Laser processing apparatus

Abstract

The application discloses a laser processing equipment, comprising a processing device, a track and a pushing mechanism. Two processing devices are arranged side by side along a first direction, and each processing device comprises a driving mechanism and a laser processing module arranged at the driving end of the driving mechanism, and the driving mechanism is used for driving the laser processing module to move; the track is arranged below the processing device and has a length direction along the first direction, and is used for supporting a tray arranged along the first direction; two pushing mechanisms are arranged below the track and correspond to the laser processing modules one by one; the pushing mechanism is used for pushing the tray on the track along the first direction, so that the tray stops below the two laser processing modules in sequence; and the workpieces in different areas of the tray are processed by the two laser processing modules in sequence, so that the processing efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of laser processing, and in particular to a laser processing device. Background Technology

[0002] With the development of laser technology, more and more fields have begun to use laser processing. Lasers can be used for chip cutting and marking in the semiconductor industry. The semiconductor industry has high requirements for processing efficiency, so the requirements for laser processing efficiency are getting higher and higher. However, due to the limitation of the laser processing area, the processing efficiency of a single laser is always limited. Utility Model Content

[0003] This application proposes a laser processing device that can solve the problem of limited processing efficiency in single-laser laser devices.

[0004] This application discloses a laser processing device, comprising:

[0005] Two processing devices are arranged side by side along a first direction. Each processing device includes a drive mechanism and a laser processing module disposed at the drive end of the drive mechanism. The drive mechanism is used to drive the laser processing module to move. A track is provided below the processing device, and its length direction is along a first direction. The track is used to receive material trays arranged along the first direction. Two pushing mechanisms are located below the track and are configured one-to-one with the laser processing module. The pushing mechanism is used to push the material trays arranged on the track along a first direction. The pushing mechanism located at the end of the track is used to receive the material trays pushed by the pushing mechanism at the beginning.

[0006] In some embodiments, the laser processing equipment includes two pushing mechanisms; the pushing mechanisms are located below the track and correspond one-to-one with the laser processing modules; the first end of the track is provided with a first station corresponding to one of the processing devices; the last end of the track is provided with a second station corresponding to the other processing device; the pushing mechanism at the first end is used to push the tray in the first station to the second station, and the pushing mechanism at the last end is used to push the tray in the second station away from the track.

[0007] In some embodiments, the pushing mechanism includes: A linear drive module is located below the track, and the drive direction is along a first direction; A receiving platform, located at the drive end of the linear drive module, is used to receive the material tray; The first cylinder is located on one side of the receiving platform, and its driving direction is along the vertical direction; The second cylinder is located on the other side of the receiving platform and its driving direction is vertical. The second cylinder and the first cylinder are arranged along the first direction. The push rods of the first cylinder and the second cylinder extend out and can form a limiting space for accommodating the material tray with the receiving platform. A pusher, located at the drive end of the second cylinder, is used to push the material tray on one side of the limiting space to move along the first direction.

[0008] In some embodiments, the laser processing equipment further includes a material blocking mechanism disposed on the side of the track. The material blocking mechanism includes a material blocking cylinder and a material blocking member disposed on the drive end of the material blocking cylinder. The material blocking member is used to restrict the movement of the material tray along the track.

[0009] In some embodiments, the laser processing equipment further includes a support plate disposed on the lower side of the track, the material blocking cylinder is disposed on the support plate, and the support plate is also provided with a through hole for the material blocking component to pass through; one end of the material blocking component is disposed on the driving end of the material blocking cylinder, the other end passes through the through hole, is vertically upward and is located between the tracks.

[0010] In some embodiments, the laser processing equipment further includes an air blowing mechanism disposed on the side of the track. The air blowing mechanism includes an air blowing pipe disposed along a first direction. The side of the air blowing pipe is provided with air holes arranged along the first direction, and the air holes face the pushing mechanism.

[0011] In some embodiments, the drive mechanism includes: The first drive module is driven in the second direction; The second drive module is located at the drive end of the first drive module, and the drive direction is along the first direction; The mounting bracket is located at the drive end of the second drive module; The third drive module is mounted on the mounting bracket, and the drive direction is along the vertical direction. The first direction, the second direction, and the vertical direction are arranged to intersect each other.

[0012] In some embodiments, the laser processing module includes: The laser is mounted on the mounting bracket; The galvanometer assembly is located at the drive end of the third drive module; An optical path assembly, mounted on the mounting bracket, is used to connect the laser and the galvanometer assembly.

[0013] In some embodiments, the laser processing equipment further includes: A reflector is disposed on one side of the galvanometer assembly and is used to reflect laser light downwards; The camera is positioned directly above the mirror.

[0014] In some embodiments, the laser processing equipment further includes a ring light source disposed on the lower side of the mirror.

[0015] The laser processing equipment in this embodiment includes a processing unit, a track, and a pushing mechanism. The processing unit is used to process products. Two processing units are arranged side-by-side along a first direction. The track below the processing unit is used to receive trays arranged along the first direction. Two pushing mechanisms are located below the track and correspond one-to-one with the laser processing modules. The pushing mechanisms can push the trays on the track along the first direction, causing the trays to sequentially stop below the two laser processing modules. The two laser processing modules then sequentially process workpieces in different areas of the trays to improve processing efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a laser processing device in one embodiment of this application; Figure 2 for Figure 1 A schematic diagram of the guide rail and the material pushing mechanism in the embodiment; Figure 3 This is a schematic diagram of the pusher mechanism in one embodiment of this application; Figure 4 This is a schematic diagram of the pusher mechanism in one embodiment of this application; Figure 5 This is a schematic diagram of the processing device in one embodiment of this application.

[0017] Label Explanation: 10. Processing device; 11. Drive mechanism; 111. First drive module; 112. Second drive module; 113. Mounting bracket; 114. Third drive module; 12. Laser processing module; 121. Laser; 122. Galvanometer; 123. Transparent mirror; 124. Camera; 125. Light source; 126. Optical path assembly; 20. Track; 21. Support plate; 30. Pushing mechanism; 31. Linear drive module; 32. Receiving platform; 33. First cylinder; 34. Second cylinder; 35. Pushing component; 40. Stopping mechanism; 50. Air blowing mechanism; The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0018] The solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments in this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0019] It should be noted that all directional indicators, such as down, left, right, front, back, etc., in the embodiments of this application are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicator will also change accordingly.

[0020] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0021] Furthermore, the descriptions involving "first," "second," etc., in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0022] This application proposes a laser processing device. Referring to Figures 1 to 5, the laser processing device includes: two processing units 10 arranged side by side along a first direction. Each processing unit 10 includes a drive mechanism 11 and a laser processing module 12 disposed at the drive end of the drive mechanism 11. The drive mechanism 11 drives the laser processing module 12 to move. A track 20 is disposed below the processing units 10, with its length direction along the first direction. The track 20 is used to receive trays arranged along the first direction. A pushing mechanism 30 is used to push the trays on the track 20 along the first direction, so that the trays stop sequentially below the two processing units 10. In this embodiment, the trays are arranged at intervals along the track 20. The pushing mechanism 30 can push the trays in a step-by-step manner on the track 20. The trays will stop sequentially below the two laser processing modules 12, and the two laser processing modules 12 will process the workpieces in different areas of the trays in sequence to improve processing efficiency.

[0023] In some embodiments, the laser processing equipment includes two pushing mechanisms 30; the pushing mechanisms 30 are located below the track 20 and correspond one-to-one with the laser processing module 12; the first end of the track 20 is provided with a first station corresponding to one of the processing devices 12; the tail end of the track 20 is provided with a second station corresponding to the other processing device 12; the pushing mechanism 30 at the first end is used to push the tray in the first station to the second station, and the pushing mechanism at the tail end is used to push the tray in the second station away from the track 20.

[0024] In this embodiment, the first end of the track 20 has a first station corresponding to one of the processing devices 10, and the second end has a second station corresponding to another processing device 10. The first station and the second station constitute a waiting station. Each of the first station, the waiting station, and the second station is provided with a material tray. The material tray can be divided into a first area and a second area from the middle. The processing device 10 at the first end can process the first area, and the processing device 10 at the second end can process the second area.

[0025] Furthermore, the feeding mechanism 30 includes: a linear drive module 31, located below the track 20, with the driving direction along a first direction; a receiving platform 32, located at the driving end of the linear drive module 31, for receiving the material tray; a first cylinder 33, located on one side of the receiving platform 32, with the driving direction along a vertical direction; a second cylinder 34, located on the other side of the receiving platform 32, with the driving direction along a vertical direction, the second cylinder 34 and the first cylinder 33 are arranged along the first direction, the push rods of the first cylinder 33 and the second cylinder 34 extend out, and can form a limiting space for accommodating the material tray with the receiving platform 32; and a pushing member 35, located at the driving end of the second cylinder 34, for pushing the material tray on one side of the limiting space to move along the first direction.

[0026] In this embodiment, a material tray is provided at the first station, the waiting station, and the second station. Each material tray can be divided into a first region and a second region from the middle. The processing device 10 at the front end can process the first region, and the processing device 10 at the rear end can process the second region. The push rods of the first cylinder 33 and the second cylinder 34 in the pushing mechanism 30 at the front end are pushed upward, and the material tray at the first station is confined in the limiting space. The pusher 35 is located on one side of the material tray in the waiting station. As the linear drive module 31 drives the two cylinders and the pusher 35 to move towards the rear end along the first direction, the material tray moves a set distance towards the rear end. The material tray at the waiting station then enters the second station, and the cylinder at the first station enters the waiting station.

[0027] Of course, the pusher mechanism 30 at the tail end will also be driven synchronously to push the tray out of the second station, thereby performing step-by-step pushing of the tray. After the pushing is completed, the push rods of the first cylinder 33 and the second cylinder 34 retract downwards, and the pusher 35 and the two cylinders also descend below the track. The linear drive module 31 drives the two cylinders and the pusher 35 to move towards the head end to directly below the processing device 10 for a second pushing. This structural design of the pusher mechanism 30 can stably push the tray step by step, ensuring the accurate movement and positioning of the tray on the track 20, providing a reliable foundation for the laser processing module 12 to process different areas of the tray.

[0028] In some embodiments, the laser processing equipment further includes a material blocking mechanism 40 disposed on the side of the track 20. The material blocking mechanism 40 includes a material blocking cylinder and a material blocking element disposed at the drive end of the material blocking cylinder. The material blocking element is used to restrict the movement of the material tray along the track 20. In this embodiment, the lifting and lowering of the material blocking element can be used to limit and release the material tray. Under the obstruction of the material blocking element, it can be ensured that the material tray moves directly below the processing device 10 so that when the push rods of the first cylinder 33 and the second cylinder 34 extend, they will not interfere with the material tray, ensuring that the material tray can smoothly enter the limiting space. The setting of the material blocking mechanism 40 effectively ensures that the material tray can accurately stop directly below the processing device 10, avoiding positional deviation of the material tray during the pushing process and improving the processing accuracy. A support plate 21 is provided at the lower part of the track 20, and the material blocking cylinder is disposed on the support plate 21. The support plate 21 is provided with a through hole for the material blocking element to pass through. The baffle is arranged in a Z-shape, with one end located on the baffle cylinder and the other end passing through the through hole and facing vertically upward.

[0029] In some embodiments, the laser processing equipment further includes an air blowing mechanism 50 disposed on the side of the track 20. The air blowing mechanism 50 includes an air blowing pipe disposed along a first direction, and the side of the air blowing pipe is provided with air holes arranged along the first direction, the air holes facing the feeding mechanism 30. The air blowing pipe can provide a stable airflow to the tray during laser processing to disperse the dust generated during processing. Maintaining a clean processing environment is beneficial to improving processing quality and extending the service life of the equipment.

[0030] In some embodiments, the drive mechanism 11 includes: a first drive module 111, with a drive direction along a second direction; a second drive module 112, disposed at the drive end of the first drive module 111, with a drive direction along a first direction; a mounting frame 113, disposed at the drive end of the second drive module 112; and a third drive module 114, disposed on the mounting frame 113, with a drive direction along a vertical direction. In this embodiment, the drive mechanism 11 expands the range of motion of the laser processing module 12, increasing the processing range and enabling the processing of larger format tray products. The first direction, the second direction, and the vertical direction are arranged in pairs, specifically perpendicular to each other. The third drive module 114 is used to adjust the focal length during laser processing. The structural design of the drive mechanism 11 provides multi-directional drive for the laser processing module 12, greatly increasing the range and flexibility of laser processing, meeting the processing requirements for large format tray products, while the focal length adjustment via the third drive module 114 ensures processing accuracy. It is worth noting that the aforementioned linear drive module, first drive module, second drive module, and third drive module may be equipped with electric cylinders.

[0031] In some embodiments, the laser processing module 12 includes: a laser 121 mounted on a mounting bracket 113; a galvanometer assembly 122 mounted on the driving end of a third driving module 114; and an optical path assembly 126 mounted on the mounting bracket 113 for connecting the laser 121 and the galvanometer assembly 122. In this embodiment, the optical path assembly 126 may include multiple sets of reflectors, allowing the laser beam emitted by the laser 121 to enter the galvanometer assembly 122. The optical path assembly 126 may also include a vertically arranged bellows tube, one end of which is connected to the galvanometer assembly 122 and the other end to the laser 121. When the galvanometer assembly 122 is driven to rise and fall by the third driving module 114, it can provide sealed protection for the laser optical path. This structure of the laser processing module 12 enables stable laser transmission and precise control. The bellows tube provides sealed protection for the laser optical path when the galvanometer assembly 122 rises and falls, improving the reliability and service life of the equipment.

[0032] In some embodiments, the laser processing equipment further includes: a reflector 123, disposed on one side of the galvanometer assembly 122, for reflecting laser light downwards; a camera 124, disposed directly above the reflector 123; and a light source 125, disposed on one side of the reflector 123. In this embodiment, the laser emission direction in the galvanometer assembly 122 can be along a first direction, and the reflector 123 is used to reflect the laser vertically downwards onto the workpiece, such as a workpiece or product. The light source 125 can provide better illumination conditions, and the camera 124 can receive the reflected light from the product and the tray. The reflected light passes through the reflector 123 and is received by the photosensitive element of the camera 124 for imaging and visual positioning, thereby improving processing accuracy. The cooperation of the reflector 123, the camera 124, and the light source 125 enables accurate imaging and visual positioning of the processed workpiece, providing precise guidance for laser processing and effectively improving processing accuracy.

[0033] In this embodiment, the working principle of the laser processing equipment is as follows: The laser processing equipment in this embodiment includes a processing device 10, a track 20, and a pushing mechanism 30. Two processing devices 10 are arranged side-by-side along a first direction, each including a drive mechanism 11 and a laser processing module 12 located at the drive end of the drive mechanism 11. The drive mechanism 11 drives the laser processing module 12 to move. The track 20 is located below the processing device 10, with its length along the first direction, and is used to receive trays arranged along the first direction. Two pushing mechanisms 30 are located below the track 20, corresponding one-to-one with the laser processing modules 12. The pushing mechanisms 30 push the trays on the track 20 along the first direction, causing the trays to sequentially stop below the two laser processing modules 12. The two laser processing modules 12 sequentially process workpieces in different areas of the trays to improve processing efficiency. The design of the entire laser processing equipment achieves efficient and precise processing of the trays, possessing good practicality and reliability, and effectively improving production efficiency and processing quality.

[0034] The above are only some or preferred embodiments of this application. Neither the text nor the drawings should limit the scope of protection of this application. All equivalent structural transformations made using the content of this application's specification and drawings under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A laser processing device, characterized in that, include: Two processing devices are arranged side by side along a first direction. Each processing device includes a drive mechanism and a laser processing module disposed at the drive end of the drive mechanism. The drive mechanism is used to drive the laser processing module to move. A track is provided below the processing device, and its length direction is along a first direction. The track is used to receive material trays arranged along the first direction. The material pushing mechanism is used to push the material tray on the track along a first direction, so that the material tray stops sequentially under the two processing devices.

2. The laser processing equipment according to claim 1, characterized in that, The laser processing equipment includes two pushing mechanisms; the pushing mechanisms are located below the track and correspond one-to-one with the laser processing modules; the first end of the track has a first station corresponding to one of the processing devices; the last end of the track has a second station corresponding to the other processing device; the pushing mechanism at the first end is used to push the tray in the first station to the second station, and the pushing mechanism at the last end is used to push the material tray in the second station away from the track.

3. The laser processing equipment according to claim 2, characterized in that, The pushing mechanism includes: A linear drive module is located below the track, and the drive direction is along a first direction; A receiving platform, located at the drive end of the linear drive module, is used to receive the material tray; The first cylinder is located on one side of the receiving platform, and its driving direction is along the vertical direction; The second cylinder is located on the other side of the receiving platform and its driving direction is vertical. The second cylinder and the first cylinder are arranged along the first direction. The push rods of the first cylinder and the second cylinder extend out and can form a limiting space for accommodating the material tray with the receiving platform. A pusher, located at the drive end of the second cylinder, is used to push the material tray on one side of the limiting space to move along the first direction.

4. The laser processing equipment according to claim 2, characterized in that, The laser processing equipment also includes a material blocking mechanism located on the side of the track. The material blocking mechanism includes a material blocking cylinder and a material blocking component located at the drive end of the material blocking cylinder. The material blocking component is used to restrict the movement of the material tray along the track.

5. The laser processing equipment according to claim 4, characterized in that, The laser processing equipment also includes a support plate located on the lower side of the track, and the material blocking cylinder is located on the support plate. The support plate is also provided with a through hole for the material blocking component to pass through. One end of the material blocking component is located at the driving end of the material blocking cylinder, and the other end passes through the through hole, is vertically upward, and is located between the tracks.

6. The laser processing equipment according to claim 3, characterized in that, The laser processing equipment also includes an air blowing mechanism located on the side of the track. The air blowing mechanism includes an air blowing pipe arranged along a first direction. The side of the air blowing pipe is provided with air holes arranged along the first direction, and the air holes face the pushing mechanism.

7. The laser processing equipment according to claim 1, characterized in that, The drive mechanism includes: The first drive module is driven in the second direction; The second drive module is located at the drive end of the first drive module, and the drive direction is along the first direction; The mounting bracket is located at the drive end of the second drive module; The third drive module is mounted on the mounting bracket, and the drive direction is along the vertical direction. The first direction, the second direction, and the vertical direction are arranged to intersect each other.

8. The laser processing equipment according to claim 7, characterized in that, The laser processing module includes: The laser is mounted on the mounting bracket; The galvanometer assembly is located at the drive end of the third drive module; An optical path assembly, mounted on the mounting bracket, is used to connect the laser and the galvanometer assembly.

9. The laser processing equipment according to claim 8, characterized in that, The laser processing equipment also includes: A reflector is disposed on one side of the galvanometer assembly and is used to reflect laser light downwards; The camera is positioned directly above the mirror.

10. The laser processing equipment according to claim 9, characterized in that, The laser processing equipment also includes a ring light source located below the mirror.

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