Wafer Notch Aligner

Abstract

This invention provides a wafer notch alignment device, comprising: a support assembly configured to drive a wafer to rotate about the central axis of the support assembly to change the circumferential position of the wafer notch, thereby sweeping the wafer notch circumferentially to form a region to be detected; a notch detection mechanism including a first transmitting end for emitting a signal and a first receiving end for receiving a signal, wherein a detection optical path is formed between the first transmitting end and the first receiving end; and an isolator configured to define at least one channel, wherein the at least one channel at least partially constrains or limits the propagation path of the detection optical path; wherein the detection optical path intersects the region to be detected, so as to detect the position of the wafer notch by changing the on / off state of the detection optical path. This invention physically constrains the detection optical path of the notch detection mechanism through the channel of the isolator, thereby at least partially constraining or limiting the propagation path of the detection optical path, effectively reducing wafer notch detection misjudgments caused by signal divergence.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to a wafer notch aligner. Background Technology

[0002] In the semiconductor wafer manufacturing process, precise positioning of the silicon ingot is fundamental to ensuring the accuracy of key processes such as photolithography, etching, and thin film deposition. To achieve this, a notch of a specific shape (such as a flat groove or a notch V groove) is usually cut into the edge of the wafer as a physical alignment reference for the wafer in the processing equipment. Its positioning accuracy directly affects the yield of subsequent chip manufacturing.

[0003] In existing technologies, wafer notch aligners generally use sensor detection systems to identify and align notches. The specific location of the notch is detected by sensors (including transmitters and receivers) that are positioned relative to each other. However, the signals from the transmitter or receiver are prone to divergence during propagation. This means that even if the wafer notch is not aligned or in place, the divergent signal may still be received by the receiver, causing the sensor to misjudge that the notch is aligned. This reduces the accuracy and reliability of notch detection, and consequently affects the precise positioning of subsequent wafer processing.

[0004] In view of this, it is necessary to propose a wafer notch aligner to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a wafer notch aligner to improve the problem of wafer notch detection misjudgment caused by signal divergence.

[0006] This utility model provides a wafer notch alignment device, comprising: The support assembly is configured to drive the wafer to rotate about the central axis of the support assembly to change the circumferential position of the wafer notch, so that the wafer notch is circumferentially swept to form the area to be detected; A gap detection mechanism includes a first transmitting end for emitting signals and a first receiving end for receiving signals, wherein a detection optical path is formed between the first transmitting end and the first receiving end; The isolator is configured to define at least one channel, which at least partially constrains or limits the propagation path of the detection optical path; The detection optical path intersects with the area to be detected, so as to detect the position of the wafer notch by changing the on / off state of the detection optical path.

[0007] In one possible embodiment, at least one channel is disposed between the first transmitter and the area to be detected along the propagation direction of the detection optical path.

[0008] In one possible embodiment, at least one channel is disposed between the first receiving end and the area to be detected along the propagation direction of the detection optical path.

[0009] In one possible embodiment, at least one channel comprises two segments; One segment is positioned between the first transmitting end and the area to be detected, along the propagation direction of the detection optical path; Another segment is disposed between the first receiving end and the area to be detected, along the propagation direction of the detection optical path.

[0010] In one possible embodiment, at least one channel has an inlet end, an outlet end, and a wall surface connecting the inlet end and the outlet end, which are disposed opposite to each other along the propagation direction of the detection optical path, wherein the diameter of the inlet end is greater than or equal to the diameter of the outlet end.

[0011] In one possible embodiment, at least one channel has a continuously variable cross-section along its own axial direction.

[0012] In one possible embodiment, at least one channel is radially contracted along the propagation direction of the detection optical path.

[0013] In one possible embodiment, the wall forming at least one channel extends straight along the axial direction and has a smooth surface.

[0014] In one possible embodiment, at least one channel is cylindrical, prismatic, or frustum-shaped.

[0015] In one possible embodiment, at least one of the channels is provided with a focusing element.

[0016] In one possible embodiment, the area to be detected forms a torus, and the detection optical path is orthogonal to or oblique to the torus.

[0017] In one possible embodiment, it further includes at least one in-situ detection mechanism configured to determine whether the wafer is in a preset in-situ position; or, It also includes at least two in-situ detection mechanisms, wherein the in-situ detection optical paths formed by the at least two in-situ detection mechanisms are parallel to each other; or, It also includes at least two in-situ detection mechanisms, and the in-situ detection optical paths formed by the at least two in-situ detection mechanisms are tilted towards each other.

[0018] In one possible embodiment, the in-situ detection mechanism includes a second transmitting end for emitting an in-situ detection optical signal and a second receiving end for receiving the in-situ detection optical signal. An in-situ detection optical path is formed between the second transmitting end and the second receiving end. The in-situ detection optical path intersects the wafer at least partially to detect the wafer's in-situ state by changing the on / off state of the detection optical path.

[0019] In one possible embodiment, it further includes: The shell has internal chambers; A driving mechanism is disposed in the cavity. The driving mechanism includes a first driving component for driving the support component to move linearly along a first direction, a second driving component for driving the support component to move linearly along a second direction, and a rotation driving component for driving the support component to rotate. The control system of the support component adjusts the movement of the support component according to the signal received by the first receiving end until the wafer notch is aligned. The advantages of the wafer notch aligner provided by this utility model are as follows: 1. The detection optical path of the notch detection mechanism is physically constrained by the channel of the isolator to at least partially constrain or limit the propagation path of the detection optical path, thereby effectively reducing the misjudgment of wafer notch detection caused by signal divergence.

[0020] 2. By reasonably setting the position and / or shape of the channel, the signal propagation path can be at least partially constrained to prevent the signal from spreading in all directions; and / or, the signal propagating along the channel axis can be received in a directional manner to shield signal interference from other directions. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the wafer notch alignment device of this utility model.

[0022] Figure 2 This is a schematic diagram of the notch detection mechanism and support mechanism in the wafer notch alignment device of this utility model.

[0023] Figure 3 This is a schematic diagram of the notch detection mechanism in the wafer notch aligner of this utility model when detecting the flat slot.

[0024] Figure 4 This is a schematic diagram of the notch detection mechanism in the wafer notch alignment device of this utility model when detecting the V-groove.

[0025] Figure 5 This is a schematic diagram of the in-situ detection mechanism and support mechanism in the wafer notch aligner of this utility model.

[0026] Explanation of reference numerals in the attached drawings: 110, support assembly; 111, support; 112, bearing surface; 120, notch detection mechanism; 121, first transmitting end; 122, first receiving end; 123, detection optical path; 130, isolator; 131, channel; 1311, entrance end; 1312, exit end; 1313, wall surface; 140, in-situ detection mechanism; 141, second transmitting end; 142, second receiving end; 143, in-situ detection optical path; 150, housing. ; 151, Top wall; 152, Side wall; 153, Opening; 160, Drive mechanism; 170, Support mechanism; 171, Top seat; 172, Base; 173, Adapter plate; 174, Support plate; 180, Bracket; 181, Adjustment hole; 182, Fixing hole; 183, Guide hole; 184, Vertical adjustment part; 185, Horizontal mounting part; 186, Side arm; 200, Wafer; 210, Notch; 220, Area to be tested; 230, Area not to be tested. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0028] To address the problems existing in the prior art, embodiments of this utility model provide a wafer notch aligner, see [link to relevant documentation]. Figures 1 to 4 The wafer notch aligner includes a support assembly 110, a notch detection mechanism 120, and an isolator 130. The support assembly 110 is configured to drive the wafer 200 to rotate about its central axis to change the circumferential position of the notch 210, causing the notch 210 to be circumferentially swept to form a region 220 to be detected. The notch detection mechanism 120 includes a first transmitting end 121 for emitting a signal and a first receiving end 122 for receiving a signal, with a detection optical path 123 formed between the first transmitting end 121 and the first receiving end 122. The isolator 130 is configured to define at least one channel 131, which at least partially constrains or defines the propagation path of the detection optical path 123. The detection optical path 123 intersects the region 220 to detect the position of the notch 210 by changing the on / off state of the detection optical path 123.

[0029] Channel 131 constrains the signal propagation path, limiting divergent signals within its range and preventing them from spreading outwards. Only when the wafer 200 notch 210 is aligned and the detection optical path 123 between the first transmitter 121 and the first receiver 122 passes through the notch 210 or a preset alignment position can the signal be stably transmitted to the first receiver 122 via channel 131, effectively reducing false detections caused by signal divergence. By physically restricting the signal propagation direction, the first receiver 122 ensures that it outputs a valid signal only when the wafer 200 notch 210 is precisely aligned, reducing the probability of false triggering in misaligned states and improving the stability and reliability of notch 210 detection.

[0030] When the notch 210 of wafer 200 is not aligned with the detection optical path 123, the signal is blocked by the edge of wafer 200, and the first receiver 122 has no signal input, thus determining that the notch 210 of wafer 200 is not aligned; when the notch 210 of wafer 200 is aligned with the detection optical path 123, the signal passes through the notch 210 area (the flat slot provides a straight path, and the notch V slot provides a straight path), and the signal is transmitted to the first receiver 122, thus determining that the notch 210 of wafer 200 is aligned, outputting a trigger signal, and completing one notch 210 detection.

[0031] In one specific embodiment, the notch detection mechanism 120 is a probe-type sensor. Traditional CCD sensors require 8.5s for correction, while probe-type sensors require 2.5s for correction. This solves the technical problem of slow correction speed of traditional CCD sensors and greatly improves the detection efficiency of wafer 200 notch 210 alignment.

[0032] The following is a detailed explanation of the location of channel 131.

[0033] In the first embodiment, see Figure 3 and Figure 4 At least one channel 131 is positioned between the first transmitter 121 and the area to be detected 220 along the propagation direction of the detection optical path 123. The signal emitted by the first transmitter 121 first enters the channel 131 of the isolator 130. The inner wall of the channel 131 physically constrains the divergent signal, confining it into a directional beam before it is directed toward the area to be detected 220. This effectively prevents the signal from spreading outwards during propagation, avoiding misjudgments in the wafer 200 notch 210 alignment detection caused by the divergent signal being received by the first receiver 122. In this scheme, the design of constraining the signal propagation path to prevent signal divergence improves the accuracy and reliability of wafer 200 notch 210 alignment detection.

[0034] In the second embodiment, see Figure 3 and Figure 4At least one channel 131 is positioned between the first receiver 122 and the area to be detected 220 along the propagation direction of the detection optical path 123. The signal emitted by the first transmitter 121 is first directed towards the area to be detected 220. When the wafer 200 notch 210 is aligned, after the signal passes through the wafer 200 notch 210, only the directional signal propagating along the axial direction of channel 131 can enter channel 131 and be received by the first receiver 122. Other divergent signals, due to angular deviations, cannot enter channel 131 and are thus shielded by channel 131, preventing the divergent signals from being received by the first receiver 122. This avoids misjudging the alignment status of the wafer 200 notch 210 due to the divergent signals being received by the first receiver 122. In this scheme, the design of receiving directional signals and shielding divergent signal interference improves the accuracy and reliability of wafer 200 notch 210 alignment detection.

[0035] In a third embodiment, at least one channel 131 includes two segments, one segment being disposed between the first transmitting end 121 and the area to be detected 220 along the propagation direction of the detection optical path 123, and the other segment being disposed between the first receiving end 122 and the area to be detected 220 along the propagation direction of the detection optical path 123. The signal emitted by the first transmitter 121 first enters one of the segments. The inner wall of one of the segments physically constrains the divergent signal, confining it into a directional beam before it is directed toward the detection area 220. This effectively prevents the signal from spreading outwards during propagation. When the wafer 200 notch 210 is aligned, after the signal passes through the wafer 200 notch 210, only the directional signal propagating along the axis of the other segment can enter that segment and be received by the first receiver 122. Divergent signals in other propagation directions cannot enter the other segment due to angular deviations, i.e., they are shielded by the other segment. This prevents the divergent signals from being received by the first receiver 122, avoiding the problem of misjudging the alignment status of the wafer 200 notch 210 due to the divergent signals being received by the first receiver 122. In this scheme, the dual approach of constraining the signal propagation path to prevent signal divergence and receiving the directional signal while shielding against divergent signal interference further improves the accuracy and reliability of wafer 200 notch 210 alignment detection.

[0036] Specifically, the photosensitive surface of the first receiving end 122 is directly aligned with the axis of the through hole, forming an axis alignment window, so that only directional signals propagating along the axis of the through hole can enter the photosensitive surface of the first receiving end 122.

[0037] The specific structure of channel 131 will be explained in detail below.

[0038] In the first specific embodiment, see Figure 2At least one channel 131 has an entrance end 1311, an exit end 1312, and a wall 1313 connecting the entrance end 1311 and the exit end 1312, which are arranged opposite each other along the propagation direction of the detection optical path 123. The diameter of the entrance end 1311 is greater than or equal to the diameter of the exit end 1312. The larger entrance end 1311 allows it to receive signals from more different propagation directions, while the smaller exit end 1312 further confines the propagation path after the signal output channel 131 compared to the entrance end 1311, making the signal more concentrated at the exit end 1312, effectively preventing the signal from spreading in all directions, thereby reducing misjudgment of the gap 210 due to signal divergence.

[0039] In the second specific embodiment, at least one channel 131 has a continuously variable cross section along its own axis, that is, the cross-sectional shape and / or size of the channel 131 is variable along its own axis. For example, different cross-sectional shapes or different cross-sectional sizes or different cross-sectional shapes and sizes are set in different sections of the channel 131, and the changes in cross-sectional shape and cross-sectional size can be regular or irregular to adapt to different signal constraints or limitation requirements.

[0040] In the third specific embodiment, at least one channel 131 is radially contracted along the propagation direction of the detection optical path 123, and the cross-section of the channel 131 gradually decreases along the propagation direction of the detection optical path 123, so that the signal is gradually confined during propagation, confining the signal into a directional beam, effectively preventing the signal from spreading to all directions during propagation, reducing misjudgment, and improving the accuracy and reliability of detection.

[0041] In the fourth specific embodiment, see Figure 2 The wall 1313 constituting at least one channel 131 extends straight along the axial direction and has a smooth surface. The wall 1313 of the channel 131 is straight along the axial direction of the channel 131 and has no bends or irregular shapes. This ensures that the signal propagates along the axial direction of the channel 131. The smooth wall 1313 of the channel 131 avoids signal scattering and absorption on the wall 1313 due to roughness or unevenness, thus preventing a reduction in signal transmission efficiency.

[0042] In some embodiments, at least one channel 131 is cylindrical (e.g. Figure 2 The specific shape of channel 131 can be flexibly set according to different signal constraints or limitations to adapt to different application scenarios (as shown in the figure), or prism or frustum shape, etc.

[0043] In one embodiment, at least one channel 131 is provided with a focusing element, which can focus the divergent signal onto a smaller predetermined propagation path, forming a more concentrated directional signal, significantly reducing signal divergence during propagation, and improving the accuracy and reliability of detection.

[0044] The specific settings of the detection area 220 will be explained in detail below.

[0045] In one embodiment, see Figure 3 and Figure 4 The area to be detected 220 forms a torus, and the detection optical path 123 intersects the torus orally or obliquely. The area to be detected 220 can be understood as the region swept circumferentially by the notch 210 of the wafer 200 when the wafer 200 rotates around its central axis. The radial coverage of the area to be detected 220, with the central axis of the wafer 200 as its axis, coincides with the radial position of the notch 210. The detection optical path 123 intersects the torus orally or obliquely, meaning that the detection optical path 123 can be directed perpendicularly or obliquely towards the area to be detected 220 located at the edge of the wafer 200.

[0046] The specific setup of the in-situ testing facility 140 will be explained in detail below.

[0047] In the first example, see Figure 1 and Figure 5 The wafer notch aligner also includes at least one in-situ detection mechanism 140 configured to determine whether the wafer 200 is in a preset in-situ position. Before performing wafer 200 notch 210 alignment detection, the in-situ detection mechanism 140 detects and determines whether the wafer 200 is in the preset in-situ position. After confirming that the wafer 200 is in the preset in-situ position, the wafer 200 notch 210 alignment detection is then performed.

[0048] In the second example, see Figure 1 and Figure 5 The wafer notch aligner also includes at least two in-situ detection mechanisms 140, and the in-situ detection optical paths 143 formed by the at least two in-situ detection mechanisms 140 are parallel to each other.

[0049] In the third example, the wafer notch aligner also includes at least two in-situ detection mechanisms 140, and the in-situ detection optical path 143 formed by the at least two in-situ detection mechanisms 140 is tilted to each other.

[0050] The in-situ detection optical paths 143 formed by at least two in-situ detection mechanisms 140 are parallel or inclined to each other and do not interfere with each other. Different locations on the wafer 200 can be detected by at least two in-situ detection optical paths 143, which improves the accuracy of in-situ detection of the wafer 200. Through the coordinated judgment of at least two in-situ detection optical paths 143, misjudgment caused by the failure of a single in-situ detection mechanism 140 or the notch 210 at the edge of the wafer 200 can be effectively avoided, thereby improving the reliability and fault tolerance of in-situ status detection.

[0051] The spatial layout of at least two in-situ detection optical paths 143 overlaps with the detection area 220 formed by the rotational motion of the wafer 200 notch 210. When the wafer 200 is in the process of rotational attitude adjustment, the at least two in-situ detection optical paths 143, through differentiated arrangement of angles and spacing design, can ensure that at least one set of in-situ detection optical paths 143 continuously covers the effective detection area of ​​the edge of the wafer 200 during the in-situ detection cycle, avoiding the signal blind zone caused by the flat slot or V slot structure of the wafer 200 notch 210 passing through the detection area, thereby realizing uninterrupted monitoring of the in-situ status of the wafer 200.

[0052] In one specific embodiment, see Figure 5 The in-situ detection mechanism 140 includes a second transmitting end 141 for emitting an in-situ detection optical signal and a second receiving end 142 for receiving the in-situ detection optical signal. An in-situ detection optical path 143 is formed between the second transmitting end 141 and the second receiving end 142. The in-situ detection optical path 143 intersects the wafer 200 at least partially to detect the in-situ state of the wafer 200 by changing the on / off state of the detection optical path 143. For example, the in-situ detection mechanism 140 is a through-beam photoelectric sensor, etc.

[0053] When the in-situ detection optical path 143 is a single path, it intersects with the non-detection area 230, which is the part of the wafer 200 excluding the detection area. In-situ determination is achieved through the spatial overlap between the in-situ detection optical path 143 and the non-detection area 230. The in-situ determination logic is as follows: When the wafer 200 is correctly placed in the preset in-situ position, the non-detection area 230 of the wafer 200 overlaps with the in-situ detection optical path 143, blocking the in-situ detection optical path 143. The in-situ detection optical path 143 is disconnected, and the second receiving end 142 receives no signal, thus determining that the wafer 200 is in-situ. If the wafer 200 is missing, offset, or not fully placed in the preset in-situ position, the non-detection area 230 does not cover the optical path, the in-situ detection optical path 143 is turned on, thus determining that the wafer 200 is missing.

[0054] In one embodiment, see Figure 5 The wafer notch aligner also includes two opposing brackets 180, one of which is equipped with a second transmitter 141 and the other with a second receiver 142. The second transmitter 141 and the second receiver 142 are respectively mounted and fixed by the brackets 180.

[0055] The specific configuration of the support mechanism 170 will be explained in detail below.

[0056] In one embodiment, see Figure 2The wafer notch aligner also includes a support mechanism 170, which includes a top seat 171 and a base 172 spaced apart. One of the top seat 171 and the base 172 is equipped with a first transmitter 121, and the other is equipped with a first receiver 122. The mounting positions of the first transmitter 121 and the first receiver 122 can be flexibly set according to actual signal adjustment requirements to adapt to different signal constraints or limitations.

[0057] In some embodiments, see Figure 2 The isolator 130 is disposed between the top seat 171 and the area to be tested 220, or between the base 172 and the area to be tested 220. Alternatively, the isolator 130 comprises two sections, one section disposed between the top seat 171 and the area to be tested 220, and the other section disposed between the base 172 and the area to be tested 220. By reasonably setting the position of the isolator 130, different distributions of the channel 131 can be achieved, thereby achieving different designs for constraining signals to prevent transmission and / or directional receiving signals to shield divergent signals.

[0058] In one embodiment, see Figure 1 , Figure 2 and Figure 5 One of the two brackets 180 is located on the top seat 171 and the other is located on the base 172. The support mechanism 170 serves as the foundation for bearing and installing the notch detection mechanism 120 and the in-situ detection mechanism 140. Both the notch detection mechanism 120 and the in-situ detection mechanism 140 are integrated into the support mechanism 170 to achieve a compact spatial layout.

[0059] In one specific embodiment, see Figure 5 One of the brackets 180 has an oblong adjustment hole 181 extending along a first direction. By passing an adjustment member through the adjustment hole 181 and the mounting hole at the mounting position of the bracket 180 (such as the top seat 171 or the base 172), the bracket 180 can be slidably installed, and the bracket 180 can be linearly displaced along the first direction, thereby realizing linear displacement adjustment of the second transmitter 141 or the second receiver 142 mounted on the bracket 180.

[0060] In another specific embodiment, see Figure 5 One of the brackets 180 has a fixing hole 182 and an arc-shaped guide hole 183 centered on the fixing hole 182 on its side wall 152. The second transmitter 141 or the second receiver 142 is rotatably mounted on the fixing hole 182. The guide block of the second transmitter 141 or the second receiver 142 can slide in the guide hole 183. During rotation, the second transmitter 141 or the second receiver 142 can be angularly deflected around the axis of the fixing hole 182 through the cooperation of the fixing hole 182 and the guide hole 183, ensuring that the optical paths of the second transmitter 141 and the second receiver 142 are accurately aligned.

[0061] In one example, see Figure 5 The bracket 180 is L-shaped and includes an integrally formed vertical adjustment part 184 and a horizontal mounting part 185. The adjustment hole 181 is provided in the horizontal mounting part 185, and the fixing hole 182 and the guide hole 183 are provided in the vertical adjustment part 184.

[0062] In one example, see Figure 5 The bracket 180 is concave and has two opposing arms 186 for mounting the second transmitter 141 or the second receiver 142 of the in-situ detection mechanism 140. The rigid support of the concave structure ensures the opposing mounting of the second transmitter 141 and the second receiver 142, guaranteeing the stability of the in-situ detection optical path 143. For example, the two arms 186 can each be provided with two second transmitters 141, two second receivers 142, or one second transmitter 141 and one second receiver 142.

[0063] In one embodiment, the support mechanism 170 further includes an adapter plate 173 disposed on the side of the base 172 near the top seat 171, wherein one of the top seat 171 and the adapter plate 173 is provided with a first transmitting end 121 and the other is provided with a first receiving end 122.

[0064] Further, see Figure 2 and Figure 5 The support mechanism 170 also includes a support plate 174 that supports the connection between the top seat 171 and the adapter plate 173. The top seat 171, the base 172, the adapter plate 173 and the support plate 174 form a frame-type support structure. The internal structure integrates a through-type wiring channel to accommodate the signal lines and control circuits of the in-situ detection mechanism 140 and the notch detection mechanism 120, thereby achieving an integrated layout and physical protection of electrical connections and improving the overall structure's compactness and anti-interference capability.

[0065] The following is a detailed explanation of the setup and driving principle of the support assembly 110.

[0066] In one embodiment, see Figure 1The wafer notch aligner also includes a housing 150 and a drive mechanism 160. The housing 150 has a cavity inside, which is surrounded by a top wall 151, a side wall 152, and a bottom wall. The drive mechanism 160 is located inside the cavity and includes a first drive assembly for driving the support assembly 110 to move linearly in a first direction, a second drive assembly for driving the support assembly 110 to move linearly in a second direction, and a rotation drive assembly for driving the support assembly 110 to rotate. The control system of the support assembly 110 adjusts the movement of the support assembly 110 based on the signal received by the first receiving end 122 until the wafer 200 notch 210 is in the alignment position. For example, the first direction is a horizontal direction and the second direction is a vertical direction.

[0067] It should be noted that the specific structure and configuration of the first drive assembly, the second drive assembly, and the rotary drive assembly are not limited here and can be flexibly configured according to requirements. For example, the first drive assembly and the second drive assembly can adopt a structure in which a motor drives a lead screw to rotate in conjunction with a guide rail slider assembly, a structure in which a motor drives a belt drive mechanism, a linear motor drive module, a cylinder, a hydraulic cylinder, etc. The rotary drive assembly can be a motor, a rotary cylinder, etc.

[0068] In one specific embodiment, see Figure 1 The support assembly 110 includes a support 111. The surface of the support 111 facing the wafer 200 is an adsorption-resistant bearing surface 112. The bearing surface 112 is provided with adsorption holes. A vacuum generator is used to generate negative pressure at the adsorption holes to adsorb the wafer 200. Specifically, the adsorption holes are arranged in a ring array. By adsorbing the wafer 200 onto the bearing surface 112, it is ensured that the wafer 200 does not slip during movement and rotation.

[0069] Further, see Figure 1 The support mechanism 170 is disposed on the outer wall of the housing 150. The outer wall of the housing 150 has an opening 153 along a first direction. The opening 153 and the support mechanism 170 are located on the same side. The support 111 can extend out of the housing 150 from the opening 153. The first driving component drives the support 111 to move linearly at the opening 153 along the first direction, that is, towards or away from the in-situ detection optical path 143. The second driving component drives the support 111 to move linearly along a second direction to adjust the height of the wafer 200.

[0070] The robotic arm places the wafer 200 on the bearing surface 112 of the support assembly 110. The vacuum generator is activated to cause the wafer 200 to adhere to the bearing surface 112. The support assembly 110 drives the wafer 200 to linearly displace along the first direction, i.e., towards the in-situ detection optical path 143. The in-situ detection mechanism 140 determines whether the wafer 200 is in place by the blocking state of the in-situ detection optical path 143. After confirming that the wafer 200 is in place, the rotation drive assembly drives the support assembly 110 and the wafer 200 on it to rotate around the central axis of the support assembly 110. The notch detection mechanism 120 identifies the position of the notch 210 and feeds back the deviation signal to the control system. The support assembly 110 drives the wafer 200 to rotate until the notch 210 is aligned and outputs an alignment completion signal, waiting for the subsequent process equipment to pick up the wafer.

[0071] In the description of this utility model, it should be understood that the terms "comprising" and "having" as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0072] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0073] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0074] While the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model. Furthermore, the utility model described herein may have other embodiments and can be implemented or realized in various ways. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains.

Claims

1. A wafer gap aligner, comprising: include: The support assembly (110) is configured to drive the wafer (200) to rotate about the central axis of the support assembly (110) to change the circumferential position of the notch (210) of the wafer (200) so that the notch (210) of the wafer (200) is circumferentially swept to form the area to be tested (220). The gap detection mechanism includes a first transmitting end (121) for emitting signals and a first receiving end (122) for receiving signals, wherein a detection optical path (123) is formed between the first transmitting end (121) and the first receiving end (122). The isolator (130) is configured to define at least one channel (131), the at least one channel (131) at least partially constraining or defining the propagation path of the detection optical path (123); The detection optical path (123) intersects with the area to be detected (220) so as to detect the position of the notch (210) of the wafer (200) by changing the on / off state of the detection optical path (123).

2. The wafer gap aligner of claim 1, wherein, At least one channel (131) is disposed between the first transmitting end (121) and the area to be detected (220) along the propagation direction of the detection optical path (123).

3. The wafer notch aligner according to claim 1, characterized in that, At least one channel (131) is disposed between the first receiving end (122) and the area to be detected (220) along the propagation direction of the detection optical path (123).

4. The wafer notch aligner according to claim 1, characterized in that, At least one channel (131) comprises two segments; One of the segments is disposed between the first transmitting end (121) and the area to be detected (220) along the propagation direction of the detection optical path (123); Another segment is disposed between the first receiving end (122) and the area to be detected (220) along the propagation direction of the detection optical path (123).

5. The wafer notch aligner according to claim 1, characterized in that, At least one channel (131) has an inlet end (1311), an outlet end (1312) disposed opposite to each other along the propagation direction of the detection optical path (123), and a wall surface (1313) connecting the inlet end (1311) and the outlet end (1312), wherein the diameter of the inlet end (1311) is greater than or equal to the diameter of the outlet end (1312).

6. The wafer notch aligner according to claim 1, characterized in that, At least one channel (131) has a continuously variable cross section along its own axis.

7. The wafer notch aligner according to claim 1, characterized in that, At least one channel (131) is radially contracted along the propagation direction of the detection optical path (123).

8. The wafer notch aligner according to claim 1, characterized in that, The wall (1313) constituting at least one channel (131) extends straight along the axial direction and has a smooth surface.

9. The wafer notch aligner according to claim 1, characterized in that, At least one channel (131) is cylindrical, prismatic, or frustum-shaped.

10. The wafer notch aligner according to claim 1, characterized in that, At least one of the channels (131) is provided with a focusing element.

11. The wafer notch aligner according to claim 1, characterized in that, The area to be detected (220) forms a ring surface, and the detection optical path (123) is orthogonal to or oblique to the ring surface.

12. The wafer notch aligner according to claim 1, characterized in that, It also includes at least one in-situ detection mechanism (140) configured to determine whether the wafer (200) is in a preset in-situ position; or, It also includes at least two in-situ detection mechanisms (140), and the in-situ detection optical paths (143) formed by the at least two in-situ detection mechanisms (140) are parallel to each other; or, It also includes at least two in-situ detection mechanisms (140), and the in-situ detection optical path (143) formed by the at least two in-situ detection mechanisms (140) is tilted to each other.

13. The wafer notch aligner according to claim 12, characterized in that, The in-situ detection mechanism (140) includes a second transmitting end (141) for emitting an in-situ detection optical signal and a second receiving end (142) for receiving the in-situ detection optical signal. An in-situ detection optical path (143) is formed between the second transmitting end (141) and the second receiving end (142). The in-situ detection optical path (143) intersects at least partially with the wafer (200) to detect the in-situ state of the wafer (200) by changing the on / off state of the detection optical path (123).

14. The wafer notch aligner according to claim 1, characterized in that, Also includes: The housing (150) has an internal chamber; A drive mechanism (160) is disposed in the cavity. The drive mechanism (160) includes a first drive component for driving the support assembly (110) to move linearly in a first direction, a second drive component for driving the support assembly (110) to move linearly in a second direction, and a rotation drive component for driving the support assembly (110) to rotate. The control system of the support assembly (110) adjusts the movement of the support assembly (110) according to the signal received by the first receiving end (122) until the wafer (200) notch (210) is in the alignment position.

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