Cover plate of wet cleaning equipment and wet cleaning equipment

Abstract

This application provides a cover plate for a wet cleaning device and the wet cleaning device itself. The wet cleaning device includes a sleeve and a bearing sleeved and fixed on the sleeve. The cover plate includes a cover plate body and a side wall. The side wall is arranged around the edge of the cover plate body to form a receiving cavity. The diameter of the receiving cavity is greater than or equal to the maximum diameter of the bearing. The cover plate body is provided with a nozzle and has a mounting hole connected to the sleeve. When the cover plate body is fixed on the sleeve through the mounting hole, the bearing and the nozzle are located on opposite sides of the cover plate body, and part of the bearing is located in the receiving cavity. This application can prevent water from entering the magnetic fluid storage space and causing magnetic fluid to overflow, thereby avoiding defects in the wafer during the wet cleaning process.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, specifically relating to a cover plate for a wet cleaning device and the wet cleaning device itself. Background Technology

[0002] In chip manufacturing, wet cleaning equipment is commonly used, which employs deionized water to clean the crystal face and back of the wafer. The crystal face, or front side of the wafer, refers to the exposed surface on the wafer where active semiconductor devices have been manufactured or will be manufactured; the crystal back is the back side of the wafer, the side opposite the front side. For example... Figure 1 As shown, the wafer is held by a wafer holder with its back side facing up and its front side facing down. Nozzle 270a scans back and forth across the back of the wafer to clean it. To prevent liquid from splashing onto the front of the wafer during cleaning, nozzle 230a sprays water onto the front of the wafer. Nozzle 230a directs the water to the center of the front of the wafer. The centrifugal force generated by the wafer's rotation distributes the water across the entire front of the wafer, forming a water film. This prevents water from splashing from the back of the wafer onto the front, thus avoiding contamination of the front of the wafer.

[0003] During the cleaning process, the wafer holder rotates the wafer. To reduce friction, a bearing is installed on the rotating shaft of the wafer holder. The nozzle 230a passes through the center of the bearing, which has a sleeve. To enhance the seal between the bearing and the sleeve, a sealing groove is formed between them, storing Fe3O4 magnetic fluid. This magnetic fluid further strengthens the seal between the bearing and the sleeve. To prevent liquid ejected from the nozzle 230a from entering the space between the bearing and the sleeve and causing the magnetic fluid to overflow, in the prior art, a cover plate is installed above the bearing to block the central through-hole.

[0004] However, after the wet cleaning process is completed, nozzle 230a stops spraying water. For example... Figure 2 As shown, at the moment of stopping, the water droplets often fail to stop in time due to nozzle backflow. At this moment, the impact force of the water sprayed from the nozzle is insufficient, causing water droplets to flow around the cover plate. These droplets then enter the sealing groove through the gaps in the cover plate, causing the magnetofluid to leak out. Furthermore, because the wafer rotates at high speed, the air pressure below the wafer is low, making it easy for the overflowing magnetofluid to be attracted to the center of the wafer's front side, thus forming a defect—a special pattern formed at the center of the wafer. After slicing and analysis using a transmission electron microscope (TEM), the presence of Fe element was found. Utility Model Content

[0005] The technical problem to be solved by this application is to provide a cover plate for a wet cleaning device and a wet cleaning device. This application can prevent water from entering the magnetic fluid storage space and causing magnetic fluid to overflow, thereby avoiding defects in the wafer during the wet cleaning process.

[0006] To solve the above-mentioned technical problems, this application provides a cover plate for a wet cleaning device. The wet cleaning device includes a sleeve and a bearing sleeved and fixed on the sleeve. The cover plate includes a cover plate body and a side wall. The side wall is arranged around the edge of the cover plate body to form a receiving cavity. The diameter of the receiving cavity is greater than or equal to the maximum diameter of the bearing. The cover plate body is provided with a nozzle and has a mounting hole connected to the sleeve. When the cover plate body is fixed on the sleeve through the mounting hole, the bearing and the nozzle are located on opposite sides of the cover plate body, and part of the bearing is located in the receiving cavity.

[0007] Furthermore, the diameter of the accommodating cavity is larger than the maximum diameter of the bearing, so that the inner surface of the sidewall is in clearance fit with the outer wall surface of the first end of the bearing.

[0008] Furthermore, the cover plate also includes an extension wall, which is fixed to the outer side of the side wall away from the receiving cavity, and the side of the extension wall facing the bearing is in the same plane as the side of the side wall facing the bearing.

[0009] Furthermore, the height of the extended wall is less than the height of the side wall.

[0010] Furthermore, a raised ridge is provided around the nozzle on the side of the cover plate body facing away from the receiving cavity.

[0011] Furthermore, the protruding ridges are positioned close to the edge of the cover plate body.

[0012] Furthermore, a groove is provided on the side of the cover plate body facing away from the receiving cavity, and the groove is an annular groove arranged around the nozzle.

[0013] Furthermore, the depth of the groove gradually decreases from the nozzle side to the edge side of the cover plate body in the circumferential width direction.

[0014] This application also provides a wet cleaning apparatus, comprising: a wafer clamping member for clamping a wafer; a sleeve and a bearing sleeved and fixed on the sleeve, wherein the bearing and the sleeve have a sealing groove for accommodating magnetofluid, and the bearing is connected to the wafer clamping member to allow the wafer clamping member to rotate relative to the sleeve; the aforementioned cover plate, the cover plate being connected to the sleeve such that a portion of the bearing is located within the accommodating cavity; and a cleaning assembly, comprising a pipe placed within the sleeve and a nozzle fixed on the cover plate, the nozzle being connected to the pipe.

[0015] Furthermore, when the cover plate is fixed to the sleeve, a gap is formed between the side wall of the cover plate facing the bearing and the wafer clamping component.

[0016] The beneficial effects of this application are: The cover plate of the wet cleaning equipment of this application includes a cover plate body and a side wall. The side wall is arranged around the edge of the cover plate body to form a receiving cavity. The diameter of the receiving cavity is greater than or equal to the maximum diameter of the bearing. When the cover plate body is fixed on the sleeve, the cover plate body completely covers the bearing, which can prevent water sliding from the top surface of the cover plate from falling directly onto the bearing. It also increases the distance that water has to travel to enter the sealing groove containing the magnetic fluid. Water entering the first end face of the bearing from the gap between the side wall and the bearing must pass over the baffle located on the inner side wall of the bearing to enter the sealing groove, thereby reducing or even eliminating the possibility of water entering the sealing groove. Furthermore, the bearing part is located in the receiving cavity, which makes the structure of the cover plate more stable and less prone to shaking. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings of the embodiments will be briefly described below. Obviously, the drawings described below only relate to some embodiments of this disclosure and are not intended to limit this disclosure.

[0018] Figure 1 This is a partial structural diagram of a wet cleaning device used in the prior art for cleaning wafers. Figure 2 A diagram showing the flow direction of water in nozzle 230a after the wafer is cleaned in a wet cleaning device in the prior art; Figure 3 This is a structural diagram of the cover plate of the wet cleaning equipment in an embodiment of this disclosure; Figure 4 This is a structural diagram of the cover plate of a wet cleaning device according to another embodiment of the present disclosure; Figure 5 This is a structural diagram of the cover plate of a wet cleaning device according to another embodiment of the present disclosure.

[0019] Figure label: Cover plate 100, cover plate body 10, first protruding ridge 11, side wall 20, extension wall 30, wet cleaning equipment 200, sleeve 210, nozzle 230, bearing 240, baffle 241, magnetic fluid 250, wafer clamping component 260, bearing sleeve 280, wafer 300, wet cleaning equipment 200a, sleeve 210a, nozzle 230a, bearing 240a, baffle 241a, magnetic fluid 250a, wafer clamping component 260a, nozzle 270a, bearing sleeve 280a, cover plate 100a, cover plate body 10a, side wall 20a, wafer 300a. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0021] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” indicate that the element or object preceding “comprising” or “including” encompasses the element or object listed following “comprising” or “including” and its equivalents, and do not exclude other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0022] In this application, the term "height" is used in conjunction with... Figure 4 The top and bottom directions are consistent; the term "width" is consistent with... Figure 4 The left and right directions are consistent.

[0023] This disclosure provides a cover plate for a wet cleaning device. The wet cleaning device includes a sleeve and a bearing sleeved and fixed on the sleeve. The cover plate includes a cover plate body and a side wall. The side wall is arranged around the edge of the cover plate body to form a receiving cavity. The diameter of the receiving cavity is greater than or equal to the maximum diameter of the bearing. The cover plate body is provided with a nozzle and has a mounting hole connected to the sleeve. When the cover plate body is fixed on the sleeve through the mounting hole, the bearing and the nozzle are located on opposite sides of the cover plate body, and part of the bearing is located in the receiving cavity.

[0024] The cover plate of the wet cleaning equipment of this application includes a cover plate body and a side wall. The side wall is arranged around the edge of the cover plate body to form a receiving cavity. The diameter of the receiving cavity is greater than or equal to the maximum diameter of the bearing. When the cover plate body is fixed on the sleeve, the cover plate body completely covers the bearing, which can prevent water sliding from the top surface of the cover plate from falling directly onto the bearing. It also increases the distance that water has to travel to enter the sealing groove containing the magnetic fluid. Water entering the first end face of the bearing from the gap between the side wall and the bearing must pass over the baffle located on the inner side wall of the bearing to enter the sealing groove, thereby reducing or even eliminating the possibility of water entering the sealing groove. Furthermore, the bearing part is located in the receiving cavity, which makes the structure of the cover plate more stable and less prone to shaking.

[0025] The cover plate and wet cleaning equipment of the present disclosure are described below with reference to the accompanying drawings.

[0026] Figure 1 This is a partial structural diagram of a wet cleaning device used in the prior art for cleaning wafers. Figure 2 This is a diagram showing the flow direction of water in nozzle 230a after the wafer is cleaned using a wet cleaning device in the prior art.

[0027] like Figure 1 , Figure 2 As shown, the existing wet cleaning equipment 200a includes a main body (not shown in the figure), a sleeve 210a, a cleaning assembly, a bearing 240a, a magnetic fluid 250a, a wafer clamping component 260a (only part of the structure is shown in the figure), and a cover plate 100a. The sleeve 210a is fixedly installed on the main body (not shown in the figure). The cleaning assembly includes a pipe (not shown in the figure) and a nozzle 230a. The pipe is placed inside the sleeve 210a, and the nozzle 230a is fixed on the cover plate 100a and communicates with the first end of the pipe. The first end of the pipe is the... Figure 1The upper end of the pipe shown is the second end, which is the end of the pipe opposite to the first end. The second end of the pipe is connected to the liquid supply tank, and the pipe is used to supply liquid to the nozzle 230a. A bearing 240a is sleeved and fixed on the sleeve 210a, and the bearing 240a is embedded in the bearing sleeve 280a. An annular sealing groove is formed between the bearing 240a and the sleeve 210a. A magnetic fluid 250a is located within the sealing groove and is used to seal the gap between the sleeve 210a and the bearing 240a. A wafer holder 260a is used to hold the wafer 300a. The bearing 240a is connected to the wafer holder 260a, allowing the wafer holder 260a to rotate relative to the sleeve 210a. Specifically, the wafer clamping component 260a is fixed to the outer ring of the bearing 240a and the bearing sleeve 280a and is drivenly connected to the drive assembly (not shown in the figure). The drive assembly drives the wafer clamping component 260a to rotate, thereby causing the wafer 300a to rotate. A baffle 241a is provided on the end face of the first end of the bearing 240a. The baffle 241a is located near the inner wall of the bearing 240a. The first end of the bearing 240a faces the wafer 300a, i.e. Figure 1 As shown, the first end of bearing 240a is the upper end of bearing 240a. Cover plate 100a includes cover plate body 10a and sidewall 20a. Sidewall 20a is arranged around the edge of cover plate body 10a to form a receiving cavity, the diameter of which is slightly larger than the diameter of the outer surface of cover plate 240a. The first end of sleeve 210a is the end facing wafer 300a, i.e., as shown... Figure 1 As shown, the first end of the sleeve 210a is the upper end of the sleeve 210a. When the cover plate 100a is installed on the first end of the sleeve 210a, the baffle 240a is located within the accommodating cavity, and the inner surface of the side wall 20a is clearance-fitted with the outer surface of the baffle 240a. However, in the prior art, such as Figure 2 As shown, at the end of wafer cleaning, a large amount of water will be sprayed onto the cover plate 100a due to nozzle back suction, and the water flows along... Figure 2 After sliding from the cover plate 100a onto the bearing 240a in the direction of the middle arrow, it will enter the sealing groove through the gap between the side wall 20a and the baffle 241a, causing the magnetic fluid 250a to overflow. Since the wafer is rotating at high speed, the air pressure under the wafer is low, which makes the overflowing magnetic fluid easily attracted to the front side of the wafer, thus forming a defect.

[0028] To address the above problems, this disclosure provides a cover plate for a wet cleaning device.

[0029] Figure 3 This is a structural diagram of the cover plate of the wet cleaning equipment in an embodiment of this disclosure.

[0030] like Figure 3As shown, the cover plate 100 of the wet cleaning equipment includes a cover plate body 10 and a side wall 20. The side wall 20 is arranged around the edge of the cover plate body 10 to form a receiving cavity, the diameter of which is greater than or equal to the maximum diameter of the bearing 240. The cover plate body 10 is provided with a nozzle 230 and a mounting hole connected to a sleeve 210. When the cover plate body 10 is fixed to the sleeve 210 through the mounting hole, the bearing 240 and the nozzle 230 are located on opposite sides of the cover plate body 10, and a portion of the bearing 240 is located within the receiving cavity. Therefore, the cover plate body 10 can completely cover the bearing 240, preventing water sliding off the cover plate body 10 from falling directly onto the bearing. It also increases the distance that water sliding off the cover plate body 10 needs to travel to enter the sealing groove, making it less likely for water to enter the sealing groove. Furthermore, water entering the first end face of the bearing 240 from the gap between the side wall 20 and the bearing 240 needs to pass over the baffle 241 located on the inner side wall of the bearing 240 before entering the sealing groove, further reducing or even eliminating the possibility of water entering the sealing groove. In addition, the bearing portion is located in the receiving cavity, making the cover plate structure more stable and less prone to shaking.

[0031] Specifically, the first end of the bearing 240 is the end facing the wafer 300, i.e. Figure 3 As shown, the first end of bearing 240 is the upper end of bearing 240. The first end of sleeve 210 is the end facing wafer 300, i.e. Figure 3 As shown, the first end of the sleeve 210 is the upper end of the sleeve 210. The cover plate body 10 is fixed to the first end of the sleeve 210, and the first end portion of the bearing 240 is located in the accommodating cavity.

[0032] In some embodiments, the diameter of the accommodating cavity is larger than the maximum diameter of the bearing 240, so that the inner surface of the sidewall 20 is clearance-fitted with the outer wall surface of the first end of the bearing. This not only makes the cover plate structure more stable and less prone to shaking, but also prevents friction between the bearing 240 and the sidewall 20 when the outer ring of the bearing rotates.

[0033] Figure 4 This is a structural diagram of the cover plate of a wet cleaning device according to another embodiment of the present disclosure.

[0034] like Figure 4 As shown, in some embodiments, the cover plate 100 further includes an extension wall 30, which is fixed to the outer side of the side wall 20 away from the receiving cavity. The side of the extension wall 30 facing the bearing 240 is in the same plane as the side of the side wall 20 facing the bearing 240. The extension wall increases the width of the gap between the side wall 20 and the wafer holder 260, making it less likely for water to enter the sealing groove.

[0035] In some embodiments, the height of the extension wall 30 is less than the height of the side wall 20. This facilitates manufacturing and reduces the weight of the cover body 10 edges, thus reducing the risk of the cover body 10 breaking due to excessive weight at the edges.

[0036] Figure 5 This is a structural diagram of the cover plate of a wet cleaning device according to another embodiment of the present disclosure.

[0037] like Figure 5 As shown, in some embodiments, a raised ridge 11 is provided around the nozzle 230 on the side of the cover plate body 10 facing away from the receiving cavity. Since the distance from the cover plate body 10 to the wafer is closer at the center where the nozzle 230 passes through the cover plate body 10 than in other areas of the cover plate body 10, the raised ridge 11 creates an annular water storage area on the cover plate body 10. When the wafer cleaning is finished, the nozzle 230 draws back the spilled water into this water storage area, thereby preventing water from sliding off the cover plate or greatly reducing the amount of water sliding off the cover plate, and further preventing water from entering the sealing groove from the gap between the bearing 240 and the cover plate 100.

[0038] In some embodiments, the protruding ridge 11 is disposed near the edge of the cover body 10. This results in a larger water storage area, enabling the storage of more water.

[0039] As a variation of the protrusion 11, in some embodiments, a groove (not shown in the figure) is provided on the side of the cover plate body 10 facing away from the receiving cavity. The groove is an annular groove arranged around the nozzle 230. The groove is used to accommodate the water that is sucked back by the nozzle 230 at the end of wafer cleaning, thereby preventing water from sliding down the cover plate, or greatly reducing the amount of water sliding down the cover plate, and further preventing water from entering the sealing groove from the gap between the bearing 240 and the cover plate 100.

[0040] In some embodiments, the depth of the groove gradually decreases from the nozzle side to the edge side of the cover body in the circumferential width direction.

[0041] This disclosure also provides a wet cleaning apparatus. For example... Figure 3-5 As shown, the wet cleaning equipment 200 includes: a sleeve 210, a cleaning assembly, a bearing 240, a magnetorheological fluid 250, a wafer clamping component 260 (only part of the structure is shown in the figure), and the aforementioned cover plate 100.

[0042] The sleeve 210 is installed on the main body of the equipment (not shown in the figure). The cleaning assembly includes: a pipe (not shown in the figure) and a nozzle 230. The pipe is placed inside the sleeve 210, and the nozzle 230 is fixed to the cover plate 100 and communicates with the first end of the pipe. The first end of the pipe is... Figure 3The upper end of the pipe shown is shown. The second end of the pipe is the end opposite to the first end of the pipe. The second end of the pipe is connected to the liquid supply tank. The pipe is used to supply liquid to the nozzle 230. The bearing 240 is sleeved and fixed on the sleeve 210, and an annular sealing groove is formed between the bearing 240 and the sleeve 210. The magnetic fluid 250 is located in the sealing groove and is used to seal the gap between the sleeve 210 and the bearing 240. The wafer holder 260 is used to hold the wafer 300. The bearing 240a is connected to the wafer holder 260a, allowing the wafer holder 260a to rotate relative to the sleeve 210a. The cover plate 100 is fixed to the first end of the sleeve 210, which is the... Figure 3 The upper end of the sleeve 210 is shown. When the cover plate 100 is fixed to the first end of the sleeve 210, the bearing 240 and the nozzle 230 are located on opposite sides of the cover plate body 10 of the cover plate 100, and part of the bearing 240 is located in the receiving cavity of the cover plate 100.

[0043] Specifically, the bearing 240 is embedded in the bearing sleeve 280, and the wafer clamping member 260 is fixed on the outer ring of the bearing 240 and fixed on the bearing sleeve 280.

[0044] Specifically, a baffle 241 is provided on the end face of the first end of the bearing 240. The baffle 241 is located near the inner wall of the bearing 240, and the first end of the bearing 240 is the end facing the wafer 300, i.e. Figure 3 As shown, the first end of bearing 240 is the upper end of bearing 240.

[0045] Specifically, the wafer clamp 260 is fixed on the outer ring of the bearing 240 and is driven to connect with the drive assembly (not shown in the figure). The drive assembly drives the wafer clamp 260 to rotate, thereby driving the wafer 300 to rotate.

[0046] In some embodiments, when the cover plate 100 is fixed to the sleeve 210, a gap is formed between the side wall 20 of the cover plate 100 facing the bearing 240 and the wafer holder 260. This not only reduces the speed at which water enters the sealing groove formed between the bearing 240 and the sleeve 210, but also prevents friction between the wafer holder 260 and the side wall 20 when the wafer holder 260 rotates.

[0047] The text and accompanying drawings in this disclosure are provided by way of example only to aid in understanding this disclosure. They should not be construed as limiting the scope of this disclosure in any way. Although certain embodiments and examples have been provided, it will be apparent to those skilled in the art, based on the content disclosed herein, that changes can be made to the illustrated embodiments and examples without departing from the scope of this disclosure.

[0048] Although this disclosure has been described with reference to exemplary embodiments, various changes and modifications may be suggested to those skilled in the art. This disclosure is intended to cover such changes and modifications that fall within the scope of the appended claims.

[0049] Nothing described in this disclosure should be construed as implying that any particular element, step, or function is an essential element that must be included within the scope of the claims. The scope of the patent subject matter is defined only by the claims.

Claims

1. A cover plate for a wet cleaning device, the wet cleaning device comprising a sleeve and a bearing sleeved and fixed on the sleeve, characterized in that: The cover plate includes a cover plate body and a side wall. The side wall is arranged around the edge of the cover plate body to form a receiving cavity. The diameter of the receiving cavity is greater than or equal to the maximum diameter of the bearing. The cover plate body is provided with a nozzle and a mounting hole connected to the sleeve. When the cover plate body is fixed to the sleeve through the mounting hole, the bearing and the nozzle are located on opposite sides of the cover plate body, and part of the bearing is located in the receiving cavity.

2. The cover plate of the wet cleaning equipment according to claim 1, characterized in that, The diameter of the accommodating cavity is larger than the maximum diameter of the bearing, such that the inner surface of the sidewall is in clearance fit with the outer wall surface of the first end of the bearing.

3. The cover plate of the wet cleaning equipment according to claim 1, characterized in that, The cover plate also includes an extension wall, which is fixed to the outer side of the side wall away from the receiving cavity, and the side of the extension wall facing the bearing is in the same plane as the side of the side wall facing the bearing.

4. The cover plate of the wet cleaning equipment according to claim 3, characterized in that, The height of the extended wall is less than the height of the side wall.

5. The cover plate of the wet cleaning equipment according to claim 1, characterized in that, The cover plate body has a raised ridge around the nozzle on the side facing away from the receiving cavity.

6. The cover plate of the wet cleaning equipment according to claim 5, characterized in that, The protruding ridge is located near the edge of the cover plate body.

7. The cover plate of the wet cleaning equipment according to claim 1, characterized in that, The cover plate body has a groove on the side facing away from the accommodating cavity, and the groove is an annular groove arranged around the nozzle.

8. The cover plate of the wet cleaning equipment according to claim 7, characterized in that, The depth of the groove gradually decreases from the nozzle side to the edge side of the cover plate body in the circumferential width direction.

9. A wet cleaning device, characterized in that, include: Wafer clamping components are used to clamp wafers; A sleeve and a bearing sleeved and fixed on the sleeve, wherein the bearing and the sleeve have a sealing groove for accommodating magnetic fluid, and the bearing is connected to the wafer holder so that the wafer holder rotates relative to the sleeve. The cover plate as described in any one of claims 1 to 8, wherein the cover plate is connected to the sleeve such that a portion of the bearing is located within the receiving cavity; The cleaning assembly includes a conduit disposed within the sleeve and a nozzle fixed to a cover plate, the nozzle being connected to the conduit.

10. The wet cleaning equipment according to claim 9, characterized in that, When the cover plate is fixed to the sleeve, a gap is formed between the side wall of the cover plate facing the bearing and the wafer clamping component.

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