A sensor-embedded inner tube

Abstract

The application provides a built-in sensor inner tube and relates to the technical field of tire detection. The application discloses a built-in sensor inner tube, which relates to the technical field of tire detection and comprises an inner tube cylinder. The inner wall of the outer ring layer is provided with a flexible wrapping layer, the outer periphery of the flexible wrapping layer is adhesively fixed to the inner wall of the outer ring layer, a heat insulation packaging sensor is loaded in the flexible wrapping layer, the heat insulation packaging sensor is adhesively fixed to the inner wall of the outer ring layer, the flexible wrapping layer covers the top of the heat insulation packaging sensor, a vent is formed between the position of covering the heat insulation packaging sensor and the position of adhesively fixing the outer ring layer, and the opening size of the vent is smaller than the passing size of the heat insulation packaging sensor in any direction. The flexible wrapping layer prevents the sensor from falling off; the internal device of the heat insulation packaging sensor is always lower than 125 DEG C during the vulcanization process of the inner tube, the sensor in the flexible wrapping layer is directly contacted with the air pressure of the inner tube through the vent, and the air pressure and the tire temperature in the inner tube are truly fed back.

Description

Technical Field

[0001] This application relates to the field of tire inspection technology, and more specifically, to an inner tube with a built-in sensor. Background Technology

[0002] Currently, most sensors used in tire inner tubes are external sensors, which cannot accurately monitor inner tube temperature. Furthermore, external sensors often experience leaks due to aging of the sealing rings and frequent disassembly. However, the inner tube vulcanization process limits the use of internal sensors; traditional inner tube vulcanization requires a high-temperature environment of 170-180℃, while the sensor's electronic components will be permanently damaged at temperatures above 125℃.

[0003] Existing built-in sensor solutions include: (1) Disposable protective layer solution, such as Chinese invention patent CN118418625A, which discloses an inner tube with a built-in temperature and pressure sensor and its manufacturing process, including an inner tube body, a rubber protective shell on the inner side of the inner tube body, a base at the bottom of the rubber protective shell, and the rubber protective shell being fixed to the inner side of the inner tube body by the base; the rubber protective shell is provided with a groove, and a temperature and pressure sensor is provided in the groove, and the temperature and pressure sensor is provided with a wireless communication module, and the temperature and pressure sensor transmits the monitored temperature and pressure signals to an external device through the wireless communication module. This solution is based on the heat insulation foam sleeve that is pulverized by heat. After high-temperature vulcanization, the heat insulation foam sleeve is pulverized, thereby realizing temperature and pressure detection.

[0004] However, the heat insulation foam sleeve used in this solution is located in the position of the rubber protective shell with air vents during the vulcanization process. After it pulverizes, it will directly block the detection path of the temperature and pressure sensor, affecting the detection efficiency of the temperature and pressure sensor.

[0005] (2) Embedded in the tire, such as Chinese invention patent with publication number CN105034716A, which discloses a tire internal temperature and pressure detection device and detection method, including pre-embedding a wireless temperature sensor and a wireless pressure sensor in a designated position inside the tire, placing the tire with the sensors embedded in the vulcanizing mold, inserting the wireless signal transmitter into the signal line channel hole pre-drilled in the mold; connecting the wireless temperature collector and the wireless pressure collector to the controller respectively, and performing communication debugging with the wireless temperature sensor and the wireless pressure sensor respectively, and starting vulcanization after completing the communication debugging.

[0006] This solution directly insulates the tire with heat, but the sensor embedded inside the tire becomes a dissimilar material part in the tire's continuous structure. Its mechanical strength is poorly matched with the tire itself, forming stress concentration points that affect the tire's strength and lifespan. Furthermore, the deployment path itself also disrupts the tire's structural continuity. Summary of the Invention

[0007] To address the aforementioned issues, this application employs a technical solution of an inner tube with a built-in sensor, comprising an inner tube cylinder. The inner tube cylinder includes an inner ring layer and an outer ring layer. A flexible wrapping layer is provided on the inner wall of the outer ring layer. The outer periphery of the flexible wrapping layer is bonded and fixed to the inner wall of the outer ring layer. A heat-insulated and encapsulated sensor is loaded within the flexible wrapping layer. The heat-insulated and encapsulated sensor is bonded and fixed to the inner wall of the outer ring layer. The flexible wrapping layer covers the top of the heat-insulated and encapsulated sensor. A vent is provided between the position where the flexible wrapping layer covers the heat-insulated and encapsulated sensor and the position where it is bonded to the outer ring layer. The opening size of the vent is smaller than the passage size of the heat-insulated and encapsulated sensor in any direction.

[0008] Optionally, the original shape of the flexible wrapping layer before bonding and fixing is elliptical. Let the minor axis length of the flexible wrapping layer be L1 and the major axis length be L2. The dimensional ratios of the minor axis length L1 and the major axis length L2 of the flexible wrapping layer with the width L and height H of the heat-insulating encapsulated sensor are as follows: L1:(L+2H)=1.8~2.1; The ratio of the minor axis length L1 to the major axis length L2 of the flexible wrapping layer is as follows: L2:L1 = 1.2~1.3; When the flexible wrapping layer is bonded and fixed to the outer ring layer, the long axis of the flexible wrapping layer is aligned with the circumferential direction of the outer ring layer, and the short axis is perpendicular to the circumferential direction of the outer ring layer.

[0009] Optionally, the thermally insulated sensor includes a housing, inside which are disposed a power module, a communication module, a computing module, and a sensing module. The power module is connected to the power pins of the communication module, the computing module, and the sensing module respectively via wires.

[0010] Optionally, the sensing module includes a temperature sensor and a pressure sensor. The housing is provided with an air passage, which includes an external air passage, an air passage inlet, and an internal air passage in sequence according to the gas flow direction. The external air passage is a groove that extends from the side of the housing to the top surface of the housing and connects to the air passage inlet. The air passage, the vent, and the inner tube are interconnected. The detection heads of the temperature sensor and the pressure sensor are located in the internal air passage. The signal output terminals of the temperature sensor and the pressure sensor are connected to the corresponding interfaces of the computing module through wires.

[0011] Optionally, the power module includes a battery, the battery is wrapped with a heat insulation layer, the space between the heat insulation layer and the outer shell is filled with potting compound, the battery is separated from the communication module, the computing module and the sensing module by a heat insulation layer, and the heat insulation layer is fixed to the outer shell based on the potting compound.

[0012] Optionally, the communication module includes a Bluetooth chip and an antenna, and the computing module includes a printed circuit board with a computing chip mounted on it. The printed circuit board establishes a communication link between the computing chip and the Bluetooth chip, directly connecting the communication pins of the computing chip with the corresponding pins of the Bluetooth chip. Alternatively, the computing chip and the communication module may be different functional units of the same chip, connected through an internal bus.

[0013] Optionally, the flexible wrapping layer is made of the same material as the inner tube tube.

[0014] Optionally, the adhesive between the flexible wrapping layer and the inner tube is an organic silicone adhesive based on silicone rubber, and the adhesive between the heat-insulating encapsulated sensor and the inner wall of the outer ring is a silicone adhesive.

[0015] Optionally, the outer shell is made of polyetheretherketone (PEEK) material, the potting compound is a polyurethane potting compound including a main agent and a curing agent, the main agent is a hydroxyl-containing prepolymer, the curing agent is an isocyanate-containing prepolymer, and the insulation layer is made of aerogel with a three-dimensional network pore structure and a thickness of 3 mm or more.

[0016] The beneficial effects of the inner tube with a built-in sensor provided in this application are as follows: (1) The inner tube with built-in sensor provided in this application uses a flexible wrapping layer to wrap the sensor. The flexible wrapping layer can stretch as the inner tube is shaped, which effectively improves the effect of the rubber sleeve not being able to stretch on the thickness of the inner tube and prevents the sensor from falling off. (2) The flexible wrapping layer contains a sensor that is individually heat-insulated and encapsulated, so that the internal device of the sensor remains below 125°C during the inner tube vulcanization process, thus preventing damage to key devices such as the battery. (3) The sensor inside the flexible wrapping layer is brought into direct contact with the tire pressure through the vent, so as to provide real feedback on the tire pressure and temperature of the tire with inner tube. The sensor is located on the inner wall of the tire tread and can directly provide feedback on the tire status when driving. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0018] Figure 1 This is a side view of the inner tube end-spreading structure provided in an embodiment of this application; Figure 2 This is a front view of the inner tube end-spreading structure provided in the embodiment of this application; Figure 3 This is a schematic diagram of the inner tube tube connector after connection according to an embodiment of this application; Figure 4This is a three-dimensional schematic diagram of the fully bonded state of the flexible wrapping layer provided in the embodiments of this application; Figure 5 This is a schematic diagram of the inner tube inflation state after vulcanization, provided in an embodiment of this application. Figure 6 This is a cross-sectional view of the heat-insulated encapsulated sensor provided in the embodiments of this application; Figure 7 This is a side view of the heat-insulated encapsulated sensor provided in an embodiment of this application; Figure 8 This is a top view of the heat-insulated encapsulated sensor provided in the embodiments of this application; Figure 9 This is a perspective view of the heat-insulated encapsulated sensor provided in the embodiments of this application; Figure 10 This is a diagram of the original state of the flexible wrapping layer provided in the embodiments of this application.

[0019] Explanation of reference numerals in the attached diagram: 1-Valvet; 2-Inner tube; 3-Heat-insulated encapsulated sensor; 4-Flexible wrapping layer; 5-Tire tube connector; 6-Potent; 7-Heat insulation layer; 8-Antenna; 9-Bluetooth chip; 10-Outer shell; 11-External air passage; 12-Temperature and pressure chip; 13-Printed circuit board; 14-Battery; 15-Inner ring; 16-Outer ring; 17-Ventilation port; 18-Air passage inlet; 19-Airflow passage; 20-Internal air passage; 21-Pleats. Detailed Implementation

[0020] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0021] like Figures 1-6 As shown, this application provides an inner tube with a built-in sensor. The device includes an inner tube cylinder 2, which includes an inner ring layer 15 and an outer ring layer 16. A flexible wrapping layer 4 is provided on the inner wall of the outer ring layer 16. The outer periphery of the flexible wrapping layer 4 is bonded and fixed to the inner wall of the outer ring layer 16. A heat-insulating encapsulated sensor 3 is loaded inside the flexible wrapping layer 4. The heat-insulating encapsulated sensor 3 is bonded and fixed to the inner wall of the outer ring layer 16. The flexible wrapping layer 4 covers the top of the heat-insulating encapsulated sensor 3. A vent 17 is provided between the position where the flexible wrapping layer 4 covers the heat-insulating encapsulated sensor 3 and the position where it is bonded to the outer ring layer 16. The opening size of the vent 17 is smaller than the passage size of the heat-insulating encapsulated sensor 3 in any direction.

[0022] The flexible wrapping layer 4 provided on the inner wall of the outer ring layer 16 provides fixation for the heat-insulated encapsulated sensor 3, preventing it from falling off. The flexible wrapping layer 4 has a vent 17 between the position covering the heat-insulated encapsulated sensor 3 and the position where it is bonded to the outer ring layer 16. This not only fixes the heat-insulated encapsulated sensor 3, but also allows the temperature and pressure of the internal environment of the inner tube cylinder 2 to be transmitted to the heat-insulated encapsulated sensor 3 through the vent 17, ensuring the authenticity of the test results. The opening size of the vent 17 is smaller than the passage size of the heat-insulated encapsulated sensor 3, which can prevent the heat-insulated encapsulated sensor 3 from accidentally falling out of the flexible wrapping layer 4, thus balancing fixation and testing requirements.

[0023] During installation, before the inner tube cylinder 2 is joined, the opening of the inner tube cylinder 2 is opened from one end. On the inner wall opposite to the valve stem 1, the inner tube cylinder 2 is inserted approximately 200mm into the inner tube cylinder 2 from the opening. The inner wall of the inner tube cylinder 2 is sanded and adhesive is applied. The heat-insulated encapsulated sensor 3 is placed in the center of the applied adhesive, and a flexible wrapping layer 4 is placed on top. The periphery of the flexible wrapping layer 4 is bonded to the inner wall of the outer ring layer 16 of the inner tube cylinder 2. After the heat-insulated encapsulated sensor 3 and the flexible wrapping layer 4 are installed, the cylinder joining process is performed to obtain the cylinder joint 5.

[0024] The position and state of each structure after the inner tube and tire cylinder 2 are as follows: Figure 5 As shown in the diagram, this application uses a flexible wrapping layer 4 to embed the heat-insulating and encapsulated sensor 3 within the inner wall of the outer ring layer 16 of the inner tube barrel 2. This allows for direct contact with the air pressure inside the inner tube barrel 2, and after assembly into the outer tire, it can approach the tire crown area, providing more accurate feedback on actual tire temperature and pressure, and collecting tire crown-related data during tire operation. This effectively solves the problem of sensor detachment during inner tube production.

[0025] In another embodiment of this application, such as Figure 4 and Figure 10 As shown, the original shape of the flexible wrapping layer 4 before bonding and fixing is elliptical. Let the minor axis length of the flexible wrapping layer 4 be L1 and the major axis length be L2. The dimensional ratios of the minor axis length L1 and the major axis length L2 of the flexible wrapping layer 4 with the width L and height H of the heat-insulating encapsulated sensor 3 are as follows: L1:(L+2H)=1.8~2.1; The ratio of the minor axis length L1 to the major axis length L2 of the flexible wrapping layer 4 is as follows: L2:L1 = 1.2~1.3; When the flexible wrapping layer 4 is bonded and fixed to the outer ring layer 16, its major axis direction is consistent with the circumferential direction of the outer ring layer 16, and its minor axis direction is perpendicular to the circumferential direction of the outer ring layer 16. That is, the minor axis direction is consistent with the width direction of the outer ring layer 16. "Circumferential direction" refers to the direction in which the inner surface of the outer ring layer 16 is curled into a circle, which is also the length direction of the outer ring layer 16 (i.e., the direction of its length). Figure 1and Figure 4 (The arrow direction) "Width direction" refers to the direction perpendicular to the circumference of the outer ring layer 16 on the inner surface of the outer ring layer 16, which is also the axial direction of the inner tube barrel 2. This setting can reduce the size ratio of the flexible wrapping layer 4 to the outer ring layer 16 in the width direction, thereby reducing the influence of the setting of the flexible wrapping layer 4 on the stress of the inner tube barrel 2.

[0026] As a flexible pressure-bearing component, the inner tube, after inflation, experiences tensile principal stress in the circumferential direction (length direction) and secondary tensile stress in the axial direction (width direction) under internal pressure. During vehicle operation, the outer ring layer 16 of the inner tube also bears additional periodic tensile and relaxation stresses along its length. Therefore, the circumferential direction of the outer ring layer 16 is the primary stress direction. Thus, the flexible wrapping layer 4, based on its own deformation capacity, provides a better load-distribution capacity through its long axis than its short axis. Meanwhile, the bonding interface between the flexible wrapping layer 4 and the inner tube barrel 2 is a stress-weak area. This interface is prone to localized shear stress and peeling stress due to uneven load distribution. When the inner tube is subjected to circumferential tension, the shear stress at the bonding interface is mainly transmitted along the length direction. The major axis of the ellipse being along the length direction means that the bonding contact length between the flexible wrapping layer 4 and the inner tube barrel 2 is longer in this direction. Under the same circumferential load, a longer contact length can reduce the shear stress per unit area and reduce the risk of the flexible wrapping layer 4 peeling off.

[0027] like Figure 4 As shown, after the flexible wrapping layer 4 is bonded, the edge of the elliptical curve will encounter a length mismatch problem in the bonding area. The redundant length of the curve will form wrinkles 21 when it is attached to the table. Therefore, the bonding between the flexible wrapping layer 4 and the outer ring layer 16 is a local bonding. During bonding, the bonding area between the flexible wrapping layer 4 and the outer ring layer 16 should be maximized as much as possible. The part affected by the wrinkles 21 can be relaxed when the outer ring layer 16 is stretched and deformed, so as to alleviate the impact of the deformation of the outer ring layer 16 on the bonding part with the flexible wrapping layer 4.

[0028] In another embodiment of this application, such as Figures 6-8 As shown, the heat-insulated encapsulated sensor 3 includes a housing 10. Inside the housing 10, there are a power module, a communication module, a computing module, and a sensing module. The power module is connected to the power pins of the communication module, the computing module, and the sensing module respectively via wires (not shown in the figure).

[0029] In this embodiment, the power module’s wires pass through the heat insulation layer 7 and are connected to the power pins of the communication module, the computing module, and the sensing module respectively. The power source is the battery 14. The power source serves as the main energy source and supplies power to the three loads—the communication module, the sensing module, and the computing module—in parallel through the wires. The advantage of this power supply method is that there is no intermediate stage loss. The disadvantage is that it requires high voltage regulation performance and has low space utilization.

[0030] As another feasible implementation, the power module's wires pass through the heat insulation layer 7 to directly supply power to the printed circuit board 13. The printed circuit board 13 then distributes the power to the communication module and the sensing module respectively. The power supply only serves as the primary energy source, first supplying power to the computing module (the printed circuit board 13 equipped with the computing chip). The computing module integrates a power distribution unit, which then distributes the power to the communication module and the sensing module a second time. The power distribution unit of the computing module can perform secondary voltage regulation on the primary power supply, filtering out ripple and noise from the power bus. At the same time, it can isolate the load surges of the communication module and the sensing module, preventing them from affecting the core power supply of the computing module.

[0031] In another embodiment of this application, such as Figures 5-9 As shown, the sensing module includes a temperature sensor and a pressure sensor. The housing 10 is provided with an air passage. The air passage includes an external air passage 11, an air passage inlet 18, and an internal air passage 20 in sequence according to the gas flow direction. The external air passage 11 is a groove that extends from the side of the housing 10 to the top surface of the housing 10 and connects to the air passage inlet 18. The air passage and the air vent 17 are interconnected with the interior of the inner tube cylinder 2. The detection heads of the temperature sensor and the pressure sensor are located in the internal air passage 20. The signal output terminals of the temperature sensor and the pressure sensor are connected to the corresponding interfaces of the computing module through wires.

[0032] In this embodiment, the signals from the temperature sensor and pressure sensor are output to the temperature and pressure chip 12. The temperature and pressure chip refers to a miniaturized sensor chip that integrates temperature and pressure measurement functions. Its internal structure and driver are existing mature technologies and will not be described in detail here. Between the position where the flexible wrapping layer 4 wraps the heat-insulating encapsulated sensor 3 and the position where the flexible wrapping layer 4 is bonded to the outer ring layer 16, an airflow passage 19 is wrapped by the flexible wrapping layer 4. The gas inside the inner tube 2 enters the flexible wrapping layer 4 through the vent 17 and then directly enters the airflow passage 19. Then, it flows through the external air passage 11 opened on the outer shell 10, from the side of the outer shell 10 to the top surface of the outer shell 10, and then enters the internal air passage 20 through the air passage inlet 18, preventing the flexible wrapping layer 4 from covering the air passage inlet 18 and obstructing the gas flow.

[0033] The internal air passage 20, air passage inlet 18, external air passage 11, airflow passage 19, vent 17, and inner tube cylinder 2 are sequentially interconnected, allowing the detection heads of the temperature sensor and pressure sensor to directly contact the internal gas environment of the inner tube cylinder 2, thereby improving the accuracy of temperature and pressure data.

[0034] In another embodiment of this application, such as Figure 6As shown, the power module includes a battery 14, which is wrapped with a heat insulation layer 7. The heat insulation layer 7 and the outer shell 10 are filled with potting compound 6. The battery 14 is separated from the communication module, the computing module and the sensing module by the heat insulation layer 7. The heat insulation layer 7 and the outer shell 10 are fixed together by the potting compound 6.

[0035] In this embodiment, the potting compound 6 filling the space between the heat insulation layer 7 and the outer shell 10 is filled on the side of the heat insulation layer 7. At least two layers of heat insulation protection are formed between the battery 14 and the inner tube 2. The first layer of heat insulation protection is composed of the outer shell 10 (the outer shell at the bottom of the battery) wrapped around the battery 14 and the heat insulation layer 7. The second layer of heat insulation protection on the side of battery 14 consists of potting compound 6 and outer casing 10 (the outer casing on the side of the battery). The second layer of heat insulation protection on the top surface of battery 14 is composed of... Figure 6 The sealed space is formed by the outer shell 10, potting compound 6 and heat insulation layer 7 shown above. This sealed space is sealed from the internal air passage 20, and only the detection heads of the temperature sensor and pressure sensor are exposed in the internal air passage 20.

[0036] The printed circuit board 13, antenna 8, Bluetooth chip 9, and temperature and pressure chip 12 are located inside the second layer of thermal insulation protection and are thermally protected by the outer casing 10. The potting compound 6 between the battery 14 and the casing 10, in addition to blocking heat, also serves to fix the relative positions of the battery 14, the heat insulation layer 7, the printed circuit board 13 and the casing 10, and can prevent relative displacement between the battery 14, the heat insulation layer 7, the printed circuit board 13 and the casing 10.

[0037] The outer shell 10, potting compound 6, and heat insulation layer 7 work together to form multiple layers of heat insulation protection, ensuring that the sensor components are not damaged during the 125℃ vulcanization process, while adapting to temperature changes during long-term use of the inner tube, and providing targeted protection for the battery 14.

[0038] In another embodiment of this application, the communication module includes a Bluetooth chip 9 and an antenna 8, and the computing module includes a printed circuit board 13 on which the computing chip is mounted. The printed circuit board 13 establishes a communication link between the computing chip and the Bluetooth chip 9, and directly connects the communication pins of the computing chip with the corresponding pins of the Bluetooth chip 9. Alternatively, the computing chip and the communication module may be different functional units of the same chip, connected through an internal bus.

[0039] During debugging and configuration, the communication module and the computing module are designed independently, which makes it easy to replace the Bluetooth chip 9 or computing chip with different performance according to the requirements. After the product is finalized, a customized solution integrating the same chip is adopted to reduce space occupation.

[0040] In another embodiment of this application, the flexible wrapping layer 4 is made of the same material as the inner tube cylinder 2. The flexible wrapping layer 4 and the inner tube cylinder 2, being of the same material, have the same elastic modulus, coefficient of thermal expansion, and aging resistance, which can avoid deformation mismatch caused by material differences (such as the relative peeling tendency caused by the different expansion rates of the two when the inner tube cylinder 2 is inflated), reduce stress concentration on the bonding surface, and extend service life. At the same time, since the two are bonded to the same material, the compatibility with adhesives is better. Using the same material for the flexible wrapping layer 4 and the inner tube cylinder 2 can improve the bonding firmness and reduce the risk of the heat-insulated encapsulated sensor 3 falling off during long-term use.

[0041] In another embodiment of this application, the adhesive material between the flexible wrapping layer 4 and the inner tube 2 is an organic silicone adhesive based on silicone rubber, and the adhesive material between the heat-insulating encapsulated sensor 3 and the inner wall of the outer ring layer 16 is a silicone adhesive.

[0042] The silicone adhesive based on silicone rubber has excellent high-temperature resistance and strong adhesion to rubber materials. After curing, it maintains a certain degree of flexibility and can expand and contract synchronously with the deformation of the inner tube to avoid cracking. The silicone adhesive between the heat-insulating encapsulated sensor 3 and the outer ring layer 16 also has the characteristics of high temperature resistance and good flexibility. It can fix the sensor and buffer the impact of the inner tube cylinder 2 on the heat-insulating encapsulated sensor 3. At the same time, it can meet the dissimilar material bonding requirements between the outer ring layer 16 and the outer shell 10 of the heat-insulating encapsulated sensor 3.

[0043] As a feasible implementation plan, the silicone adhesive based on silicone rubber can be directly used from Wanhua Chemical Group Co., Ltd.'s SA1100 silicone adhesive: WANICONE® SA1100. The composition is a single-component de-alcoholized room temperature curing silicone rubber. The curing process is to cure for 7 days at a temperature of 23°C and a humidity of 50%. After curing, the hardness is 30 Shore A, the tensile strength is 1.4 MPa, and the elongation at break is 140%.

[0044] The silicone adhesive used is Huirui Adhesive Industry's HR-323T flexible silicone adhesive, which has a curing temperature range of -60 to 200°C, an elongation at break of ≥350%, and a peel strength of ≥8 W / m.

[0045] In another embodiment of this application, such as Figure 5 As shown, the outer shell 10 is made of polyetheretherketone (PEEK), the potting compound 6 is a polyurethane potting compound, which includes a main agent and a curing agent. The main agent is a hydroxyl-containing prepolymer, and the curing agent is an isocyanate-containing prepolymer. The heat insulation layer 7 is made of aerogel with a three-dimensional network pore structure, with a thickness of ≥3mm and a thermal conductivity of 0.016~0.012W / (m·K).

[0046] The insulation layer uses aerogel, which has a unique three-dimensional network porous structure that allows heat to be transferred only along the pore direction, thus lengthening the heat conduction path. Aerogel has a low thermal conductivity, and combined with its extremely high porosity, the contact area between the material and the hot surface is smaller, resulting in better heat conduction suppression. The 3mm thick aerogel particles contain numerous pore walls, which can all be considered as reflective and refractive surfaces of radiation, effectively blocking radiative heat transfer.

[0047] As a feasible implementation plan, the aerogel glass fiber insulation felt of Jiangxi Hongbai New Material Co., Ltd. can be used directly. It is composed of silica aerogel and glass fiber cotton, with a specific surface area of ​​500~1500m2 / g and a porosity of 90~98%, a dielectric constant ε=1.008, and a thermal conductivity of 0.004~0.025W / mk.

[0048] The polyetheretherketone (PEEK) shell is heat-resistant and has high mechanical strength, protecting the internal electronic modules from squeezing by the inner tube 2 or external impacts. It also has good chemical stability and does not react with rubber or vulcanizing agents. The polyurethane-based heat-insulating potting compound combines heat insulation and flexibility, blocking heat conduction and filling the gaps inside the shell to fix the position of each module and buffer vibration. The aerogel heat insulation layer with a three-dimensional mesh porous structure has high heat insulation efficiency and can effectively block the high temperature of vulcanization from being transferred to the battery 14, ensuring the safety of the power module. Before using the potting compound, thoroughly stir the main agent and curing agent separately. The weight ratio of the main agent to the curing agent during mixing is 3:1. The process includes two curing stages: initial curing and final curing. Initial curing takes 30-50 minutes at room temperature or 10 minutes at 60-80°C. Final curing takes 6-10 hours at room temperature or 60-80°C for 60 minutes.

[0049] As a viable alternative, the YEBOND®2008HN two-component polyurethane adhesive from Shanghai Ningrui Chemical Co., Ltd. can be used directly. The working time is 30-40 minutes, the initial adhesion is formed in 2.5-4 days, and it is fully cured after 5-7 days. The tensile strength is >11.0MPa (aluminum / aluminum interface), the applicable temperature range is -40 to 110℃, and the maximum temperature for short-term exposure of one hour is 130℃.

[0050] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. An inner tube with a built-in sensor, comprising an inner tube tube casing, the inner tube tube casing comprising an inner ring layer and an outer ring layer, characterized in that: The inner wall of the outer ring layer is provided with a flexible wrapping layer. The outer periphery of the flexible wrapping layer is bonded and fixed to the inner wall of the outer ring layer. A heat-insulated encapsulated sensor is loaded inside the flexible wrapping layer. The heat-insulated encapsulated sensor is bonded and fixed to the inner wall of the outer ring layer. The flexible wrapping layer covers the top of the heat-insulated encapsulated sensor. A vent is provided between the position of the flexible wrapping layer covering the heat-insulated encapsulated sensor and the position of the outer ring layer. The opening size of the vent is smaller than the passage size of the heat-insulated encapsulated sensor in any direction.

2. The inner tube with a built-in sensor according to claim 1, characterized in that: The original shape of the flexible wrapping layer before bonding and fixing is elliptical. Let the minor axis length of the flexible wrapping layer be L1 and the major axis length be L2. The dimensional ratios of the minor axis length L1 and the major axis length L2 of the flexible wrapping layer with the width L and height H of the heat-insulated encapsulated sensor are as follows: L1:(L+2H)=1.8~2.1; The ratio of the minor axis length L1 to the major axis length L2 of the flexible wrapping layer is as follows: L2:L1 = 1.2~1.3; When the flexible wrapping layer is bonded and fixed to the outer ring layer, the long axis of the flexible wrapping layer is consistent with the circumferential direction of the outer ring layer, and the short axis is perpendicular to the circumferential direction of the outer ring layer.

3. The inner tube with a built-in sensor according to claim 1, characterized in that: The heat-insulated encapsulated sensor includes a housing, inside which are disposed a power module, a communication module, a computing module, and a sensing module. The power module is connected to the power pins of the communication module, the computing module, and the sensing module respectively via wires.

4. The inner tube with a built-in sensor according to claim 3, characterized in that: The sensing module includes a temperature sensor and a pressure sensor. The housing is provided with an air passage, which includes an external air passage, an air passage inlet, and an internal air passage in sequence according to the gas flow direction. The external air passage is a groove that extends from the side of the housing to the top surface of the housing and connects to the air passage inlet. The air passage, the vent, and the inner tube are interconnected. The detection heads of the temperature sensor and the pressure sensor are located in the internal air passage. The signal output terminals of the temperature sensor and the pressure sensor are connected to the corresponding interfaces of the computing module through wires.

5. The inner tube with a built-in sensor according to claim 3, characterized in that: The power module includes a battery, which is wrapped with a heat insulation layer. The space between the heat insulation layer and the outer shell is filled with potting compound. The battery is separated from the communication module, the computing module and the sensing module by a heat insulation layer. The heat insulation layer is fixed to the outer shell based on the potting compound.

6. The inner tube with a built-in sensor according to claim 3, characterized in that: The communication module includes a Bluetooth chip and an antenna, and the computing module includes a printed circuit board with a computing chip mounted on it. The printed circuit board establishes a communication link between the computing chip and the Bluetooth chip, directly connecting the communication pins of the computing chip with the corresponding pins of the Bluetooth chip. Alternatively, the computing chip and the communication module may be different functional units of the same chip, connected through an internal bus.

7. The inner tube with a built-in sensor according to claim 1, characterized in that: The flexible wrapping layer is made of the same material as the inner tube tube.

8. The inner tube with a built-in sensor according to claim 1, characterized in that: The adhesive between the flexible wrapping layer and the inner tube is an organic silicone adhesive based on silicone rubber, and the adhesive between the heat-insulating encapsulated sensor and the inner wall of the outer ring is a silicone adhesive.

9. The inner tube with a built-in sensor according to claim 5, characterized in that: The outer shell is made of polyetheretherketone (PEEK), the potting compound is a polyurethane potting compound, which includes a main agent and a curing agent. The main agent is a hydroxyl-containing prepolymer, the curing agent is an isocyanate-containing prepolymer, and the insulation layer is made of aerogel with a three-dimensional network pore structure and a thickness of 3 mm or more.

Images