Wafer production outer diameter roll grinding device

Abstract

The utility model relates to wafer processing equipment field discloses a kind of outer diameter roll grinding devices for wafer production, it includes rectangular frame, bottom plate and support plate are connected below frame by bolt, protective shell is equipped outside frame, drive mechanism is installed in upper end, clamping assembly is connected below, roll grinding assembly is equipped in support plate side;Drive mechanism contains drive motor, screw and sliding block, sliding block is connected with hydraulic ram below;Clamping assembly has sliding disc, electric telescopic rod, upper and lower clamping plate, rotating disc with suction cup is connected on plate rotation, rotating motor with driving wheel is installed in upper clamping plate side, driving wheel engages driven wheel;Roll grinding assembly contains roll grinding disc with roll grinding groove, rotating column is connected below disc, roll grinding motor with driving gear is installed in bottom plate side, driving gear engages driven gear;The device is high in machining precision, clamping is stable, avoid wafer damage and adjust flexible, adapt to multiple needs.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment technology, specifically to an outer diameter grinding device for wafer production. Background Technology

[0002] In the wafer manufacturing process, outer diameter grinding is a key process to ensure wafer dimensional accuracy and surface quality, and its processing effect directly affects subsequent wafer packaging and device performance.

[0003] A search revealed existing technology (application number: CN202322239963.4), which describes a "wafer outer diameter grinding device." While this utility model solves the problems of low chip removal efficiency and safety hazards during grinding by setting up an independent chip removal mechanism and isolating the operating area with a work box to improve safety, in practical applications, the existing technology uses a grinding wheel with a single-direction drive, which leads to uneven distribution of grinding force. Furthermore, it lacks a dedicated grinding groove for precise positioning and grinding of the wafer outer diameter, making it prone to dimensional deviations during processing. This makes it difficult to ensure the consistency of the outer diameter of multiple wafers and fails to meet the stringent surface finish requirements of high-precision wafers, thus restricting the production quality of high-end wafer products. The existing technology's clamping structure relies solely on a single rotating stage with a vacuum chuck, which can only fix the wafer from one side and lacks clamping force adjustment. During grinding, the wafer is prone to displacement due to insecure fixing, affecting processing accuracy.

[0004] Therefore, there is an urgent need for an outer diameter grinding device for wafer production that can improve processing accuracy, ensure clamping stability, and reduce losses. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing an outer diameter grinding device for wafer production.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an outer diameter grinding device for wafer production, comprising a frame, the frame being rectangular and having a base plate and a support plate bolted to its lower part, the base plate being placed below the support plate, a driving mechanism being provided at the upper end of the frame, the driving mechanism being used to drive a clamping assembly to move, the lower part of the driving mechanism being connected to the upper part of the clamping assembly, the clamping assembly being used for clamping and rotating the wafer, a grinding assembly being provided on the side of the support plate away from the driving mechanism, the grinding assembly being used for grinding the wafer, and a protective shell being provided on the outer side of the frame for protection of the device.

[0007] As a further description of the above technical solution:

[0008] The driving mechanism includes a drive motor, which is located on one side of the frame and its output shaft is connected to a screw. A sliding block is threadedly connected to one side of the screw, and the two ends of the sliding block slide on both sides of the frame.

[0009] As a further description of the above technical solution:

[0010] The upper end of the hydraulic rod is connected to the middle of the lower surface of the sliding block, and the lower end of the hydraulic rod is the telescopic end.

[0011] As a further description of the above technical solution:

[0012] The clamping assembly includes a sliding disk that slides above a hydraulic rod. The lower surface of the sliding disk is connected to the upper end of the drive end of an electric telescopic rod on both sides, and the lower end of the drive end of the electric telescopic rod is connected to the upper surface of an upper clamping plate. The telescopic end of the electric telescopic rod passes through the upper clamping plate and is connected to the upper surface of the lower clamping plate.

[0013] As a further description of the above technical solution:

[0014] A rotating disk is rotatably connected to the middle of the lower surface of the upper clamping plate and the middle of the upper surface of the lower clamping plate. A suction cup is provided on the side of the rotating disk away from the upper and lower clamping plates. A rotary motor is provided on one side of the upper surface of the upper clamping plate. The output shaft of the rotary motor is connected to a drive wheel. The drive wheel meshes with a driven wheel. The driven wheel is connected to the upper end of the rotating disk on the lower surface of the upper clamping plate.

[0015] As a further description of the above technical solution:

[0016] The grinding assembly includes a grinding disc with multiple grinding grooves and a rotating column connected to the lower surface of the grinding disc. The lower end of the rotating column passes through a support plate and is rotatably connected to the upper surface of the base plate.

[0017] As a further description of the above technical solution:

[0018] A tumbling motor is provided on one side of the upper surface of the base plate. The output shaft of the tumbling motor is connected to a drive gear. The drive gear meshes with a driven gear. The driven gear is connected to the lower part of the rotating column.

[0019] This utility model has the following beneficial effects:

[0020] 1. The device adopts a design in which the grinding disc and the wafer rotate in opposite directions. The grinding motor drives the grinding disc to rotate stably, and the rotating motor drives the wafer to rotate synchronously. The reverse motion can enhance the uniformity of the grinding force. With the special grinding groove on the grinding disc, the outer diameter of the wafer can be precisely ground, effectively reducing processing errors, improving the consistency of the outer diameter of the wafer and the surface finish, and meeting the needs of high-precision wafer production.

[0021] 2. The clamping assembly achieves double fixation through upper and lower clamping plates and suction cups. The electric telescopic rod can precisely adjust the clamping force, which can ensure that the wafer does not shift during the grinding process and avoid wafer breakage due to excessive clamping force. The rotating disk rotates synchronously with the wafer, reducing friction between the wafer and the clamping structure, further protecting the wafer surface from scratches and reducing production losses. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the internal structure of this utility model;

[0024] Figure 3 This is a cross-sectional view of the drive mechanism and clamping assembly structure of this utility model;

[0025] Figure 4 This is a schematic diagram of the grinding assembly structure of this utility model.

[0026] Legend:

[0027] 1. Frame; 2. Base plate; 3. Support plate; 4. Protective shell; 5. Drive mechanism; 6. Clamping assembly; 7. Tumbling assembly; 501. Drive motor; 502. Screw; 503. Sliding block; 504. Hydraulic rod; 601. Sliding disc; 602. Upper clamping plate; 603. Lower clamping plate; 604. Rotating disc; 605. Suction cup; 606. Rotary motor; 607. Drive wheel; 608. Driven wheel; 609. Electric telescopic rod; 701. Tumbling disc; 702. Rotating column; 703. Tumbling motor; 704. Drive gear; 705. Driven gear. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] Example 1:

[0032] like Figures 1 to 4 As shown in the figure, this embodiment provides an outer diameter grinding device for wafer production, including a frame 1. The frame 1 is rectangular, and a base plate 2 and a support plate 3 are bolted to the bottom of the frame 1. The base plate 2 is placed below the support plate 3. A driving mechanism 5 is provided at the upper end of the frame 1. The driving mechanism 5 is used to drive the clamping assembly 6 to move. The lower part of the driving mechanism 5 is connected to the upper part of the clamping assembly 6. The clamping assembly 6 is used for clamping and rotating the wafer. A grinding assembly 7 is provided on the side of the support plate 3 away from the driving mechanism 5. The grinding assembly 7 is used for grinding the wafer. A protective shell 4 is provided on the outer side of the frame 1 for the protection of the device.

[0033] In this embodiment, the drive mechanism 5, the clamping assembly 6, and the grinding assembly 7 constitute an outer diameter grinding device for wafer production according to this application.

[0034] It should also be noted that the wafer in this application can be a silicon-based wafer, a silicon carbide wafer, a gallium nitride wafer, etc. Figure 1 In this embodiment, a silicon-based wafer is used as an example for description. Of course, other types of wafers can also adopt a similar structure, which will not be repeated hereafter.

[0035] Understandable Figure 1The diagram only schematically illustrates some of the components of the outer diameter grinding apparatus; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 Due to limitations, the outer diameter grinding device can also include, compared to... Figure 1 More or fewer parts.

[0036] Furthermore, in this embodiment, the frame 1 provides overall support, the base plate 2 and the support plate 3 form a double-layer load-bearing structure, the protective shell 4 isolates the external environment, and the drive mechanism 5, clamping assembly 6 and grinding assembly 7 work together to achieve wafer positioning, clamping and grinding, ensuring the stability of the device structure, avoiding external impurities from interfering with the processing, and providing a foundation for subsequent precise processing.

[0037] Specifically, the drive mechanism 5 includes a drive motor 501, which is located on one side of the frame 1 and its output shaft is connected to a screw 502. One side of the screw 502 is threadedly connected to a sliding block 503, and the two ends of the sliding block 503 slide on both sides of the frame 1.

[0038] In this embodiment, the output shaft of the drive motor 501 drives the screw 502 to rotate. The screw 502 is converted into the horizontal linear motion of the sliding block 503 through thread transmission, so as to realize the smooth movement of the sliding block 503, provide power for the clamping assembly 6 to adjust the horizontal position, and ensure the movement accuracy.

[0039] Specifically, the upper end of the hydraulic rod 504 is connected to the middle of the lower surface of the sliding block 503, and the lower end of the hydraulic rod 504 is a telescopic end.

[0040] As a preferred implementation, the extension and retraction of the hydraulic rod 504 drives the clamping assembly 6 connected to the lower end to rise and fall in the vertical direction, precisely adjusting the height of the clamping assembly 6 and the wafer to adapt to the processing position requirements of different grinding grooves of the grinding assembly 7.

[0041] Example 2:

[0042] A clamping component 6 is provided based on embodiment 1.

[0043] Specifically, the clamping assembly 6 includes a sliding disk 601, which slides above the hydraulic rod 504. The lower surface of the sliding disk 601 is connected to the upper end of the driving end of the electric telescopic rod 609 on both sides, and the lower end of the driving end of the electric telescopic rod 609 is connected to the upper surface of the upper clamping plate 602. The telescopic end of the electric telescopic rod 609 passes through the upper clamping plate 602 and is connected to the upper surface of the lower clamping plate 603.

[0044] In this embodiment, the telescopic end of the electric telescopic rod 609 extends and retracts, causing the lower clamping plate 603 to move closer to or further away from the upper clamping plate 602, thereby clamping and releasing the wafer. By clamping the wafer in both directions, the wafer is fixed, avoiding wafer displacement caused by clamping on one side. At the same time, the clamping distance can be adjusted according to the wafer thickness.

[0045] Specifically, a rotating disk 604 is rotatably connected to the middle of the lower surface of the upper clamping plate 602 and the middle of the upper surface of the lower clamping plate 603. A suction cup 605 is provided on the side of the rotating disk 604 away from the upper clamping plate 602 and the lower clamping plate 603. A rotary motor 606 is provided on one side of the upper surface of the upper clamping plate 602. The output shaft of the rotary motor 606 is connected to a drive wheel 607. The drive wheel 607 meshes with a driven wheel 608. The driven wheel 608 is connected to the upper end of the rotating disk 604 on the lower surface of the upper clamping plate 602.

[0046] With this configuration, the suction cups 605 are made of silicone and arranged in a ring array. The output of the rotary motor 606 drives the drive wheel 607 to rotate. The drive wheel 607 drives the driven wheel 608 to rotate through gear meshing. The driven wheel 608 drives the rotating disk 604 and the wafers adsorbed by the suction cups 605 to rotate, so that the wafers rotate around their own axis. This, together with the grinding assembly 7, forms a reverse motion. At the same time, the suction cups 605 enhance the stability of the wafer fixation and prevent the wafers from slipping during processing.

[0047] Example 3:

[0048] A grinding assembly 7 is provided based on embodiment 2.

[0049] Specifically, the grinding assembly 7 includes a grinding disc 701, which has multiple grinding grooves and a rotating column 702 connected to its lower surface. The lower end of the rotating column 702 passes through the support plate 3 and is rotatably connected to the upper surface of the base plate 2.

[0050] The rotating column 702 drives the grinding disc 701 to rotate around its own axis. The wafer contacts the grinding groove of the grinding disc 701 to achieve outer diameter grinding. Wafers with different precision requirements can be processed through multiple grinding grooves to ensure that the outer diameter of the wafer is in full contact with the grinding surface.

[0051] Specifically, a tumbling motor 703 is provided on one side of the upper surface of the base plate 2. The output shaft of the tumbling motor 703 is connected to a drive gear 704. The drive gear 704 meshes with a driven gear 705. The driven gear 705 is connected to the lower part of the rotating column 702.

[0052] In this embodiment, the output of the grinding motor 703 drives the drive gear 704 to rotate. The drive gear 704 drives the driven gear 705 to rotate through gear meshing. The driven gear 705 drives the rotating column 702 and the grinding disc 701 to rotate, providing stable rotational power to the grinding disc 701, ensuring that the grinding disc 701 rotates at a uniform speed, and improving the surface finish of the wafer grinding.

[0053] In actual use, the wafer is first placed on the rotating disk 604 rotatably connected to the upper surface of the lower clamping plate 603. At this time, the lower surface of the wafer contacts the suction cup 605 provided on the rotating disk 604. Then, the electric telescopic rod 609 is activated. The telescopic end of the electric telescopic rod 609 drives the lower clamping plate 603 to rise, so that the upper surface of the wafer contacts the suction cup 605 provided on the rotating disk 604 rotatably connected to the lower surface of the upper clamping plate 602. After the wafer is stable, the grinding motor 703 is started. The output of the grinding motor 703... The output shaft drives the drive gear 704 to rotate. Because the drive gear 704 meshes with the driven gear 705, the drive gear 704 drives the driven gear 705 to rotate. The driven gear 705 drives the rotating column 702 to rotate, thereby causing the grinding disc 701 to rotate. Then, the rotary motor 606 is started. The output shaft of the rotary motor 606 drives the drive wheel 607 to rotate. Because the drive wheel 607 meshes with the driven wheel 608, the drive wheel 607 drives the driven wheel 608 to rotate. The driven wheel 608 drives the upper clamping plate. The rotating disk 604, rotatably connected to the lower surface of the upper clamping plate 602, rotates, thus securing the wafer firmly in the chuck 605. The rotation of the rotating disk 604 on the lower surface of the upper clamping plate 602 causes the wafer and the rotating disk 604 on the upper surface of the lower clamping plate 603 to rotate. At this time, the wafer and the grinding disk 701 rotate in opposite directions. Depending on the need for grinding the wafer, the hydraulic rod 504 is activated. The output shaft of the hydraulic rod 504 drives the upper clamping plate 602 to rise and fall. Meanwhile, the sliding disk 601 is at the drive end of the hydraulic rod 504. The sliding mechanism is used for guidance. After the wafer is adjusted to the appropriate height, the drive motor 501 is started. The output shaft of the drive motor 501 drives the screw 502 to rotate. The rotation of the screw 502 drives the threaded sliding block 503 to move. At this time, the two ends of the sliding block 503 slide on both sides of the frame 1. The movement of the sliding block 503 drives the clamping assembly 6 and the wafer to contact the grinding groove on the grinding disk 701 for grinding. After the grinding is completed, the drive motor 501 is started to move the wafer away from the grinding disk 701, and then the wafer can be taken out.

[0054] The drive motor 501, hydraulic rod 504, rotary motor 606, electric telescopic rod 609, and tumbling motor 703 are all electrically connected to the PLC controller. The PLC controller is electrically connected to an external power supply. The PLC controller facilitates the power supply control of the electrical equipment, ensuring that the equipment can be powered on when needed, thus avoiding the situation where power cannot be supplied when power is required.

[0055] It should be noted that the controller can be a conventional known device that is controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific embodiments of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0056] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An outer diameter grinding apparatus for wafer production, characterized in that: The device includes a frame (1), which is rectangular and has a base plate (2) and a support plate (3) connected to its lower part by bolts. The base plate (2) is placed below the support plate (3). A drive mechanism (5) is provided at the upper end of the frame (1). The drive mechanism (5) is used to drive the clamping assembly (6) to move. The lower part of the drive mechanism (5) is connected to the upper part of the clamping assembly (6). The clamping assembly (6) is used for clamping and rotating the wafer. A grinding assembly (7) is provided on the side of the support plate (3) away from the drive mechanism (5). The grinding assembly (7) is used for grinding the wafer. A protective shell (4) is provided on the outer side of the frame (1) for the protection of the device.

2. The outer diameter grinding device for wafer production according to claim 1, characterized in that: The drive mechanism (5) includes a drive motor (501), which is located on one side of the frame (1) and its output shaft is connected to a screw (502). A sliding block (503) is threadedly connected to one side of the screw (502), and the two ends of the sliding block (503) slide on both sides of the frame (1).

3. The outer diameter grinding device for wafer production according to claim 2, characterized in that: The upper end of the hydraulic rod (504) is connected to the middle of the lower surface of the sliding block (503), and the lower end of the hydraulic rod (504) is the telescopic end.

4. The outer diameter grinding device for wafer production according to claim 3, characterized in that: The clamping assembly (6) includes a sliding disk (601), which slides above the hydraulic rod (504). The lower surface of the sliding disk (601) is connected to the upper end of the driving end of the electric telescopic rod (609) on both sides, and the lower end of the driving end of the electric telescopic rod (609) is connected to the upper surface of the upper clamping plate (602). The telescopic end of the electric telescopic rod (609) passes through the upper clamping plate (602) and is connected to the upper surface of the lower clamping plate (603).

5. The outer diameter grinding apparatus for wafer production according to claim 4, characterized in that: A rotating disk (604) is rotatably connected to the middle of the lower surface of the upper clamping plate (602) and the middle of the upper surface of the lower clamping plate (603). A suction cup (605) is provided on the side of the rotating disk (604) away from the upper clamping plate (602) and the lower clamping plate (603). A rotary motor (606) is provided on one side of the upper surface of the upper clamping plate (602). The output shaft of the rotary motor (606) is connected to a drive wheel (607). The drive wheel (607) meshes with a driven wheel (608). The driven wheel (608) is connected to the upper end of the rotating disk (604) on the lower surface of the upper clamping plate (602).

6. The outer diameter grinding apparatus for wafer production according to claim 5, characterized in that: The grinding assembly (7) includes a grinding disc (701), which has multiple grinding grooves and a rotating column (702) connected to the lower surface of the grinding disc (701). The lower end of the rotating column (702) passes through the support plate (3) and is rotatably connected to the upper surface of the base plate (2).

7. The outer diameter grinding apparatus for wafer production according to claim 6, characterized in that: A tumbling motor (703) is provided on one side of the upper surface of the base plate (2). The output shaft of the tumbling motor (703) is connected to the drive gear (704). The drive gear (704) meshes with the driven gear (705). The driven gear (705) is connected to the bottom of the rotating column (702).

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