A magnetic core reflow soldering protection assembly

Abstract

The utility model discloses a kind of magnetic core reflow soldering protection assemblies, to solve the problem of magnetic core surface easy cracking, appear bad quality in magnetic core reflow soldering process. The protection assembly mainly includes protective cover, heat insulation buffer layer and fixing frame. By the cooperation of protective cover plate and heat insulation buffer layer, the temperature that can be significantly reduced that magnetic core bears in reflow soldering process, avoid the performance change caused by high temperature of magnetic core;When high-temperature reflow, heat insulation buffer layer is used to prevent temperature rising rate too high, when cooling, the characteristics of heat insulation buffer layer are used to prevent temperature falling rate too fast, effectively reduce the risk of magnetic core surface cracking. The utility model is simple in structure, convenient to operate, can be reused, can significantly improve the yield of magnetic core in reflow soldering process, reduce production cost, suitable for various types of magnetic core reflow soldering protection.

Description

Technical Field

[0001] This utility model relates to the field of auxiliary equipment for electronic component processing, and in particular to a magnetic core reflow soldering protection component. Background Technology

[0002] In the manufacturing process of electronic components, transformer cores often need to be mounted using reflow soldering to establish electrical conductivity with the circuit board. However, during reflow soldering, temperature variations can have several adverse effects on the cores. First, excessively high temperatures can alter the properties of the magnetic materials, affecting key magnetic performance indicators such as permeability and saturation magnetic flux density, thus reducing the overall performance of the electronic component.

[0003] Lowering the reflow soldering temperature to eliminate the effect of high temperatures on the transformer core would lead to insufficient soldering temperature between the transformer and the circuit board (especially aluminum-based circuit boards) or other components, resulting in poor soldering. Existing reflow soldering machines with multi-zone control also suffer from low temperature control accuracy, failing to meet the requirements of the aforementioned transformer core reflow soldering process.

[0004] In addition, uneven heating of the transformer core can easily cause cracks on the core surface, which not only affects the appearance of the core, but also has an adverse effect on the subsequent welding quality and the cooperation with other components. Therefore, while adopting heat insulation solutions to reduce the heating of the core, it is also necessary to consider whether the core is heated evenly.

[0005] Currently, protective measures for magnetic core reflow soldering are relatively limited. There is a lack of a device that can protect the magnetic core from high temperatures during reflow soldering without affecting the reliability of transformer core mounting. Therefore, there is an urgent need to design a new type of magnetic core reflow soldering protection component to solve the above problems. Utility Model Content

[0006] The purpose of this invention is to provide a magnetic core reflow soldering protection component to solve the problems in the prior art where magnetic cores are easily affected by high temperatures during reflow soldering, leading to performance degradation, and surface cracking caused by rapid temperature changes. The specific details are as follows:

[0007] A magnetic core reflow soldering protection assembly, used in the reflow soldering process of magnetic components, characterized in that it comprises: The protective cover is a plate-shaped structure used to block the high-temperature airflow directly above the magnetic components during reflow soldering. Its shape matches the shape and size of the projection area of ​​the magnetic components on the mounting surface, and it can completely cover the projection area of ​​the magnetic core in the magnetic components on the mounting surface. A heat-insulating buffer layer is located directly below the protective cover, with at least a portion of it in contact with the magnetic components. The mounting bracket is fixedly connected to the protective cover and is used to secure the protective cover and the heat insulation buffer layer.

[0008] Preferably, the number of magnetic elements is one, and the protective cover is rectangular; or, the number of magnetic elements is multiple, and the protective cover is a combination of multiple adjacent rectangles.

[0009] Preferably, the mounting brackets are arranged on opposite sides of the protective cover, together forming a cross-shaped assembly. Preferably, the protective cover has overflow holes in the corresponding areas at the magnetic component pins.

[0010] Preferably, the material of the heat insulation buffer layer is selected from silicone, rubber, or other low thermal conductivity materials with damping properties.

[0011] Preferably, one end of the fixing frame is fixedly connected to the protective cover, and the end of the fixing frame away from the protective cover is provided with a detachable installation structure.

[0012] Preferably, the detachable installation structure is any one of a snap-fit ​​structure, a threaded connection structure, a hinge structure, or a magnetic connection structure.

[0013] Preferably, a magnet is provided at the end of the mounting bracket away from the protective cover.

[0014] Preferably, there are multiple fixing brackets.

[0015] Preferably, the protective cover is made of a non-magnetic material, which is selected from aluminum alloy, stainless steel, or composite materials.

[0016] The present invention has the following beneficial effects: 1. Effective protection of magnetic core performance: Through the combination of protective cover and heat insulation buffer layer, the temperature of the magnetic core during reflow soldering can be significantly reduced, effectively avoiding changes in the performance of magnetic materials caused by high temperature, and improving the performance stability of magnetic components.

[0017] 2. Preventing surface cracking: During high-temperature reflow, the slow thermal conductivity of the insulation buffer layer is used to reduce the heating rate of the magnetic core surface in the high-temperature environment. During cooling, the slow heat dissipation of the insulation buffer layer is used to reduce the cooling rate of the magnetic core surface in the low-temperature environment, thereby reducing the risk of magnetic core surface cracking, ensuring the appearance quality and electrical performance of the magnetic core, and helping to improve the product yield.

[0018] 3. High versatility: The mounting bracket is small in size and the installation and fixing methods are flexible. No special installation space needs to be reserved. The protective components can be used for different types and specifications of magnetic components. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure before reflow soldering in Embodiment 1 of this utility model; Figure 2 This is a schematic diagram of the structure of the magnetic core reflow soldering protection assembly protecting a single magnetic element according to Embodiment 1 of this utility model; Figure 3 This is a schematic diagram of the structure before reflow soldering in Embodiment 2 of this utility model; Figure 4 This is a schematic diagram of the structure of the magnetic core reflow soldering protection assembly protecting multiple magnetic components according to Embodiment 2 of this utility model; Figure 5 This is a schematic diagram of the magnetic core protection scheme involved in this utility model when applied in a reflow soldering tray.

[0020] The meanings of the reference numerals in the above figures are as follows: 10. PCB circuit board; 20. Magnetic components; 30. Magnetic core reflow soldering protection assembly; 301. Protective cover; 302. Fixing bracket; 303. Thermal insulation buffer layer; 304. Flow hole; 40. Reflow soldering tray. Detailed Implementation

[0021] To make the technical solution of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention. Those skilled in the art can make other modifications, substitutions, or alterations to the present invention without creative effort, and these modifications, substitutions, or alterations still fall within the protection scope of the present invention.

[0022] Example 1 The technical solution disclosed in this embodiment is aimed at the application scenario of reflow soldering a single magnetic component 20 on a PCB circuit board 10. In the reflow soldering process, the heat exchange process mainly includes preheating, reflow soldering, and cooling. The reflow soldering mainly involves spraying high-temperature gas from the air outlets perpendicular to the circuit board to melt the solder paste pre-applied at the pins of the surface mount components, thereby completing the mounting of each component. In this application, the magnetic component 20 includes, but is not limited to, a planar transformer, a planar PFC inductor, or a planar resonant inductor. Figure 1 The diagram illustrates the state of each material before a single magnetic component 20 is to be mounted onto a PCB circuit board 10 via reflow soldering.

[0023] like Figure 2The diagram illustrates the structure of the magnetic core reflow soldering protection assembly 30 in this embodiment. The magnetic core reflow soldering protection assembly 30 includes a protective cover 301, a fixing frame 302, and a heat insulation buffer layer 303. The protective cover 301 is a plate-shaped structure, positioned directly above the magnetic element 20. Its shape matches the shape and size of the projection area of ​​the magnetic element 20 on the mounting surface, completely covering the projection area of ​​the magnetic core in the magnetic element 20 on the mounting surface. The heat insulation buffer layer 303 is disposed between the protective cover 301 and the magnetic element 20. Preferably, it can have the same shape as the protective cover 301. The protective cover is made of a non-magnetic material, specifically aluminum alloy, stainless steel, or composite materials. The heat insulation buffer layer can be made of silicone, rubber, or other materials with damping properties. Low thermal conductivity material. The mounting bracket 302 is fixedly connected to the protective cover 301 and is used to fix the protective cover 301 and the heat insulation buffer layer 303. Specifically, one end of the mounting bracket 302 is fixedly connected to the protective cover 301, and the other end is detachably mounted on the PCB circuit board 10, or detachably mounted on the reflow soldering tray 40, or detachably mounted on the fixture used to fix the PCB circuit board 10. The detachable mounting structure can be achieved by a snap-fit ​​structure, a threaded connection structure, a hinge structure, or a magnetic connection structure. Depending on the process requirements, there can be multiple mounting brackets 302.

[0024] The heat insulation buffer layer 303 can be further fixedly mounted on the protective cover 301. The combination of the protective cover 301 and the heat insulation buffer layer 303 can effectively block the thermal shock of the high-temperature hot air during reflow soldering to the surface of the magnetic core of the magnetic component 20, avoid the surface of the magnetic core from heating up drastically and causing surface cracking; it can also prevent the magnetic core from overheating and reducing its performance.

[0025] Furthermore, at least a portion of the heat-insulating buffer layer 303 is in contact with the magnetic element 20. This contact area allows for heat exchange with the surface of the magnetic element 20. When the contact area occupies only a portion of the magnetic core surface, it is evenly distributed across the core surface. Due to the low thermal conductivity of the heat-insulating buffer layer 303, heat can be uniformly and slowly conducted to the magnetic core surface during the reflow soldering process, ensuring a slow heating rate and uniform surface temperature distribution. This further eliminates stress caused by uneven heating on the magnetic core surface and reduces the risk of surface cracking. Simultaneously, during the cooling process, the heat-insulating buffer layer prevents the magnetic core surface from cooling too quickly, similarly eliminating stress caused by uneven heating. In addition, the damping characteristics of the heat-insulating buffer layer reduce the impact force transmitted from the protective cover 301 to the magnetic element 20, preventing misalignment of the magnetic element 20.

[0026] See Figure 2The protective cover 301 is rectangular in shape. Specifically, the protective cover 301 is rectangular in shape, which exactly covers the projection area of ​​the magnetic core of the magnetic element 20 on the mounting surface; or the protective cover 301 is rectangular in shape, which exactly covers the projection area of ​​the magnetic core of the magnetic element 20 on the mounting surface. The fixing bracket 302 is disposed on opposite sides of the protective cover 301, and together with the protective cover 301, forms a cross-shaped structure.

[0027] The outer surface of the protective cover can be provided with anti-slip textures or easy-grip recesses or protrusions to facilitate installation and removal. To provide a better installation environment for the magnetic component 20, a conductive layer or static dissipation layer can also be provided on the inner surface of the protective cover, or a conductive layer or static dissipation layer can be provided on the surface of the heat insulation buffer layer to eliminate the risk of static electricity.

[0028] Example 2 like Figures 3-4 The illustration shows another embodiment of the magnetic core reflow soldering protection assembly 30 disclosed in this utility model. The difference between this embodiment and Embodiment 1 is that this embodiment requires one magnetic core reflow soldering protection assembly 30 to simultaneously protect multiple magnetic components 20. The magnetic core reflow soldering protection assembly 30 is configured to simultaneously cover multiple magnetic components 20. The shape of the protective cover 301 matches the shape and size of the combined projection of the multiple magnetic components 20 on the mounting surface. See [link to relevant documentation]. Figure 4 The protective cover 301 is a combination of multiple adjacent rectangles. The fixing brackets 302 are located on the two long sides of the protective cover 301, forming a cross-shaped structure together with the protective cover 301. The heat insulation buffer layer 303 is identical in shape and size to the multiple integrated protective covers 301, and is finally fixed in place using the fixing brackets 302. Furthermore, to ensure that the reflow soldering effect is not affected, the protective cover 301... An appropriately sized flow passage 304 is provided in the corresponding area at the pin of the magnetic component 20 to ensure that the high-temperature heat flow during the reflow soldering process can smoothly reach the soldering position where the pin of the magnetic component 20 is located.

[0029] This invention has a simple structure, is easy to operate, and is reusable. It can significantly improve the yield of magnetic cores during reflow soldering, reduce production costs, and is suitable for reflow soldering protection of various types of magnetic cores.

[0030] Example 3 like Figure 5As shown, the magnetic core protection scheme of this utility model is applied in a reflow soldering tray. The reflow soldering tray 40 can simultaneously hold and solder multiple PCB circuit boards 10. In this case, by independently setting a magnetic core reflow soldering protection component 30 for each PCB circuit board 10, the magnetic component 20 is fixed to the PCB circuit board during the reflow soldering process. The specific structure and fixing method of the magnetic core reflow soldering protection component 30 can adopt the technical solutions disclosed in Embodiment 1 or Embodiment 2.

[0031] The above embodiments are only used to help understand the method and core idea of ​​this utility model. For those skilled in the art, other equivalent application schemes that can be naturally associated with the above description and examples without departing from the principle of this utility model, as well as some improvements and modifications to this utility model, all fall within the protection scope of the claims of this utility model.

Claims

1. A magnetic core reflow soldering protection assembly, used in the reflow soldering process of magnetic components, characterized in that, include: The protective cover is a plate-shaped structure used to block the high-temperature airflow directly above the magnetic components during reflow soldering. Its shape matches the shape and size of the projection area of ​​the magnetic components on the mounting surface and can completely cover the projection area of ​​the magnetic core in the magnetic components on the mounting surface. A heat-insulating buffer layer is located directly below the protective cover, with at least a portion of it in contact with the magnetic components. The mounting bracket is fixedly connected to the protective cover and is used to secure the protective cover and the heat insulation buffer layer.

2. The magnetic core reflow soldering protection assembly according to claim 1, characterized in that: The magnetic component is one, and the protective cover is rectangular in shape. Alternatively, the number of magnetic components may be multiple, and the shape of the protective cover may be a combination of multiple adjacent rectangles.

3. The magnetic core reflow soldering protection assembly according to claim 2, characterized in that: The mounting brackets are set on opposite sides of the protective cover, together forming a component with a cross shape.

4. The magnetic core reflow soldering protection assembly according to claim 3, characterized in that: The protective cover has overflow holes in the corresponding area at the magnetic component pin.

5. The magnetic core reflow soldering protection assembly according to claim 4, characterized in that: The material for the heat insulation buffer layer is selected from silicone or rubber.

6. The magnetic core reflow soldering protection assembly according to claim 1, characterized in that: One end of the mounting bracket is fixedly connected to the protective cover, and the end of the mounting bracket away from the protective cover is provided with a detachable installation structure.

7. The magnetic core reflow soldering protection assembly according to claim 6, characterized in that: The detachable installation structure can be any one of the following: snap-fit ​​structure, threaded connection structure, hinge structure, or magnetic connection structure.

8. The magnetic core reflow soldering protection assembly according to claim 6, characterized in that: A magnet is installed at the end of the mounting bracket away from the protective cover.

9. The magnetic core reflow soldering protection assembly according to claim 1, characterized in that: There are multiple mounting brackets.

10. The magnetic core reflow soldering protection assembly according to claim 1, characterized in that: The protective cover is made of non-magnetic material, which is selected from aluminum alloy, stainless steel, or composite materials.

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