Multi-station detection platform, circuit board defect detection device and system

Abstract

The application discloses a multi-station detection platform, a circuit board defect detection device and a system, and relates to the technical field of circuit board quality detection. The device comprises a platform base frame provided with a feeding station and a discharging station; a cascade detection station group integrated with oppositely arranged first-stage detection station modules and second-stage detection station modules is arranged between the feeding station and the discharging station; the feeding station is in transmission communication with the first-stage detection station modules; the discharging station is in transmission communication with the first-stage detection station modules and the second-stage detection detection station modules respectively; a central flow transfer manipulator is arranged directly above the area where the cascade detection station group is located; the central flow transfer manipulator is electrically connected with the first-stage detection station modules; and the central flow transfer manipulator is arranged to move a circuit board to be detected placed on the first-stage detection station modules to the second-stage detection station modules in response to a circuit board re-inspection signal of the first-stage detection station modules, so as to meet the requirements of efficient and high-precision industrial detection.

Description

Technical Field

[0001] This application relates to the field of circuit board quality inspection technology, and in particular to a multi-station inspection platform, circuit board defect inspection equipment and system. Background Technology

[0002] With the continuous development of circuit board quality inspection technology, users have placed higher demands on the accuracy and efficiency of FPC (Flexible Printed Circuit) defect detection. However, traditional FPC board defect detection equipment (i.e., circuit board defect detection equipment) typically adopts a single-station and single-algorithm detection mode, leading to a contradiction between detection efficiency and accuracy. Specifically, using high-precision algorithms results in slow detection speeds, while using simple algorithms leads to high false alarm rates. Simultaneously, unreasonable allocation of computational resources, using the same processing method for all boards, results in resource waste, and the fixed detection process cannot be dynamically adjusted, making it difficult to meet the needs of efficient and high-precision industrial inspection.

[0003] The above content is only used to help understand the technical solution of this application and does not represent an admission that the above content is prior art. Utility Model Content

[0004] The main purpose of this utility model is to provide a multi-station inspection platform, circuit board defect inspection equipment and system, which aims to meet the industrial inspection needs of circuit board defect inspection equipment with high efficiency and high precision.

[0005] To achieve the above objectives, this application provides a multi-station inspection platform, the multi-station inspection platform comprising: The multi-station testing platform includes: A platform base frame, on which a loading station and a unloading station are provided; A cascaded inspection station group is arranged between the loading station and the unloading station. The cascaded inspection station group includes a first-level inspection station module and a second-level inspection station module arranged opposite to each other. The loading station is driven to the first-level inspection station module, and the unloading station is driven to both the first-level inspection station module and the second-level inspection station module. A central transfer robot is positioned directly above the area where the cascaded inspection station group is located. The central transfer robot is electrically connected to the first-level inspection station module. The central transfer robot is configured to move the circuit board to be tested, placed on the first-level inspection station module, to the second-level inspection station module in response to the circuit board re-inspection signal of the first-level inspection station module.

[0006] In one embodiment, the first-level detection station module includes a first station platform, a first optical system installed on the first station platform, and a first computing unit electrically connected to the first optical system; The second-level inspection station module includes a second station platform, a second optical system installed on the second station platform, and a second computing unit electrically connected to the second optical system.

[0007] In one embodiment, the image resolution of the second optical system is higher than that of the first optical system; The first computing unit is an embedded industrial control computer, and the second computing unit is an artificial intelligence server with an integrated graphics processing chip.

[0008] In one embodiment, the first workstation platform is provided with a first good product discharge port and a first defective product discharge port, and the second workstation platform is provided with a second good product discharge port and a second defective product discharge port. The unloading station includes a good product area and a defective product area. The good product area is connected to the first good product discharge port and the second good product discharge port via conveyor belts, and the defective product area is connected to the first defective product discharge port and the first defective product discharge port via conveyor belts.

[0009] In one embodiment, the second workstation platform is further provided with a difficult-to-dispose-of-products discharge port, and the cascaded testing workstation group also includes a manual re-inspection workstation platform; The difficult-to-dispose-of-products discharge port is connected to the manual re-inspection station platform via a conveyor belt; The good product discharge port of the manual re-inspection station platform is connected to the good product area via a conveyor belt, and the defective product discharge port of the manual re-inspection station platform is connected to the defective product area via a conveyor belt.

[0010] In one embodiment, the central transfer robot is a gantry robot, and the central processing unit of the gantry robot is electrically connected to the first computing unit.

[0011] In one embodiment, the gantry-type manipulator further includes a support frame spanning the platform base, a horizontal moving mechanism disposed on the support frame, a vertical lifting mechanism connected to the horizontal moving mechanism, and a vacuum suction cup device disposed at the end of the vertical lifting mechanism.

[0012] In one embodiment, the horizontal moving mechanism includes an X-axis linear module and a Y-axis linear module arranged perpendicularly to each other, and the vertical lifting mechanism is a Z-axis linear module.

[0013] In addition, to achieve the above objectives, a circuit board defect detection device is also provided, the circuit board defect detection device comprising: The multi-station testing platform described in any of the above items; The control system is connected to the cascaded testing station group and the gantry-type robotic arm in the multi-station testing platform.

[0014] In addition, to achieve the above objectives, a circuit board defect detection system is also provided, which includes at least the circuit board defect detection equipment described above.

[0015] To address the issues of inconsistent detection efficiency and accuracy, unreasonable allocation of computing resources, and rigid processes caused by the single-station, single-algorithm mode of traditional FPC defect detection equipment, this application constructs a multi-station detection platform that includes a loading station, a unloading station, and a cascaded detection station group consisting of a first-level detection station module and a second-level detection station module. This platform is further supported by the coordinated control of a central rotating robot located directly above the area where the cascaded detection station group is located, thereby achieving the high-efficiency and high-precision industrial inspection requirements. Specifically, through the cascaded layout of two-level inspection station modules (i.e., the first-level inspection station module and the second-level inspection station module), the circuit boards under test that are questionable after inspection by the first-level inspection station module can automatically trigger a re-inspection signal and be automatically transferred by the central robotic arm to the second-level inspection station module for re-inspection. This realizes the dynamic optimization of the circuit board defect detection process and the precise allocation of resources. That is, most good circuit boards can be quickly pre-inspected and diverted, while only a few questionable products can be re-inspected with high precision. Ultimately, without significantly increasing the total inspection time, the accuracy of circuit board defect detection is effectively improved, the false alarm rate is reduced, and the problem of resource waste is solved, thus meeting the needs of efficient and high-precision industrial inspection. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the multi-station testing platform involved in this application; Figure 2 This refers to the first / secondary detection station module involved in the embodiments of this application; Figure 3 This is a schematic diagram of the partitioned storage structure involved in the embodiments of this application; Figure 4 This is a schematic diagram of a circuit board defect detection device involved in the embodiments of this application; Figure 5 This is a schematic diagram of a circuit board defect detection system according to an embodiment of this application.

[0017] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0018] Explanation of icon numbers: 100. Platform base frame; 10. Loading station; 20. Unloading station; 30. Cascaded inspection station group; 31. First-level inspection station module; 32. Second-level inspection station module; 40. Central transfer robot; 21. Good product area; 22. Defective product area. Detailed Implementation

[0019] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0020] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0021] With the continuous development of circuit board quality inspection technology, users have placed higher demands on the accuracy and efficiency of FPC (Flexible Printed Circuit) defect detection. However, traditional FPC board defect detection equipment (i.e., circuit board defect detection equipment) typically adopts a single-station and single-algorithm detection mode, leading to a contradiction between detection efficiency and accuracy. Specifically, using high-precision algorithms results in slow detection speeds, while using simple algorithms leads to high false alarm rates. Simultaneously, unreasonable allocation of computational resources, using the same processing method for all boards, results in resource waste, and the fixed detection process cannot be dynamically adjusted, making it difficult to meet the needs of efficient and high-precision industrial inspection.

[0022] Therefore, addressing the issues of efficiency versus accuracy, unreasonable allocation of computational resources, and rigid processes inherent in traditional FPC defect detection equipment due to its single-station, single-algorithm approach, this application proposes a multi-station detection platform. This application constructs a multi-station detection platform comprising a loading station, a unloading station, and a cascaded detection station group consisting of a first-level detection station module and a second-level detection station module. This is further enhanced by the coordinated control of a central rotating robotic arm positioned directly above the cascaded detection station group, thus achieving high-efficiency and high-precision industrial inspection requirements. Specifically, through the cascaded layout of two-level inspection station modules (i.e., the first-level inspection station module and the second-level inspection station module), the circuit boards under test that are questionable after inspection by the first-level inspection station module can automatically trigger a re-inspection signal and be automatically transferred by the central robotic arm to the second-level inspection station module for re-inspection. This realizes the dynamic optimization of the circuit board defect detection process and the precise allocation of resources. That is, most good circuit boards can be quickly pre-inspected and diverted, while only a few questionable products can be re-inspected with high precision. Ultimately, without significantly increasing the total inspection time, the accuracy of circuit board defect detection is effectively improved, the false alarm rate is reduced, and the problem of resource waste is solved, thus meeting the needs of efficient and high-precision industrial inspection.

[0023] Based on this, the embodiments of this application provide a multi-station inspection platform, referring to... Figure 1 , Figure 1 This is a schematic diagram of the multi-station testing platform involved in this application.

[0024] Reference Figure 1 This application provides a multi-station inspection platform, which includes: Platform base frame 100, on which a loading station 10 and a unloading station 20 are provided.

[0025] In this embodiment, by clearly defining the platform frame 100 of the loading station 10 and the unloading station 20, a highly integrated and linear physical framework is established for the entire circuit board defect detection process. This ensures that the path of the circuit board under test from entry to exit is optimal and fixed, eliminating the flow delays and path conflicts caused by chaotic layout in traditional equipment. Furthermore, the loading station 10 and the unloading station 20 serve as the starting and ending points of the circuit board defect detection process, respectively, making the material flow clear and laying a solid structural foundation for subsequent automated and highly efficient cascaded detection.

[0026] A cascaded inspection station group 30 is disposed between the loading station 10 and the unloading station 20. The cascaded inspection station group 30 includes a first-level inspection station module 31 and a second-level inspection station module 32 disposed opposite to each other. The loading station 10 is connected to the first-level inspection station module 31, and the unloading station 20 is connected to both the first-level inspection station module 31 and the second-level inspection station module 32.

[0027] In this embodiment, by integrating a first-level inspection station module 31 and a second-level inspection station module 32 into the cascaded inspection station group 30, and connecting the loading station 10 to the first-level inspection station module 31 via a conveyor belt, and connecting the unloading station 20 to the first-level inspection station module 31 and the second-level inspection station module 32 via conveyor belts respectively, the first inspection station module can serve as a highly efficient main inspection line. That is, the circuit board to be tested after rapid initial inspection by the first-level inspection station module 31 can directly flow to the unloading station 20 via the conveyor belt, ensuring the overall efficiency of the circuit board defect detection process. The second-level inspection station module 32 serves as a professional re-inspection component. The circuit board to be tested that triggers the re-inspection signal is moved to the second-level inspection station module 32 by the central transfer robot 40, thereby achieving decoupling between high-speed initial inspection and high-precision re-inspection, fundamentally solving the inherent contradiction that single-station and single-algorithm modes cannot balance efficiency and accuracy.

[0028] A central transfer robot 40 is positioned directly above the area where the cascaded inspection station group 30 is located. The central transfer robot 40 is electrically connected to the first-level inspection station module 31. The central transfer robot 40 is configured to move the circuit board to be tested, placed on the first-level inspection station module 31, to the second-level inspection station module 32 in response to the circuit board re-inspection signal of the first-level inspection station module 31.

[0029] In this embodiment, the central transfer robot 40, positioned directly above the area of ​​the cascaded inspection station group 30 and electrically connected to the first-level inspection station module 31, forms the intelligent scheduling hub of the entire multi-station inspection platform. This allows the central transfer robot 40 to respond in real time to the circuit board re-inspection signal issued by the first-level module and accurately transfer the circuit board to be tested from the first-level inspection station module 31 to the second-level inspection station module 32. This realizes a dynamic re-inspection process based on the initial inspection results. This not only allows high-precision inspection resources to focus on a few difficult workpieces, significantly improving the overall efficiency and resource utilization of the multi-station inspection platform, but also effectively solves the technical defect of the traditional single-station inspection where efficiency and accuracy cannot be achieved simultaneously through this automated intelligent diversion mechanism.

[0030] Furthermore, based on the first embodiment of this application described above, a second embodiment of the multi-station inspection platform of this application is proposed, with reference to... Figure 2 In some feasible embodiments, the first-level detection station module 31 includes a first station platform, a first optical system installed on the first station platform, and a first computing unit electrically connected to the first optical system; the second-level detection station module 32 includes a second station platform, a second optical system installed on the second station platform, and a second computing unit electrically connected to the second optical system.

[0031] In this embodiment, by configuring an independent detection system consisting of a first station platform, a first optical system, and a first computing unit for the first-level detection station module 31, and another independent detection system consisting of a second station platform, a second optical system, and a second computing unit for the second-level detection station module 32, hardware decoupling and functional specialization of the two-level detection resources are achieved. Specifically, the first computing unit is configured as an embedded industrial control computer equipped with a highly efficient defect detection algorithm, dedicated to achieving rapid initial screening and triage of circuit board defects; while the second computing unit is configured as an artificial intelligence server integrating a graphics processing chip to provide powerful parallel computing capabilities for the re-inspection process of circuit board defect detection, enabling the second computing unit to process complex image features and effectively identify irregular or minute circuit board defects that are difficult for the first computing unit to determine, thereby significantly improving the accuracy of circuit board defect detection.

[0032] Furthermore, in some other feasible embodiments, the image resolution of the second optical system is higher than that of the first optical system; the first computing unit is an embedded industrial control computer, and the second computing unit is an artificial intelligence server with an integrated graphics processing chip.

[0033] Furthermore, in some feasible embodiments, reference is made to Figure 3 The first workstation platform is provided with a first good product discharge port and a first defective product discharge port, and the second workstation platform is provided with a second good product discharge port and a second defective product discharge port. The unloading station 20 includes a good product area 21 and a defective product area 22. The good product area 21 is connected to the first good product discharge port and the second good product discharge port respectively via conveyor belts, and the defective product area 22 is connected to the first defective product discharge port and the first defective product discharge port respectively via conveyor belts.

[0034] In this embodiment, a first good product discharge port and a first defective product discharge port are set up on the first workstation platform, and a second good product discharge port and a second defective product discharge port are set up on the second workstation platform. The unloading station 20 is divided into a good product area 21 and a defective product area 22. The good product area 21 is connected to two good product discharge ports by conveyor belts, and the defective product area 22 is connected to two defective product discharge ports by conveyor belts, thus constructing a parallel and centralized material sorting network, realizing efficient collaboration between the detection and sorting processes. Specifically, products clearly identified as good or defective by the first-level module can directly enter the corresponding collection area, while products verified by the second-level module can also be collected through a dedicated channel. This ensures that all circuit boards to be tested can be automatically and accurately classified and collected, while avoiding mutual interference between different detection paths, maximizing production capacity while ensuring detection accuracy.

[0035] Furthermore, in some other feasible embodiments, the second workstation platform is also provided with a difficult-to-dispose-of-product discharge port, and the cascaded inspection workstation group 30 also includes a manual re-inspection workstation platform; the difficult-to-dispose-of-product discharge port is connected to the manual re-inspection workstation platform via a conveyor belt; the good-product discharge port of the manual re-inspection workstation platform is connected to the good-product area 21 via a conveyor belt, and the defective-product discharge port of the manual re-inspection workstation platform is connected to the defective-product area 22 via a conveyor belt.

[0036] In this embodiment, a difficult-to-dispose-of-products discharge port is set up through the second workstation platform, and a manual re-inspection workstation platform connected to the difficult-to-dispose-of-products discharge port via a conveyor belt is added. The good-products discharge port and defective-products discharge port of this manual re-inspection workstation platform are respectively connected to the good-product area 21 and defective-product area 22 of the unloading station 20, constructing a complete closed-loop inspection system. This achieves efficient processing and final judgment of difficult-to-dispose-of-defect products that are difficult for machines to determine. Specifically, circuit boards that cannot be clearly classified after being judged by the second-level inspection module can be automatically transferred to the manual re-inspection workstation through the difficult-to-dispose-of-products discharge port. After final judgment by the operator, they are respectively classified into the good-product area 21 and defective-product area 22 of the unloading station 20. This not only significantly improves the system's ability to identify complex defects and the overall inspection accuracy, but also effectively solves the limitations of machine inspection by seamlessly integrating manual re-inspection into the automated process, ensuring no loss of automation efficiency. It forms a three-level decision-making mechanism of machine initial inspection - machine re-inspection - manual final inspection, making the entire inspection system highly efficient, highly accurate, and highly reliable.

[0037] Furthermore, in some feasible embodiments, reference is made to Figure 4 The central transfer robot 40 is a gantry robot, and the central processing unit of the gantry robot is electrically connected to the first computing unit.

[0038] Furthermore, in some other feasible embodiments, the gantry-type manipulator also includes a support frame spanning the platform base 100, a horizontal moving mechanism disposed on the support frame, a vertical lifting mechanism connected to the horizontal moving mechanism, and a vacuum suction cup device disposed at the end of the vertical lifting mechanism.

[0039] Furthermore, in some feasible embodiments, the horizontal moving mechanism includes an X-axis linear module and a Y-axis linear module arranged perpendicularly to each other, and the vertical lifting mechanism is a Z-axis linear module.

[0040] In summary, addressing the issues of inconsistent detection efficiency and accuracy, unreasonable allocation of computing resources, and rigid processes caused by the single-station, single-algorithm mode of traditional FPC defect detection equipment, this application constructs a multi-station detection platform that includes a loading station 10, a unloading station 20, and a cascaded detection station group 30 composed of a first-level detection station module 31 and a second-level detection station module 32. This is further supported by the coordinated control of a central transfer robot 40 positioned directly above the area where the cascaded detection station group 30 is located, thus achieving efficient and high-precision industrial inspection. Specifically, through the cascaded layout of two-level inspection station modules (i.e., the first-level inspection station module 31 and the second-level inspection station module 32), the circuit boards under test that are questionable after inspection by the first-level inspection station module 31 can be automatically triggered for re-inspection. They are then automatically transferred by the central robotic arm to the second-level inspection station module 32 for re-inspection. This achieves dynamic optimization and precise resource allocation of the circuit board defect detection process. That is, most good circuit boards can be quickly pre-inspected and diverted, while only a few questionable products can be re-inspected with high precision. Ultimately, without significantly increasing the total inspection time, the accuracy of circuit board defect detection is effectively improved, the false alarm rate is reduced, and the problem of resource waste is solved, thus meeting the needs of efficient and high-precision industrial inspection.

[0041] Furthermore, based on the first embodiment of this application described above, a second embodiment of the multi-station inspection platform of this application is proposed for use in circuit board defect inspection equipment. (Refer to...) Figure 4 , Figure 4 This is a schematic diagram of a circuit board defect detection device according to an embodiment of this application. The circuit board defect detection device provided in this application includes: Multi-station testing platform as described in any of the above; The control system is connected to the cascaded testing station group and the gantry-type robotic arm in the multi-station testing platform.

[0042] Furthermore, based on the first and second embodiments of this application described above, a third embodiment of the multi-station inspection platform of this application is proposed for use in a circuit board defect inspection system. (Refer to...) Figure 5 , Figure 5 This is a schematic diagram of a circuit board defect detection system according to an embodiment of this application. The circuit board defect detection system provided in this application includes at least the circuit board defect detection equipment described in any of the above-mentioned embodiments.

[0043] The above are only some embodiments of this application and do not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. A multi-station inspection platform, characterized in that, The multi-station testing platform includes: A platform base frame, on which a loading station and a unloading station are provided; A cascaded inspection station group is arranged between the loading station and the unloading station. The cascaded inspection station group includes a first-level inspection station module and a second-level inspection station module arranged opposite to each other. The loading station is driven to the first-level inspection station module, and the unloading station is driven to both the first-level inspection station module and the second-level inspection station module. A central transfer robot is positioned directly above the area where the cascaded inspection station group is located. The central transfer robot is electrically connected to the first-level inspection station module. The central transfer robot is configured to move the circuit board to be tested, placed on the first-level inspection station module, to the second-level inspection station module in response to the circuit board re-inspection signal of the first-level inspection station module.

2. The multi-station testing platform as described in claim 1, characterized in that, The first-level detection station module includes a first station platform, a first optical system installed on the first station platform, and a first computing unit electrically connected to the first optical system; The second-level inspection station module includes a second station platform, a second optical system installed on the second station platform, and a second computing unit electrically connected to the second optical system.

3. The multi-station testing platform as described in claim 2, characterized in that, The image resolution of the second optical system is higher than that of the first optical system; The first computing unit is an embedded industrial control computer, and the second computing unit is an artificial intelligence server with an integrated graphics processing chip.

4. The multi-station testing platform as described in claim 2, characterized in that, The first workstation platform is provided with a first good product discharge port and a first defective product discharge port, and the second workstation platform is provided with a second good product discharge port and a second defective product discharge port. The unloading station includes a good product area and a defective product area. The good product area is connected to the first good product discharge port and the second good product discharge port via conveyor belts, and the defective product area is connected to the first defective product discharge port and the first defective product discharge port via conveyor belts.

5. The multi-station testing platform as described in claim 4, characterized in that, The second workstation platform is also equipped with a discharge port for difficult-to-dispose products, and the cascaded testing workstation group also includes a manual re-inspection workstation platform; The difficult-to-dispose-of-products discharge port is connected to the manual re-inspection station platform via a conveyor belt; The good product discharge port of the manual re-inspection station platform is connected to the good product area via a conveyor belt, and the defective product discharge port of the manual re-inspection station platform is connected to the defective product area via a conveyor belt.

6. The multi-station testing platform as described in claim 2, characterized in that, The central transfer robot is a gantry robot, and the central processing unit of the gantry robot is electrically connected to the first computing unit.

7. The multi-station testing platform as described in claim 6, characterized in that, The gantry-type manipulator also includes a support frame spanning the platform base, a horizontal moving mechanism disposed on the support frame, a vertical lifting mechanism connected to the horizontal moving mechanism, and a vacuum suction cup device disposed at the end of the vertical lifting mechanism.

8. The multi-station testing platform as described in claim 7, characterized in that, The horizontal moving mechanism includes an X-axis linear module and a Y-axis linear module arranged perpendicularly to each other, and the vertical lifting mechanism is a Z-axis linear module.

9. A circuit board defect detection device, characterized in that, The circuit board defect detection equipment includes: The multi-station testing platform according to any one of claims 1 to 8; The control system is connected to the cascaded testing station group and the gantry-type robotic arm in the multi-station testing platform.

10. A circuit board defect detection system, characterized in that, The circuit board defect detection system includes at least the circuit board defect detection equipment as described in claim 9.

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