover the outer periphery of the support ring.

[0010] Optionally, the drive unit is a linear cylinder, and the sub-protective sleeve is disposed at the extension end of the linear cylinder; the linear cylinder drives the sub-protective sleeve to extend out of a preset stroke so that when the support ring is located in the movement path of the sub-protective sleeve, the linear cylinder drives the sub-protective sleeve to rotate around the hinge point to a horizontal state and cover the outer periphery of the support ring.

[0011] Optionally, the protective case is made of an acid-resistant material.

[0012] In another aspect, this utility model provides a wafer cleaning machine, including a support ring, a support portion, a sealing wall, and a support ring protection device; the sealing wall encloses to form a cleaning chamber, the support portion is disposed inside the cleaning chamber, the support ring is placed on top of the support portion, and the wafer is placed inside the support ring.

[0013] Optionally, the support unit has a support rod movably disposed within the cleaning chamber, which can drive the support unit and the support ring to rotate along the axis.

[0014] Optionally, the top of the cleaning chamber has an opening; the support can extend and retract in the vertical direction, allowing the support ring to move into or out of the cleaning chamber through the opening.

[0015] The beneficial effects of this utility model include: This application provides a support ring protection device, including a suction device and a protective sleeve. The protective sleeve is adapted to the support ring of a wafer cleaning machine and can be fitted onto the outer surface of the support ring to shield the sidewalls and top of the support ring, thereby minimizing the area of ​​direct contact between corrosive media and the support ring and providing efficient protection. The protective sleeve is formed by assembling multiple sub-protective sleeves. The suction device communicates with the inner cavity of the sub-protective sleeves to remove corrosive media that has seeped into the protective sleeve. Even if a small amount of corrosive media seeps into the protective sleeve, the suction device can quickly remove it, keeping the inside of the protective sleeve clean and maintaining good protection for the support ring. The above-mentioned support ring protection device reduces the possibility of support ring corrosion, reduces equipment contamination, pipeline blockage, and frequent component replacement caused by corrosion, and improves product yield, production efficiency, and operational safety. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 One of the structural schematic diagrams of the support ring protection device provided in the embodiment of this utility model; Figure 2 A schematic diagram showing the connection between the linear cylinder and the sub-protective sleeve provided in an embodiment of this utility model; Figure 3 A second schematic diagram of the support ring protection device provided in this embodiment of the utility model; Figure 4 This is a schematic diagram of the structure of a wafer cleaning machine provided in an embodiment of the present invention.

[0018] Icons: 100-Support ring protection device; 110-Suction device; 111-Water-air separator; 112-Pipe; 120-Protective sleeve; 121-Sub-protective sleeve; 1211-First protective wall; 1212-Second protective wall; 130-Linear cylinder; 200-Wafer cleaning machine; 210-Support ring; 220-Support part; 221-Support rod; 230-Sealing wall; 231-First sealing plate; 232-Second sealing plate. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0021] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0022] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] Please refer to Figure 1 This embodiment provides a support ring protection device 100, including a suction device 110 and a protective sleeve 120. The protective sleeve 120 is adapted to the support ring 210 of the wafer cleaning machine 200 and can be sleeved on the outer surface of the support ring 210 to cover the side walls and top of the support ring 210. The protective sleeve 120 is formed by assembling multiple sub-protective sleeves 121. The suction device 110 communicates with the inner cavity of the sub-protective sleeves 121 and is used to remove corrosive media that have penetrated into the protective sleeve 120.

[0024] Specifically, the support ring 210 is used to support the wafer during the cleaning process. It is usually made of metal, such as iron, and is therefore prone to corrosion when it comes into contact with the highly corrosive hydrofluoric acid solution used in the wafer cleaning process. The support ring protection device 100 provided in this application can protect the support ring 210 and reduce the possibility of the support ring 210 being corroded by the cleaning solution.

[0025] The support ring protection device 100 includes multiple sub-protective sleeves 121, with at least two sub-protective sleeves 121. Preferably, the thickness of the protective sleeve 120 is 1 mm. The sub-protective sleeve 121 is arc-shaped to fit the annular structure of the support ring 210, facilitating complete fitting onto the outer wall of the support ring 210. Figure 1As shown, in one specific embodiment of this application, the support ring protection device 100 includes two sub-protective sleeves 121. The two sub-protective sleeves 121 are symmetrically arranged in a semi-circular structure, which can be precisely spliced ​​to form a ring structure that fits the support ring 210 structure. By using two sub-protective sleeves 121, the cost can be minimized and the assembly and disassembly efficiency of the protective sleeves 120 can be improved. Of course, the number of sub-protective sleeves 121 can be three, four, etc., in addition to two; and this application does not impose any limitation on the arc length of each sub-protective sleeve 121, as long as multiple sub-protective sleeves 121 can be spliced ​​to form a ring structure that fits the support ring 210 structure, so that every part of the support ring 210 is covered by the protective sleeves 120.

[0026] Since the support ring 210 is located on top of the support portion 220 of the wafer cleaning machine 200, its outer wall and top are exposed. To facilitate the fitting of the protective sleeve 120 onto the support ring 210 while ensuring that the outer periphery of the support ring 210 is covered, preferably, as follows: Figure 2 As shown, the support ring 210 has an L-shaped cross-section and vertically arranged first protective wall 1211 and second protective wall 1212. The first protective wall 1211 covers the outer side of the support ring 210, and the second protective wall 1212 covers the top of the support ring 210. When the protective sleeve 120 is installed, the support ring 210 can extend into the protective sleeve 120 from the opening of the L-shaped support ring 210, facilitating the installation and removal of the protective sleeve 120. Maintenance and replacement do not require complete removal, reducing operational difficulty. Preferably, the protective sleeve 120 has a certain degree of elasticity. Multiple sub-protective sleeves 121 are assembled to form a closed ring structure, which can fully cover the entire outer circumference of the support ring 210, eliminating blind spots. Compared with the integral ring protective sleeve 120, the splicing design is easier to install on the assembled support ring 210 and also easier to disassemble, improving the convenience of use and replacement.

[0027] like Figure 1 As shown, the suction device 110 is connected to the inner cavity of the sub-protective sleeve 121. Even if a small amount of corrosive medium seeps into the protective sleeve 120 through tiny gaps, the suction device 110 can remove it in time, preventing the medium from staying in the protective sleeve 120 for a long time and corroding the support ring 210. This makes up for the possible protective gaps between the two adjacent sub-protective sleeves 121 and further improves the reliability of protection.

[0028] By removing corrosive media, the corrosion reaction within the protective sleeve 120 is reduced, decreasing the amount of metal byproducts generated, thereby reducing the frequency of component replacements and improving production efficiency. Simultaneously, timely removal of residual chemicals also reduces the risk of operator exposure to hazardous media, enhancing production safety.

[0029] It should be noted that, in one possible embodiment of this application, firstly, a buffer gap is provided between the inner wall of the protective sleeve 120 and the outer wall of the support ring 210. The buffer gap provides a certain space between the protective sleeve 120 and the support ring 210, avoiding rigid contact between them. The buffer gap provides a temporary storage and flow channel for corrosive media penetrating into the protective sleeve 120, allowing the corrosive media to flow more smoothly to the suction device 110. Combined with the suction action of the suction device 110, this accelerates the discharge of the corrosive media, preventing localized stagnation and continuous corrosion of the support ring 210. Preferably, the buffer gap is 0.5 mm.

[0030] Secondly, the protective sleeve 120 is made of acid-resistant corrosion-resistant material, which makes the protective sleeve 120 itself not easily corroded by acidic solutions such as hydrofluoric acid, thus avoiding the situation where the protective sleeve 120 loses its protective function due to corrosion damage; in addition, the acid-resistant corrosion-resistant material will not react chemically with corrosive media such as hydrofluoric acid to produce harmful substances, avoiding the generation of additional new pollutants due to corrosion of the protective sleeve 120, further reducing the risk of contamination to the wafer transport box and the inside of the equipment, and ensuring product yield.

[0031] Third, each sub-protective sleeve 121 can be individually connected to a corresponding suction device 110, or multiple sub-protective sleeves 121 can be connected to a single suction device 110, as long as the suction device 110 can effectively suction the corrosive medium from the inner cavity of the sub-protective sleeve 121. This application does not impose any limitations on this. Preferably, in one specific embodiment of this application, as... Figure 1 As shown, multiple sub-protective sleeves 121 are connected to a single suction device 110 to save production costs and installation space.

[0032] The aforementioned support ring protection device 100 includes a suction device 110 and a protective sleeve 120. The protective sleeve 120 is adapted to the support ring 210 of the wafer cleaning machine 200 and can be fitted onto the outer surface of the support ring 210 to shield the sidewalls and top of the support ring 210, thereby minimizing the area of ​​direct contact between corrosive media and the support ring 210 and providing efficient protection. The protective sleeve 120 is formed by assembling multiple sub-protective sleeves 121. The suction device 110 communicates with the inner cavity of the sub-protective sleeves 121 and is used to remove corrosive media that has seeped into the protective sleeve 120. Even if a small amount of corrosive media seeps into the protective sleeve 120, the suction device 110 can quickly remove it, keeping the inside of the protective sleeve 120 clean and maintaining good protection for the support ring 210. The aforementioned support ring protection device 100 reduces the possibility of corrosion of the support ring 210, reduces problems such as equipment contamination, pipeline blockage, and frequent component replacement caused by corrosion, and improves product yield, production efficiency, and operational safety.

[0033] Optionally, such as Figure 1 As shown, the suction device 110 includes a main body and a water-gas separator 111. The main body and the inner cavity of the sub-protective sleeve 121 are connected by a pipe 112. The water-gas separator 111 is disposed on the pipe 112 between the main body and the sub-protective sleeve 121 and is used to separate the solution and gas in the corrosive medium.

[0034] Specifically, the suction device 110 includes a main body, which is mainly used to realize the suction function. It is directly connected to the inner cavity of the protective sleeve 120 via a pipe 112, forming a medium transmission channel from the protective sleeve 120 to the suction device 110. The main body includes a suction power unit and a medium storage chamber. The suction power unit is used to generate negative pressure to drive the corrosive medium from the inner cavity of the sub-protective sleeve 121 through the pipe 112 to the main body. Preferably, the suction power unit is a diaphragm vacuum pump that avoids direct contact with corrosive gases; a piston-type suction mechanism, etc., can also be used. The medium storage chamber is used to temporarily store the solution or gas that has entered the main body after separation by the water-gas separator 111.

[0035] In addition to the body itself, such as Figure 1 As shown, the suction device 110 also includes a water-gas separator 111, which has a filter layer to intercept tiny droplets entrained in the airflow. Corrosive media drawn in by the main body can enter the water-gas separator 111, which separates the mixed state of the corrosive media into solution and gas. This allows the liquid medium to be collected and processed separately, while the gas is purified before being discharged or recycled. This avoids the synergistic corrosion of the suction device 110 and pipelines by the gas-liquid mixture, prevents it from entering the main body and damaging the suction power components, extends the service life of the suction device 110, and reduces the frequency of equipment downtime due to malfunctions of the suction device 110.

[0036] In one possible embodiment of this application, the support ring protection device 100 further includes a driving unit, which is drivenly connected to the sub-protective sleeve 121 and is used to drive the sub-protective sleeve 121 to move closer to or away from the support ring 210.

[0037] Specifically, there can be one drive unit, which can be simultaneously connected to multiple sub-protective sleeves 121; of course, there can also be multiple drive units, with each drive unit corresponding to one sub-protective sleeve 121. The drive unit configuration can precisely control the movement state of the sub-protective sleeves 121, enabling flexible adjustment between the sub-protective sleeves 121 and the support ring 210.

[0038] When maintenance or replacement of the support ring 210 or protective sleeve 120 is required, the drive unit moves the sub-protective sleeve 121 away from the support ring 210 to increase the operating space between the sub-protective sleeve 121 and the support ring 210, facilitating the operator's inspection, cleaning, or replacement of the support ring 210. Conversely, when wafer cleaning operations are required, the drive unit moves the sub-protective sleeve 121 closer to the support ring 210, ensuring a tight fit or maintaining a suitable protective gap to guarantee the stability of the protective effect.

[0039] It should be noted that the driving unit of this application can drive the sub-protective sleeve 121 to move horizontally to approach or move away from the support ring 210, or drive the sub-protective sleeve 121 to move horizontally and vertically to approach or move away from the support ring 210; of course, it can also drive the sub-protective sleeve 121 to approach or move away from the support ring 210 by axial rotation. This application does not impose any restrictions on the specific driving method of the driving unit, as long as it can make the sub-protective sleeve 121 approach the support ring 210 and be sleeved on the outer periphery of the support ring 210, or move away from the support ring 210.

[0040] Optionally, one end of the drive unit is connected to the protective sleeve 120, and the other end is hinged to the side wall of the support part 220 of the wafer cleaning machine, with the support ring 210 located on the end face of the support part 220; the drive unit can drive the sub-protective sleeve 121 to rotate around the hinge to a horizontal state and cover the outer periphery of the support ring 210.

[0041] Specifically, the hinge at one end of the drive unit to the side wall of the wafer cleaning machine support 220 provides a stable support point for the drive unit, enabling it to rotate around the hinge point. When the drive unit rotates around the hinge point, the sub-protective sleeve 121 can move smoothly along a preset arc path, avoiding collisions and interference with other components during the movement. The support ring 210 is located precisely on the movement trajectory of the sub-protective sleeve 121. Therefore, when the drive unit drives the sub-protective sleeve 121 to rotate along the preset arc path, the support ring 210 can be positioned within the sub-protective sleeve 121 through relative movement with it.

[0042] When wafer cleaning is required, the sub-protective sleeve 121 rotates to a horizontal position to tightly cover the support ring 210, forming a closed protective structure that effectively blocks corrosive media. When wafer replacement or maintenance of the support ring 210 is required, the drive unit rotates in the opposite direction to move the sub-protective sleeve 121 away from the support ring 210, exposing the operating space for quick loading, unloading, or maintenance operations. Compared to linear drive methods, rotary motion is more suitable for covering the outer circumference of the annular support ring 210, and the switching from opening to closing can be completed with a smaller movement amplitude, saving operating space.

[0043] For example, such as Figure 2 and Figure 3As shown, the driving unit is a linear cylinder 130, and the sub-protective sleeve 121 is disposed at the extension end of the linear cylinder 130. The linear cylinder 130 drives the sub-protective sleeve 121 to extend out of a preset stroke so that when the support ring 210 is located in the movement path of the sub-protective sleeve 121, the linear cylinder 130 drives the sub-protective sleeve 121 to rotate around the hinge point to a horizontal state and cover the outer periphery of the support ring 210.

[0044] Specifically, such as Figure 2 and Figure 3 As shown, the linear extension and retraction of the linear cylinder 130 provides the linear displacement required to drive the sub-protective sleeve 121, while the hinge point allows the entire drive system to rotate around the axis, so that the movement trajectory of the sub-protective sleeve 121 is no longer limited to a single direction. When the linear cylinder 130 extends or retracts, the hinge point acts as a fulcrum, converting the linear motion into rotational motion around the axis, thereby driving the sub-protective sleeve 121 to achieve a spatial attitude change from a non-working position to a horizontally covered position. This significantly reduces the space occupied by the device in the horizontal direction, making the internal space utilization of the wafer cleaning machine more compact and reasonable, leaving more space for the arrangement and operation of other components.

[0045] In actual operation, when wafer cleaning is required, the linear cylinder 130 first extends to a preset stroke to ensure that the support ring 210 is located within the movement path of the sub-protective sleeve 121. Then, the linear cylinder 130 drives the sub-protective sleeve 121 to rotate around the hinge point to a horizontal state and cover the outer circumference of the support ring 210. After the cleaning operation is completed, the linear cylinder 130 first drives the sub-protective sleeve 121 to rotate around the hinge point to a position perpendicular to the plane where the support ring 210 is located, and then the linear cylinder 130 drives the sub-protective sleeve 121 to retract. Of course, in addition to the above process, the linear cylinder 130 can also synchronize the extension and rotation processes. When wafer cleaning is required, the linear cylinder 130 extends, simultaneously driving the protective sleeve 120 to rotate around the hinge point. As the cylinder continues to extend, the sub-protective sleeve 121 gradually approaches a horizontal state until it completely covers the support ring 210. At this time, a semi-sealed protective space is formed between the protective sleeve 120 and the support ring 210, effectively preventing the intrusion of corrosive media. After the cleaning operation is completed, the linear cylinder 130 retracts, and at the same time drives the sub-protective sleeve 121 to rotate in the opposite direction, leaving the support ring 210 and exposing the operating space, which facilitates wafer replacement and equipment maintenance.

[0046] Another aspect of this utility model, such as Figure 4 As shown, a wafer cleaning machine 200 is provided, including a support ring 210, a support portion 220, a sealing wall 230, and a support ring protection device 100; the sealing wall 230 encloses to form a cleaning chamber, the support portion 220 is disposed in the cleaning chamber, the support ring 210 is placed on top of the support portion 220, and the support ring 210 is used to place wafers.

[0047] Specifically, such as Figure 4 As shown, the wafer cleaning machine 200 includes a support ring 210 for supporting the wafer. The support ring 210 is horizontally disposed on the top of the support portion 220 to facilitate the placement and removal of the wafer. This ensures that the wafer remains horizontal during the cleaning process and avoids damage caused by wafer shaking or collision due to unstable support.

[0048] A sealing wall 230 is disposed around the support portion 220 to form a cleaning chamber, preferably, as shown below. Figure 4 As shown, the sealing wall 230 has a vertically arranged first sealing plate 231 and a second sealing plate 232 inclined towards the center of the cleaning chamber relative to the first sealing plate 231. The second sealing plate 232 is connected to the first sealing plate 231. The arrangement of the first sealing plate 231 and the second sealing plate 232 can further prevent the cleaning solution from splashing out of the cleaning chamber, thus improving cleaning safety.

[0049] The specific structure and beneficial effects of the support ring protection device 100 have been described in detail above and will not be repeated here.

[0050] The aforementioned wafer cleaning machine 200, through the setting of the support ring protection device 100, reduces the possibility of corrosion of the support ring 210, reduces problems such as equipment pollution, pipeline blockage, and frequent component replacement caused by corrosion, and improves product yield, production efficiency and operational safety.

[0051] Optionally, such as Figure 3 As shown, the support part 220 has a support rod 221 that is movably disposed in the cleaning chamber. The support rod 221 can drive the support part 220 and the support ring 210 to rotate along the axis.

[0052] Specifically, such as Figure 3 As shown, the movable configuration of the support rod 221 provides flexible position adjustment capability for the support part 220 and the support ring 210. When the protective sleeve 120 is fitted on the outer periphery of the support ring 210, the support rod 221 can drive the support part 220 and the support ring 210 to rotate around the axis for one revolution, so as to ensure that there is a preset gap between the protective sleeve 120 and the support ring 210, and to prevent the protective sleeve 120 from rotating with the support ring 210, thereby improving the reliability of the subsequent corrosive medium suction process.

[0053] Meanwhile, during the wafer cleaning process, the support rod 221 can drive the support part 220 and the support ring 210 to rotate in the cleaning chamber, so that all parts of the wafer can be evenly contacted with the cleaning solution, thereby improving the cleaning quality and thus increasing the product yield.

[0054] Optionally, the top of the cleaning chamber has an opening; the support 220 can extend and retract in the vertical direction, allowing the support ring 210 to move into or out of the cleaning chamber through the opening.

[0055] Specifically, such as Figure 4 As shown, the top opening of the cleaning chamber provides a direct passage for the support ring 210 and the wafer to enter and exit. The top opening utilizes the vertical space above the cleaning machine, allowing operators or automated equipment to directly pick up and place wafers on the support ring 210 from above. This provides a wider field of vision and more flexible movements, effectively reducing damage to wafers caused by improper loading and unloading, and improving operational safety and efficiency.

[0056] The vertical extension and retraction of the support part 220, in conjunction with the top opening, completes the movement of the support ring 210 in and out. When the wafer is being cleaned, the support part 220 retracts into the cleaning chamber to prevent cleaning solution from splashing outside the cleaning chamber. When it is necessary to load or unload the wafer, the support part 220 extends upward to the outside of the top opening, driving the support ring 210 to rise from the opening and move out of the cleaning chamber. This allows operators or robotic arms to safely pick up and place wafers outside the cleaning chamber, avoiding direct contact with residual corrosive media inside the chamber and reducing safety hazards.

[0057] The above description is merely an optional embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

[0058] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable way without contradiction. In order to avoid unnecessary repetition, this utility model will not describe the various possible combinations separately.

Claims

1. A support ring protection device, characterized in that, It includes a suction device (110) and a protective sleeve (120). The protective sleeve (120) is adapted to the support ring (210) of the wafer cleaning machine (200) and can be fitted onto the outer surface of the support ring (210) to cover the side wall and top of the support ring (210). The protective sleeve (120) is formed by assembling multiple sub-protective sleeves (121). The suction device (110) is connected to the inner cavity of the sub-protective sleeves (121) and is used to remove corrosive media that have penetrated into the protective sleeve (120).

2. The support ring protection device according to claim 1, characterized in that, The suction device (110) includes a main body and a water-gas separator (111). The main body is connected to the inner cavity of the sub-protective sleeve (121) through a pipe (112). The water-gas separator (111) is disposed on the pipe (112) between the main body and the sub-protective sleeve (121) and is used to separate the solution and gas in the corrosive medium.

3. The support ring protection device according to claim 1, characterized in that, There is a buffer gap between the inner wall of the protective sleeve (120) and the outer wall of the support ring (210).

4. The support ring protection device according to claim 1, characterized in that, The support ring protection device (100) further includes a driving unit, which is drivenly connected to the sub-protective sleeve (121) for driving the sub-protective sleeve (121) to move closer to or away from the support ring (210).

5. The support ring protection device according to claim 4, characterized in that, One end of the drive unit is connected to the sub-protective sleeve (121), and the other end is hinged to the side wall of the support part (220) of the wafer cleaning machine. The support ring (210) is located on the end face of the support part (220). The drive unit can drive the sub-protective sleeve (121) to rotate around the hinge point to a horizontal state and cover the outer periphery of the support ring (210).

6. The support ring protection device according to claim 4 or 5, characterized in that, The driving unit is a linear cylinder (130), and the sub-protective sleeve (121) is disposed at the telescopic end of the linear cylinder (130). The linear cylinder (130) drives the sub-protective sleeve (121) to extend a preset stroke so that when the support ring (210) is located in the movement path of the sub-protective sleeve (121), the linear cylinder (130) drives the sub-protective sleeve (121) to rotate around the hinge point to a horizontal state and cover the outer periphery of the support ring (210).

7. The support ring protection device according to claim 1, characterized in that, The protective sleeve (120) is made of an acid-resistant corrosion-resistant material.

8. A wafer cleaning machine, characterized in that, It includes a support ring (210), a support portion (220), a sealing wall (230), and a support ring protection device (100) as described in any one of claims 1-7; the sealing wall (230) encloses to form a cleaning chamber, the support portion (220) is disposed in the cleaning chamber, the support ring (210) is placed on top of the support portion (220), and the support ring (210) is used to place a wafer.

9. The wafer cleaning machine according to claim 8, characterized in that, The support part (220) has a support rod (221) movably disposed in the cleaning chamber, and the support rod (221) can drive the support part (220) and the support ring (210) to rotate along the axis.

10. The wafer cleaning machine according to claim 8, characterized in that, The top of the cleaning chamber has an opening; the support (220) is extendable in the vertical direction, so that the support ring (210) can move into or out of the cleaning chamber through the opening.

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