A welding head cooling device for electronic chip welding

Abstract

The utility model relates to electronic welding equipment technical field discloses a welding head cooling device for electronic chip welding, the utility model discloses a welding box, one end line connection welding cable, welding assembly sets up at the side of welding box, including welding handle, top and welding cable far away from the one end line connection of welding box, cooling module sets up at the side of welding box, including static cooling assembly, sets up at the side of welding box, still include dynamic cooling assembly, sets up at one side of welding handle, through setting up static cooling assembly and dynamic cooling assembly, realize the double heat dissipation of welding head in use and the idle time, improve the cooling efficiency. Utilize the same fan to supply air to the U-shaped airflow channel of the placing base and the annular channel in the welding handle through the three-way pipeline, which not only reduces the equipment cost and space occupation, but also realizes the continuous operation mode of "welding and cooling at the same time, quick cooling after use", effectively prevents the welding head from overheating and oxidizing, and prolongs its service life.

Description

Technical Field

[0001] This utility model relates to the field of electronic welding equipment technology, specifically a welding head cooling device for electronic chip welding. Background Technology

[0002] In the fields of electronics manufacturing and repair, especially in microelectronic packaging, surface mount technology rework, and precision chip soldering, the temperature control of the soldering tip directly affects the soldering quality and device reliability. Traditional soldering irons or precision soldering stations accumulate a large amount of heat in the soldering tip due to continuous heating during prolonged operation. If heat cannot be dissipated effectively and promptly, the soldering tip temperature will become too high, leading to problems such as tip oxidation, plating peeling, and reduced heat transfer efficiency. In severe cases, it can even damage chips or printed circuit boards due to overheating. Currently, common cooling methods mostly rely on natural heat dissipation or intermittent shutdowns for cooling, which are inefficient and severely impact production cycle time and operational continuity.

[0003] However, most existing welding cooling devices only provide passive cooling through air cooling or metal heat-conducting blocks after welding, lacking a dynamic heat dissipation mechanism during the welding process. This leads to continuous heat accumulation at the weld joint, affecting the stability of subsequent welding. Furthermore, while some devices are equipped with cooling ducts, their airflow design is often flawed, easily interfering with weld formation or causing flux splatter. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a cooling device for the welding head of electronic chip welding.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a welding head cooling device for electronic chip welding, including a welding box with a welding cable connected to one end; a welding assembly, disposed beside the welding box, including a welding handle with its top connected to the end of the welding cable away from the welding box; and a cooling module, disposed beside the welding box, including a static cooling assembly disposed beside one side of the welding box and a dynamic cooling assembly disposed beside the welding handle.

[0006] As a further description of the above technical solution:

[0007] The welding assembly includes: an insulating layer disposed inside the welding handle; a welding core disposed inside the insulating layer, with its top connected to the internal wiring of the welding cable; and a welding head disposed at the bottom of the welding handle, with its top welded to the bottom of the welding core.

[0008] As a further description of the above technical solution:

[0009] The static cooling assembly includes: a fan, mounted on the work platform and located beside the welding box; a three-way pipe, one end of which is connected to the fan's air outlet; a base, mounted on the work platform, with one end face connected to two sets of pipes of the three-way pipe; an airflow channel, located inside the base and communicating with the inside of the pipes on both sides of the three-way pipe near the base; a heat-conducting block, located inside the base and extending into the base on both sides, with the welding head in contact with the central surface of the heat-conducting block; and a insertion hole, located at the center of the top of the base, with the welding head inserted into the insertion hole.

[0010] As a further description of the above technical solution:

[0011] An exhaust vent is provided on the top of the placement base near the outside of the insertion hole.

[0012] As a further description of the above technical solution:

[0013] The airflow channel is U-shaped.

[0014] As a further description of the above technical solution:

[0015] The dynamic cooling assembly includes: an airflow hose, one end of which is connected to a pipe on the side of the base away from the T-junction pipe and communicates with the internal airflow channel, and the other end of which is connected to a pipe on the top side of the welding grip; an airflow annular channel, which is opened inside the welding grip and located on the outer wall of the insulation layer; an air outlet, which is opened on the welding grip near the bottom of the welding head; and a baffle, which is set at the bottom of the welding grip and welded to the welding core located at the upper part of the welding head and at the bottom of the air outlet.

[0016] As a further description of the above technical solution:

[0017] The baffle is double-conical.

[0018] This utility model has the following beneficial effects:

[0019] 1. By integrating static and dynamic cooling mechanisms, efficient and uniform cooling of the welding head is achieved. The most significant core technological effect is a substantial improvement in the heat dissipation capacity of the welding head, effectively preventing overheating caused by prolonged operation, thereby extending the service life of the welding head and improving welding reliability.

[0020] 2. The cooling device features a compact structure and simple operation, allowing for seamless integration into existing welding equipment without significant modifications to enhance its performance. Users can easily start and adjust the cooling system to adapt to different welding needs, greatly improving operational flexibility and convenience. Attached Figure Description

[0021] Figure 1This is an overall schematic diagram of a welding head cooling device for electronic chip welding proposed in this utility model;

[0022] Figure 2 This is an overall side view of a welding head cooling device for electronic chip welding proposed in this utility model;

[0023] Figure 3 This is a half-sectional view of the base for a cooling device for an electronic chip welding head, as proposed in this utility model.

[0024] Figure 4 This is a half-sectional schematic diagram of the welding grip of a welding head cooling device for electronic chip welding proposed in this utility model.

[0025] Legend:

[0026] 1. Welding box; 11. Welding cable; 2. Welding assembly; 21. Welding handle; 22. Insulation layer; 23. Welding core; 24. Welding head; 3. Cooling module; 31. Static cooling assembly; 311. Fan; 312. T-shaped pipe; 313. Placement base; 314. Airflow channel; 315. Heat-conducting block; 316. Plug-in hole; 32. Dynamic cooling assembly; 321. Airflow hose; 322. Airflow annular channel; 323. Air outlet; 324. Baffle plate. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] Example 1:

[0031] like Figures 1 to 4 As shown, this embodiment provides a welding head cooling device for electronic chip welding, including: a welding box 1 with a welding cable 11 connected to one end; a welding assembly 2, disposed next to the welding box 1, including a welding handle 21, the top of which is connected to the end of the welding cable 11 away from the welding box 1; and a cooling module 3, disposed next to the welding box 1, including a static cooling assembly 31 disposed next to one side of the welding box 1, and a dynamic cooling assembly 32 disposed next to the welding handle 21.

[0032] In this embodiment, the welding assembly 2 and the cooling module 3 constitute a welding head cooling device for electronic chip welding according to this application.

[0033] It should also be noted that the electronic chip in this application can be a memory chip, a sensor chip, a radio frequency chip, etc. Figure 1 In this embodiment, a memory chip is used as an example for description. Of course, other types of electronic chips can also adopt a similar structure, which will not be described in detail below.

[0034] Understandable, Figure 1 The subject matter is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1 The limitations mean that the topics can also include those that are more... Figure 1 More or fewer parts.

[0035] It should also be understood that both welding box 1 and fan 31 were purchased from the market and are common knowledge in this field. They are only used and not modified, so the control method and circuit connection will not be described in detail.

[0036] Furthermore, in this embodiment, the welding box 1 is made of rectangular metal, which has good electrical conductivity and heat dissipation. The welding assembly 2 includes a welding handle 21, which is made of cylindrical plastic, providing good insulation and portability. Current is transmitted through the welding cable 11, and the welding assembly 2 performs the welding operation. The cooling module 3 cools the welding head through static and dynamic cooling components. This improves welding efficiency and extends the service life of the welding head.

[0037] Specifically, the welding assembly 2 includes: an insulating layer 22 disposed inside the welding handle 21; a welding core 23 disposed inside the insulating layer 22, with its top connected to the internal wiring of the welding cable 11; and a welding head 24 disposed at the bottom of the welding handle 21, with its top welded to the bottom of the welding core 23.

[0038] In this embodiment, the insulating layer 22 is made of cylindrical plastic, possessing good insulation and heat resistance; the welding core 23 is made of cylindrical metal, possessing good electrical and thermal conductivity; and the welding head 24 is made of conical metal, possessing good thermal conductivity and wear resistance. Current is transmitted to the welding core 23 through the welding cable 11, generating heat which is then transferred to the welding head 24 via heat conduction for welding. This ensures the stability and efficiency of the welding process.

[0039] Example 2:

[0040] Based on Example 1, in order to improve the efficiency of cooling the welding head 24 when it is not in the welding state, a static cooling component 31 is provided next to the welding box 1.

[0041] Specifically, the static cooling assembly 31 includes: a fan 311, mounted on the working platform and located beside the welding box 1; a three-way pipe 312, one end of which is connected to the air outlet of the fan 311; a placement base 313, mounted on the working platform, with one end face connected to two sets of pipes of the three-way pipe 312; an airflow channel 314, located inside the placement base 313 and communicating with the inside of the pipes of the three-way pipe 312 near the placement base 313; a heat-conducting block 315, located inside the placement base 313 and extending to the placement base 313 on both sides, with the welding head 24 in contact with the middle surface of the heat-conducting block 315; and a insertion hole 316, located at the top center of the placement base 313, with the welding head 24 inserted into the insertion hole 316.

[0042] In a preferred embodiment, the fan 311 is made of metal, featuring high airflow and low noise. The three-way pipe 312 is made of cylindrical plastic, offering good airtightness and heat resistance. The base 313 is made of rectangular metal, providing good thermal conductivity and stability. The airflow channel 314 is a U-shaped channel located inside the base 313. The heat-conducting block 315 is made of rectangular metal, offering good thermal conductivity. The insertion hole 316 is a cylindrical hole. The fan 311 blows airflow into the three-way pipe 312, and then from the three-way pipe 312 into the airflow channel 314. The airflow absorbs heat from the welding head 24 through the heat-conducting block 315, accelerating cooling. This achieves static cooling of the welding head and improves cooling efficiency.

[0043] Specifically, an exhaust vent is provided on the top of the placement base 313 near the outside of the insertion hole 316.

[0044] In this embodiment, the exhaust vent is used to discharge hot airflow, ensuring smooth airflow within the airflow channel 314. This improves cooling efficiency and prevents heat buildup.

[0045] Example 3:

[0046] Based on Example 2, in order to cool the welding head 24 during welding, a dynamic cooling component 32 is provided inside the welding handle 21.

[0047] Specifically, the dynamic cooling assembly 32 includes: an airflow hose 321, one end of which is connected to a pipe on the side of the base 313 away from the three-way pipe 312 and communicates with the internal airflow channel 314, and the other end is connected to a pipe on the top side of the welding grip 21; an airflow annular channel 322, which is opened inside the welding grip 21 and located on the outer wall of the insulation layer 22; an air outlet 323, which is opened on the welding grip 21 near the bottom of the welding head 24; and a baffle 324, which is set at the bottom of the welding grip 21 and welded to the welding core 23 located at the upper end of the welding head 24 and located at the bottom of the air outlet 323.

[0048] The airflow hose 321 is made of cylindrical rubber, possessing excellent flexibility and airtightness, and can be arbitrarily changed in shape to adapt to different operational needs. The airflow annular channel 322 is an annular channel, the air outlet 323 is a square hole, and the baffle 324 is made of double-conical metal, possessing good thermal conductivity and wear resistance. Airflow enters the airflow annular channel 322 from the airflow hose 321, and dissipates heat by blowing on the insulation layer 22 and welding core 23 through the air outlet 323. The baffle 324 changes the airflow direction to prevent the airflow from affecting the welding process. This achieves dynamic cooling of the welding head, improving the stability and efficiency of the welding process.

[0049] In actual use, the user first plugs one end of the welding cable 11 into the output terminal of the welding box 1, turns on the power of the welding box 1, and sets the required temperature and power parameters. The power supply of the welding box 1 generates current, which is transmitted through the welding cable 11 to the welding core 23 inside the welding handle 21. When the current passes through the welding core 23, heat is generated due to the resistance, which heats the welding core 23. The heat generated by the welding core 23 is transferred to the tip of the welding head 24 through heat conduction. Then the user can start welding the chip.

[0050] Simultaneously, the user can activate the blower 311 during welding. The blower 311 blows airflow into the three-way pipe 312, and then from the three-way pipe 312 into the airflow channel 314. The airflow then enters the airflow hose 321, and through the other end of the airflow hose 321 into the airflow annular channel 322, blowing the insulating layer 22 and the internal welding core 23 to dissipate heat. Afterward, the heat-carrying airflow will be discharged from the air outlet 323. First, the flow direction is changed by the conical slope at the top of the baffle 324, so it will not affect the welding process. While the airflow blows outward, it can also blow the already welded material. Good chip cooling is accelerated. When the soldering is completed and the soldering head 24 needs to be cooled, the user inserts the soldering head 24 into the plug hole 316. The surface of the soldering head 24 contacts the heat-conducting block 315. The heat-conducting block 315 absorbs the heat of the soldering head 24 and transfers it to the two sides located inside the airflow channel 314. The airflow blown by the fan 311 enters the airflow channel 314 through the three-way pipe 312 to accelerate the cooling of the heat-conducting block 315. The hot airflow first enters the airflow annular channel 322 through the airflow hose 321, then is blown out from the air outlet 323, and finally is discharged from the exhaust port next to the plug hole 316.

[0051] The heat-conducting block 315 can also be in other shapes to absorb and conduct heat from the welding head 24. The shape is not limited here, as long as it can absorb and conduct heat from the welding head 24.

[0052] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A cooling device for a welding head used in electronic chip soldering, characterized in that: Includes a welding box (1), with a welding cable (11) connected to one end of the circuit; The welding assembly (2) is set on one side of the welding box (1) and includes a welding handle (21) with its top connected to the welding cable (11) at the end away from the welding box (1). The cooling module (3) is located next to the welding box (1), including a static cooling component (31) located next to one side of the welding box (1) and a dynamic cooling component (32) located next to the welding handle (21).

2. The cooling device for the welding head of an electronic chip as described in claim 1, characterized in that: The welding assembly (2) includes an insulating layer (22) disposed inside the welding grip (21); The welding core (23) is set inside the insulation layer (22) and its top is connected to the internal wiring of the welding cable (11); The welding head (24) is located at the bottom of the welding handle (21) and its top is welded to the bottom of the welding core (23).

3. The cooling device for the welding head of an electronic chip as described in claim 2, characterized in that: The static cooling assembly (31) includes: a fan (311), which is mounted on the working platform and located next to the welding box (1); A three-way pipe (312) is connected at one end to the air outlet of the fan (311); Place the base (313) on the work platform, and connect the two sets of pipes of the tee pipe (312) on both sides of one end face; An airflow channel (314) is opened inside the placement base (313) and is connected to the inside of the pipes on both sides of the three-way pipe (312) near the placement base (313); The heat-conducting block (315) is disposed inside the placement base (313) and extends to the placement base (313) on both sides, and the welding head (24) contacts the middle surface of the heat-conducting block (315); A plug hole (316) is provided at the top center of the base (313), and a welding head (24) is inserted into the plug hole (316).

4. The cooling device for the welding head of electronic chip welding according to claim 3, characterized in that: An exhaust vent is provided on the top of the placement base (313) near the outside of the insertion hole (316).

5. A cooling device for a welding head used in electronic chip welding according to claim 4, characterized in that: The airflow channel (314) is U-shaped.

6. A cooling device for a welding head used in electronic chip welding according to claim 5, characterized in that: The dynamic cooling assembly (32) includes: an airflow hose (321), one end of which is connected to a pipe on the side of the placement base (313) away from the tee pipe (312) and communicates with the internal airflow channel (314), and the other end is connected to a pipe on the top side of the welded handle (21); An airflow annular channel (322) is formed inside the welding grip (21) and located on the outer wall of the insulation layer (22); An air outlet (323) is located on the welding handle (21) near the bottom of the welding head (24); The baffle (324) is located at the bottom of the welding handle (21) and welded to the welding core (23) at the upper end of the welding head (24) and at the bottom of the air outlet (323).

7. A cooling device for a welding head used in electronic chip welding according to claim 6, characterized in that: The baffle (324) is double-conical.

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