A half-wafer adsorption patching device

Abstract

This application relates to the field of silicon wafer patching technology and discloses a half-wafer adsorption patching device, which includes a placement frame, an adsorption component, a conveying track, and a collecting component. The adsorption component includes a translational part, a vertical telescopic part, a rotating part, and an adsorption part. The translational part is disposed on the placement frame and moves relative to the placement frame; the vertical telescopic part is disposed on the translational part, the rotating part is disposed at the bottom of the vertical telescopic part, and the adsorption part is disposed on the rotating part; a pair of conveying tracks are provided, and the conveying tracks are disposed below the adsorption part; the collecting component is disposed near the conveying tracks. This application has the effect of facilitating silicon wafer patching.

Description

Technical Field

[0001] This application relates to the field of silicon wafer patching technology, and in particular to a half-wafer adsorption patching device. Background Technology

[0002] Half-wafers are an intermediate product in the solar cell manufacturing process. They are made by cutting a whole silicon wafer into two or more smaller wafers. Currently, to improve ease of placement, a pair of half-wafers are usually placed simultaneously on a wafer conveyor and transported to the basket for loading.

[0003] To ensure the quality of the silicon wafers loaded into the baskets, they are inspected using vision cameras and other detection devices during transport on the wafer conveyor. When quality issues such as microcracks or breakage are found, the wafers are removed from the conveyor belt using a gripping device.

[0004] If one half of a pair of silicon wafers is removed, the missing half usually needs to be replaced to ensure that the wafers are placed in pairs in the basket. Currently, if one half of a pair of wafers is damaged, the entire pair is removed to ensure that the wafers are placed in pairs in the basket. However, this approach results in significant waste of wafers, and removing the entire pair also reduces the efficiency of basket loading. Utility Model Content

[0005] To facilitate silicon wafer patching, this application provides a half-wafer adsorption patching device.

[0006] The half-wafer adsorption and patching device provided in this application adopts the following technical solution: A half-wafer silicon wafer adsorption and patching device includes a placement rack, an adsorption assembly, a conveying track, and a collection assembly. The adsorption assembly includes a translation section, a vertical extension section, a rotation section, and an adsorption section, wherein: The translation part is disposed on the placement frame and moves relative to the placement frame; The vertical telescopic part is disposed on the translation part, the rotating part is disposed at the bottom of the vertical telescopic part, and the adsorption part is disposed on the rotating part; The conveying track is provided in pairs and is located below the adsorption section; The collection component is located near the conveying track.

[0007] Optionally, the adsorption section includes a mounting plate and a Bernoulli adsorption plate, wherein: The mounting plate is disposed on the rotating part; The Bernoulli adsorption plate is disposed at one end of the mounting plate; The Bernoulli adsorption plate is horizontally arranged, and an adsorption groove is provided at the bottom of the Bernoulli adsorption plate. Compressed airflow is introduced into the adsorption groove, and an air film is formed between the adsorption groove and the silicon wafer through the compressed airflow.

[0008] Optionally, the adsorption tank includes an annular tank, a first branch tank, and a second branch tank, wherein: The first branch grass troughs are distributed circumferentially along the center line of the annular groove and are connected to the annular groove through the outer wall of the annular groove. The second branch channel is connected through the inner wall of the annular channel.

[0009] Optionally, the collection assembly includes an adjustment frame, a placement seat, and a collection box, wherein: The placement seat is located on the adjustment frame, and the collection box is placed on the collection box.

[0010] Optionally, the placement seat includes a placement plate and a side plate, wherein: The side plates are located on the top of the placement plate and are provided in multiple ways along the side of the placement plate.

[0011] Optionally, a cushioning pad is provided on the inner wall of the collection box.

[0012] Optionally, the adjustment frame includes a fixing frame, a clamping seat, and a support frame, wherein: The clamping seat is disposed on the fixing frame; The clamping seat holds the support frame.

[0013] Optionally, the mounting bracket is provided with a sliding groove; An adjusting bolt is threaded onto the clamping seat, and the adjusting bolt passes through the slide groove.

[0014] In summary, this application includes at least one of the following beneficial technical effects: 1. Through the coordinated action of the translational, vertical extension, and rotational parts of the adsorption assembly, the remaining half of the silicon wafer can be quickly and accurately adsorbed and moved to the missing position, achieving rapid wafer replacement. This automated operation reduces manual intervention, improves the efficiency and accuracy of wafer replacement, and reduces errors and delays caused by manual operation; 2. The Bernoulli adsorption plate effectively avoids the problem of silicon wafer detachment caused by uneven adsorption force, improves the reliability of the device during long-term operation, and avoids scratches and contamination caused by physical contact. 3. The inner wall of the collection box in the collection assembly is equipped with elastic cushioning pads, which can effectively protect the half-wafer. When the half-wafer is placed into the collection box, the cushioning pads can reduce collisions and friction between the wafers, reduce the risk of wafer breakage, ensure that the wafer remains intact during collection, and improve the product yield. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application.

[0016] Figure 2 yes Figure 1 An enlarged schematic diagram of part A in the middle.

[0017] Figure 3 This is a schematic diagram illustrating the structure of the adsorption tank in the embodiments of this application.

[0018] Figure 4 This is a schematic diagram illustrating the structure of the collection component in an embodiment of this application.

[0019] Figure 5 This is a schematic diagram illustrating the placement structure in the embodiments of this application.

[0020] Figure 6 This is a schematic diagram illustrating the adjustment frame structure in an embodiment of this application.

[0021] Explanation of reference numerals in the attached figures: 1. Placement rack; 11. Crossbeam; 12. Column; 2. Adsorption assembly; 21. Translation part; 22. Vertical telescopic part; 23. Rotation part; 24. Adsorption part; 241. Mounting plate; 242. Bernoulli adsorption plate; 243. Adsorption groove; 244. Annular groove; 245. First branch groove; 246. Second branch groove; 3. Collection assembly; 31. Adjustment rack; 311. Fixing rack; 312. Clamping seat; 313. Support frame; 314. Slide groove; 32. Placement seat; 321. Placement plate; 322. Side plate; 33. Collection box; 331. Buffer pad. Detailed Implementation

[0022] The following is in conjunction with the appendix Figures 1-6 This application will be described in further detail.

[0023] This application discloses a half-wafer adsorption patching device.

[0024] A half-wafer adsorption and patching device includes a placement rack 1, an adsorption component 2, a conveying track, and a collection component 3. The adsorption component 2 is disposed on the placement rack 1, the conveying track is disposed below the adsorption component 2, the conveying component conveys the half-wafer, and the collection component 3 is disposed near the conveying component.

[0025] When transporting half-wafers via a conveyor track, a pair of half-wafers is typically transported. If one half-wafer in the pair is missing, the adsorption component 2 adsorbs the remaining half-wafer and moves to detach it from the conveyor component, where it awaits completion. If the other pair of half-wafers is missing, the adsorption component 2 is moved to place the missing half-wafer in the missing position, thus completing the pair.

[0026] If no half of the silicon wafer is missing on the conveying component for a long time, move the adsorption component 2 so that the half of the silicon wafer on the adsorption component 2 is placed above the collection component 3 and the half of the silicon wafer falls into the collection component 3 for collection. This reduces the possibility that the adsorption component 2 will fall off due to the decrease in suction force during the long adsorption process.

[0027] The placement rack 1 includes a horizontal beam 11 and uprights 12. The horizontal beam 11 is horizontally arranged, and the uprights 12 are vertically arranged at the bottom of the horizontal beam 11. Multiple uprights 12 are arranged along the length of the horizontal beam 11. In this embodiment, three uprights 12 are provided. The top of each upright 12 is fixedly connected to the bottom of the horizontal beam 11, and the bottom of each upright 12 is fixedly installed at a predetermined position. A half-wafer passage area is formed between the horizontal beam 11 and two adjacent uprights 12.

[0028] A conveying assembly is located in the area where the half-wafer passes through, and the conveying assembly includes a pair of half-wafer conveyors. When conveying the half-wafer, the pair of half-wafers are placed on the pair of half-wafer conveyors for conveying.

[0029] The adsorption assembly 2 includes a translation section 21, a vertical telescopic section 22, a rotating section 23, and an adsorption section 24. The translation section 21 is fixedly mounted on the top of the crossbeam 11, and the vertical telescopic section 22 is fixedly mounted on the translation section 21. The position of the adsorption section 24 in the horizontal and vertical directions is adjusted by the translation section 21 and the vertical telescopic section 22. In this embodiment, both the translation section 21 and the vertical telescopic section 22 are slide cylinders.

[0030] The rotating part 23 is horizontally fixedly installed at the bottom of the vertical telescopic part 22. In this embodiment, the rotating part 23 is a rotary cylinder. The adsorption part 24 is fixedly installed on the rotary cylinder, and the rotary cylinder drives the adsorption part 24 to rotate. The adsorption part 24 includes a mounting plate 241 and a Bernoulli adsorption plate 242. The mounting plate 241 is horizontally elongated, and the Bernoulli adsorption plate 242 is fixedly installed on the mounting plate 241. The Bernoulli adsorption plate 242 is horizontally arranged, and its length direction is consistent with the half-wafer conveying direction on the half-wafer conveyor, thereby giving the Bernoulli adsorption plate 242 and the half-wafer a larger contact area and improving the adsorption stability of the Bernoulli adsorption plate 242 and the half-wafer.

[0031] The Bernoulli adsorption plate 242 is installed at one end of the mounting plate 241, which facilitates the rapid transport of half silicon wafers on the Bernoulli adsorption plate 242 between a pair of half silicon wafer conveyors by rotating the rotary cylinder, thereby improving the efficiency of half silicon wafer replacement.

[0032] The bottom of the Bernoulli adsorption plate 242 is provided with an adsorption groove 243. The middle of the adsorption groove 243 is connected to a clean compressed gas source, so that clean compressed gas is introduced into the adsorption groove 243. The compressed gas diffuses to the surroundings through the adsorption groove 243. When the Bernoulli adsorption plate 242 is close to the silicon wafer, a very thin gas film is generated between the Bernoulli adsorption plate 242 and the silicon wafer under the action of the high-speed airflow of the compressed gas. A low-pressure zone is formed between the Bernoulli adsorption plate 242 and the silicon wafer, so that the silicon wafer is adsorbed below the Bernoulli adsorption plate 242. The gas film realizes the non-contact suspension of the silicon wafer, avoiding scratches and contamination caused by physical contact.

[0033] The adsorption tank 243 includes an annular tank 244, a first branch tank 245, and a second branch tank 246. Multiple first branch tanks 245 are distributed circumferentially along the centerline of the annular tank 244 and communicate with the annular tank 244 through its outer wall. Multiple second branch tanks 246 are provided and communicate with the annular tank 244 through its inner wall. Through the annular tank 244, the first branch tanks 245, and the second branch tanks 246, the gas film between the Bernoulli adsorption plate 242 and the silicon wafer becomes more uniform, improving the uniformity of force on the adsorbed half-wafer and thus enhancing the stability of the adsorbed half-wafer.

[0034] The collection component 3 includes an adjustment frame 31, a placement seat 32, and a collection box 33. The adjustment frame 31 is fixedly installed in a predetermined position, the placement seat 32 is fixedly installed on the adjustment frame 31, and the collection box 33 is placed on the placement seat 32 to collect half silicon wafers.

[0035] The adjusting frame 31 includes a fixed frame 311, a clamping seat 312, and a support frame 313, with the clamping seat 312 clamping the support frame 313. The fixed frame 311 has a sliding groove 314, and the clamping seat 312 is threaded with an adjusting bolt that passes through the sliding groove 314, thus fixing the clamping seat 312 to the fixed frame 311. By changing the position of the adjusting bolt in the sliding groove 314, the position of the clamping seat 312 is adjusted, thereby adjusting the position of the collection box 33.

[0036] The placement seat 32 includes a placement plate 321 and side plates 322. Multiple side plates 322 are located on top of the placement plate 321 and are arranged along the side of the placement plate 321. The placement plate 321 and the multiple side plates 322 form a placement area. A collection box 33 is placed in the placement area and positioned by the placement plate 321 and the multiple side plates 322. After the half-wafer on the Bernoulli adsorption plate 242 has been adsorbed for a predetermined time, the Bernoulli adsorption plate 242 places the half-wafer inside the collection box 33, releasing the adsorption on the half-wafer. An elastic buffer pad 331 is placed on the inner wall of the collection box 33. When the half-wafer is placed in the collection box 33, the buffer pad 331 protects the half-wafer, reducing the possibility of breakage.

[0037] The implementation principle of the half-wafer adsorption and patching device in this application embodiment is as follows: During operation, the conveying component transports half-wafers via a pair of half-wafer conveyors. When one half-wafer is missing from the pair, the adsorption component 2, through the coordinated action of the translation part 21, the vertical extension part 22, and the rotation part 23, adsorbs the remaining half-wafer and detaches it from the conveying component for waiting. When the other pair of half-wafers is missing, the adsorption component 2 places the adsorbed half-wafer at the missing position to complete the pair of half-wafers. If the conveying component does not experience a missing half-wafer for an extended period, the adsorption component 2 moves the adsorbed half-wafer above the collecting component 3. Through the cooperation of the adjusting frame 31 and the placement seat 32, the half-wafer is placed into the collecting box 33. The buffer pad 331 inside the collecting box 33 protects the half-wafer from breakage.

[0038] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A half-wafer adsorption patching device, characterized in that: The system includes a placement rack, an adsorption assembly, a conveying track, and a collection assembly. The adsorption assembly comprises a translational section, a vertical telescopic section, a rotating section, and an adsorption section, wherein: The translation part is disposed on the placement frame and moves relative to the placement frame; The vertical telescopic part is disposed on the translation part, the rotating part is disposed at the bottom of the vertical telescopic part, and the adsorption part is disposed on the rotating part; The conveying track is provided in pairs and is located below the adsorption section; The collection component is located near the conveying track.

2. The half-wafer adsorption patching device according to claim 1, characterized in that: The adsorption section includes a mounting plate and a Bernoulli adsorption plate, wherein: The mounting plate is disposed on the rotating part; The Bernoulli adsorption plate is disposed at one end of the mounting plate; The Bernoulli adsorption plate is horizontally arranged, and an adsorption groove is provided at the bottom of the Bernoulli adsorption plate. Compressed airflow is introduced into the adsorption groove, and an air film is formed between the adsorption groove and the silicon wafer through the compressed airflow.

3. The half-wafer adsorption patching device according to claim 2, characterized in that: The adsorption tank includes an annular tank, a first branch tank, and a second branch tank, wherein: The first branch groove is distributed circumferentially along the center line of the annular groove and is connected to the annular groove through the outer wall of the annular groove. The second branch channel is connected through the inner wall of the annular channel.

4. The half-wafer adsorption patching device according to claim 1, characterized in that: The collection assembly includes an adjustment frame, a placement base, and a collection box, wherein: The placement seat is located on the adjustment frame, and the collection box is placed on the collection box.

5. The half-wafer adsorption patching device according to claim 4, characterized in that: The placement base includes a placement plate and a side plate, wherein: The side plates are located on the top of the placement plate and are provided in multiple ways along the side of the placement plate.

6. The half-wafer adsorption patching device according to claim 4, characterized in that: The inner wall of the collection box is equipped with a cushioning pad.

7. The half-wafer adsorption patching device according to claim 4, characterized in that: The adjustment frame includes a fixed frame, a clamping base, and a support frame, wherein: The clamping seat is disposed on the fixing frame; The clamping seat holds the support frame.

8. The half-wafer adsorption patching device according to claim 7, characterized in that: The mounting frame is provided with a sliding groove; An adjusting bolt is threaded onto the clamping seat, and the adjusting bolt passes through the slide groove.

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