Rotary centrifugal chip cold sintering defoaming clamp

Abstract

A rotary centrifugal chip cold insert embedding defoaming clamp. It relates to the technical field of semiconductors. The utility model discloses a threaded adjustable connection with the glue blocking box. Start the rotary platform, and the rotary platform starts to rotate, and drives the glue blocking box to make rotary motion, and the bubbles in the epoxy resin glue in the box are "flung" to the edge of the chip sample under the centrifugal force and discharged from the inner wall of the glue blocking box, the clamp structure is simple, can work simultaneously in multiple stations, only needs to dress sample and starts heating sheet and power output mechanism in the operation process, therefore, the production process operation is simple and high in efficiency, and high in efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a rotary centrifugal chip cold mounting defoaming fixture. Background Technology

[0002] Chip failure analysis, a core component of semiconductor quality control, involves key steps such as unpacking, cross-section preparation, and microscopic observation. Among these, cold mounting, a crucial preliminary process for physical failure analysis, involves embedding and fixing the chip sample in epoxy resin, providing a stable structural support for subsequent grinding, polishing, and microscopic observation. Its quality directly determines the integrity of the cross-sectional structure, especially critical for observing nanoscale defects (such as metal electromigration cracks and gate oxide breakdown) in advanced process chips. However, with increasing chip integration and complex packaging structures, the precision requirements for sample preparation are becoming increasingly stringent. On the one hand, if bubbles accumulate at the interface between the sample and the resin, they will weaken the protective force of the embedding layer on brittle materials, leading to chip edge peeling or IMC layer (intermetallic compound) breakage during the polishing process, resulting in the loss of key failure evidence. On the other hand, porous or crack-sensitive materials (such as low-K dielectric layers) may suffer from insufficient mechanical strength of the inserts due to air bubbles, making them prone to displacement or breakage during cutting. Therefore, it is essential to ensure that the resin filling process is free of air bubbles and stress damage to guarantee the accuracy and reliability of the analysis. Currently, common defoaming methods include: 1. Manual vibration defoaming: This method relies on the operator's experience. Uneven force can easily introduce new bubbles or damage the chip's microstructure. In addition, the sample processing time is long and the probability of rework is high.

[0003] 2. Vacuum impregnation defoaming: This method has high equipment costs, complex operation, limited effectiveness on porous samples, and is only used in large laboratories, making it difficult to popularize.

[0004] 3. Adding defoamer to remove foam poses a risk of contaminating the chip surface and interfering with the accuracy of subsequent EDS or XPS elemental analysis, potentially leading to misinterpretation of elemental analysis results as sulfur corrosion or halogen contamination.

[0005] Therefore, in the process of cold mounting sample preparation for chip failure analysis, how to design a defoaming fixture that is simple to operate, efficient, and low in cost is a technical problem that urgently needs to be solved in this case. Utility Model Content

[0006] To address the above problems, this utility model provides a rotary centrifugal chip cold embedding defoaming fixture with a compact structure and simple and efficient operation.

[0007] The technical solution of this utility model is: A rotary centrifugal chip cold mounting defoaming fixture includes: A rotating platform is located on top of a rotating mechanism and is driven to rotate by the rotating mechanism. Multiple adhesive-blocking boxes are provided and can be detachably and fixedly installed on the top of the rotating platform, with receiving cavities having top openings; The clamping plug is adjustablely and fixedly installed on the side of the adhesive blocking box, with its head end located outside the adhesive blocking box and its tail end extending into the receiving cavity to fit the side of the cover glass.

[0008] Specifically, the rotating mechanism includes a rotary cylinder or an electric rotary table.

[0009] Specifically, the top surface of the rotating platform is provided with multiple tenon joints; The bottom of the adhesive-resistant box is provided with a slot that fits the mortise.

[0010] Specifically, the cross-section of the falcon root has a structure that is wider at the top and narrower at the bottom.

[0011] Specifically, the bottom surface of the rotating platform is a plane.

[0012] Specifically, the bottom surface of the rotating platform is equipped with heating elements.

[0013] Specifically, the rotating platform is provided with multiple heat-conducting holes.

[0014] Specifically, the depth of the cavity is less than the height of the chip sample.

[0015] Specifically, the chip sample includes a substrate, a chip, an adhesive layer, and a cover glass sheet connected in sequence from bottom to top.

[0016] Specifically, a pair of clamping plugs are provided, which are adjustablely connected to the resist box via threads. When the rotating platform is started, it begins to rotate, causing the resist box to rotate as well. Air bubbles in the epoxy resin adhesive inside the box are "thrown" to the edge of the chip sample and discharged from the inner wall of the resist box under centrifugal force. The fixture structure is simple, allowing multiple stations to work simultaneously. During operation, only sample loading and activation of the heating element and power output mechanism are required, making the production process simple, efficient, and highly effective. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the distribution structure of the falcon roots on the rotating platform; Figure 3 This is a schematic diagram of a chip placed inside a resist box. The arrows in the adhesive layer indicate the direction in which air bubbles move under centrifugal force. Figure 4 This is a schematic diagram of the structure of air bubbles in the glue layer after a period of centrifugal force. Figure 5This is a schematic diagram of the structure of air bubbles in the glue layer after centrifugal force is applied; In the diagram, 100 represents the rotating platform, 110 represents the tenon joint, and 120 represents the heating element. 200 is the rotating mechanism, 300 is the adhesive resist box, 400 is the clamping plug, 510 is the cover glass, 520 is the adhesive layer, 530 is the chip, and 540 is the substrate. Detailed Implementation

[0018] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0019] In the description of this utility model, it should be understood that the terms "upper," "lower," "left," "right," "vertical," "horizontal," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] The following is for reference. Figure 1-5 Description according to this utility model; A rotary centrifugal chip cold mounting defoaming fixture includes: A rotating platform 100 is mounted on top of a rotating mechanism 200 and is driven to rotate by the rotating mechanism 200. Multiple adhesive-blocking boxes 300 are provided and can be detachably and fixedly installed on the top of the rotating platform 100. Each box has a receiving cavity with a top opening. The adhesive-blocking box 300 can be made of metal or non-metal, preferably a porous hydrophobic polymer material. The clamping plug 400 is adjustablely and fixedly installed on the side of the adhesive blocking box 300, with its head end located outside the adhesive blocking box 300 and its tail end extending into the receiving cavity to fit the side of the cover glass 510.

[0022] The rotating mechanism includes a rotary cylinder or an electric rotary table.

[0023] The top surface of the rotating platform 100 is provided with multiple tenon joints 110; The bottom of the adhesive-resistant box 300 is provided with a slot that is compatible with the ferrule 110.

[0024] The cross-section of the 110-type ferrule has a structure that is wider at the top and narrower at the bottom.

[0025] The bottom surface of the rotating platform 100 is a flat plane.

[0026] The bottom surface of the rotating platform 100 is equipped with heating elements 120.

[0027] The rotating platform 100 is equipped with multiple heat conduction holes.

[0028] The depth of the cavity is less than the height of the chip sample.

[0029] The chip sample includes a substrate 540, a chip 530, an adhesive layer 520, and a cover glass 510 connected sequentially from bottom to top.

[0030] A pair of clamping plugs 400 are provided, which are adjustablely connected to the adhesive-resistant box 300 via threads.

[0031] This device uses centrifugal force to eliminate air bubbles in chip samples (“substrate-chip-adhesive-cover glass” structure) embedded and fixed with epoxy resin adhesive. The specific implementation steps and principles are as follows: 1. Place the chip sample, which has been coated with epoxy resin and embedded, into the breathable adhesive barrier box 300, and tighten the clamping plug 400 (the clamping plug not only prevents the coverslip from flying out during rotation, but also limits the distance between the coverslip and the chip, preventing the adhesive from accumulating on one side during rotation and causing cavitation on the other side to form persistent bubbles). 2. Select a tenon 110 on the surface of a rotating platform 100 and insert the tenon 110 into the groove at the bottom of the adhesive blocking box 300 to fix the adhesive blocking box 300 (the tenon position on the rotating platform in this case is set to an eccentric position in order to avoid the air bubbles at the center of rotation from being unable to be discharged due to the lack of centrifugal force after the platform rotates). 3. The heating element 120 is activated. The heat emitted by the heating element 120 passes through the rotating platform 100, the substrate 540 and the chip 530, and is finally conducted into the epoxy adhesive. The viscosity of the adhesive decreases and its fluidity increases. The resistance of air bubbles moving in the adhesive decreases (the air bubbles in the adhesive come from: large air bubbles visible to the naked eye during the chip cold mounting sample preparation process and tiny air bubbles dissolved in the adhesive that precipitate and aggregate under heat). 4. Start the rotating platform 100. The rotating platform 100 starts to rotate and drives the resist box 300 to rotate. The air bubbles in the epoxy resin adhesive inside the box are "thrown" to the edge of the chip sample and discharged from the inner wall of the resist box 300 under the action of centrifugal force. The air bubbles are eliminated. After the adhesive has cured, the sample is removed. The cold mounting of the chip sample is completed.

[0032] Regarding the information disclosed in this case, the following points need to be clarified: (1) The accompanying drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design. (2) Where there is no conflict, the embodiments and features disclosed in this case can be combined with each other to obtain new embodiments; The above are merely specific embodiments disclosed in this case, but the scope of protection of this disclosure is not limited thereto. The scope of protection disclosed in this case shall be determined by the scope of protection of the claims.

Claims

1. A rotary centrifugal chip cold mounting defoaming fixture, characterized in that, include: A rotating platform (100) is set on top of a rotating mechanism (200) and is driven to rotate by the rotating mechanism (200); Multiple adhesive-resistant boxes (300) are provided and are detachably and fixedly mounted on the top of the rotating platform (100), and have receiving cavities with top openings; The clamping plug (400) is adjustable and fixedly installed on the side of the adhesive blocking box (300), with its head end located outside the adhesive blocking box (300) and its tail end extending into the receiving cavity to fit the side of the cover glass (510).

2. The rotary centrifugal chip cold mounting defoaming fixture according to claim 1, characterized in that, The rotating mechanism includes a rotary cylinder or an electric rotary table.

3. The rotary centrifugal chip cold mounting defoaming fixture according to claim 1, characterized in that, The top surface of the rotating platform (100) is provided with multiple ferrules (110). The bottom of the adhesive-resistant box (300) is provided with a slot that is compatible with the ferrule (110).

4. The rotary centrifugal chip cold mounting defoaming fixture according to claim 3, characterized in that, The cross-section of the falcon root (110) has a structure that is wider at the top and narrower at the bottom.

5. The rotary centrifugal chip cold mounting defoaming fixture according to claim 1, characterized in that, The bottom surface of the rotating platform (100) is a plane.

6. The rotary centrifugal chip cold mounting defoaming fixture according to claim 1, characterized in that, The bottom surface of the rotating platform (100) is provided with heating elements (120).

7. The rotary centrifugal chip cold mounting defoaming fixture according to claim 1, characterized in that, The rotating platform (100) is provided with multiple heat conduction holes.

8. The rotary centrifugal chip cold mounting defoaming fixture according to claim 1, characterized in that, The depth of the cavity is less than the height of the chip sample.

9. A rotary centrifugal chip cold mounting defoaming fixture according to claim 8, characterized in that, The chip sample comprises a substrate (540), a chip (530), an adhesive layer (520), and a cover glass (510) connected sequentially from bottom to top.

10. A rotary centrifugal chip cold mounting defoaming fixture according to claim 1, characterized in that, The clamping plugs (400) are provided in pairs and are adjustablely connected to the adhesive-resistant box (300) by threads.

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