Packaging device for a sensor chip

Abstract

The utility model relates to sensor chip processing technical field, concretely is the packaging device of sensor chip, including lower mould, the upper side of lower mould is provided with the upper mould of liftable setting, and the upper mould and lower mould are set up on cooperation and have the mould groove, the bottom of lower mould is provided with epoxy resin block feed pipe, and the bottom between epoxy resin block feed pipe and lower mould on mould groove is set up with infusion groove between the communication, and the discharge end of epoxy resin block feed pipe is installed electric heating spare, and the below of epoxy resin block feed pipe is provided with push -out block, and is provided with push -out structure in cooperation with push -out block, and the inside top of upper mould and the inside bottom of lower mould all set up have the serpentine cooling circuit, and the both ends of serpentine cooling circuit form cooling liquid inlet pipe and cooling liquid outlet pipe respectively, the utility model has the beneficial effect that the utility model can improve sensor chip after the cooling setting effect and efficiency of effect of encapsulation, and, improve the encapsulation effect.

Description

Technical Field

[0001] This utility model relates to the field of sensor chip processing technology, specifically to a sensor chip packaging device. Background Technology

[0002] In the manufacturing process of sensor chips, the packaging process is crucial. It involves wrapping the chip with a molding compound (such as epoxy resin) to isolate it from the external environment and prevent the internal circuitry from getting damp, oxidized, or mechanically damaged.

[0003] Traditional packaging technology commonly uses a molding process, in which epoxy resin blocks are heated and liquefied, then injected into a mold, molded, and cooled to set. However, existing technologies suffer from low cooling efficiency and uneven temperature distribution, which can easily lead to shrinkage and deformation of the package or internal stress concentration, affecting the stability of chip performance.

[0004] For example, Chinese patent document CN222106608U discloses a chip molding and cooling curing structure that uses an air-cooling solution. However, relying solely on airflow for heat dissipation makes it difficult to achieve rapid and uniform cooling, and cleaning the mold cavity after packaging requires manual handling, leaving residual debris that can easily contaminate subsequent products. Therefore, there is an urgent need for a packaging structure that integrates efficient cooling and automated cleaning to improve the packaging quality, production efficiency, and yield of sensor chips. Utility Model Content

[0005] The purpose of this invention is to provide a packaging device for sensor chips to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a sensor chip packaging device, including a lower mold, an upper mold that is vertically movable above the lower mold, mold grooves that mate with each other on the upper and lower molds, an epoxy resin block feed pipe at the bottom of the lower mold, a liquid delivery tank that connects the epoxy resin block feed pipe to the bottom of the mold groove on the lower mold, an electric heating element installed at the outlet end of the epoxy resin block feed pipe, a pushing block below the epoxy resin block feed pipe, and a pushing structure that mates with the pushing block, a serpentine cooling circuit being formed at the top inside the upper mold and the bottom inside the lower mold, with a coolant inlet pipe and a coolant outlet pipe forming at both ends of the serpentine cooling circuit.

[0007] The present invention is further configured to include a workbench, a support frame is provided on one side of the workbench, an electric push rod is provided on the support frame, and the upper mold is installed at the bottom output end of the electric push rod. When the electric push rod is started, the descent of the upper mold can be controlled by the electric push rod, and the upper mold and the lower mold are closed to form a plastic sealing cavity.

[0008] The present invention is further configured such that a packaging platform is provided on the workbench, and the bottom end of the epoxy resin block feed pipe extends to the bottom of the packaging platform.

[0009] The present invention is further configured such that the pushing structure includes an electric cylinder, a receiving groove is provided on the worktable, the electric cylinder is installed in the receiving groove, and the pushing block is installed at the output end of the electric cylinder and can be stored in the receiving groove. When feeding the epoxy resin block, the epoxy resin block is aligned and placed below the epoxy resin block feeding pipe. This process can be achieved by existing technology and will not be described in detail in the present invention. The electric cylinder is activated, and the pushing block is moved by controlling the electric cylinder, so that the pushing block pushes the epoxy resin block into the epoxy resin block feeding pipe, and is heated by an electric heating element. The electric heating element can be an electric heating wire or an electric heating tube structure, both of which are existing heating structures. After the epoxy resin block is heated and melted by the electric heating element, under the pushing action of the pushing block, the melted epoxy resin liquid is transported through the liquid delivery tank to the mold groove after the mold is closed, so that the epoxy resin liquid completely fills the cavity formed after the upper mold and the lower mold are closed, thereby realizing the plastic encapsulation operation of the sensor chip located therein.

[0010] The present invention is further configured such that a purging frame is provided between the upper mold and the lower mold, a purging pipe is provided on the purging frame, and an air blowing head is provided on the purging pipe. A moving drive structure is provided on the packaging platform in conjunction with the purging frame, and the input end of the purging pipe is connected to an external dry and clean air source through a flexible hose structure. In this way, the purging and cleaning of the sensor chip can be realized after unloading after one packaging, avoiding the generation of debris residue during the packaging process.

[0011] The present invention is further configured such that the moving drive structure includes a ball screw, and a screw motor and a screw nut are provided in conjunction with the ball screw. The ball screw is mounted on the packaging platform through a bearing seat, and the blowing frame is mounted on the screw nut. When the screw motor is started, the operation of the ball screw can be controlled by the screw motor, so that the screw nut drives the blowing frame to move. The blowing frame carries the blowing pipe and moves. During this process, a clean and dry external air source is delivered to the blowing pipe and blown out through the air blower, thereby realizing the blowing of debris generated in the mold groove due to the packaging of the sensor chip. In the present invention, the air blower is preferably installed on the upper and lower sides of the blowing pipe, so that the mold groove in the upper mold and the lower mold can be simultaneously blown and cleaned during the movement, improving the effect of subsequent sensor packaging and avoiding poor sensor packaging sealing due to debris residue.

[0012] The present invention is further provided that the ball screw nut is provided with telescopic protective covers on both sides in conjunction with the ball screw. The telescopic protective covers adopt a corrugated cover structure, which can enhance the protection of the ball screw during operation and prevent the ball screw from coming into contact with external dust.

[0013] The present invention is further configured such that the support frame is provided with a suction hood, and the suction hood is connected to a negative pressure dust collection device. The suction hood can absorb the debris generated by the sensor chip packaging blown out by the blow pipe, thus preventing the debris from splashing randomly or accumulating near the packaging platform, which would affect the subsequent sensor chip packaging effect.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. High-efficiency cooling, shaping, and precise packaging

[0016] This invention achieves rapid and uniform cooling of the epoxy resin molten material within the mold cavity by incorporating a serpentine cooling circuit inside the upper and lower molds, along with coolant inlet and outlet pipes. This significantly improves the efficiency of sensor chip packaging and shaping. Simultaneously, the synergistic effect of the electric push rod and the limiting telescopic rod ensures precise mold closing between the upper and lower molds, preventing packaging defects caused by misalignment. This allows the epoxy resin molten material to completely fill the mold cavity, forming a comprehensive encapsulation of the sensor chip, effectively improving packaging quality and product consistency.

[0017] 2. This invention achieves automatic feeding, melting, and injection of epoxy resin blocks through the cooperation of an electric cylinder-driven pushing block and an electric heating element, reducing manual intervention and improving production efficiency. After encapsulation, the blowing frame, in conjunction with a ball screw-driven moving structure, can automatically blow and clean the mold grooves of the upper and lower molds. Combined with a suction hood and negative pressure dust collection equipment, residual debris is effectively removed, avoiding secondary pollution. This integrated design not only ensures the cleanliness of the encapsulation environment but also extends the service life of the mold and reduces maintenance costs. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the sensor chip packaging device in this utility model. Figure 1 ;

[0019] Figure 2 This is a schematic diagram of the overall structure of the sensor chip packaging device in this utility model. Figure 2 ;

[0020] Figure 3 This is a cross-sectional schematic diagram of the fit structure between the upper mold, lower mold, epoxy resin block feed pipe and extrusion block in this utility model.

[0021] Figure 4 This is a cross-sectional view of the position and structure of the serpentine cooling circuit in this utility model;

[0022] Figure 5 This is a cross-sectional schematic diagram of the mating structure between the lower mold and the epoxy resin block feed pipe in this utility model;

[0023] Figure 6 This is a schematic diagram of the installation structure of the purge pipe in this utility model.

[0024] The components represented by each number in the attached diagram are listed below: 1. Lower mold; 2. Upper mold; 3. Mold groove; 4. Epoxy resin block feed pipe; 5. Liquid inlet tank; 6. Electric heating element; 7. Push block; 8. Serpentine cooling circuit; 9. Coolant inlet pipe; 10. Coolant outlet pipe; 11. Workbench; 12. Support frame; 13. Electric push rod; 14. Sealing platform; 15. Electric cylinder; 16. Receiving tank; 17. Blowing frame; 18. Blowing pipe; 19. Air blower; 20. Ball screw; 21. Screw motor; 22. Screw nut; 23. Telescopic protective cover; 24. Suction hood. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] This utility model provides a technical solution: Please refer to Figures 1-6 The sensor chip packaging device includes a lower mold 1, an upper mold 2 that can be lifted and lowered above the lower mold 1, mold grooves 3 that are formed on the upper mold 2 and the lower mold 1, an epoxy resin block feed pipe 4 that is provided at the bottom of the lower mold 1, a liquid delivery tank 5 that is connected between the epoxy resin block feed pipe 4 and the bottom of the mold groove 3 on the lower mold 1, an electric heating element 6 that is installed at the outlet end of the epoxy resin block feed pipe 4, a pusher block 7 that is provided below the epoxy resin block feed pipe 4 and a pusher structure that is provided in conjunction with the pusher block 7, a serpentine cooling circuit 8 that is formed at the top inside the upper mold 2 and the bottom inside the lower mold 1, and a coolant inlet pipe 9 and a coolant outlet pipe 10 that are formed at the two ends of the serpentine cooling circuit 8, respectively.

[0027] This utility model also includes a workbench 11, a support frame 12 is provided on one side of the workbench 11, an electric push rod 13 is provided on the support frame 12, the upper mold 2 is installed at the bottom output end of the electric push rod 13, the electric push rod 13 is started, the lowering of the upper mold 2 can be controlled by the electric push rod 13, and the mold is closed with the lower mold 1 to form a plastic sealing cavity.

[0028] This utility model has a packaging platform 14 on the workbench 11, and the bottom end of the epoxy resin block feed pipe 4 extends to the bottom of the packaging platform 14.

[0029] Please see Figures 1-6As one embodiment of the pushing structure: the pushing structure includes an electric cylinder 15, a receiving groove 16 is provided on the worktable 11, the electric cylinder 15 is installed in the receiving groove 16, and the pushing block 7 is installed at the output end of the electric cylinder 15 and can be stored in the receiving groove 16. When feeding the epoxy resin block, the epoxy resin block is aligned and placed below the epoxy resin block feed pipe 4. This process can be achieved by existing technology, which will not be described in detail in this utility model. The electric cylinder 15 is activated, and the pushing block 7 is moved by the electric cylinder 15, so that the pushing block 7 pushes the epoxy resin block into the worktable 11. The resin block is pushed into the epoxy resin block feed pipe 4 and heated by the electric heating element 6. The electric heating element 6 can be an electric heating wire or an electric heating tube, both of which are existing heating structures. After the epoxy resin block is heated and melted by the electric heating element 6, the melted epoxy resin liquid is transported through the liquid delivery tank 5 to the mold groove 3 after the mold is closed, so that the epoxy resin liquid completely fills the cavity formed after the upper mold 2 and the lower mold 1 are closed, thereby realizing the encapsulation operation of the sensor chip located therein.

[0030] This invention provides a blowing frame 17 between the upper mold 2 and the lower mold 1, with a blowing pipe 18 on the blowing frame 17 and an air blowing head 19 on the blowing pipe 18. The packaging platform 14 is equipped with a moving drive structure in conjunction with the blowing frame 17. The input end of the blowing pipe 18 is connected to an external dry and clean air source through a flexible hose structure. In this way, the blowing and cleaning of the sensor chip can be completed after unloading in one packaging process, avoiding the generation of debris residue during the packaging process.

[0031] Please see Figures 1-6 As one implementation of the moving drive structure: the moving drive structure includes a ball screw 20, and a screw motor 21 and a screw nut 22 are provided in conjunction with the ball screw 20. The ball screw 20 is mounted on the packaging platform 14 through a bearing seat. The blowing frame 17 is mounted on the screw nut 22. When the screw motor 21 is started, the operation of the ball screw 20 can be controlled by the screw motor 21, so that the screw nut 22 drives the blowing frame 17 to move. The blowing frame 17 carries the blowing pipe 18 to move. During this process, a clean and dry external air source is delivered to the blowing pipe 18 and blown out through the air blower 19, thereby realizing the blowing of debris generated in the mold groove 3 due to the packaging of the sensor chip. In this utility model, the air blower 19 is preferably installed on the upper and lower sides of the blowing pipe 18, so that the mold groove 3 in the upper mold and the lower mold can be simultaneously blown and cleaned during the movement, improving the effect of subsequent sensor packaging and avoiding poor sensor packaging sealing due to debris residue.

[0032] In this invention, telescopic protective covers 23 are provided on both sides of the ball screw nut 22 in conjunction with the ball screw 20. The telescopic protective covers 23 adopt a corrugated cover structure, which can enhance the protection of the ball screw 20 during operation and prevent the ball screw 20 from contacting external dust.

[0033] Please see Figures 1-6 As one implementation of the packaging stage 14: a suction hood 24 is provided on the other side of the support frame 12. The suction hood 24 is connected to a negative pressure dust collection device. The suction hood 24 can absorb the debris generated by the sensor chip packaging blown out by the blow pipe 18, so as to avoid the debris from splashing randomly or accumulating near the packaging stage 14, which would affect the subsequent sensor chip packaging effect.

[0034] In summary, the working principle and specific workflow of this utility model are as follows:

[0035] In use, the sensor chip to be packaged is placed in the mold groove 3 of the lower mold 1, and then the upper mold 2 is lowered by the electric push rod 13 to engage with the lower mold 1.

[0036] The present invention preferably provides limiting telescopic rods on both sides of the electric push rod 13 to enhance the accuracy of the upper mold 2 during movement and achieve precise mold closing with the lower mold 1;

[0037] During this process, the epoxy resin block can be simultaneously aligned and placed below the epoxy resin block feed pipe 4. This process can be achieved through existing technology, and will not be described in detail in this utility model.

[0038] Start the electric cylinder 15, and control the pusher block 7 to move so that the pusher block 7 pushes the epoxy resin block into the epoxy resin block feed pipe 4, and heats it through the electric heating element 6.

[0039] The electric heating element 6 can be an electric heating wire or an electric heating tube, both of which are existing heating structures.

[0040] After the epoxy resin block is heated and melted by the electric heating element 6, after the upper mold 2 and the lower mold 1 are closed, the molten epoxy resin is transported to the mold groove 3 after the mold is closed by the pushing action of the pushing block 7. This allows the molten epoxy resin to completely fill the cavity of the mold groove 3 formed after the upper mold 2 and the lower mold 1 are closed, thereby achieving full coverage of the sensor chip located therein.

[0041] Afterwards, the coolant will be transported through the existing coolant circulation system to the corresponding serpentine cooling circuit 8 via the coolant inlet pipe 9. After circulation, it will be discharged through the coolant outlet pipe 10 to simultaneously heat exchange and cool down the upper mold 2 and the lower mold 1, so that the epoxy resin material in the mold groove 3 can be quickly cooled and shaped to realize the packaging operation of the sensor chip.

[0042] Here, both the coolant inlet pipe 9 and the coolant outlet pipe 10 are made of flexible hoses and connected to the existing coolant circulation system.

[0043] The design of the serpentine cooling circuit 8 increases the contact area between the coolant and the mold, significantly improving heat exchange efficiency;

[0044] Then, the upper mold 2 is controlled by the electric push rod 13, and the encapsulated sensor chip is taken out from the mold groove 3 to achieve demolding. This step can be achieved by existing technology, and will not be described in detail in this utility model.

[0045] Then, start the lead screw motor 21. The lead screw motor 21 can control the operation of the ball screw 20, so that the lead screw nut 22 drives the blowing frame 17 to move, and the blowing frame 17 carries the blowing pipe 18 to move.

[0046] During this process, clean and dry air from the outside is delivered to the blow pipe 18 and blown out through the blow head 19, thereby blowing out the debris generated by the sensor chip packaging in the mold groove 3 of the upper mold 2 and the lower mold 1. The blown debris can be sucked up by the suction hood 24 and transported to the external negative pressure dust collection equipment for collection.

[0047] This improves the cleanliness of the mold groove 3 during subsequent sensor chip packaging, avoids poor sealing due to debris residue, and improves the packaging effect of the sensor chip.

[0048] In this utility model, the operation of related electrical components such as motors and electric push rods can be controlled by a PLC control system according to a set program. The specific working process and working principle of this utility model have been described in detail. Based on the above working process and working principle, those skilled in the art should know the specific circuit connection relationship and implement it through existing technology. Furthermore, the circuit connection relationship between related electrical components and the specific driver program are not the subject of protection of this utility model, and this utility model will not elaborate on them.

[0049] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0050] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A sensor chip packaging device, comprising a lower mold (1), an upper mold (2) being vertically and movably disposed above the lower mold (1), and mold grooves (3) being formed on the upper mold (2) and the lower mold (1), characterized in that: The bottom end of the lower mold (1) is provided with an epoxy resin block feed pipe (4). A liquid delivery tank (5) is provided between the epoxy resin block feed pipe (4) and the bottom of the mold groove (3) on the lower mold (1). An electric heating element (6) is installed at the outlet end of the epoxy resin block feed pipe (4). A push block (7) is provided below the epoxy resin block feed pipe (4), and a push structure is provided in conjunction with the push block (7). A serpentine cooling circuit (8) is provided at the top inside of the upper mold (2) and the bottom inside of the lower mold (1). A coolant inlet pipe (9) and a coolant outlet pipe (10) are formed at both ends of the serpentine cooling circuit (8).

2. The sensor chip packaging device according to claim 1, characterized in that: Also includes A workbench (11) is provided with a support frame (12) on one side of the workbench (11), and an electric push rod (13) is provided on the support frame (12). The upper mold (2) is installed at the bottom output end of the electric push rod (13).

3. The sensor chip packaging device according to claim 2, characterized in that: A packaging platform (14) is provided on the workbench (11), and the bottom end of the epoxy resin block feed pipe (4) extends to the bottom of the packaging platform (14).

4. The sensor chip packaging device according to claim 3, characterized in that: The pushing structure includes an electric cylinder (15), and a receiving groove (16) is provided on the worktable (11). The electric cylinder (15) is installed in the receiving groove (16), and the pushing block (7) is installed at the output end of the electric cylinder (15) and can be stored in the receiving groove (16).

5. The sensor chip packaging device according to claim 3, characterized in that: A purge frame (17) is provided between the upper mold (2) and the lower mold (1). A purge pipe (18) is provided on the purge frame (17). An air blowing head (19) is provided on the purge pipe (18). A moving drive structure is provided on the packaging platform (14) in conjunction with the purge frame (17).

6. The sensor chip packaging device according to claim 5, characterized in that: The moving drive structure includes a ball screw (20), and a screw motor (21) and a screw nut (22) are provided in conjunction with the ball screw (20). The ball screw (20) is mounted on the encapsulation platform (14) through a bearing seat, and the blower (17) is mounted on the screw nut (22).

7. The sensor chip packaging device according to claim 6, characterized in that: The lead screw nut (22) is equipped with telescopic protective covers (23) on both sides in conjunction with the ball screw (20).

8. The sensor chip packaging device according to claim 5, characterized in that: The support frame (12) is provided with a suction hood (24), and the suction hood (24) is connected to a negative pressure dust collection device.

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