A chip stacker and semiconductor packaging system

Abstract

This utility model applies to the field of chip stacking machines and discloses a chip stacking machine and a semiconductor packaging system. The semiconductor packaging system includes a chip stacking machine, a robotic arm, and a robot PLC. The chip stacking machine includes a housing, a preheating table, a feeding rack, a chip stacking support, a moving mechanism, a material gripper, a chip stacking machine PLC, and a first position sensor. The housing is equipped with a safety door and a feeding port. The preheating table and the chip stacking support are located inside the housing. The feeding rack is placed on the preheating table and has multiple chip stacking slots. The moving mechanism is mounted on the chip stacking support, and the material gripper is mounted on the moving mechanism. The first position sensor is mounted on the chip stacking support and is used to detect whether the material gripper has returned to its origin. The chip stacking machine PLC is used to communicate with the robot PLC. The robot PLC only controls the robotic arm to pick up the feeding rack after receiving a material gripper presence signal, a chip stacking completion signal, and a chip stacking machine status safety signal from the chip stacking machine PLC, thereby avoiding collisions between the feeding rack and the material gripper.

Description

Technical Field

[0001] This utility model relates to the field of chip stacking machines, and more particularly to a chip stacking machine and a semiconductor packaging system. Background Technology

[0002] In the semiconductor packaging field, with the continuous development of automation technology, fully automated production has widely replaced traditional manual operations. The collaborative operation of robots and various production equipment has become key to improving production efficiency. In this mode, the robot's actions strictly rely on the signal instructions issued by each production device through a PLC (Programmable Logic Controller). The completion signal sent by the production equipment after completing a predetermined process is the core basis for the robot to execute the next action.

[0003] In specific application scenarios, chip sorting machines, as important equipment in the semiconductor packaging process, are mainly responsible for arranging semiconductor components to designated positions according to preset requirements. In existing technology, the working logic of a chip sorting machine is as follows: after completing the last row of chip arrangement, the chip sorting machine PLC will immediately send a chip sorting completion signal to the robot PLC; after receiving the completion signal, the robot PLC will drive the robotic arm to perform the next action (such as picking up the loading rack).

[0004] However, existing chip stacking machines have significant drawbacks: the trigger condition for sending the stacking completion signal is only related to "completing the last stack of wafers," and does not relate to whether the wafer grippers have returned to their initial positions. In actual production, unexpected situations such as sudden equipment alarms or mechanical failures may occur, causing the chip stacking machine to complete the stacking process, but the wafer grippers may fail to return to their initial positions in time. At this point, the robot PLC has already received the stacking completion signal and drives the robotic arm to continue moving. This can easily cause the robotic arm to collide with the unreturned wafer grippers when picking up the loading rack, leading to deformation or even damage to the furnace rack and wafer grippers. This not only affects production continuity but also increases equipment maintenance costs and product defect rates, seriously restricting the efficient and stable production of semiconductor packaging.

[0005] Therefore, existing technologies still need improvement and development. Utility Model Content

[0006] The first objective of this invention is to provide a chip stacking machine that addresses the technical problem that existing chip stacking machines may trigger a chip stacking completion signal when the chip claw fails to return to its original position, causing the robotic arm to collide with the chip claw when picking up the material rack.

[0007] To achieve the above objectives, the solution provided by this utility model is as follows:

[0008] A sheet stacking machine includes a housing, a preheating table, a feeding rack, a sheet stacking support, a moving mechanism, a material claw, a sheet stacking machine PLC, and a first position sensor. The housing is provided with a safety door and a feeding port. The preheating table and the sheet stacking support are disposed inside the housing. The feeding rack is placed on the preheating table and is provided with multiple sheet stacking slots. The moving mechanism is mounted on the sheet stacking support, and the material claw is mounted on the moving mechanism. The moving mechanism is used to drive the material claw to move to place the product in the sheet stacking slot. The first position sensor is mounted on the sheet stacking support and is used to detect whether the material claw has returned to its origin. The first position sensor is connected to the sheet stacking machine PLC, and the sheet stacking machine PLC is used to communicate with a robot PLC.

[0009] Preferably, the first position sensor is located to the side of the origin position of the feed claw.

[0010] Preferably, the device further includes a sensor bracket, which is mounted on the sheet-laying bracket and corresponds to the origin position of the feed claw, and the first position sensor is mounted on the sensor bracket.

[0011] Preferably, the chip stacking machine PLC is provided with a first signal input terminal, a second signal input terminal, a third signal input terminal, and a first communication terminal. The first position sensor is connected to the third signal input terminal. The third signal input terminal is used to receive the claw presence signal output by the first position sensor. The first signal input terminal is used to receive the moving mechanism positioning signal. The second signal input terminal is used to receive the safety door sensing signal. The first communication terminal is used to communicate with the second communication terminal of the robot PLC. The chip stacking machine PLC converts the moving mechanism positioning signal, the safety door sensing signal, and the claw presence signal into a chip stacking completion signal, a chip stacking machine status safety signal, and a chip stacking machine safety pick-and-place signal. The chip stacking machine PLC uses the first communication terminal to feed back the chip stacking completion signal, the chip stacking machine status safety signal, and the chip stacking machine safety pick-and-place signal to the robot PLC.

[0012] Preferably, the tray arrangement bracket includes a bracket body, a first arm and a second arm, the first arm and the second arm are spaced apart on the left and right sides of the bracket body, and a photoelectric sensor is provided at the end of the second arm away from the bracket body. The photoelectric sensor is connected to the first signal input terminal and is used to detect the positioning signal of the detection moving mechanism.

[0013] Preferably, a second position sensor is provided on the housing, the second position sensor is located next to the safety door, the second position sensor is connected to the second signal input terminal, and is used to detect whether the safety door is closed.

[0014] Preferably, the PLC of the chip sorting machine is also provided with a fourth signal input terminal, and an infrared sensor is provided on the preheating table. The infrared sensor is connected to the fourth signal input terminal and is used to detect whether the feeding rack exists.

[0015] The second objective of this utility model is to provide a semiconductor packaging system, including a chip stacker, a robotic arm, and a robot PLC. The chip stacker is the chip stacker described above. After receiving the chip stacking completion signal, the chip stacker status safety signal, and the chip stacker safety pick-up and put-down signal output by the chip stacker PLC, the robot PLC sends an instruction to control the robotic arm to pick up the loading rack from the loading port.

[0016] In this solution, the chip stacker is equipped with a first position sensor to detect whether the claw has reset and returned to the origin. The first position sensor only outputs a claw presence signal when it detects that the claw has returned to the origin. The robot PLC only controls the robot arm to pick up the loading rack after receiving the claw presence signal converted by the chip stacker PLC based on the claw presence signal, the chip stacking completion signal, and the chip stacker status safety signal. This can prevent the loading rack from colliding with the claw and protect the chip stacker. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 This is a side view of the chip stacker provided in this embodiment of the utility model;

[0019] Figure 2 This is a cross-sectional view of the chip sorting machine provided in this embodiment of the utility model;

[0020] Figure 3 This is a partial schematic diagram of the film sorting machine provided in an embodiment of this utility model;

[0021] Figure 4 This is a structural block diagram of the semiconductor packaging system provided in this embodiment of the present invention.

[0022] Explanation of icon numbers:

[0023] 10. Machine casing; 11. Safety door; 12. Feeding port; 20. Preheating table; 30. Feeding rack; 31. Sheet chute; 40. Sheet chute support; 41. Support body; 42. First arm; 43. Second arm; 50. Moving mechanism; 60. Material claw; 70. Sheet chute PLC; 71. First signal input terminal; 72. Second signal input terminal; 73. Third signal input terminal; 74. First communication terminal; 75. Fourth signal input terminal; 80. First position sensor; 90. Sensor bracket; 100. Photoelectric sensor; 110. Second position sensor; 120. Infrared sensor; 130. Robot PLC; 131. Second communication terminal. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this utility model are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0026] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0027] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0028] like Figures 1 to 4 As shown, this is a slicer machine according to one embodiment of the present invention.

[0029] Please see Figures 1-4 As shown, the sheet-laying machine of this utility model embodiment includes a housing 10, a preheating table 20, a feeding rack 30, a sheet-laying support 40, a moving mechanism 50, a material claw 60, a sheet-laying machine PLC 70, and a first position sensor 80. The housing 10 is equipped with a safety door 11 and a feeding port 12. The preheating table 20 and the sheet-laying support 40 are disposed inside the housing 10. The feeding rack 30 is placed on the preheating table 20 and is equipped with multiple sheet-laying troughs 31. The moving mechanism 50 is mounted on the sheet-laying support 40. The claw 60 is mounted on the moving mechanism 50, which is used to move the claw 60 to place the product in the stacking tray 31. The first position sensor 80 is mounted on the stacking bracket 40 and is used to detect whether the claw 60 has returned to the origin. The first position sensor 80 is connected to the stacking machine PLC 70. When the first position sensor 80 detects that the claw 60 has returned to the origin, it outputs a claw presence signal to the stacking machine PLC 70. The stacking machine PLC 70 is used to communicate with the robot PLC 130.

[0030] In this embodiment, when the material claw 60 is detected to be at the origin, the first position sensor 80 outputs a material claw presence signal to the sheet stacking machine PLC 70. The sheet stacking machine PLC 70 is also used to receive the moving mechanism positioning signal and the safety door sensing signal. The sheet stacking machine PLC 70 converts the moving mechanism positioning signal, the safety door sensing signal and the material claw presence signal into a sheet stacking completion signal, a sheet stacking machine status safety signal and a sheet stacking machine safety pick-up and put-down signal, respectively, and transmits them to the robot PLC 130, so that the robot PLC 130 can send instructions to control the robot arm to pick up the loading rack 30 after receiving the sheet stacking completion signal, the sheet stacking machine status safety signal and the sheet stacking machine safety pick-up and put-down signal.

[0031] In this embodiment, the first position sensor 80 is located beside the origin of the gripper 60.

[0032] In this embodiment, for example, a proximity sensor is used as the first position sensor 80. When the claw 60 returns to the origin, the proximity sensor will be triggered by detecting the proximity of the claw 60 (metal material). At this time, the proximity sensor will output a high-level signal, that is, a claw presence signal.

[0033] In this embodiment, the moving mechanism 50 is a conventional XYZ three-axis moving mechanism 50. For example, it is driven by a servo motor, in conjunction with a ball screw and a linear guide. As long as it can drive the material claw 60 to move along the x-axis, y-axis and z-axis and place the product in the stacking material slot 31, it can drive the material claw 60 to complete the stacking operation. The specific structure is not described in detail here.

[0034] In this embodiment, the sheet stacker also includes a sensor bracket 90, which is mounted on the sheet stacker bracket 40 and corresponds to the origin position of the feed claw 60. A first position sensor 80 is mounted on the sensor bracket 90.

[0035] In this embodiment, the chip sorting machine PLC 70 is equipped with a first signal input terminal 71, a second signal input terminal 72, a third signal input terminal 73, and a first communication terminal 74. The first position sensor 80 is connected to the third signal input terminal 73. The third signal input terminal 73 is used to receive the claw presence signal output by the first position sensor 80. The first signal input terminal 71 is used to receive the moving mechanism positioning signal. The second signal input terminal 72 is used to receive the safety door sensing signal. The chip sorting machine PLC 70 converts the moving mechanism positioning signal, the safety door sensing signal, and the claw presence signal into a chip sorting completion signal, a chip sorting machine status safety signal, and a chip sorting machine safety pick-and-place signal. The first communication terminal 74 is used to communicate with the second communication terminal of the robot PLC 130. The chip sorting machine PLC 70 feeds back the chip sorting completion signal, the chip sorting machine status safety signal, and the chip sorting machine safety pick-and-place signal to the robot PLC 130 through the first communication terminal 74.

[0036] In this embodiment, the tray arrangement bracket 40 includes a bracket body 41, a first arm 42, and a second arm 43. The first arm 42 and the second arm 43 are spaced apart on the left and right sides of the bracket body 41. A photoelectric sensor 100 is provided at the end of the second arm 43 away from the bracket body 41. The photoelectric sensor 100 is connected to a first signal input terminal and is used to detect the arrival signal of the moving mechanism 50. The sensing distance of the photoelectric sensor 100 can be adjusted according to the actual situation. In this embodiment, the photoelectric sensor 100 can only sense the moving mechanism 50 when the moving mechanism 50 is in the last tray arrangement position, thereby generating a moving mechanism arrival signal and outputting it to the first signal input terminal 71 of the tray arrangement machine PLC 70. When the moving mechanism 50 reaches the last tray arrangement position, it means that the moving mechanism 50 has placed the product into the last tray arrangement slot.

[0037] In this embodiment, the photoelectric sensor 100 is disposed on the top of the second arm 43.

[0038] In this embodiment, the safety door 11 is a transparent door, which makes it easy to observe the operation of the film sorting machine.

[0039] In this embodiment, a second position sensor 110 is provided on the housing 10. The second position sensor 110 is located next to the safety door 11 and is connected to the second signal input terminal 72. It is used to detect whether the safety door is closed. The safety door sensing signal is generated by the second position sensor 110.

[0040] In this embodiment, the second position sensor 110 is generated by a magnetic proximity switch. A matching permanent magnet is installed on the safety door 11 to work with the magnetic proximity switch. When the safety door 11 is closed, the switch is closed and the magnetic proximity switch outputs a low level to the PLC 70 of the chip setter; when the safety door 11 is open, the switch is open and outputs a high level.

[0041] Furthermore, the PLC70 of the stacking machine is also equipped with a fourth signal input terminal 75. An infrared sensor 120 is installed on the preheating table 20. The infrared sensor 120 is connected to the fourth signal input terminal 75 and is used to detect whether the feeding rack 30 exists. When the infrared sensor 120 detects the feeding rack 30, it outputs a rack sensing signal to the fourth signal input terminal 75. After receiving the rack sensing signal and the safety door sensing signal, the PLC70 of the stacking machine controls the moving mechanism 50 to drive the claw 60 to perform the stacking operation.

[0042] The working principle of the chip stacking machine in this embodiment is as follows: After the moving mechanism 50 drives the material claw 60 to complete the chip stacking operation, the chip stacking machine outputs a moving mechanism positioning signal and a safety door sensing signal to the chip stacking machine PLC 70, and the material claw 60 resets and returns to the origin. When the material claw 60 returns to the origin, the first position sensor 80 detects the material claw 60 and outputs a material claw presence signal to the chip stacking machine PLC 70. After receiving the moving mechanism positioning signal, the safety door sensing signal, and the material claw presence signal, the chip stacking machine PLC 70 converts them into a chip stacking completion signal, a chip stacking machine status safety signal, and a chip stacking machine safety pick-and-place signal, and transmits these signals to the robot PLC 130. The robot PLC 130 will only control the robot arm to execute the next step after simultaneously receiving the chip stacking completion signal, the chip stacking machine status safety signal, and the chip stacking machine safety pick-and-place signal.

[0043] If the gripper 60 experiences an abnormal alarm during the reset process and cannot return to its original position, the first position sensor 80 will not detect the gripper 60. Consequently, the first position sensor 80 will not send a gripper presence signal to the chip stacker PLC 70, and the chip stacker PLC 70 will not send a chip stacker safety pick-up / place signal to the robot PLC 130. Since the robot PLC 130 does not receive the chip stacker safety pick-up / place signal, it will not control the robot arm to execute the next step.

[0044] The chip stacking machine of this utility model embodiment is equipped with a first position sensor 80 for detecting whether the material claw 60 has reset and returned to the origin. The first position sensor 80 only outputs a material claw presence signal when it detects that the material claw 60 has returned to the origin. The robot PLC 130 only controls the robot arm to pick up the loading rack 30 after receiving the material claw presence signal converted by the chip stacking machine PLC 70 based on the material claw presence signal, the chip stacking completion signal, and the chip stacking machine status safety signal. This can avoid collision between the loading rack 30 and the material claw 60 and protect the chip stacking machine.

[0045] Please see Figures 1-4 As shown, this utility model embodiment also provides a semiconductor packaging system, including a chip stacker, a robotic arm, and a robot PLC130. The chip stacker is the chip stacker described above. After receiving the chip stacking completion signal, the chip stacker status safety signal, and the chip stacker safety pick-up and put-down signal output by the chip stacker PLC70, the robot PLC130 sends an instruction to control the robotic arm to pick up the loading rack 30 from the loading port 12.

[0046] In this embodiment, the robot PLC130 is equipped with a second communication terminal 131, which is connected to the first communication terminal 74 via optical fiber.

[0047] In this embodiment, the robotic arm is a conventional robotic arm structure, which only needs to be able to receive instructions from the robot PLC130 to pick up the loading rack 30. The specific structure will not be described in detail here.

[0048] The working principle of the semiconductor packaging system in this embodiment is as follows: After the moving mechanism 50 drives the material claw 60 to complete the wafer stacking operation, the wafer stacking machine outputs the moving mechanism positioning signal and the safety door sensing signal to the wafer stacking machine PLC 70, and the material claw 60 resets and returns to the origin. When the material claw 60 returns to the origin, the first position sensor 80 detects the material claw 60 and outputs the material claw presence signal to the wafer stacking machine PLC 70. After receiving the moving mechanism positioning signal, the safety door sensing signal and the material claw presence signal, the wafer stacking machine PLC 70 converts them into a wafer stacking completion signal, a wafer stacking machine status safety signal and a wafer stacking machine safety pick-up and place signal, and transmits the wafer stacking completion signal, the wafer stacking machine status safety signal and the wafer stacking machine safety pick-up and place signal to the robot PLC 130. After receiving the wafer stacking completion signal, the wafer stacking machine status safety signal and the wafer stacking machine safety pick-up and place signal at the same time, the robot PLC 130 controls the robot arm to take the material rack from the loading port 12 to carry out the next operation.

[0049] If the gripper 60 experiences an abnormal alarm during the reset process and cannot return to its original position, the first position sensor 80 will not detect the gripper 60. Consequently, the first position sensor 80 will not send a gripper presence signal to the chip stacker PLC 70, and the chip stacker PLC 70 will not send a chip stacker safety pick-up / place signal to the robot PLC 130. Since the robot PLC 130 does not receive the chip stacker safety pick-up / place signal, it will not control the robot arm to execute the next step.

[0050] The semiconductor packaging system of this utility model embodiment is equipped with a first position sensor 80 for detecting whether the claw 60 has reset and returned to the origin. The first position sensor 80 only outputs a claw presence signal when it detects that the claw 60 has returned to the origin. The robot PLC 130 only controls the robot arm to pick up the loading rack 30 after receiving the claw presence signal converted by the chip stacker PLC 70 based on the claw presence signal, the chip stacking completion signal, and the chip stacker status safety signal. This can avoid collision between the loading rack 30 and the claw 60 and protect the chip stacker.

[0051] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A sheet discharging apparatus characterized by comprising: The system includes a housing, a preheating table, a feeding rack, a sheet-laying support, a moving mechanism, a material claw, a sheet-laying machine PLC, and a first position sensor. The housing is equipped with a safety door and a feeding port. The preheating table and the sheet-laying support are located inside the housing. The feeding rack is placed on the preheating table and has multiple sheet-laying slots. The moving mechanism is mounted on the sheet-laying support, and the material claw is mounted on the moving mechanism. The moving mechanism is used to move the material claw to place the product in the sheet-laying slots. The first position sensor is mounted on the sheet-laying support and is used to detect whether the material claw has returned to its origin. The first position sensor is connected to the sheet-laying machine PLC, which is used to communicate with a robot PLC.

2. The sheet dispenser as claimed in claim 1, wherein The first position sensor is located to the side of the origin position of the gripper.

3. The sheet dispenser as claimed in claim 1, wherein It also includes a sensor bracket, which is mounted on the sheet-laying bracket and corresponds to the origin position of the feed claw, and the first position sensor is mounted on the sensor bracket.

4. The sheet dispenser of claim 1 wherein, The chip stacking machine PLC is equipped with a first signal input terminal, a second signal input terminal, a third signal input terminal, and a first communication terminal. The first position sensor is connected to the third signal input terminal. The third signal input terminal is used to receive the claw presence signal output by the first position sensor. The first signal input terminal is used to receive the moving mechanism positioning signal. The second signal input terminal is used to receive the safety door sensing signal. The first communication terminal is used to communicate with the second communication terminal of the robot PLC. The chip stacking machine PLC converts the moving mechanism positioning signal, the safety door sensing signal, and the claw presence signal into a chip stacking completion signal, a chip stacking machine status safety signal, and a chip stacking machine safety pick-and-place signal. The chip stacking machine PLC uses the first communication terminal to feed back the chip stacking completion signal, the chip stacking machine status safety signal, and the chip stacking machine safety pick-and-place signal to the robot PLC.

5. The sheet dispenser as claimed in claim 4, wherein The tray arrangement bracket includes a bracket body, a first arm and a second arm. The first arm and the second arm are spaced apart on the left and right sides of the bracket body. A photoelectric sensor is provided at the end of the second arm away from the bracket body. The photoelectric sensor is connected to the first signal input terminal and is used to detect the positioning signal of the moving mechanism.

6. The sheet dispenser as claimed in claim 4, wherein A second position sensor is provided on the housing. The second position sensor is located next to the safety door and is connected to the second signal input terminal to detect whether the safety door is closed.

7. The sheet dispenser as claimed in claim 4, wherein The PLC of the chip sorting machine is also equipped with a fourth signal input terminal. An infrared sensor is installed on the preheating table. The infrared sensor is connected to the fourth signal input terminal and is used to detect whether the feeding rack exists.

8. A semiconductor package system, comprising: The device includes a film sorting machine, a robotic arm, and a robot PLC. The film sorting machine is the type described in any one of claims 1-7. After receiving the film sorting completion signal, the film sorting machine status safety signal, and the film sorting machine safety pick-up and put-down signal output by the film sorting machine PLC, the robot PLC sends an instruction to control the robotic arm to pick up the feeding rack from the feeding port.

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