application device

Abstract

The utility model provides a kind of applying device, it is for the applying device of sensing component to host, applying device includes shell, the detachable assembly of the cover of shell with the mode of thread connection, and stripping mechanism, sensing component is contained in shell, sensing component includes application part and sensor, application part includes the adhering piece with adhesion, and the surface of adhering piece towards host is covered with release film at least part;Stripping mechanism includes stripping piece and limiting portion, stripping piece is coupled to limiting portion in the way of freely rotatable, limiting portion is fixedly arranged in cover and limit stripping piece to be separated from limiting portion;In the state of cover assembly in shell, stripping piece and release film are fixedly connected;Stripping piece makes release film from adhering piece stripping by the disassembly of cover and shell.According to the utility model, it can provide a kind of applying device for reducing the influence of environmental factors on the adhesive surface viscosity of biological sensing device.

Description

Technical Field

[0001] This utility model relates to the field of biomedical engineering industry, and specifically to an application device. Background Technology

[0002] Human tissue fluid and blood typically contain various analytes. When the concentration of these analytes (such as glucose) in the body is too high or too low, abnormal health conditions may occur. Therefore, to promptly understand the concentration of analytes in the body and adjust their levels through dietary changes or medication, biosensor devices (such as continuous glucose monitoring systems, CGM) are often used to obtain this information. Biosensor devices (also known as sensing components) typically include an applicator and a sensor. The sensor is at least partially implanted in the host body, and the applicator supports the sensor and has an adhesive surface to ensure the biosensor device adheres securely to the host.

[0003] An application device is a means of applying a biosensor to a host. The biosensor is typically housed within the application device, and during user use, the application device triggers a puncture, attaching the applicator to the host's surface and at least partially implanting the sensor beneath the host body. Currently, biosensors are usually present within the application device with the adhesive side of the applicator exposed.

[0004] However, products typically have a limited shelf life. If the adhesive surface is exposed for an extended period during this time, it may be affected by factors such as temperature and humidity, leading to a decrease in the viscosity of the adhesive surface and consequently affecting the wearing experience. Summary of the Invention

[0005] This invention is proposed in view of the above-mentioned state of the prior art, and its purpose is to provide an application device that can reduce the influence of environmental factors on the adhesive surface of a biosensor during its shelf life.

[0006] Therefore, this utility model provides an application device for applying a sensing component to a host. The application device includes a housing, a cover detachably assembled to the housing via a threaded connection, and a peeling mechanism. The sensing component is housed within the housing and includes an application portion and a sensor. The application portion includes an adhesive sheet with adhesive properties, and at least a portion of the surface of the adhesive sheet facing the host is covered with a release film. The peeling mechanism includes a peeling member and a limiting portion. The peeling member is rotatably coupled to the limiting portion, and the limiting portion is fixedly disposed on the cover and restricts the peeling member from detaching from the limiting portion. When the cover is assembled to the housing, the peeling member and the release film are fixedly connected. The peeling member peels the release film from the adhesive sheet by disassembling and detaching the cover and the housing.

[0007] In this invention, by covering at least a portion of the surface of the adhesive sheet of the sensor component with a release film, the adhesive components on the surface of the adhesive sheet can be protected by the release film, which helps ensure that the adhesive sheet maintains good adhesion throughout the product's shelf life. A peeling mechanism is provided, comprising a peeling member and a limiting part. The limiting part is fixedly disposed on the cover and restricts the peeling member from detaching from the limiting part. The peeling member is fixedly connected to the release film and is coupled to the limiting part in a freely rotatable manner. During the process of unassembling the cover and the housing by twisting the cover, the cover moves away from the housing and pulls the peeling member away from the adhesive sheet, thereby peeling the release film off the adhesive sheet. Since the peeling member is coupled to the limiting part in a freely rotatable manner, during the peeling process, the peeling mechanism and the cover rotate relative to each other without relative movement with the release film. This helps to prevent the peeling mechanism from scratching the sensor component or affecting the stability of the sensor component in the housing. Therefore, the release film can be peeled off the adhesive sheet stably, minimizing the impact on the sensor component.

[0008] Alternatively, in the application device of this invention, the peeling member may include a compressible and deformable buffer portion, which is fixedly connected to the release film when the cover is assembled into the housing. In this case, the fixed connection between the buffer portion and the release film, and the compressibility and deformability of the buffer portion, can further reduce the impact of the peeling mechanism on the sensing components.

[0009] Furthermore, in the application device according to this invention, the buffer portion may optionally be selected from foam, rubber, and silicone. This provides a compressible and deformable buffer portion.

[0010] Furthermore, in the application device according to this utility model, optionally, when the cover is assembled into the housing, the buffer portion is in a relaxed or compressed state. Thus, the buffer portion can provide a cushioning effect, preventing direct contact between rigid components and the sensing assembly, reducing scratches on the sensing assembly, or minimizing the impact on the stability of the sensing assembly within the housing.

[0011] Alternatively, in the application device according to this utility model, the peeling member is fixedly connected to the release film by adhesive. This allows the peeling member and the release film to be fixedly connected.

[0012] Alternatively, in the application device according to this utility model, the peeling member may include a bearing structure, which is rotatably coupled to the limiting portion. Thus, the peeling member can be rotatably coupled to the limiting portion via the bearing structure.

[0013] Alternatively, in the application device of this utility model, the peeling member may include a bearing structure, which is rotatably coupled to the limiting portion, and the bearing structure and the buffer portion are fixedly connected. Thus, the peeling member includes a bearing structure and a buffer portion, which allows the peeling member to be rotatably coupled to the limiting portion via the bearing structure, and reduces the impact on the sensing components via the buffer portion.

[0014] Alternatively, in the application device according to this utility model, the limiting portion may have a flange or a plurality of protrusions, and the flange or the protrusions may be used to restrict the peeling member from disengaging from the limiting portion. Thus, the flange or the protrusions can be used to restrict the peeling member from disengaging from the limiting portion.

[0015] Furthermore, in the application device of this utility model, optionally, the cover is provided with a column, the column passes through the peeling mechanism, and the peeling mechanism is configured to rotate around the column. This further stabilizes the structure of the peeling mechanism.

[0016] Furthermore, in the application device of this utility model, optionally, the column has a hollow structure, the sensor includes an implantation portion, and the hollow structure is configured to accommodate the implantation portion. This allows for full utilization of the space within the application device, making its structure more compact.

[0017] According to this invention, an application device can be provided that can reduce the impact of environmental factors on the adhesive surface tack of sensing components during shelf life. Attached Figure Description

[0018] The present invention will now be explained in further detail by way of example only with reference to the accompanying drawings.

[0019] Figure 1 This diagram illustrates an application scenario of the sensing component involved in this utility model.

[0020] Figure 2 This is a schematic diagram showing the structure of the instrument kit involved in this utility model example.

[0021] Figure 3 This is a schematic diagram showing the structure of the sensing component involved in this utility model example.

[0022] Figure 4 This is a first-view structural schematic diagram showing the sensing component, cover, and peeling mechanism involved in this utility model example.

[0023] Figure 5 This is a second-view structural schematic diagram showing the sensing components, cover, and peeling mechanism involved in this utility model example.

[0024] Figure 6 This is a schematic diagram showing the structure of the cover and peeling mechanism combined in the example of this utility model.

[0025] Figure 7 This is a schematic diagram showing the structure of the cover and the peeling mechanism in the separated state according to the example of this utility model.

[0026] Figure 8 This is a schematic diagram showing the structure of the limiting part involved in this utility model example. Detailed Implementation

[0027] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the following description, the same reference numerals are used for the same parts, and repeated descriptions are omitted. Furthermore, the drawings are merely schematic diagrams, and the proportions of the parts or the shapes of the parts may differ from the actual figures.

[0028] It should be noted that the terms "comprising" and "having" in this utility model, and any variations thereof, such as the process, method, system, product, or device that includes or has a series of steps or units, are not necessarily limited to those steps or units that are explicitly listed, but may include or have other steps or units that are not explicitly listed or that are inherent to these processes, methods, products, or devices.

[0029] It should be noted that in this article, relative position and direction terms such as "above", "facing upward", "below", "facing downward", "up and down direction", "left side", "facing left side", "left side", "facing left side", "right side", "facing right side", "right side", "facing right side", "left and right direction", "front", "facing forward", "back", "facing backward", and "front and back direction" are used with reference to the usual operating posture and should not be considered as restrictive.

[0030] This invention relates to an application device for applying a sensing component to a host. In some examples, the application device of this invention may also be referred to as a booster device, a delivery device, an implantation device, an applicator, or an auxiliary device. Furthermore, the sensing component of this invention may also be referred to as a biosensor, a monitor, a continuous analyte monitor, a detection device, a sensor assembly, or an information acquisition device.

[0031] In some examples, for an analyte of glucose, the sensing component can be a glucose sensor. However, it is not limited to glucose concentration; for example, by changing the sensing layer of the sensor, other bodily fluid components besides glucose concentration can be obtained. These bodily fluid components can be, for example, one or more of glucose, acetylcholine, amylase, bilirubin, cholesterol, human chorionic gonadotropin, creatine kinase, creatine, creatine anhydride, DNA, fructosamine, glutamine, growth hormone, hormones, blood ketones, lactate, oxygen, peroxides, prostate-specific antigen, prothrombin, RNA, thyroid-stimulating hormone, or troponin. For ease of description, some examples below use glucose as the analyte. It should be noted that this does not constitute a limitation of this disclosure, and unless there is a contradiction, the relevant descriptions also apply to other analytes.

[0032] The application device of the sensing component involved in this utility model will be described in detail below with reference to the accompanying drawings.

[0033] Figure 1 This is a diagram illustrating an application scenario of the sensing component 800 involved in this utility model example. Figure 2 This is a schematic diagram showing the structure of the instrument kit 1 involved in this utility model example.

[0034] In some examples, the sensing component 800 and the application device 300 can form a device kit 1. The sensing component 800 can be applied to the host via the application device 300, and the host can acquire physiological information through the sensing component 800 applied to itself. In some examples, the sensing component 800 can be applied to a desired location.

[0035] In some examples, the application device 300 may include a housing 100 and a cover 200. The housing 100 and the cover 200 may be detachably assembled by means of a threaded connection.

[0036] In some examples, when the instrument kit 1 is not in use, the housing 100 and the cover 200 are assembled together, and the sensing component 800 is held in the housing 100. When needed, the user can disassemble the cover 200 and the housing 100, then turn the opening of the housing 100 toward the host, triggering the puncture component to perform puncture and drive the sensing component 800 to move to the surface of the host body via the drive mechanism of the application device 300.

[0037] Next, the drive mechanism and puncture assembly of the application device 300 will be described below for ease of understanding. It should be noted that the descriptions of drive mechanisms and puncture assemblies in the prior art can also be referenced regarding the application device 300.

[0038] In some examples, the application device 300 may include a puncture assembly. The puncture assembly can provide a puncture path for the sensor 820. The sensor 820 can follow the puncture assembly into the subcutaneous tissue of the host. In some examples, the application device 300 may include a driving assembly. In some examples, the driving assembly can drive the puncture assembly and the sensing assembly 800 to move towards the host to apply the implantation portion 821 of the sensor 820 to the subcutaneous tissue of the host. In some examples, the driving assembly may include a spring.

[0039] In some examples, the housing 100 may have a receiving portion for accommodating the sensing component 800. In some examples, the puncture component may be arranged adjacent to the receiving portion. In some examples, the sensing component 800 may be assembled into the receiving portion, and the implantation portion 811 of the sensor 820 may be placed in the puncture component. The sensing component 800 may be pushed to the host using a drive component. During this process, the implantation portion 811 of the sensor 820 may be carried into the skin by the puncture component, and finally the puncture component may be removed from the subcutaneous tissue.

[0040] Regarding the application device 300 of this utility model, apart from the driving component and the puncture component, other structures can be referred to the descriptions of various application devices 300 in the prior art, as long as they can apply the sensing component 800 to the predetermined position and make the sensor 820 at least partially implanted under the skin of the host, which will not be described in detail here.

[0041] In some examples, the sensing component 800 can be configured to acquire the host's analyte levels. In some examples, the sensing component 800 can be an analyte sensing device that can generate information about specific analytes in bodily fluids based on bodily fluids, such as reacting with analytes in bodily fluids and generating analyte information. In this case, by reacting with analytes in bodily fluids, the sensing component 800 facilitates the acquisition of analyte information in the bodily fluids. For example, the sensing component 800 can be applied to the host's body surface and at least partially located under the host's skin to acquire the host's subcutaneous glucose concentration. See also Figure 1 After the application device 300 applies the sensing component 800 to the host, the sensing component 800 can be partially implanted into the host's body to detect analytes within the host. Although Figure 1 The wearing position of the sensing component 800 is shown, but this embodiment is not limited to this. For example, the sensing component 800 can also be worn on the abdomen, waist, legs, etc.

[0042] Figure 3 This is a schematic diagram showing the structure of the sensing component 800 involved in this utility model example.

[0043] In some examples, the sensing component 800 may include a sensor 820 and an application portion 810. In some examples, the sensor 820 may be supported on the application portion 810.

[0044] In some examples, sensor 820 can be placed partially or entirely under the skin of the host. In other words, sensor 820 can be placed at least partially under the skin. This allows for the monitoring of analyte information in the subcutaneous tissue fluid.

[0045] In some examples, after being placed subcutaneously, sensor 820 can react with glucose in the subcutaneous tissue fluid to generate glucose information for the host. The patch 810 can be applied to the host's body surface. In some examples, patch 810 can also receive the glucose information generated by sensor 820. In some examples, patch 810 can also provide the sensor 820 with the electrical energy required to acquire physiological information. This facilitates continuous monitoring by sensor 820 under the host's skin.

[0046] In some examples, sensor 820 includes an implantable portion 821 and an external portion connected to the implantable portion 821. The implantable portion 821 is implanted within a host body to detect analyte information. The external portion is located outside the host body and is coupled to an applicator 810 for transmitting information acquired by the implantable portion 821 to the applicator 810 for information processing.

[0047] In some examples, the implantation portion 821 of the sensor 820 can be elongated. In some examples, the implantation portion 821 can be rigid. This facilitates placement under the host's skin. In other examples, the implantation portion 821 can also be flexible, in which case the host's foreign body sensation can be reduced. In some examples, after the implantation portion 821 is implanted into the host, its depth can reach the dermis and be located in the interstitial tissue of the skin, so that the sensor 820 can collect glucose information from the interstitial fluid.

[0048] In some examples, the implantation portion 821 may include a working electrode and a counter electrode. In this disclosure, a sensing layer including a glucose enzyme may be disposed on the working electrode. The sensor 820, placed subcutaneously, can generate a current signal by reacting with glucose in tissue fluid or blood via the glucose enzyme on the working electrode, forming a circuit with the counter electrode. This current signal is then analyzed to obtain glucose concentration information. In some examples, the current signal generated by the sensor 820 can be transmitted to the dressing portion 810.

[0049] In some examples, the implanted portion 821 may also include a reference electrode. In some examples, the reference electrode may form a known and fixed potential difference with the tissue fluid or blood. In this case, the potential difference between the working electrode and the tissue fluid or blood can be measured by the potential difference formed between the reference electrode and the working electrode. This allows for a more accurate determination of the voltage generated by the working electrode, enabling the measured current signal to more accurately reflect the glucose concentration information in the tissue fluid or blood. In some examples, the number of reference electrodes may be one or more, for example, two.

[0050] In some examples, the applicator 810 is configured to adhere to the surface of a host's body. In some examples, the applicator 810 may include an adhesive sheet 811 with adhesive properties. The applicator 810 can be applied to and fixed to the surface of the host's body by the adhesive sheet 811.

[0051] In some examples, at least a portion of the surface of the adhesive patch 811 may be covered with a release film. In some examples, the host-facing surface of the adhesive patch 811 may be covered with a release film. Thus, the adhesive patch 811 can be protected by the release film, reducing the impact of environmental factors on the adhesive patch 811, reducing the decrease in the adhesiveness of the adhesive patch 811, and thereby helping to reduce unpleasant wearing experiences.

[0052] Figure 4 This is a first-view structural schematic diagram showing the sensing component 800, cover 200 and peeling mechanism 500 involved in this utility model example. Figure 5 This is a second-view structural schematic diagram showing the sensing component 800, cover 200, and peeling mechanism 500 involved in this utility model example. Figure 5 The sensor component 800, cover 200 and peeling mechanism 500 are shown in a separate diagram. Figure 6 This is a schematic diagram showing the structure of the cover 200 and the peeling mechanism 500 in combination according to the example of this utility model. Figure 7 This is a schematic diagram showing the structure of the cover 200 and the peeling mechanism 500 in the separated state according to the example of this utility model. Figure 8 This is a schematic diagram showing the structure of the limiting part 520 involved in this utility model example.

[0053] In some examples, the application device 300 may include a peeling mechanism 500. The peeling mechanism 500 is used to peel off the release film covering the surface of the adhesive sheet 811. Specifically, when the instrument kit 1 is assembled (i.e., before the sensor assembly 800 is used), the surface of the adhesive sheet 811 is covered with a release film, thereby protecting the adhesive sheet 811 and reducing the impact of environmental factors on it; when the sensor assembly 800 needs to be used, the peeling mechanism 500 peels off the release film covering the surface of the adhesive sheet 811. In some examples, the peeling mechanism 500 peels off the release film covering the surface of the adhesive sheet 811 during the process of disassembling the cover 200 and the housing 100 (unscrewing the cover).

[0054] In some examples, the peeling mechanism 500 may include a peeling member 510 and a limiting part 520.

[0055] In some examples, the limiting part 520 can be fixedly disposed on the cover 200. For example, the limiting part 520 can be fixedly disposed on the cover 200 by a snap-fit ​​action, or the limiting part 520 can be integrally formed on the cover 200.

[0056] In some examples, the limiting part 520 can restrict the peeling part 510 from detaching from the limiting part 520.

[0057] like Figures 5 to 8 As shown, in some examples, the limiting portion 520 may have a flange or a plurality of protrusions 521, which restrict the release member 510 from the limiting portion 520.

[0058] In some examples, the release element 510 can be rotatably coupled to the limiting portion 520. For example... Figure 5 As shown, the peeling member 510 may have a through hole, through which the limiting portion 520 passes and through the protrusion 521 to limit the peeling member 510. The peeling member 510 may rotate freely around the limiting portion 520, but is restricted from detaching from the limiting portion 520.

[0059] In some examples, with the cover 200 assembled to the housing 100, the release element 510 can be fixedly connected to the release film. In some examples, the release element 510 peels the release film from the adhesive sheet 811 by disassembling and detaching the cover 200 and the housing 100.

[0060] In some examples, the release element 510 can be adhesively attached to the release film. This allows the release film to be peeled off from the adhesive sheet 811 via adhesive action. For example, the surface of the release element 510 facing the release film can be coated with adhesive, which allows the release element 510 and the release film to adhere together. In some examples, the adhesive force between the release element 510 and the release film is greater than the adhesive force between the release film and the adhesive sheet 811. In some examples, the release film can be a single-sided release film, with the surface facing the adhesive sheet 811 coated with a release agent, resulting in a smaller adhesive force between the release film and the adhesive sheet 811, and the other surface uncoated, resulting in a larger adhesive force between the release film and the release element 510. This facilitates the smooth peeling of the release film from the adhesive sheet 811 using the release element 510.

[0061] In some examples, the release element 510 may include a compressible buffer portion 511. In some examples, with the cover 200 assembled to the housing 100, the buffer portion 511 is fixedly connected to the release film. In this case, the buffer portion 511 has compressible characteristics, and through contact with the release film, it can provide a buffering effect, preventing direct contact between rigid components and the sensing assembly 800, reducing scratches on the sensing assembly 800, or reducing the impact on the stability of the sensing assembly 800 within the housing 100.

[0062] In some examples, the cushioning portion 511 can be selected from foam, rubber, and silicone. Foam is a porous elastic material filled with tiny pores. Through a foaming process, the substrate is formed into a loose structure, possessing properties such as lightweight, compressibility, resilience, and cushioning. Foam can be selected from polyurethane foam, polyethylene foam, etc. Thus, a compressible and deformable cushioning portion 511 can be provided.

[0063] In some examples, the stripper 510 may include a bearing structure 512, which is rotatably coupled to the retaining portion 520. For example... Figure 7 As shown, the bearing structure 512 can be confined within the limiting portion 520 and can rotate freely around the limiting portion 520. Therefore, the peeling member 510 can be coupled to the limiting portion 520 in a freely rotatable manner via the bearing structure 512.

[0064] In some examples, the bearing structure 512 and the buffer portion 511 are fixedly connected. Thus, the bearing structure 512 can rotate under the action of the buffer portion 511. Therefore, the release member 510, including the bearing structure 512 and the buffer portion 511, allows the release member 510 to be rotatably coupled to the limiting portion 520 via the bearing structure 512, and reduces the impact on the sensing assembly 800 via the buffer portion 511.

[0065] In some examples, the cover 200 may be provided with a post 210, which may pass through the peeling mechanism 500. The peeling mechanism 500 is configured to rotate about the post 210. This further stabilizes the structure of the peeling mechanism 500. In some examples, the post 210 also serves to support the sensing component 800. This further enhances the stability of the sensing component 800 within the housing 100.

[0066] In some examples, the post 210 may pass through the limiting part 520. The limiting part 520 is configured to rotate about the post 210.

[0067] See Figure 4 and Figure 7 In some examples, the column 210 may have a hollow structure configured to accommodate the implantation portion 821 of the sensor 820. This allows for full utilization of the space within the application device 300, resulting in a more compact structure.

[0068] In some examples, the assembly process of the instrument kit 1 may include the following steps: The sensing component 800 is attached to the housing 100, and the cover 200 is assembled to the housing 100 by screwing it in. After the upper end of the release liner 510 (i.e., the buffer portion 511) contacts and adheres to the release film of the sensing component 800, the bearing mechanism 512 begins to operate. The cover 200 is continued to be screwed in until it is sealed to the housing 100. During this process, the buffer portion 511 can be compressed. Due to the squeezing and adhesive forces of the release liner 510 and the release film, the release liner 510 (including the buffer portion 511 and the bearing mechanism 512) will not move relative to the release film due to the screwing of the cover 200. Thus, during the assembly process of the instrument kit 1, the release liner 510 achieves contact and adhesion with the release film and subsequently does not move relative to the release film, reducing the impact on the release film.

[0069] In some examples, the contact assembly process (i.e., the preparation for application) of the device kit 1 may include the following steps: The user unscrews the cover 200 to open it and disassemble it from the housing 100. Since the release liner 510 is already bonded to the release film after the initial assembly, the bearing mechanism 512 begins to operate initially during the unscrewing process until the compressed buffer 511 is released; during this process, the buffer 511 does not move relative to the release film. Later in the unscrewing process, as the cover 200 continues to move away from the housing 100, the release liner 510 causes the release film to peel off from the adhesive sheet 811, exposing the adhesive surface of the adhesive sheet 811 for subsequent attachment to the host body surface. Subsequently, the sensing assembly 800 can be applied to the host using the application device 300.

[0070] In summary, in this invention, by covering at least a portion of the surface of the adhesive sheet 811 with a release film, the adhesive components on the surface of the adhesive sheet 811 can be protected by the release film, which helps ensure that the adhesive sheet 811 maintains good adhesion throughout the shelf life of the instrument kit 1. By providing a peeling mechanism 500, which includes a peeling element 510 and a limiting part 520, the limiting part 520 is fixedly disposed on the cover 200 and restricts the peeling element 510 from disengaging from the limiting part 520. The peeling element 510 is fixedly connected to the release film, and the peeling element 510 is rotatably coupled to the limiting part 520. During the process of unassembling and reassembling the cover 200 and the housing 100 by twisting the cover 200, the cover 200 moves away from the housing 100, and the peeling element 510 moves away from the adhesive sheet 811, thereby achieving release. The film is peeled off from the adhesive sheet 811. Since the peeling member 510 is rotatably coupled to the limiting part 520, during the process of peeling the release film off the adhesive sheet 811, the peeling mechanism 500 and the cover 200 rotate relative to each other without relative movement with the release film. This helps to avoid the peeling mechanism 500 from scratching the sensing component 800 or affecting the stability of the sensing component 800 in the housing 100. As a result, the release film can be peeled off from the adhesive sheet 811 stably and the impact on the sensing component 800 can be reduced.

[0071] Although the present invention has been specifically described above in conjunction with the accompanying drawings and examples, it is to be understood that the above description does not limit the present invention in any way. Those skilled in the art can make modifications and variations to the present invention as needed without departing from the essential spirit and scope of the present invention, and all such modifications and variations fall within the scope of the present invention.

Claims

1. An application device for applying a sensing component to a host, characterized in that, The application device includes a housing, a cover detachably assembled to the housing via a threaded connection, and a peeling mechanism. The sensing component is housed within the housing and includes an application portion and a sensor. The application portion includes an adhesive sheet with adhesive properties, and at least a portion of the surface of the adhesive sheet facing the host is covered with a release film. The peeling mechanism includes a peeling member and a limiting portion. The peeling member is rotatably coupled to the limiting portion, and the limiting portion is fixedly disposed on the cover and restricts the peeling member from detaching from the limiting portion. With the cover assembled on the housing, the peeling member and the release film are fixedly connected; the peeling member peels the release film off the adhesive sheet by disassembling and assembling the cover and the housing.

2. The application device according to claim 1, characterized in that, The release element includes a compressible and deformable buffer portion, which is fixedly connected to the release film when the cover is assembled into the housing.

3. The application device according to claim 2, characterized in that, The buffer is selected from foam, rubber and silicone.

4. The application device according to claim 2, characterized in that, When the cover is assembled into the housing, the buffer portion is in a relaxed or compressed state.

5. The application device according to any one of claims 1 to 4, characterized in that, The release element is fixedly connected to the release film by adhesive.

6. The application device according to claim 1, characterized in that, The stripper includes a bearing structure that is rotatably coupled to the limiting portion.

7. The application device according to claim 2, characterized in that, The stripper includes a bearing structure that is rotatably coupled to the limiting part, and the bearing structure and the buffer part are fixedly connected.

8. The application device according to claim 1, characterized in that, The limiting portion has a flange or multiple protrusions, which restrict the release member from the limiting portion.

9. The application device according to claim 1, characterized in that, The cover is provided with a column, which passes through the peeling mechanism, and the peeling mechanism is configured to rotate around the column.

10. The application device according to claim 9, characterized in that, The column has a hollow structure, and the sensor includes an implantable part, the hollow structure being configured to accommodate the implantable part.

Images