A chuck assembly for wafers or chips and wafer testing equipment

Abstract

This invention provides a chuck assembly for wafers or chips and a wafer testing device, relating to the field of wafer testing technology. In this invention, the first leveling assembly of the chuck is connected to an adapter plate and a temperature control assembly, with the middle areas of the first leveling assembly and the temperature control assembly corresponding to each other. The second leveling assembly is connected to the adapter plate and is arranged corresponding to the outer edge area of ​​the temperature control assembly. When the chuck is at the target operating temperature, due to the principle of temperature control, the temperature is highest at the top and gradually decreases downwards along the thickness direction. The chuck itself exhibits a deformation state where the inside is higher than the outside. Simultaneously, the heat-sensitive part of the second leveling assembly expands and elongates due to heat. The first leveling assembly is not sensitive to temperature changes. Therefore, the first and second leveling assemblies will exhibit a deformation state where the middle is lower than the surrounding area, thus resisting and adjusting the deformation of the temperature control assembly and the chuck, thereby improving the flatness of the chuck surface and greatly enhancing its overall flatness.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing technology, and in particular to a chuck assembly and wafer testing equipment for wafers or chips. Background Technology

[0002] A wafer chuck serves as a stage for wafers or other test objects. Depending on the testing requirements, the chuck needs to provide the corresponding testing temperature. Therefore, to ensure the stage's operating temperature, a layer of cooling gas or liquid is typically installed beneath the stage, with the cooling medium's temperature lower than the working surface temperature. An internal heater is also included for precise temperature control. Consequently, the stage exhibits a temperature decrease from top to bottom. At operating temperatures above room temperature, the upper surface of the stage expands more thermally than the bottom, resulting in a deformation phenomenon where the center is higher and the edges are lower. At operating temperatures below room temperature, the upper surface contracts less while the lower surface contracts more, again resulting in a deformation phenomenon where the center is higher and the edges are lower, causing the stage's surface to have a curved shape and poor flatness. Therefore, there is an urgent need to design a chuck that can improve flatness. Utility Model Content

[0003] One objective of this invention is to provide a chuck assembly for wafers or chips, solving the technical problem of low flatness of chucks in the prior art when there is an internal temperature difference.

[0004] Another objective of this invention is to provide a wafer testing device having the aforementioned chuck assembly.

[0005] Specifically, this invention provides a chuck assembly for wafers or chips, comprising: A chuck is used to carry wafers or chips; A temperature control component is located on the side of the chuck away from the wafer or chip and is connected to the chuck. The temperature control component is used to control the temperature of the chuck. The adapter plate is located on the side of the temperature control component away from the chuck; The first leveling component is connected to both the adapter plate and the temperature control component, and the middle areas of the first leveling component and the temperature control component are arranged correspondingly. The second leveling component has a higher coefficient of thermal expansion than the material used in the first leveling component. It is connected to the adapter plate and is arranged correspondingly to the outer edge area of ​​the temperature control component. When the chuck is at the target operating temperature, the second leveling component expands and elongates due to heat, thereby pushing the edge area of ​​the temperature control component away from the adapter plate to counteract the deformation caused by heat on the edge areas of the chuck and the temperature control component. The target operating temperature is higher or lower than the ambient temperature.

[0006] Optionally, the first leveling component includes a plurality of first leveling columns, which are evenly arranged in the middle area of ​​the temperature control component. The second leveling component includes a plurality of second leveling columns, which are evenly arranged in the outer edge region of the temperature control component.

[0007] Optionally, at least a portion of the coefficient of thermal expansion of the second leveling column is greater than that of the first leveling column.

[0008] Optionally, each of the second leveling columns includes: The first part is located in the internal area of ​​the adapter plate; The second part is located on the side of the adapter plate near the temperature control component, and extends through the adapter plate and is connected to the adapter plate. The second part is in contact with the temperature control component.

[0009] Optionally, the coefficient of thermal expansion of the second part is greater than that of the first part.

[0010] Optionally, the material of the second part is any one of aluminum, copper, or stainless steel.

[0011] Optionally, the height of the second part ranges from 10mm to 20mm.

[0012] Optionally, the top surface of the first leveling component may be flush with or not flush with the top surface of the second leveling component.

[0013] Optionally, the chuck, the temperature control component, and the adapter plate are all square. The first leveling columns are arranged in a square, and the second leveling columns are divided into four second leveling column groups. The four second leveling column groups are respectively arranged at the four corners of the temperature control component, and each second leveling column group includes multiple second leveling columns.

[0014] In particular, this utility model also provides a wafer testing device, including the chuck described above.

[0015] In this invention, the first leveling component of the chuck is connected to both the adapter plate and the temperature control component, with their middle areas corresponding to each other. The second leveling component is made of a material with a higher coefficient of thermal expansion than the material used in the first leveling component. It is also connected to the adapter plate and corresponds to the outer edge area of ​​the temperature control component. When the chuck is at the target operating temperature, the second leveling component expands and elongates due to heat, pushing the edge area of ​​the temperature control component away from the adapter plate. This counteracts the deformation caused by heat on the edge areas of the chuck and temperature control component, effectively compensating for the deformation caused by heat on the edge areas with the deformation of the second leveling component. Therefore, the flatness of the chuck surface is improved.

[0016] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0017] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings: Figure 1 This is a schematic structural diagram of a chuck assembly according to an embodiment of the present invention; Figure 2 This is a schematic layout diagram of a first leveling component and a second leveling component according to an embodiment of the present utility model; Figure 3 This is a schematic side view of a chuck assembly according to an embodiment of the present invention; Figure 4 This is a schematic cross-sectional view of a chuck assembly according to an embodiment of the present invention; Figure 5 This is a schematic structural diagram of the second leveling column according to an embodiment of the present invention.

[0018] Figure label: 100-Chuck assembly, 10-Chuck, 20-Temperature control assembly, 30-Adapter plate, 40-First leveling column, 50-Second leveling column, 51-First part, 52-Second part, 53-Connector, 54-Adjusting component. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0020] In the description of this utility model, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0022] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0024] Figure 1 This is a schematic structural diagram of a chuck assembly 100 according to an embodiment of the present invention. Figure 2 This is a schematic layout diagram of the first leveling component and the second leveling component according to an embodiment of the present invention. Figure 3 This is a schematic side view of a chuck assembly 100 according to an embodiment of the present invention. Figures 1 to 3As shown, in one specific embodiment, a chuck assembly 100 for wafers or chips includes a chuck 10, a temperature control assembly 20, an adapter plate 30, a first leveling assembly, and a second leveling assembly. The chuck 10 is used to carry wafers or chips. The temperature control assembly 20 is located on the side of the chuck 10 away from the wafer or chip and is connected to the chuck 10; the temperature control assembly 20 is used to control the temperature of the chuck 10. The adapter plate 30 is located on the side of the temperature control assembly 20 away from the chuck 10. The first leveling assembly is connected to both the adapter plate 30 and the temperature control assembly 20, and their middle regions are correspondingly arranged. The material of the second leveling assembly has a higher coefficient of thermal expansion than the material used in the first leveling assembly, and it is connected to the adapter plate 30 and correspondingly arranged to the outer edge region of the temperature control assembly 20. When the chuck assembly 100 is at the target operating temperature, the second leveling component expands and elongates due to heat, pushing the edge area of ​​the temperature control component 20 away from the adapter plate 30. This counteracts the deformation caused by heat on the edge areas of the chuck 10 and the temperature control component 20. The target operating temperature is higher or lower than room temperature. Here, it can be understood that the chuck assembly 100 includes the adapter plate 30, the temperature control component 20, and the chuck 10 arranged sequentially from bottom to top. The first leveling component connects the temperature control component 20 to the adapter plate 30. The second leveling component adjusts the deformation caused by heat on the edge areas of the chuck 10 and the temperature control component 20.

[0025] This embodiment is equivalent to using the deformation of the second leveling component to compensate for the deformation caused by heat in the edge area, thus improving the flatness of the chuck 10 surface. The flatness of the chuck 10 and the temperature control component 20 can be corrected from 100μm to within 20μm.

[0026] In some embodiments, both the chuck 10 and the temperature control component 20 are made of copper, which can be understood as pure copper. The adapter plate 30 is made of Invar steel. In other embodiments, the chuck 10 and the temperature control component 20 may also be made of other suitable materials, and the adapter plate 30 may also be made of other suitable materials.

[0027] In some embodiments, the first leveling component includes a plurality of first leveling columns 40, which are evenly arranged in the middle region of the temperature control component 20. The second leveling component includes a plurality of second leveling columns 50, which are evenly arranged in the outer edge region of the temperature control component 20. This embodiment is equivalent to adopting a separate structure for both the first and second leveling components. In other embodiments, the first and second leveling components may also adopt an integrated structure.

[0028] In some embodiments, the chuck 10, temperature control component 20, and adapter plate 30 are all square. A plurality of first leveling posts 40 are arranged in a square configuration, and a plurality of second leveling posts 50 are divided into four groups of second leveling posts. These four groups are respectively located at the four corners of the temperature control component 20, and each group includes a plurality of second leveling posts 50. In other embodiments, the chuck 10, temperature control component 20, and adapter plate 30 can also be designed in other shapes, such as circular.

[0029] In some embodiments, each second leveling column group includes two second leveling columns 50. In other embodiments, the number of second leveling columns 50 included in each second leveling column group may also be three, four, or five, etc.

[0030] In some embodiments, in addition to the second leveling columns 50 being arranged at the four corners of the temperature control component 20, a second leveling column 50 is also provided between two adjacent corners. See [reference needed]. Figure 2 .

[0031] In some embodiments, the number of first leveling columns 40 is four, and the four first leveling columns 40 are arranged in a directional manner.

[0032] In some embodiments, at least a portion of the coefficient of thermal expansion of the second leveling column 50 is greater than the coefficient of thermal expansion of the first leveling column 40. It can be understood that this embodiment only requires that at least a portion of the coefficient of thermal expansion of the second leveling column 50 is greater than the coefficient of thermal expansion of the first leveling column 40; the value of the coefficient of thermal expansion of at least a portion of the second leveling column 50 is not limited.

[0033] This embodiment utilizes the difference in thermal expansion coefficients between the materials of the first leveling column 40 and the second leveling column 50, and uses the deformation of the second leveling column 50 itself to compensate for the deformation of the chuck 10 and the temperature control component 20, and the amount of compensation will change with the temperature.

[0034] In this embodiment, a first leveling column 40 and a second leveling column 50 are used to compensate for deformation at different positions of the chuck 10 and the temperature control component 20. The deformation of the chuck 10 and the temperature control component 20 extends from the middle outwards, exhibiting a state where the middle is higher and the periphery is lower. The first leveling column 40 needs to be securely connected to the temperature control component 20 to ensure the shape of the chuck 10, for example, by using Invar alloy or other materials with extremely low coefficients of thermal expansion. In addition, a second leveling column 50 with a high coefficient of thermal expansion is arranged around the periphery of the chuck 10. After the second leveling column 50 expands due to heat, the surface formed by the first leveling column 40 and the second leveling column 50 exhibits a state where the middle is lower and the periphery is higher, thereby adjusting the flatness of the chuck 10 surface.

[0035] In some embodiments, both the first leveling column 40 and the second leveling column 50 are made of metal, with a wide range of material options, and conventional materials can meet the requirements.

[0036] Figure 4 This is a schematic cross-sectional view of a chuck assembly 100 according to an embodiment of the present invention. Figure 5 This is a schematic structural diagram of the second leveling column 50 according to an embodiment of the present invention. Figure 4 and Figure 5 As shown, and see Figures 1 to 3 In some embodiments, each second leveling post 50 includes a first portion 51 and a second portion 52. The first portion 51 is located in the internal region of the adapter plate 30. The first portion 51 may be made of a different material but with the same structural form as the second portion 52, or it may be integrally formed with the adapter plate 30. The second portion 52 is located on the side of the adapter plate 30 near the temperature control component 20, penetrates the adapter plate 30, and is connected to the adapter plate 30. The second portion 52 contacts the temperature control component 20. Here, the second portion 52 is connected to the adapter plate 30 by threads or other means.

[0037] In some embodiments, the coefficient of thermal expansion of the second part 52 is greater than that of the first part 51.

[0038] In some embodiments, the material of the second portion 52 is any one of aluminum, copper, or stainless steel. In a preferred embodiment, the material of the second portion 52 is aluminum. Alternatively, the material of the second portion 52 may be any material with a coefficient of thermal expansion greater than that of Invar alloy.

[0039] In some embodiments, the first portion 51 may be made of a material with an extremely low coefficient of thermal expansion, such as Invar. In other embodiments, the material of the first portion 51 may also be selected from other materials with extremely low coefficients of thermal expansion, depending on specific design requirements.

[0040] In some embodiments, the height of the second part 52 is in the range of 10mm-20mm, for example, it can be 10mm, 12mm, 14mm, 16mm, 18mm or 20mm.

[0041] In some embodiments, each second leveling post 50 further includes a connector 53 that extends through the first portion 51 and is connected to the second portion 52, wherein the connector 53 does not extend beyond the end face of the second portion 52. Here, the connector 53 is a screw.

[0042] In some embodiments, the second leveling column 50 further includes an adjusting member 54, which is configured to rotate when operated to move the second portion 52 along the axial direction of the second leveling column 50, thereby lifting the edge region of the temperature control assembly 20 away from the adapter plate 30, thus counteracting the deformation caused by heat on the edge regions of the chuck 10 and the temperature control assembly 20. It can be understood that the second adjusting column 50 has two adjustment methods: one is to adjust the flatness of the chuck 10 surface by the deformation of the second portion 52 itself; the other is to adjust the flatness of the chuck 10 surface by moving the second portion 52 driven by the adjusting member 54. Here, the adjusting member 54 can be manually operated, or a driving member can be used to directly drive the adjusting member 54 to rotate. In some embodiments, the top surface of the first leveling assembly may be flush with or not flush with the top surface of the second leveling assembly.

[0043] In some embodiments, the structure of the first leveling column 40 is substantially the same as that of the second leveling column 50, the only difference being that the first part 51 and the second part 52 are made of the same material, namely Invar steel, and the connector 53 passes through the first part 51 and the second part 52 and is connected to the temperature control component 20.

[0044] This embodiment also provides a wafer testing apparatus, which includes the chuck assembly 100 of any of the above embodiments. Details regarding the chuck assembly 100 are not provided here.

[0045] This embodiment effectively improves the flatness of the working surface of the chuck 10 through thermo-structural physics coupling simulation. Furthermore, this embodiment achieves the adjustment of the flatness of the chuck 10 solely through the expansion and elongation of the second leveling column 50, resulting in a simple structure and a more compact chuck assembly 100.

[0046] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A chuck assembly for wafers or chips, characterized in that, include: A chuck is used to carry wafers or chips; A temperature control component is located on the side of the chuck away from the wafer or chip and is connected to the chuck. The temperature control component is used to control the temperature of the chuck. The adapter plate is located on the side of the temperature control component away from the chuck; The first leveling component is connected to both the adapter plate and the temperature control component, and the middle areas of the first leveling component and the temperature control component are arranged correspondingly. The second leveling component has a higher coefficient of thermal expansion than the material used in the first leveling component. It is connected to the adapter plate and is arranged correspondingly to the outer edge area of ​​the temperature control component. When the chuck is at the target operating temperature, the second leveling component expands and elongates due to heat, thereby pushing the edge area of ​​the temperature control component away from the adapter plate to counteract the deformation caused by heat on the edge areas of the chuck and the temperature control component. The target operating temperature is higher or lower than the ambient temperature.

2. The chuck assembly according to claim 1, characterized in that, The first leveling component includes a plurality of first leveling columns, which are evenly arranged in the middle area of ​​the temperature control component. The second leveling component includes a plurality of second leveling columns, which are evenly arranged in the outer edge region of the temperature control component.

3. The chuck assembly according to claim 2, characterized in that, The coefficient of thermal expansion of at least a portion of the second leveling column is greater than that of the first leveling column.

4. The chuck assembly according to claim 3, characterized in that, Each of the second leveling columns includes: The first part is located in the internal area of ​​the adapter plate; The second part is located on the side of the adapter plate near the temperature control component, and extends through the adapter plate and is connected to the adapter plate. The second part is in contact with the temperature control component.

5. The chuck assembly according to claim 4, characterized in that, The coefficient of thermal expansion of the second part is greater than that of the first part.

6. The chuck assembly according to claim 4, characterized in that, The material of the second part is any one of aluminum, copper or stainless steel.

7. The chuck assembly according to claim 6, characterized in that, The height range of the second part is 10mm-20mm.

8. The chuck assembly according to any one of claims 1-7, characterized in that, The top surface of the first leveling component may be flush with or not flush with the top surface of the second leveling component.

9. The chuck assembly according to any one of claims 2-7, characterized in that, The chuck, the temperature control component, and the adapter plate are all square in shape. The first leveling columns are arranged in a square, and the second leveling columns are divided into four second leveling column groups. The four second leveling column groups are respectively arranged at the four corners of the temperature control component, and each second leveling column group includes multiple second leveling columns.

10. A wafer testing device, characterized in that, Includes the chuck assembly as described in any one of claims 1-9.

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