Chip sorting and testing machine

Abstract

This invention discloses a chip sorting and inspection machine, belonging to the field of chip inspection technology. The chip sorting and inspection machine includes: a feeding unit for storing wafers and conveying them to a die-bonding unit; a die-bonding unit for placing wafers and adjusting their angles; a loading unit including multiple loading claws that alternately grip chips from the wafers on the die-bonding unit and convey them to an inspection component; an inspection component for inspecting the chips and separating them into qualified and unqualified chips, further classifying the qualified chips; a unloading unit including multiple unloading claws that alternately grip qualified chips and convey them to an output unit; an output unit for storing qualified chips; and a discarding unit for storing unqualified chips. The chip sorting and inspection machine provided by this application has high integration and high inspection efficiency, and is less prone to chip loss during the inspection process.

Description

Technical Field

[0001] This invention relates to the field of chip inspection technology, and more specifically, to a chip sorting and inspection machine. Background Technology

[0002] After production is completed, the products need to be tested to separate qualified and unqualified products.

[0003] In the existing technology, different devices are usually used to test different properties of a product. For example, device A is used to test property A of the product, device B is used to test property B of the product, and device C is used to test property C of the product.

[0004] However, equipment A, equipment B, and equipment C are often located in different workshops or are relatively far apart. In this case, the products that need to be processed need to be transferred multiple times. However, the longer the transfer distance, the greater the risk of damage to products with higher precision, such as chips, and it will also reduce the efficiency of product testing. Summary of the Invention

[0005] In existing technologies, different stages of chip testing require different testing equipment, which are often far apart. This necessitates multiple long-distance transports of the chip, potentially causing chip damage and low testing efficiency. This solution proposes a chip sorting and testing machine. By integrating the testing equipment, it avoids multiple transfers of the chip during the testing process and uses multiple grippers for alternating loading and unloading to improve testing efficiency, thus solving the problems of existing technologies.

[0006] To achieve the above objectives, the technical solution provided by the present invention is as follows: The first aspect of the present invention provides a chip sorting and inspection machine, including a feeding unit, a die bonding unit, a loading unit, an inspection component, a unloading unit, an output unit, and a discarding unit; The feeding unit is used to store wafers and transport the wafers to the die bonding unit; The die-bonding unit is used to place the wafer and adjust the angle of the wafer; The feeding unit includes multiple feeding claws, which alternately grab the chips inside the wafer on the die bonding unit and transport the chips to the detection component; The detection component is used to detect the chip, and to classify the detected chip into qualified chips and unqualified chips, and to grade the qualified chips. The feeding unit includes multiple feeding claws, which alternately grab the qualified chip and transport it to the discharging unit; The discharge unit is used to store the qualified chips; The discarding unit is used to store the defective chips.

[0007] The chip sorting and inspection machine of this application completes all chip inspections in one go through the inspection components, separating qualified chips from unqualified chips, and classifying qualified chips into grades. This allows the chip inspection equipment to be concentrated in one location, realizing the integration of inspection equipment, avoiding multiple transfers of chips during the chip inspection process, reducing the risk of chip damage. The machine automates loading and unloading, as well as the collection and disposal of unqualified chips, through a feeding unit, die bonding unit, loading unit, unloading unit, unloading unit, and throwing unit. Furthermore, the multi-claw alternating loading and unloading settings of the loading and unloading units enable higher chip inspection efficiency.

[0008] In the chip sorting and inspection machine provided in this application, the feeding unit further includes: A loading basket for storing the wafers and having a loading cover; A loading lift is connected to the loading basket and is used to move the loading basket up and down, and to move the loading basket closer to or away from the die bonding unit. The feeding cover opener is connected to the feeding cover body and drives the feeding cover body to separate from the feeding basket and move away from the wafer transport path; The wafer feeding conveyor, when the feeding lift moves the feeding basket close to the die bonding unit, grabs the wafer from the feeding basket and moves it onto the die bonding unit. The feeding cap opener automatically opens the feeding basket, facilitating subsequent automatic grabbing of the wafer from the feeding basket by the wafer feeding conveyor.

[0009] In the chip sorting and inspection machine provided in this application, the die bonding unit further includes: A rotating mechanism is used to place the wafer and drive the wafer to rotate about a vertical axis; A film-supporting mechanism is provided on the rotating mechanism and supports the film attached to the bottom of the wafer. A die-bonding moving base, wherein the rotating mechanism is disposed on the die-bonding moving base, so as to drive the rotating mechanism to move on the horizontal plane along the direction close to or away from the feeding unit and the direction perpendicular to the direction via the die-bonding moving base, and to drive the rotating mechanism to move up and down via the die-bonding moving base; A die-bonding identification camera is used to photograph the wafer on the rotating mechanism and detect the angle and orientation of the wafer and the position of each chip on the wafer. When the wafer's angle and orientation are in a preset state, the rotating mechanism stops rotating. The rotating mechanism drives the wafer to rotate so that the chips on the wafer can be aligned with the chip placement device at a subsequent workstation after only translation, facilitating subsequent chip transport and ensuring that the chips do not collide with the placement device during transport and cause damage. A film-supporting mechanism opens the film to facilitate separation of the chip from the film, allowing the chip to be removed from the wafer. A die-bonding moving seat drives the rotating mechanism to move the chip to be removed from the wafer to the desired removal station, facilitating chip loading by the loading unit. The die-bonding identification camera identifies the chips on the wafer, recognizing whether the chip has rotated to a preset angle and whether it has been moved to the desired removal station based on the image captured by the camera.

[0010] In the chip sorting and inspection machine provided in this application, the die bonding unit further includes a chip ejector. The chip ejector moves up and down and passes through corresponding clearance holes provided on the die bonding moving seat, the film supporting mechanism, and the rotating mechanism to abut against the chip on the wafer and separate the chip from the film. The abutment between the chip ejector and the chip allows the chip to be separated from the film, so that the loading unit can pick up the chip.

[0011] In the chip sorting and inspection machine provided in this application, the feeding unit further includes: A first feeding track is provided with the feeding claw, which moves along the first feeding track to transport the chip on the rotating mechanism to the detection component; The first feeding support, the first feeding track is disposed on the first feeding support, so as to drive the first feeding track to move closer to or away from the rotating mechanism via the first feeding support; The second feeding track is provided with the feeding claw, which moves along the second feeding track to transport the chip on the rotating mechanism to the detection component; The second feeding support and the second feeding track are provided on the second feeding support so that the second feeding track can be driven to move closer to or away from the rotating mechanism via the second feeding support; The first and second feeding tracks are arranged opposite to each other, forming a moving space for the feeding claw to move, and the rotating mechanism is located below the moving space. The cooperation between the first feeding support and the first feeding track, as well as the cooperation between the second feeding track and the second feeding support, enables the feeding claw to have two horizontal dimensions of movement, thereby allowing for fine-tuning of the feeding claw's position on the horizontal plane. This ensures that the feeding claw can accurately move the chip to the chip sorting and inspection machine for inspection, preventing chip damage due to collisions with the chip sorting and inspection machine during transport, and reducing chip loss during the inspection process.

[0012] In the chip sorting and inspection machine provided in this application, the inspection component further includes: Electrical testing unit, including conformity testing unit and graded testing unit; The chip sorting and inspection unit can detect whether the chip is qualified and its performance through the electrical detection unit, thereby classifying the chip. Finally, the appearance inspection unit inspects the appearance of the chip. This allows the chip sorting and inspection machine of this application to complete all chip inspections in one go, thus avoiding the risk of chip damage caused by multiple transfers when different inspection equipment is set in different locations.

[0013] In the chip sorting and testing machine provided in this application, the qualified testing unit and the graded testing unit both include a rotatable rotating frame and multiple testing stations arranged around the rotating frame. The rotating frame is provided with multiple placement compartments for placing chips, so that when the rotating frame rotates and drives the placement compartment to the corresponding testing station, the testing station tests the chip in the placement compartment. The detection station corresponding to the qualified detection unit is used to detect whether the chip is qualified, and the detection station corresponding to the grade detection unit is used to detect the grade of the chip. The qualified detection unit and the grade detection unit adopt a rotating bracket with a placement chamber and multiple detection stations, so that the multiple detection stations can be compactly arranged, thereby reducing the footprint of the chip sorting and detection machine of this application.

[0014] In the chip sorting and inspection machine provided in this application, the discarding unit is further disposed between the qualified inspection unit and the grading inspection unit, and a transfer unit is also provided between the qualified inspection unit and the grading inspection unit to transport the chips that have been inspected on the qualified inspection unit to the grading inspection unit. Directly discarding unqualified chips detected by the qualified inspection unit reduces the number of chips that need to be inspected by the subsequent grading inspection unit and appearance inspection unit, making the entire chip inspection process more efficient.

[0015] In the chip sorting and inspection machine provided in this application, the appearance inspection unit further includes a stage for placing the chip and multiple appearance inspection cameras to perform multi-angle visual inspection of the chip on the stage. This enables comprehensive visual inspection of all surfaces of the chip.

[0016] In the chip sorting and inspection machine provided in this application, the unloading unit further includes: A sorting table, wherein the sorting table is provided with a support suitable for placing the chip; A first unloading track is provided with the unloading claw, which moves along the first unloading track to transport the chip on the appearance inspection unit to the sorting table; The first feeding support, the first feeding track is disposed on the first feeding support, so as to drive the first feeding track to move closer to or away from the appearance detection unit via the first feeding support; The second unloading track is equipped with the unloading claw, which moves along the second unloading track to transport the chip on the appearance inspection unit to the sorting table; The second feeding support and the second feeding track are provided on the second feeding support so that the second feeding track can be driven to move closer to or away from the appearance detection unit via the second feeding support. The first and second feeding tracks are arranged opposite to each other, forming a moving space between them for the feeding claw to move. The appearance inspection unit and the sorting table are located below the moving space. The cooperation between the first feeding support and the first feeding track, and the cooperation between the second feeding track and the second feeding support, enables the feeding claw to have two horizontal dimensions of movement. This allows for fine-tuning of the feeding claw's position on the horizontal plane, ensuring that the feeding claw can accurately pick up the chip from the appearance inspection unit and place it on the output unit. This prevents the chip from being damaged by collisions with the appearance inspection unit and the output unit during transport, and reduces chip loss during the inspection process.

[0017] In the chip sorting and inspection machine provided in this application, the discharge unit further includes: A feeding basket for storing the wafers and having a feeding cover; A material lifting machine is connected to the material lifting basket to drive the material lifting basket to move up and down, and to move the material lifting basket closer to or away from the sorting table; The discharge cover opener is connected to the discharge cover body and drives the discharge cover body to separate from the discharge basket and move away from the transport path of the wafer; The wafer unloading conveyor, when the unloading lift moves the unloading basket close to the sorting table, grabs the support member on the sorting table and moves the support member into the unloading basket. This enables the storage of inspected chips and protects the chips from damage.

[0018] The beneficial effects of this application are: The chip sorting and inspection machine provided in the first aspect of this application completes all chip inspections in one go through inspection components, separating qualified chips from unqualified chips, and classifying qualified chips into grades. This allows the chip inspection equipment to be concentrated in one location, realizing the integration of inspection equipment, avoiding multiple transfers of chips during chip inspection, reducing the risk of chip damage, and automating the loading, unloading, unloading, discharge, and throwing of unqualified chips through a feeding unit, die bonding unit, loading unit, unloading unit, discharge unit, and throwing unit. Furthermore, the multi-claw alternating loading and unloading settings of the loading and unloading units can improve the efficiency of chip inspection.

[0019] The chip sorting and testing method provided in the second aspect of this application completes all chip testing in one step through testing steps, distinguishing between qualified and unqualified chips, and classifying qualified chips into grades. This allows the chip testing equipment to be concentrated in the same area, realizing the integration of testing equipment, avoiding multiple transfers of chips during chip testing, reducing the risk of chip damage, and improving chip testing efficiency through the alternating loading and unloading of multiple grippers in the material picking and unloading steps. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural schematic diagram of the chip sorting and inspection machine of this application; Figure 2 This is a top view of the chip sorting and inspection machine of this application after the top cover has been removed; Figure 3 This is a perspective view of the chip sorting and inspection machine of this application after the top cover has been removed; Figure 4 This is a perspective view of the feeding basket and feeding lift in the chip sorting and testing machine of this application; Figure 5 This is a perspective view of the feeding and capping machine in the chip sorting and inspection machine of this application; Figure 6 This is a perspective view of the die bonding unit and sorting table in the chip sorting and inspection machine of this application; Figure 7 This is a top view of the feeding unit, unloading unit, and transfer unit in the chip sorting and inspection machine of this application. The arrows in the figure indicate the directions in which the feeding unit, unloading unit, and transfer unit move the chips. Figure 8 for Figure 3 Enlarged view of region A in the middle; Figure 9 for Figure 3 Enlarged view of region B in the middle; Figure 10 This is a perspective view of the discharge cap opening machine in the chip sorting and inspection machine of this application; Figure 11 This is a perspective view of the unloading basket and unloading lift in the chip sorting and testing machine of this application.

[0021] Label Explanation: 100. Feeding unit; 101. Feeding basket; 1011. Feeding cover; 102. Feeding lifter; 103. Feeding cover opener; 104. Feeding wafer conveyor; 200. Die bonding unit; 201. Rotating mechanism; 202. Film support mechanism; 203. Die bonding moving seat; 204. Die bonding recognition camera; 205. Chip ejector; 300. Feeding unit; 301. Feeding claw; 302. First feeding track; 303. First feeding support; 304. Second feeding track; 305. Second feeding support; 306. Positioning camera; 400. Unloading unit; 401. Unloading... 402. Feeding claw; 403. First feeding track; 404. First feeding support; 405. Second feeding track; 406. Sorting table; 500. Discharge unit; 501. Feeding basket; 5011. Feeding cover; 502. Feeding lifter; 503. Discharge cover opener; 504. Feeding wafer conveyor; 600. Throwing unit; 700. Electrical detection unit; 701. Qualification detection unit; 702. Grading detection unit; 703. Rotating frame; 7031. Placement bin; 800. Appearance inspection unit; 801. Storage table; 900. Transfer unit. Detailed Implementation

[0022] To further understand the content of this invention, a detailed description of the invention will be provided in conjunction with the accompanying drawings and embodiments.

[0023] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal," etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. These terms are primarily for better description of this application and its embodiments and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to be constructed and operated in a specific orientation. Furthermore, some of the above terms may be used to indicate other meanings besides orientation or positional relationships; for example, the term "upper" may in some cases indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application according to the specific circumstances.

[0024] To further understand the content of this invention, a detailed description of the invention will be provided in conjunction with the accompanying drawings and embodiments.

[0025] like Figures 1-11 As shown, the first aspect of this application provides a chip sorting and inspection machine, including a feeding unit 100, a die-bonding unit 200, a loading unit 300, an inspection component, a unloading unit 400, an unloading unit 500, and a discarding unit 600. The feeding unit 100 stores wafers and transports them to the die-bonding unit 200; the die-bonding unit 200 places the wafers and adjusts their angle; the loading unit 300 includes multiple loading claws 301 that alternately grip the chips on the wafers in the die-bonding unit 200 and transport them to the inspection component; the inspection component inspects the chips and sorts them into qualified and unqualified chips, further classifying the qualified chips; the unloading unit 400 includes multiple unloading claws 401 that alternately grip the qualified chips and transport them to the unloading unit 500; the unloading unit 500 stores the qualified chips; and the discarding unit 600 stores the unqualified chips.

[0026] Based on the above configuration, the chip sorting and inspection machine of this application completes all chip inspections in one go through the inspection components, distinguishing between qualified and unqualified chips, and classifying qualified chips into grades. This allows the chip inspection equipment to be concentrated in the same area, realizing the integration of inspection equipment, avoiding multiple transfers of chips during the chip inspection process, reducing the risk of chip damage. The feeding unit 100, die bonding unit 200, loading unit 300, unloading unit 400, unloading unit 500, and throwing unit 600 perform automated loading and unloading, as well as the collection and throwing of unqualified chips. Furthermore, the multi-claw alternating loading and unloading configuration of the loading unit 300 and unloading unit 400 can make the chip inspection efficiency higher.

[0027] Specifically, such as Figure 4 and Figure 5 As shown, the feeding unit 100 includes: a loading basket 101, a loading lift 102, a loading cover opener 103, and a loading wafer conveyor 104. The loading basket 101 is used to store wafers and has a loading cover 1011; this loading basket 101 is prior art. The loading lift 102 is connected to the loading basket 101 and is used to move the loading basket 101 up and down, and to move the loading basket 101 closer to or away from the die bonding unit 200. The loading lift 102 is specifically configured to include a telescopic cylinder, a support plate, a track on the support plate, and a drive structure. The loading basket 101 is mounted on the track on the support plate and is driven by the drive structure to move along the track closer to or away from the die bonding unit 200. The support plate is connected to the telescopic cylinder, which drives the support plate and the loading basket 101 up and down. The feeding and opening machine 103 can be equipped with suction cups or grippers to connect with the feeding cover 1011. It also features tracks extending towards or away from the die-bonding unit 200 and corresponding drivers, enabling the feeding cover 1011 to separate from the feeding basket 101. Furthermore, it has vertical tracks and drivers to move the feeding cover 1011 away from the wafer transport path. The feeding wafer conveyor 104, when the feeding lift 102 moves the feeding basket 101 close to the die-bonding unit 200, grabs the wafer from the basket and moves it onto the die-bonding unit 200. Supporting guides can be provided along the path of the wafer to the die-bonding unit 200 to support and guide it, facilitating accurate movement of the wafer onto the die-bonding unit 200.

[0028] like Figure 6As shown, the die bonding unit 200 includes: a rotation mechanism 201, a film support mechanism 202, a die bonding moving seat 203, and a die bonding recognition camera 204. The rotation mechanism 201 is existing technology; it is used to place the wafer and drive the wafer to rotate around a vertical axis. The rotation mechanism 201 can drive the wafer to rotate so that the chips on the wafer can be rotated to a state where they can match the relevant placement devices on subsequent workstations after only translation, facilitating subsequent chip transport and ensuring that the chips do not collide with the placement devices and cause damage during transport.

[0029] The film-supporting mechanism 202 is existing technology. It is mounted on the rotating mechanism 201 and supports the film attached to the bottom of the wafer to facilitate the separation of the chip from the film, so as to facilitate the removal of the chip from the wafer. The rotating mechanism 201 is mounted on the die-bonding moving seat 203. The die-bonding moving seat 203 drives the rotating mechanism 201 to move horizontally in a direction close to or away from the feeding unit 100 and in a direction perpendicular to that direction. The die-bonding moving seat 203 also drives the rotating mechanism 201 to move up and down. The die-bonding moving seat 203 can drive the rotating mechanism 201 to move, thereby moving the chip to be removed from the wafer to the removal station, so that the loading unit 300 can pick up the chip for loading. The die-bonding moving seat 203 can be specifically configured to include two tracks extending in the left and right directions, a receiving seat, and two... The device includes two tracks extending in the front-to-back direction and corresponding drive devices. Two tracks extending in the left-to-right direction are mounted on a receiving seat. The receiving seat is mounted on the two tracks extending in the front-to-back direction. The rotating mechanism 201 is mounted on the two tracks extending in the left-to-right direction and can be driven by the corresponding drive devices to move in the left-to-right direction. The receiving seat can be driven by the corresponding drive devices to move in the front-to-back direction. The drive devices are preferably a combination of motor and screw to achieve precise adjustment of the position of the rotating mechanism 201. The receiving seat needs to be provided with holes so that the subsequent chip ejector 205 can contact the chip on the wafer.

[0030] The die bonding recognition camera 204 is used to take pictures of the wafer on the rotating mechanism 201 and detect the angle and orientation of the wafer and the position of each chip on the wafer. When the angle and orientation of the wafer are in a preset state, the rotating mechanism 201 stops rotating and can identify whether the chip has been moved to the station to be taken out. The specific picture recognition technology adopts existing technology.

[0031] like Figure 6As shown, the die bonding unit 200 also includes a chip ejector 205. The chip ejector 205 moves up and down and passes through the clearance holes corresponding to the die bonding moving seat 203, the film supporting mechanism 202 and the rotating mechanism 201 to abut against the chip on the wafer and separate the chip from the film so that the loading unit 300 can pick up the chip. The chip ejector 205 can be specifically configured to include a telescopic cylinder and an ejector head. The telescopic cylinder can drive the ejector head to move up and down to eject the chip. Multiple ejector pins can be set on the ejector head. The number of ejector pins and the distribution area can be set according to the chip specifications. The larger the chip, the more ejector pins and the larger the distribution area. The smaller the chip, the fewer ejector pins and the smaller the distribution area.

[0032] like Figure 7 As shown, the feeding unit 300 includes: a first feeding track 302, a first feeding support 303, a second feeding track 304, and a second feeding support 305. The first feeding track 302 extends in a front-to-back direction and is equipped with a feeding claw 301 and a driving device for driving the feeding claw 301. The feeding claw 301 moves along the first feeding track 302 to transport the chip on the rotating mechanism 201 to the detection component. The first feeding track 302 is mounted on the first feeding support 303, which is equipped with a track extending in a left-to-right direction and a driving device. This allows the first feeding track 302 to move closer to or away from the rotating mechanism 201 via the first feeding support 303. Both the driving device for the first feeding support 303 and the driving device for the feeding claw 301 preferably employ a motor and screw drive combination to achieve precise positioning of the feeding claw on the horizontal plane.

[0033] The second feeding track 304 extends in the front-to-back direction and is provided with a feeding claw 301 and a driving device for driving the feeding claw 301. The feeding claw 301 moves along the second feeding track 304 to transport the chip on the rotating mechanism 201 to the detection component. The second feeding track 304 is provided on the second feeding support 305. The second feeding support 305 is provided with a track extending in the left-to-right direction and a driving device, so that the second feeding track 304 can be moved closer to or away from the rotating mechanism 201 via the second feeding support 305. The driving device for driving the second feeding support 305 and the driving device for driving the feeding claw 301 are preferably both motor and screw drive combinations to achieve precise positioning of the feeding claw on the horizontal plane.

[0034] The first feeding track 302 and the second feeding track 304 are arranged opposite to each other, forming a moving space for the feeding claw 301 to move. The rotating mechanism 201 is located below the moving space. The feeding claw is equipped with a suction cup, which is connected to a negative pressure device to pick up the chip, thereby reducing damage to the chip surface. The feeding claw also needs to be connected to a cylinder that can extend and retract in the vertical direction to drive the chip to move in the vertical direction, thereby ensuring that the chip is in a high position during the process of moving to the detection component and is not prone to collision with the detection component. After the chip is delivered to the position, the chip is lowered to a low position so that the chip can be placed on the detection component. The suction cup, negative pressure device and cylinder mentioned above are all existing technologies.

[0035] like Figure 2 and Figure 3 As shown, the testing components include an electrical testing unit 700 and an appearance testing unit 800. The electrical testing unit 700 includes a pass / fail testing unit 701 and a grade testing unit 702. The electrical testing unit 700 can detect whether the chip is qualified and its performance, thereby grading the chip. Finally, the appearance testing unit 800 inspects the chip's appearance. This allows the chip sorting and testing machine of this application to complete all chip testing in one go, thus avoiding the risk of chip damage caused by multiple transfers when different testing equipment is placed in different locations.

[0036] Both the qualified inspection unit 701 and the grading inspection unit 702 include a rotatable rotating frame 703 and multiple inspection stations arranged around the rotating frame 703. The rotating frame has multiple placement chambers 7031 for placing chips. When the rotating frame rotates and drives the placement chambers 7031 to the corresponding inspection station, the inspection station inspects the chips in the placement chambers 7031. The inspection station corresponding to the qualified inspection unit 701 is used to detect whether the chips are qualified, and the inspection station corresponding to the grading inspection unit 702 is used to detect the grade of the chips. The qualified inspection unit 701 and the grading inspection unit 702 use a rotating frame with placement chambers 7031 and multiple inspection stations to allow for a compact arrangement of the inspection stations, thereby reducing the footprint of the chip sorting and inspection machine of this application. The relevant inspection components at each inspection station are all purchased commercially and can be replaced and adjusted according to the inspection requirements of different chip models and specifications.

[0037] like Figure 2As shown, the chip discarding unit 600 is located between the pass / fail inspection unit 701 and the grade inspection unit 702. A transfer unit 900 is also provided between the pass / fail inspection unit 701 and the grade inspection unit 702 to transfer the inspected chips from the pass / fail inspection unit 701 to the grade inspection unit 702. Directly discarding defective chips detected by the pass / fail inspection unit 701 reduces the number of chips that the subsequent grade inspection unit 702 and appearance inspection unit 800 need to inspect, making the entire chip inspection process more efficient. Specifically, the throwing unit 600 can be a waffle-shaped storage box, and the transfer unit 900 includes a transfer track and a transfer support. The transfer track extends in the left-right direction and is equipped with transfer claws and a drive device for driving the transfer claws. The transfer claws move along the transfer track to transport the chips on the qualified detection unit 701 to the grading detection unit 702. The transfer track is located on the transfer support, which is equipped with a track extending in the front-back direction and a drive device. The transfer track is moved back and forth by the transfer support, realizing the transfer of chips between the placement chamber 7031 and the throwing unit 600, and driving the drive device of the transfer support. The drive device for driving the transfer claw is preferably a combination of motor and screw to achieve precise positioning of the transfer claw on the horizontal plane. In addition, the transfer claw is equipped with a suction cup, which is connected to a negative pressure device to pick up the chip, thereby reducing damage to the chip surface. The transfer claw also needs to be connected to a cylinder that can extend and retract in the vertical direction to move the chip in the vertical direction, thereby ensuring that the chip is in a high position during the movement to the detection component and is not prone to collision with the placement chamber 7031 and the throwing unit 600. The suction cup, negative pressure device and cylinder mentioned above are all existing technologies.

[0038] like Figure 1 and Figure 3 As shown, the appearance inspection unit 800 includes a stage 801 for placing chips and appearance inspection cameras. Multiple appearance inspection cameras are configured to perform multi-angle visual inspection of the chips on the stage 801, such as inspecting the six sides of the chip in six directions (up, down, left, right, front, and back). This is existing technology and will not be described in detail here.

[0039] like Figure 6 and Figure 7 As shown, the unloading unit 400 includes a sorting table 406, a first unloading track 402, a first unloading support 403, a second unloading track 404, and a second unloading support 405. The structure of the sorting table 406 is the same as that of the die bonding unit 200. The sorting table 406 is provided with a support suitable for placing chips. The support is a diaphragm. The diaphragm is clamped and fixed by the film support mechanism 202. The tested chips are placed on the diaphragm, and the diaphragm can be divided into sections to place chips of different grades.

[0040] The first feeding track 402 extends in the front-to-back direction and is provided with a feeding claw 401 and a driving device for driving the feeding claw 401. The feeding claw 401 moves along the first feeding track 402 to transport the chip on the rotating mechanism 201 to the detection component. The first feeding track 402 is provided on the first feeding support 403. The first feeding support 403 is provided with a track extending in the left-to-right direction and a driving device, so that the first feeding track 402 can be moved closer to or away from the rotating mechanism 201 via the first feeding support 403. The driving device for driving the first feeding support 403 and the driving device for driving the feeding claw 401 are preferably both motor and screw drive combinations to achieve precise positioning of the feeding claw on the horizontal plane.

[0041] The second feeding track 404 extends in the front-to-back direction and is provided with a feeding claw 401 and a driving device for driving the feeding claw 401. The feeding claw 401 moves along the second feeding track 404 to transport the chip on the rotating mechanism 201 to the detection component. The second feeding track 404 is provided on the second feeding support 405. The second feeding support 405 is provided with a track extending in the left-to-right direction and a driving device, so that the second feeding track 404 can be driven to move closer to or away from the rotating mechanism 201 via the second feeding support 405. The driving device for driving the second feeding support 405 and the driving device for driving the feeding claw 401 are preferably both motor and screw drive combinations to achieve precise positioning of the feeding claw on the horizontal plane.

[0042] The first feeding track 402 and the second feeding track 404 are arranged opposite to each other, forming a moving space for the feeding claw 401 to move. The appearance inspection unit 800 and the sorting table 406 are located below the moving space. The feeding claw is equipped with a suction cup, which is connected to a negative pressure device to pick up the chip, thereby reducing damage to the chip surface. The feeding claw also needs to be connected to a cylinder that can extend and retract in the vertical direction to move the chip in the vertical direction, thereby ensuring that the chip is in a high position and does not collide with the table 801 and the sorting table 406 during the movement. The suction cup, negative pressure device and cylinder are all existing technologies.

[0043] like Figure 10 and Figure 11As shown, the unloading unit 500 includes a unloading basket 501, an unloading lift 502, an unloading cover opener 503, and an unloading wafer conveyor 504. The unloading basket 501 is used to store wafers, i.e., a support for placing inspected chips, and has an unloading cover 5011; this unloading basket 501 is existing technology. The unloading lift 502 is connected to the unloading basket 501 and is used to move the unloading basket 501 up and down, and to move the unloading basket 501 closer to or away from the sorting table 406. The unloading lift 502 is specifically configured to include a telescopic cylinder, a support plate, a track on the support plate, and a drive structure. The unloading basket 501 is located on the track on the support plate and is driven by the drive structure to move along the track closer to or away from the sorting table 406. The support plate is connected to the telescopic cylinder, which drives the support plate and the unloading basket 501 up and down. The unloading cover opener 503 can be equipped with suction cups or grippers to connect with the unloading cover 5011. It also features tracks extending towards or away from the sorting table 406 and corresponding drivers, enabling the unloading cover 5011 to separate from the unloading basket 501. Furthermore, it has vertical tracks and drivers to move the unloading cover 5011 away from the wafer transport path. The unloading wafer conveyor 504, when the unloading lifter 502 moves the unloading basket 501 close to the sorting table 406, grabs the support on the sorting table 406 and places it into the unloading basket 501. Supporting guide rails can be installed along the path of the wafer to the unloading basket 501 to support and guide the wafer, facilitating accurate movement of the wafer into the unloading basket 501.

[0044] Based on the above-described structure of the chip sorting and inspection machine, its specific workflow is as follows: Loading steps: After the loading lift 102 moves the loading basket 101 up and down to the open position, the feeding opener 103 opens the loading cover 1011 on the loading basket 101 and moves the loading cover 1011 up so that the loading cover 1011 leaves the wafer transport path. Then the loading lift 102 moves the loading basket 101 up and down to adjust so that the unloading wafer conveyor 504 can grab the wafer in the loading basket 101. Then the unloading wafer conveyor 504 moves the wafer to the rotating mechanism 201 of the die bonding unit 200.

[0045] Inspection steps: After the wafer is moved onto the rotating mechanism 201, the film support mechanism 202 first clamps the film at the bottom of the wafer and then uses the film support mechanism 202 to open the film at the bottom of the wafer. Then, the die bonding moving seat 203 moves the rotating mechanism 201 to below the die bonding recognition camera 204 so that the die bonding recognition camera 204 can take pictures and recognize the wafer on the rotating mechanism 201 and feed back the picture recognition results to the rotating mechanism 201 in real time so that the rotating mechanism 201 can rotate and adjust so that the chips that have been divided on the wafer are arranged horizontally and vertically, so as to correspond to the placement compartment 7031 used to place chips in the subsequent inspection components. Then, the die-bonding moving seat 203 drives the rotating mechanism 201 to move back and forth and left and right for fine-tuning of its position. At the same time, the die-bonding identification camera 204 takes pictures of the wafer on the rotating mechanism 201 to identify it, so that the chip to be picked up is in the pick-up position, that is, the chip to be picked up is directly above the chip ejector 205, so that the chip ejector 205 can eject the chip. Then, the two loading claws 301 alternately pick up the ejected chip and transport the chip to the placement chamber 7031 of the qualified inspection unit 701. It can be understood that the die-bonding identification camera 204 can also number the chips on the wafer according to their specifications and record the order in which each numbered chip is sent into the inspection component, so as to facilitate subsequent monitoring of whether each numbered chip is qualified and its grade. It should be noted that before the chip is placed into the placement chamber 7031 of the qualified detection unit 701, the loading claw 301 will carry the chip past and pause at a positioning camera 306 that takes pictures from bottom to top. The positioning camera 306 will take pictures of the bottom of the chip to identify whether the chip's position needs to be adjusted in front, back, left, or right. The chip's front, back, left, and right positions will be adjusted by cooperating with the corresponding material track and loading support to ensure that the chip does not collide with the placement chamber 7031.

[0046] Inspection steps: The rotating brackets on the qualified inspection unit 701 and the graded inspection unit 702 drive the placement chamber 7031 to rotate, thereby moving the chip to different inspection stations for corresponding inspections. First, the qualified inspection unit 701 checks whether the chip is qualified, and then the graded inspection unit 702 checks the specific grade of the chip. The qualified inspection unit 701 and the graded inspection unit 702 are connected by a transfer unit 900 to transport the chip. If the chip taken out from the qualified inspection unit 701 is qualified, the transfer unit 900 will transport the chip to the graded inspection unit 702. If the chip taken out from the qualified inspection unit 701 is unqualified, the transfer unit 900 will transport the chip to the discarding unit 600. After the chip has completed the graded inspection, the unloading claw 401 on the unloading unit 400 will pick up the chip and place it on the stage 801 of the appearance inspection unit 800 for visual inspection, thus completing the entire inspection process.

[0047] The unloading process involves two unloading claws 401 alternately picking up the ejected chips and conveying them to a diaphragm held on a sorting table 406. The diaphragm is divided into multiple areas based on the different grades of the chips to accommodate different grades. The chip numbers in each area are recorded according to the chip numbers previously identified by the die-bonding identification camera 204. Once the diaphragm is full, the unloading lifter 502 moves the unloading basket 501 up and down to the open position. The unloading capping machine 503 opens the unloading cover 5011 on the unloading basket 501 and moves it upwards, removing it from the wafer transport path. The unloading lifter 502 then moves the unloading basket 501 up and down to adjust its position, allowing the unloading wafer conveyor 504 to pick up the wafers from the sorting table 406. The unloading wafer conveyor 504 then moves the wafers into the unloading basket 501.

[0048] The second aspect of this application provides a chip sorting and detection method, implemented using the aforementioned chip sorting and detection machine, comprising the following steps: Loading step: The wafer is transported to the die bonding unit 200; Material handling and inspection steps: The die bonding unit 200 is moved to the material handling station to separate the chip from the wafer, and the chip is alternately transported to the inspection component by multiple loading claws 301 on the loading unit 300 for inspection. Testing steps: Perform conformity testing on the chips to obtain qualified and unqualified chips; collect and store unqualified chips using the discarding unit 600; perform grade testing on qualified chips to obtain chips of different grades; and perform appearance testing on chips of each grade. Unloading step: The qualified chips that have completed the inspection are alternately conveyed to the unloading unit 500 for storage using multiple unloading claws 401 on the unloading unit 400.

[0049] The chip sorting and testing method provided in the second aspect of this application completes all chip testing in one step through testing steps, distinguishing between qualified and unqualified chips, and classifying qualified chips into grades. This allows the chip testing equipment to be concentrated in the same area, realizing the integration of testing equipment, avoiding multiple transfers of chips during chip testing, reducing the risk of chip damage, and improving chip testing efficiency through the alternating loading and unloading of multiple grippers in the material picking and unloading steps.

[0050] The chip sorting and testing method of this application completes all chip testing in one step, separating qualified chips from unqualified chips, and classifying qualified chips into grades. This allows the chip testing equipment to be concentrated in one location, realizing the integration of testing equipment, avoiding multiple transfers of chips during the chip testing process, reducing the risk of chip damage, and improving the efficiency of chip testing by setting up multiple grippers for alternating loading and unloading in the material picking and unloading steps.

[0051] The present invention and its embodiments have been described above illustratively. This description is not restrictive, and the figures shown are only one embodiment of the present invention; the actual structure is not limited thereto. Therefore, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A chip sorting and inspection machine, characterized in that, It includes a feeding unit (100), a die bonding unit (200), a loading unit (300), a detection component, a unloading unit (400), a discharge unit (500), and a throwing unit (600). The feeding unit (100) is used to store the wafer and transport the wafer to the die bonding unit (200). The die bonding unit (200) is used to place the wafer and adjust the angle of the wafer; The loading unit (300) includes multiple loading claws (301), which alternately grab the chip in the wafer on the die bonding unit (200) and transport the chip to the detection component; The detection component is used to detect the chip, and to classify the detected chip into qualified chips and unqualified chips, and to grade the qualified chips. The unloading unit (400) includes multiple unloading claws (401), which alternately grab the qualified chip and transport it to the unloading unit (500). The discharge unit (500) is used to store the qualified chips; The rejecting unit (600) is used to store the defective chips.

2. The chip sorting and inspection machine according to claim 1, characterized in that, The feeding unit (100) includes: A loading basket (101) is used to store the wafer and has a loading cover (1011). The loading lift (102) is connected to the loading basket (101) and is used to move the loading basket (101) up and down, and to move the loading basket (101) closer to or away from the die bonding unit (200). The feeding cover opener (103) is connected to the feeding cover body (1011) and drives the feeding cover body (1011) to separate from the feeding basket (101) and move away from the transport path of the wafer; When the loading lift (102) moves the loading basket (101) close to the die bonding unit (200), the loading wafer conveyor (104) grabs the wafer in the loading basket (101) and moves the wafer onto the die bonding unit (200).

3. The chip sorting and inspection machine according to claim 1, characterized in that, The die-bonding unit (200) includes: A rotating mechanism (201) is used to place the wafer and drive the wafer to rotate about the vertical axis. A film-supporting mechanism (202) is provided on the rotating mechanism (201) and supports the film attached to the bottom of the wafer. The die-bonding moving base (203) has a rotating mechanism (201) mounted on it. The rotating mechanism (201) is driven by the die-bonding moving base (203) to move on the horizontal plane in a direction close to or away from the feeding unit (100) and in a direction perpendicular to that direction. The rotating mechanism (201) is also driven by the die-bonding moving base (203) to move up and down. A die-bonding identification camera (204) is used to take pictures of the wafer on the rotating mechanism (201) and detect the angle and orientation of the wafer and the position of each chip on the wafer, so that the rotating mechanism (201) stops rotating when the angle and orientation of the wafer is in a preset state.

4. A chip sorting and inspection machine according to claim 3, characterized in that, The die bonding unit (200) also includes a chip ejector (205), which moves up and down and passes through the clearance holes corresponding to the die bonding moving seat (203), the film support mechanism (202) and the rotating mechanism (201) to abut against the chip on the wafer and separate the chip from the film.

5. A chip sorting and inspection machine according to claim 3, characterized in that, The feeding unit (300) includes: The first feeding track (302) is provided with the feeding claw (301), and the feeding claw (301) moves along the first feeding track (302) to transport the chip on the rotating mechanism (201) to the detection component; The first feeding support (303) and the first feeding track (302) are provided on the first feeding support (303) so that the first feeding track (302) can be driven to move closer to or away from the rotating mechanism (201) via the first feeding support (303). The second feeding track (304) is provided with the feeding claw (301), and the feeding claw (301) moves along the second feeding track (304) to transport the chip on the rotating mechanism (201) to the detection component; The second feeding support (305) and the second feeding track (304) are provided on the second feeding support (305) so that the second feeding track (304) can be driven to move closer to or away from the rotating mechanism (201) via the second feeding support (305). The first feeding track (302) and the second feeding track (304) are arranged opposite to each other, and the two feeding claws (301) move in the moving space, and the rotating mechanism (201) is located below the moving space.

6. A chip sorting and inspection machine according to claim 3, characterized in that, The detection component includes: An electrical testing unit (700) includes a qualified testing unit (701), a graded testing unit (702), and an appearance testing unit (800). The qualified testing unit (701) and the graded testing unit (702) each include a rotatable rotating frame (703) and multiple testing stations arranged around the rotating frame (703). The rotating frame (703) is provided with multiple placement compartments (7031) for placing chips. When the rotating frame (703) rotates and drives the placement compartment (7031) to the corresponding testing station, the testing station tests the chip in the placement compartment (7031). The detection station corresponding to the qualified detection unit (701) is used to detect whether the chip is qualified, and the detection station corresponding to the graded detection unit (702) is used to detect the grade of the chip.

7. A chip sorting and inspection machine according to claim 6, characterized in that, The ejection unit (600) is located between the qualified detection unit (701) and the graded detection unit (702), and a transfer unit (900) is also provided between the qualified detection unit (701) and the graded detection unit (702) to transfer the chip that has been detected on the qualified detection unit (701) to the graded detection unit (702) via the transfer unit (900).

8. A chip sorting and inspection machine according to claim 6, characterized in that, The appearance inspection unit (800) includes a stage (801) for placing the chip and appearance inspection cameras. Multiple appearance inspection cameras are configured to perform multi-angle visual inspection of the chip on the stage (801).

9. A chip sorting and inspection machine according to claim 6, characterized in that, The feeding unit (400) includes: Sorting table (406), the sorting table (406) is provided with a support suitable for placing the chip; The first unloading track (402) is provided with the unloading claw (401). The unloading claw (401) moves along the first unloading track (402) to transport the chip on the appearance inspection unit (800) to the sorting table (406). The first feeding support (403) and the first feeding track (402) are provided on the first feeding support (403) so that the first feeding track (402) can be driven by the first feeding support (403) to move closer to or away from the appearance inspection unit (800). The second unloading track (404) is provided with the unloading claw (401). The unloading claw (401) moves along the second unloading track (404) to transport the chip on the appearance inspection unit (800) to the sorting table (406). The second feeding support (405) and the second feeding track (404) are provided on the second feeding support (405) so that the second feeding track (404) can be driven to move closer to or away from the appearance inspection unit (800) via the second feeding support (405). The first feeding track (402) and the second feeding track (404) are arranged opposite to each other, forming a moving space between them for the feeding claw (401) to move, and the appearance inspection unit (800) and the sorting table (406) are located below the moving space.

10. A chip sorting and inspection machine according to claim 9, characterized in that, The discharge unit (500) includes: A feeding basket (501) is used to store the wafer and has a feeding cover (5011). The unloading lift (502) is connected to the unloading basket (501) to drive the unloading basket (501) to move up and down, and to move the unloading basket (501) closer to or away from the sorting table (406). The discharge cover opener (503) is connected to the discharge cover body (5011) and drives the discharge cover body (5011) to separate from the discharge basket (501) and move away from the transport path of the wafer; When the unloading lift (502) moves the unloading basket (501) close to the sorting table (406), the unloading wafer conveyor (504) grabs the support on the sorting table (406) and moves the support into the unloading basket (501).

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