A chucking device for reducing wafer surface damage

Abstract

The application discloses a clamping device for reducing wafer surface damage, and belongs to the technical field of wafer manufacturing. The clamping device comprises a wafer chuck, a plurality of clamping pieces, a plurality of supporting pieces and a driving mechanism. The wafer chuck is uniformly provided with a plurality of connecting holes in a circumferential direction at a position close to an edge. The clamping piece comprises a connecting column and a limiting plate. The connecting column is arranged in the connecting hole and can rotate in the connecting hole. The limiting plate is vertically provided with a first side wall and a second side wall. The first side wall is arranged as an inwardly recessed arc. The supporting piece is arranged at an upper surface of the wafer chuck and is spaced apart from the connecting hole. The distance between the supporting piece and the connecting hole is greater than the length of the limiting plate. The upper surface of the supporting piece is used for supporting the wafer. The driving mechanism is arranged below the wafer chuck and is used for driving the connecting column to rotate. When the wafer is limited and fixed, only the clamping piece rotates, and the lower surface of the wafer is not affected, so that the damage to the wafer surface is further reduced.

Description

Technical Field

[0001] This application relates to a clamping device for reducing wafer surface damage, belonging to the field of wafer manufacturing technology. Background Technology

[0002] In the semiconductor manufacturing industry, wafers are the core basic material, and their processing requires many complex and precise steps. Among these steps, wafer clamping devices play a crucial role in ensuring the stability and precise positioning of the wafers during various process operations.

[0003] With the rapid development of the semiconductor industry, wafer sizes are constantly increasing while thicknesses are continuously decreasing, placing more stringent demands on wafer clamping devices and processing technologies. Current wafer clamping technologies mostly employ integrated support and limiting clamping components. During clamping, a robotic arm places the wafer onto the clamping component, a portion of which provides support. A drive mechanism then rotates the clamping component, clamping and limiting the wafer. However, this method, because the clamping component itself supports the wafer during rotation, causes wear at the connection point between the clamping component and the lower surface of the wafer. This wear damages the lower surface of the wafer, affecting subsequent processing and ultimately impacting wafer quality.

[0004] Therefore, there is an urgent need for a clamping device that can reduce wafer surface damage and improve clamping stability. Utility Model Content

[0005] To address the aforementioned issues, this application proposes a wafer clamping device that reduces clamping stress. The device comprises a clamping component and a support component on the wafer chuck. The support component supports the wafer, while the clamping component provides limiting clamping. During wafer clamping, the support component does not rotate; only the rotation of the clamping component limits and clamps the sidewalls of the wafer. This prevents the lower surface of the wafer from being affected during the rotation of the clamping component, thus avoiding surface damage. This further reduces wafer surface damage while ensuring wafer clamping stability.

[0006] This application provides a clamping device for reducing wafer surface damage, comprising: A wafer chuck; the wafer chuck is provided with a plurality of connection holes evenly distributed around its periphery near its edge; Several clamping components; the clamping components include a connecting post and a limiting plate. The connecting post is disposed in a connecting hole and can rotate within the connecting hole. The first end of the limiting plate is fixedly connected to the connecting post. The limiting plate has a first sidewall and a second sidewall perpendicular to the connecting post, respectively. The first sidewall is configured as an inwardly concave arc shape and is used to limit the wafer. Several support members; the support members are spaced apart from the connection holes and fixedly connected to the upper surface of the wafer chuck, the distance between the support members and the connection holes is greater than the length of the limiting plate, and the upper surface of the support members is used to support the wafer; A drive mechanism is provided below the wafer chuck, and the drive mechanism is used to drive the connecting post to rotate.

[0007] Optionally, the drive mechanism includes a plurality of pulleys, a belt, and a motor. The pulleys are fixedly connected to the lower part of the connecting column, the belt is sleeved on the outer side wall of the plurality of pulleys, and the motor is connected to one of the pulleys.

[0008] Optionally, a first groove is provided on the first sidewall that is recessed into the second sidewall.

[0009] Optionally, the second sidewall has a second groove extending towards the first end near the second end, and the second groove communicates with the first groove.

[0010] Optionally, the length of the first groove is A, and the length of the second groove is 1 / 8 to 1 / 6A.

[0011] Optionally, both the first groove and the second groove are provided with an elastic layer.

[0012] Optionally, the area of ​​the upper surface of the support member is smaller than the area of ​​the lower surface of the support member.

[0013] Optionally, the upper surface of the support member is provided with a plurality of protrusions.

[0014] Optionally, a flow channel is provided at the edge of the wafer chuck, and the flow channel is disposed between the support and the clamping member.

[0015] Optionally, the position of the flow channel away from the center is the outlet, and the position of the flow channel near the center is the inlet, and the depth of the inlet is greater than the depth of the outlet.

[0016] Optionally, the flow channel is V-shaped.

[0017] The beneficial effects that this application may produce include, but are not limited to: 1. The wafer surface damage reduction clamping device provided in this application, by setting support members and clamping members, can effectively support and clamp the wafer, prevent the wafer from shifting, ensure the clamping stability of the wafer, and improve the wafer processing effect.

[0018] 2. The clamping device for reducing wafer surface damage provided in this application has a first groove and a second groove on the clamping member. The clamping effect of the first groove and the second groove is improved by the synergistic effect of the first groove and the second groove. The first groove limits and fixes the sidewall of the wafer, and the second groove limits the upper and lower surfaces of the wafer to prevent the wafer from falling off. 3. The wafer chuck provided in this application for reducing wafer surface damage has a flow channel on the wafer chuck, which allows residual or flowing liquid on the wafer chuck to flow out along the flow channel when the wafer is cleaned or treated with liquid, thus preventing it from remaining on the surface of the wafer chuck.

[0019] 4. The clamping device for reducing wafer surface damage provided in this application has an inlet depth of the flow channel that is greater than the outlet depth. This can promote the rapid outward discharge of liquid in the flow channel and prevent liquid at the outlet from flowing back onto the wafer chuck. Attached Figure Description

[0020] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a top view schematic diagram of the clamping device involved in the embodiments of this application; Figure 2 This is a perspective view of the clamping component involved in the embodiments of this application; Figure 3 This is a side view of the clamping member involved in the embodiments of this application; Figure 4 This is a three-dimensional schematic diagram of the flow channel involved in the embodiments of this application.

[0021] List of components and reference numerals: 10. Wafer chuck; 11. Connecting hole; 12. Flow channel; 20. Clamping component; 21. Limiting plate; 211. First groove; 212. Second groove; 22. Connecting post; 30. Support component Detailed Implementation To more clearly illustrate the overall concept of this application, a detailed explanation is provided below with reference to the accompanying drawings.

[0022] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0023] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0024] Furthermore, it should be understood in the description of this application that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0026] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0027] In this application, unless otherwise expressly specified and limited, the "above" or "below" of the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. In the description of this specification, references to terms such as "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples.

[0028] refer to Figure 1-4 This application discloses a clamping device for reducing wafer surface damage, characterized in that it includes: A wafer chuck 10; the wafer chuck 10 has a plurality of connection holes 11 evenly arranged circumferentially near its edge; a plurality of clamping members 20; the clamping members 20 include connecting posts 22 and limiting plates 21, the connecting posts 22 are disposed in the connecting posts 11 and can rotate within the connecting posts 11, the first end of the limiting plate 21 is fixedly connected to the connecting posts 22, and the limiting plate 21 has a first sidewall and a second sidewall perpendicular to the connecting posts 22, the first sidewall is set as an inwardly concave arc shape, the first sidewall is used to limit the wafer; a plurality of supporting members 30; the supporting members 30 are spaced apart from the connecting posts 11 and fixedly connected to the upper surface of the wafer chuck 10, the distance between the supporting members 30 and the connecting posts 11 is greater than the length of the limiting plate 21, the upper surface of the supporting members 30 is used to support the wafer; a driving mechanism, the driving mechanism is disposed below the wafer chuck 10, the driving mechanism is used to drive the connecting posts 22 to rotate.

[0029] The robotic arm places the wafer onto the support 30 on the surface of the wafer chuck 10. The drive mechanism is then activated, which drives the connecting column 22 to rotate. Consequently, the limiting plate 21 also rotates accordingly. The first sidewall of the limiting plate 21 adheres to the sidewall of the wafer, thereby limiting and fixing the sidewall of the wafer.

[0030] This setup enables effective fixing and limiting of the wafer, preventing the wafer from shifting on the wafer chuck 10. By using the support member 30 and the clamping member 20 to work together to limit and fix the wafer, not only can damage to the wafer surface be reduced, but the wafer can also be effectively clamped, ensuring wafer clamping stability and preventing wafer displacement.

[0031] Specifically, the method of fixing the limiting plate 21 and the connecting column 22 is not limited. It can be glued, welded, or integrally molded, as long as the fixing connection between the limiting plate 21 and the connecting column 22 can be achieved.

[0032] Specifically, the curvature of the first sidewall is adapted to the curvature of the wafer, which enables the limiting and fixing of the sidewall of the wafer.

[0033] Specifically, the drive mechanism includes several pulleys, a belt, and a motor. The pulleys are fixedly connected to the lower part of the connecting column, and the belt is sleeved on the outer wall of the pulleys. The motor is connected to one of the pulleys. In this configuration, the motor drives one of the pulleys to rotate, which in turn drives the pulleys to rotate in the same direction. This, in turn, causes the connecting column to rotate, which in turn causes the limiting plate 21 to rotate towards the wafer, thus limiting and fixing the wafer. Simultaneously, after the wafer processing is complete, the drive motor reverses its direction, causing the connecting column 22 to rotate, which in turn causes the limiting plate 21 to rotate away from the wafer, finally removing the wafer.

[0034] Specifically, the motor can be a servo motor or a stepper motor, as long as it can achieve bidirectional drive of the pulley.

[0035] As one implementation method, refer to Figure 2 A first groove 211 recessed into the second sidewall is provided on the first sidewall. With this configuration, the first groove 211 can enhance the stability of the wafer. The first groove 211 can engage with the edge of the wafer, further improving the fixing stability of the wafer under the action of static friction. At the same time, the first groove 211 can suppress the circumferential rotation of the wafer, ensuring process accuracy and avoiding local excessive friction damage caused by misalignment.

[0036] As one implementation method, refer to Figure 2 and Figure 3 A second groove 212 extends from the second sidewall near the second end toward the first end, and the second groove 212 communicates with the first groove 211. With this configuration, the first groove 211 disperses the clamping stress at the wafer edge. After the second groove 212 communicates with the first groove 211, it can limit the upper and lower surfaces of the wafer, further restricting wafer displacement and preventing wafer breakage. Simultaneously, it can disperse clamping stress, avoiding stress concentration points and further reducing the damage rate of thinner wafers.

[0037] In one implementation, the length of the first groove 211 is A, and the length of the second groove 212 is 1 / 8 to 1 / 6A. This configuration can both disperse stress and ensure stable wafer clamping force, effectively preventing wafer wobbling due to insufficient local clamping force.

[0038] If the length of the second groove 212 exceeds 1 / 6A, firstly, the clamping and limiting area of ​​the second groove 212 on the wafer surface increases, affecting the processing speed and effect of the wafer surface, and thus affecting the processing quality of the wafer; secondly, if the second groove 212 is too long, the contact area between the first groove 211 and the wafer sidewall will decrease, thus affecting the clamping stability of the first groove 211 on the wafer. If the length of the second groove 212 is less than 1 / 8A, the second groove 212 cannot effectively clamp and limit the wafer. During high-speed operation, the wafer may break free from the constraint of the first groove 211 and detach from the wafer chuck 10, making it impossible to process the wafer normally and reducing the processing effect.

[0039] As one implementation method, refer to Figure 2 Both the first groove 211 and the second groove 212 are provided with an elastic layer. With this configuration, the elastic layer can generate a buffering effect when the first groove 211 and the second groove 212 approach the wafer, avoiding a large impact force on the wafer when it comes into contact with the first groove 211 and the second groove 212, and preventing the edge of the wafer from being damaged due to the impact force, or even the entire wafer from breaking.

[0040] Specifically, the elastic layer can be made of fluororubber or silicone rubber, as long as it can provide a buffering effect between the wafer and the first groove 211 and the second groove 212.

[0041] In one implementation, the area of ​​the upper surface of the support 30 is smaller than the area of ​​the lower surface of the support 30. This configuration offers several advantages: First, the larger lower surface area of ​​the support 30 shifts its center of gravity closer to the bottom, increasing its resistance to tipping under lateral forces during high-speed wafer rotation, preventing tilting and thus preventing wafer displacement or detachment. Second, the upper surface of the support 30 directly contacts the lower surface of the wafer. If the upper surface area were too large, it could lead to extensive direct contact with the wafer, causing localized stress concentration. Third, the smaller contact area with the wafer avoids introducing impurities onto the wafer surface, preventing negative impacts on subsequent wafer processing.

[0042] In one implementation, the upper surface of the support 30 is provided with several protrusions. This configuration serves two purposes: first, it can accurately disperse wafer pressure, avoiding damage from localized stress concentration; second, it enhances surface friction, suppressing wafer misalignment and slippage. Especially during wafer cleaning and high-speed transport, the static friction between the planar support and the lower surface of the wafer is insufficient, easily leading to wafer misalignment. By setting protrusions, the friction can be increased by increasing the contact roughness and engagement depth, thus preventing wafer displacement.

[0043] As one implementation method, refer to Figure 1The wafer chuck 10 has a flow channel 12 at its edge, which is located between the support member 30 and the clamping member 20.

[0044] This setup enables efficient drainage of fluids generated during processing or cleaning, preventing excessive liquid accumulation at the edges that could damage the wafer. Especially in wafer cleaning or wet processing, cleaning or etching solutions can easily accumulate in the gap between the support 30 and the clamping member 20. If these accumulated solutions come into contact with the wafer edges for an extended period, they may cause excessive etching of the wafer edges.

[0045] In addition, by setting the flow channel 12 at the edge of the wafer chuck 10, the cleaning solution or etching solution can be directly discharged, avoiding accumulation at the edge of the wafer chuck 10 and ensuring that the etching degree of the wafer edge and the wafer center is consistent.

[0046] In one implementation, the position of the flow channel 12 away from the center is the outlet, and the position of the flow channel 12 closer to the center is the inlet, with the depth of the inlet being greater than the depth of the outlet.

[0047] Under this setting, firstly, a stable gravity gradient can be formed, which accelerates fluid flow and shortens the residence time, especially for etching solution, avoiding corrosion of the flow channel 12 caused by prolonged residence in the flow channel 12; secondly, it can prevent liquid from flowing back to the middle position of the wafer chuck 10, avoiding the wafer chuck 10 containing a large amount of liquid, which would affect the processing effect of the wafer and the wafer chuck 10.

[0048] As one implementation method, refer to Figure 4 The flow channel 12 is V-shaped. In this configuration, the inclined sidewalls of the V-shaped flow channel 12 can guide the fluid, allowing the fluid on the surface of the wafer chuck 10 to flow quickly into the flow channel 12 and out of the outlet of the flow channel 12. This promotes the rapid convergence of the fluid into the flow channel 12. Especially during the high-speed rotation of the wafer, under the action of centrifugal force, the liquid on the wafer will fall to the edge of the wafer chuck 10, and the fluid will quickly converge and be output through the V-shaped flow channel 12 at the edge of the wafer chuck 10.

[0049] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0050] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A clamping device for reducing wafer surface damage, characterized in that, include: Wafer chuck; The wafer chuck has several connection holes evenly arranged around its periphery near the edge. Several clamping components; the clamping components include a connecting post and a limiting plate. The connecting post is disposed in a connecting hole and can rotate within the connecting hole. The first end of the limiting plate is fixedly connected to the connecting post. The limiting plate has a first sidewall and a second sidewall perpendicular to the connecting post, respectively. The first sidewall is configured as an inwardly concave arc shape and is used to limit the wafer. Several support members; the support members are spaced apart from the connection holes and fixedly connected to the upper surface of the wafer chuck, the distance between the support members and the connection holes is greater than the length of the limiting plate, and the upper surface of the support members is used to support the wafer; A drive mechanism is provided below the wafer chuck, and the drive mechanism is used to drive the connecting post to rotate.

2. The clamping device for reducing wafer surface damage according to claim 1, characterized in that, The first sidewall is provided with a first groove that is recessed into the second sidewall.

3. The clamping device for reducing wafer surface damage according to claim 2, characterized in that, The second sidewall has a second groove extending toward the first end near the second end, and the second groove communicates with the first groove.

4. The clamping device for reducing wafer surface damage according to claim 3, characterized in that, The length of the first groove is A, and the length of the second groove is 1 / 8 to 1 / 6A.

5. The clamping device for reducing wafer surface damage according to claim 4, characterized in that, Both the first groove and the second groove are provided with an elastic layer.

6. The clamping device for reducing wafer surface damage according to claim 1, characterized in that, The area of ​​the upper surface of the support is smaller than the area of ​​the lower surface of the support.

7. The clamping device for reducing wafer surface damage according to claim 6, characterized in that, The upper surface of the support member is provided with several protrusions.

8. The clamping device for reducing wafer surface damage according to claim 1, characterized in that, The wafer chuck has a flow channel at its edge, which is located between the support and the clamping member.

9. The clamping device for reducing wafer surface damage according to claim 8, characterized in that, The outlet of the flow channel is located away from the center, and the inlet of the flow channel is located closer to the center. The depth of the inlet is greater than the depth of the outlet.

10. The clamping device for reducing wafer surface damage according to claim 8, characterized in that, The flow channel is V-shaped.

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