Chip adsorption adjustment mechanism

Abstract

This invention provides a chip adsorption adjustment mechanism, comprising a main body and a fixing part, the main body and the fixing part being fixedly connected; the main body has a first through hole, the fixing part has a second through hole, the first through hole and the second through hole are connected, and the fixing part also has a third through hole, the first through hole and the second through hole are connected through the third through hole; the first through hole has a quadrilateral cross-section, and the third through hole has a circular cross-section. The chip adsorption nozzle of this invention adopts a quadrilateral nozzle structure combined with a cavity structure with a circular cross-section. The quadrilateral through hole has a larger contact area, resulting in higher adsorption capacity and stability. Simultaneously, the cavity has a certain volume and sealing performance, enabling the vacuum to remain stable for a short time, providing a buffering effect, mitigating large vacuum fluctuations, and ensuring that the chip maintains a stable adsorption force during adsorption and transfer.

Description

Technical Field

[0001] This utility model specifically relates to a chip adsorption nozzle and a chip adsorption adjustment mechanism. Background Technology

[0002] In the LED and semiconductor surface mount technology (SMT) field, the picking process primarily relies on nozzles as the medium. Currently, circular nozzles are the mainstream choice in the industry. These nozzles have a standard circular cross-section. During operation, they generate suction force through internal negative pressure to hold the chip or other components awaiting mounting, and then transfer them to the designated location. In automated mounting equipment, the circular nozzle is connected to the equipment's vacuum system. When the vacuum system is activated, a negative pressure is created inside the circular nozzle, thereby achieving the adsorption of the components.

[0003] From a physical perspective, the circular nozzle, due to its circular cross-section, has a relatively small contact area when contacting components such as chips. According to the formula for calculating adsorption force, F = PS (where F is the adsorption force, P is the vacuum pressure, and S is the contact area), under the same vacuum pressure conditions, the smaller the contact area S, the lower the adsorption force F. When adsorbing chips, the insufficient contact area of ​​a circular nozzle often leads to weak adsorption capacity, resulting in unstable picking. In actual production, this unstable picking can cause problems such as component drops and misalignment during placement, affecting product quality and causing equipment downtime for troubleshooting and component re-picking, thus reducing production efficiency.

[0004] Therefore, it is necessary to provide a chip adsorption nozzle that adopts a quadrilateral nozzle structure combined with a vacuum cavity structure with a circular cross-section, which improves the adsorption force and adsorption stability of the chip adsorption nozzle. Utility Model Content

[0005] The primary objective of this invention is to provide a chip adsorption nozzle that addresses the shortcomings of existing chip adsorption nozzles, such as weak adsorption force and poor adsorption stability.

[0006] The second objective of this invention is to provide a chip adsorption adjustment mechanism that addresses the shortcomings of poor chip adsorption stability in existing technologies.

[0007] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0008] A chip adsorption nozzle includes a main body and a fixing part, the main body and the fixing part being fixedly connected; the main body has a first through hole, the fixing part has a second through hole, the first through hole and the second through hole are connected; the fixing part also has a third through hole, the first through hole is connected to the second through hole through the third through hole; the first through hole has a quadrilateral cross section, and the third through hole has a circular cross section.

[0009] The first through-hole of this novel chip adsorption nozzle adopts a quadrilateral nozzle structure. This quadrilateral structure, with its larger contact area, enhances adsorption capacity and stability when in contact with the chip. It also effectively prevents the chip from shifting or rotating during adsorption, ensuring positional accuracy during transfer and placement, meeting the requirements of high-precision manufacturing processes. Furthermore, the third through-hole can serve as a vacuum chamber, storing partial vacuum. When the vacuum chamber is in a vacuum state, a negative pressure environment is also formed inside the first through-hole, buffering large fluctuations in vacuum pressure and providing a stable vacuum environment for chip adsorption, ensuring that the chip maintains a stable adsorption force throughout the adsorption and transfer process.

[0010] The present invention can be improved in the following way: the first through hole extends from the main body into the fixing part and communicates with the third through hole, and the first through hole and the second through hole have the same axis.

[0011] In this invention, the cross-sectional area of ​​the second through hole is smaller than the cross-sectional area of ​​the first through hole.

[0012] In this invention, the cross-section of the first through hole is one of a rectangle, a rhombus, or a square.

[0013] Preferably, the cross-section of the first through hole is square.

[0014] In this invention, the fixing part is further provided with a fourth through hole, and the third through hole is connected to the second through hole through the fourth through hole. Providing the fourth through hole facilitates the outlet of airflow during the vacuuming process, forming a stable vacuum chamber.

[0015] Furthermore, the fourth through hole is a conical hole. The conical shape of the fourth through hole facilitates gas discharge during the vacuum process between the third and second through holes, resulting in a more stable adsorption process.

[0016] In this invention, the main body is cylindrical, and the fixing part is conical. This design facilitates the connection and fixation of the chip adsorption nozzle and the suction rod of the vacuum system.

[0017] A chip adsorption adjustment mechanism includes the aforementioned chip adsorption nozzle and adsorption fixing component; the chip adsorption nozzle is connected to the adsorption fixing component.

[0018] In this invention, the adsorption and fixing assembly includes a rotating fixing base and a suction nozzle cap module, the suction nozzle cap module being connected to the rotating fixing base. The suction nozzle cap module is equipped with a suction nozzle rod, which is connected to the chip adsorption nozzle, allowing the suction nozzle rod to insert into the second through hole of the chip adsorption nozzle. During equipment operation, the internal vacuum system generates vacuum pressure, which is transmitted to the inner cavity of the suction nozzle through the suction nozzle rod of the equipment arm. The second through hole is securely connected to the suction nozzle rod of the equipment arm via an interference fit. This connection method not only ensures the stability of the mechanical structure but also guarantees the sealing of the vacuum channel.

[0019] Furthermore, the nozzle cap module is connected to the rotating fixed base via the first arm.

[0020] In this invention, the adsorption and fixing assembly further includes a height measuring module and a pressure adjusting module; the height measuring module is used to adjust the distance between the suction nozzle and the chip, and the pressure adjusting module is used to adjust the pressure of the chip adsorption nozzle on the chip.

[0021] This utility model has the following beneficial effects:

[0022] (1) The chip adsorption nozzle of this utility model adopts a quadrilateral nozzle structure combined with a cavity structure with a circular cross section. The quadrilateral through hole has a larger contact area, higher adsorption capacity and stability. At the same time, the cavity has a certain volume and sealing performance, which can make the vacuum stable for a short time, has a buffering effect, alleviates large fluctuations in vacuum, and ensures that the chip maintains a stable adsorption force during adsorption and transfer.

[0023] (2) In the chip adsorption adjustment mechanism of this utility model, the chip adsorption nozzle is connected to the adsorption fixing component. The adsorption fixing component is provided with a nozzle rod, which is stable. At the same time, it can also adjust the distance between the nozzle and the chip and the pressure of the chip adsorption nozzle on the chip, so that the nozzle can maintain a higher adsorption force and adsorption stability on the chip. Attached Figure Description

[0024] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0025] Figure 1 This is a schematic diagram of the overall structure of the chip adsorption nozzle of this utility model;

[0026] Figure 2 This is a front view of the chip adsorption nozzle of this utility model;

[0027] Figure 3 This is a left view of the chip adsorption nozzle of this utility model;

[0028] Figure 4 This is a bottom view of the chip adsorption nozzle of this utility model;

[0029] Figure 5 This is a schematic diagram of the overall structure of the chip adsorption adjustment mechanism of this utility model;

[0030] The following are the markings in the attached diagram: 1. Chip suction nozzle; 2. Adsorption and fixing assembly; 101. Main body; 102. Fixing part; 103. First through hole; 104. Second through hole; 105. Third through hole; 106. Fourth through hole; 201. Rotating fixing base; 202. Nozzle cap module; 203. Height measuring module; 204. Pressure adjustment module; 205. Nozzle rod; 206. First arm; 207. Second arm; 208. First adjusting screw; 209. Second adjusting screw; 210. Spring. Detailed Implementation

[0031] Example 1

[0032] like Figure 1-4 The chip suction nozzle 1 shown includes a main body 101 and a fixing part 102. The main body 101 is fixedly connected to the fixing part 102. The main body 101 has a first through hole 103, and the fixing part 102 has a second through hole 104 and a third through hole 105. The first through hole 103 has a quadrilateral cross-section, the third through hole 105 has a circular cross-section, and the cross-sectional area of ​​the second through hole 104 is smaller than that of the first through hole 103. The first through hole 103 extends from the main body 101 into the fixing part 102 and communicates with the third through hole 105, and the first through hole 103 and the second through hole 104 have the same axis. The second through hole 104 communicates with the third through hole 105 and is used to connect to an external vacuum system. In this invention, the cross-section of the first through hole 103 is one of a rectangle, a rhombus, or a square. In this embodiment, the cross-section of the first through hole 103 is square, and the first through hole 103 is a square hole.

[0033] The chip adsorption nozzle 1 of this invention features a quadrilateral nozzle structure in its first through-hole 103. This quadrilateral structure, with its larger contact area, enhances adsorption capacity and stability when in contact with the chip, while also providing more accurate feedback data to the equipment. Due to the larger contact area, the wear on the nozzle from the component is relatively uniform during long-term use, thus extending the nozzle's lifespan. Under the same operating conditions, the lifespan of a quadrilateral nozzle is 20%-30% longer than that of a circular nozzle. Simultaneously, more stable adsorption and more accurate data feedback allow for smoother equipment operation, thereby increasing production per unit time (UPH). Furthermore, the third through-hole 105 can serve as a vacuum chamber, storing a partial vacuum to provide a stable vacuum environment for chip adsorption. When the vacuum system is activated, air is rapidly extracted, creating a vacuum within the chamber. Because the chamber has a certain volume and sealing performance, the vacuum can be maintained stably for a short period. This design aims to prevent a sudden loss of vacuum due to external interference or a brief malfunction of the vacuum system, which could lead to a sharp decrease in adsorption force. For example, during equipment operation, momentary voltage fluctuations or slight vibrations in the pipeline may occur. Without the buffering effect of the vacuum chamber, the vacuum pressure may fluctuate significantly, affecting the chip adsorption effect. The presence of the vacuum chamber can mitigate such fluctuations to a certain extent, ensuring that the chip maintains a stable adsorption force during adsorption and transfer.

[0034] To further improve the stability of chip adsorption by the chip adsorption nozzle 1, a fourth through hole 106 is also provided in the fixing part 102. The fourth through hole 106 is a tapered hole, and the third through hole 105 is connected to the second through hole 104 through the fourth through hole 106. By providing the fourth through hole 106, it is more conducive to the airflow being discharged between the third through hole 105 and the second through hole 104 during the vacuuming process, forming a stable vacuum cavity.

[0035] Example 2

[0036] like Figure 5 The chip adsorption adjustment mechanism shown includes an adsorption fixing component 2 and a chip adsorption nozzle 1 as described in Example 1; the chip adsorption nozzle 1 is connected to the adsorption fixing component 2.

[0037] The adsorption and fixing assembly 2 includes a rotating fixing base 201 and a suction nozzle cap module 202, the suction nozzle cap module 202 being connected to the rotating fixing base 201; the suction nozzle cap module 202 is provided with a suction nozzle rod 205, the suction nozzle rod 205 being connected to the chip adsorption nozzle 1, such that the suction nozzle rod 205 is inserted into the second through hole 104 of the chip adsorption nozzle 1. In this embodiment, the suction nozzle cap module 202 is fixed to the top of the first arm 206, and the bottom of the first arm 206 is connected to the rotating fixing base 201.

[0038] The adsorption and fixing assembly 2 further includes a height measuring module 203 and a pressure adjusting module 204. The height measuring module 203 is used to adjust the distance between the suction nozzle and the chip, and the pressure adjusting module 204 is used to adjust the pressure of the chip adsorption nozzle 1 on the chip. Specifically, a second arm 207 is also fixed on the rotating fixing base 201. The middle part of the first arm 206 is connected to the second arm 207 through a first adjusting screw 208. The distance between the first arm 206 and the second arm 207 is adjusted by adjusting the first adjusting screw 208, thereby adjusting the distance between the chip adsorption nozzle 1 and the chip. The middle part of the first arm 206 is fixedly connected to one end of a spring 210, and the other end of the spring 210 is connected to a second adjusting screw 209 fixed on the second arm 207. The pressure of the chip adsorption nozzle 1 on the chip is adjusted by adjusting the tension of the spring 210.

[0039] This novel chip adsorption adjustment mechanism allows for convenient adjustment of the distance between the chip adsorption nozzle 1 and the chip, as well as the pressure applied to the chip, ensuring stable adsorption force and thus achieving stable chip adsorption and precise picking. Actual production test data shows that using the quadrilateral nozzle combined with the chip adsorption adjustment mechanism of this invention reduces the equipment alarm rate by 21%. This is because stable nozzle adsorption reduces component drops, placement deviations, and other malfunctions, thereby lowering the frequency of alarms triggered by abnormal conditions. In terms of production efficiency, compared to using a circular nozzle, production capacity is increased by approximately 30%. On one hand, stable adsorption and accurate data feedback reduce equipment downtime; on the other hand, the more efficient adsorption and transfer process increases the production quantity per unit time.

[0040] The above embodiments of this utility model are not intended to limit the scope of protection of this utility model. The implementation of this utility model is not limited thereto. All other modifications, substitutions or alterations made to the above structure of this utility model based on the above content of this utility model and in accordance with the common technical knowledge and conventional means in the field, without departing from the basic technical idea of ​​this utility model, shall fall within the scope of protection of this utility model.

Claims

1. A chip adsorption adjustment mechanism, characterized in that, It includes a chip adsorption nozzle (1) and an adsorption and fixing assembly (2); the chip adsorption nozzle (1) is connected to the adsorption and fixing assembly (2); The chip adsorption nozzle (1) includes a main body (101) and a fixing part (102), the main body (101) and the fixing part (102) are fixedly connected; the main body (101) is provided with a first through hole (103), the fixing part (102) is provided with a second through hole (104), the first through hole (103) and the second through hole (104) are connected, the fixing part (102) is also provided with a third through hole (105), the first through hole (103) is connected with the second through hole (104) through the third through hole (105); the cross-section of the first through hole (103) is quadrilateral, and the cross-section of the third through hole (105) is circular.

2. The chip adsorption adjustment mechanism according to claim 1, characterized in that, The first through hole (103) extends from the main body (101) into the fixing part (102) and communicates with the third through hole (105), and the first through hole (103) and the second through hole (104) have the same axis.

3. The chip adsorption adjustment mechanism according to claim 2, characterized in that, The cross-sectional area of ​​the second through hole (104) is smaller than that of the first through hole (103).

4. The chip adsorption adjustment mechanism according to any one of claims 1-3, characterized in that, The first through hole (103) has a cross-section that is one of a rectangle, a rhombus, or a square.

5. The chip adsorption adjustment mechanism according to claim 4, characterized in that, The fixing part (102) is also provided with a fourth through hole (106), and the third through hole (105) is connected to the second through hole (104) through the fourth through hole (106); the fourth through hole (106) is a tapered hole.

6. The chip adsorption adjustment mechanism according to claim 5, characterized in that, The main body (101) is cylindrical, and the fixing part (102) is conical.

7. The chip adsorption adjustment mechanism according to claim 1, characterized in that, The adsorption fixing component (2) includes a rotating fixing seat (201) and a suction nozzle cap module (202). The suction nozzle cap module (202) is connected to the rotating fixing seat (201). The suction nozzle cap module (202) is provided with a suction nozzle rod (205). The suction nozzle rod (205) is connected to the chip adsorption nozzle (1) so that the suction nozzle rod (205) is inserted into the second through hole (104) of the chip adsorption nozzle (1).

8. The chip adsorption adjustment mechanism according to claim 7, characterized in that, The nozzle cap module (202) is connected to the rotating fixed base (201) via the first arm (206).

9. The chip adsorption adjustment mechanism according to claim 8, characterized in that, The adsorption and fixing component (2) further includes a height measuring module (203) and a pressure regulating module (204); the height measuring module (203) is used to adjust the distance between the suction nozzle and the chip, and the pressure regulating module (204) is used to adjust the pressure of the chip adsorption suction nozzle (1) on the chip.

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