Buffer assembly and buffer structure

Abstract

The utility model discloses a kind of buffer assembly and buffer structure. Buffer assembly includes surface layer, bottom layer, intermediate layer, first buffer unit and second buffer unit, bottom layer is oppositely arranged with surface layer, intermediate layer is between surface layer and bottom layer, second buffer unit is set between intermediate layer and bottom layer, first buffer unit is set between surface layer and intermediate layer;And second buffer unit is set between intermediate layer and bottom layer, wherein the first interval from surface layer to intermediate layer is not equal to the second interval from bottom layer to intermediate layer. The buffer structure of the utility model is to stack two groups of buffer assembly into box, and the middle of box has aperture for accommodating electronic device. Wherein the buffer unit with different wave size and density is spliced configuration, to form a kind of composite buffer structure.

Description

Technical Field

[0001] This utility model relates to the field of packaging structure technology, and in particular to a cushioning component and cushioning structure. Background Technology

[0002] Currently, many sophisticated electronic devices and delicate glass products on the market require cushioning packaging during transportation. Cushioning packaging protects products during transport, effectively absorbing external impacts to prevent direct damage. However, the variety of existing cushioning structures is limited, thus failing to meet the diverse transportation needs of various products. Utility Model Content

[0003] In view of this, the purpose of this utility model is to provide a buffer component and a buffer structure, which form a buffer structure through the buffer component, and the packaging method of the buffer structure solves the problems of traditional packaging structures.

[0004] In a first aspect, the present invention provides a buffer component comprising: a surface layer; a bottom layer disposed opposite to the surface layer; an intermediate layer located between the surface layer and the bottom layer; a first buffer unit disposed between the surface layer and the intermediate layer; and a second buffer unit disposed between the intermediate layer and the bottom layer, wherein the first distance between the surface layer and the intermediate layer is not equal to the second distance between the bottom layer and the intermediate layer.

[0005] In some embodiments, the first buffer unit has a plurality of first upper connecting portions and a plurality of first lower connecting portions, the plurality of first upper connecting portions being connected to the surface layer and the plurality of first lower connecting portions being connected to the intermediate layer; the second buffer unit has a plurality of second upper connecting portions and a plurality of second lower connecting portions, the plurality of second upper connecting portions being connected to the intermediate layer and the plurality of second lower connecting portions being connected to the bottom layer.

[0006] In some embodiments, two adjacent first upper connecting portions have a first distance, two adjacent second upper connecting portions have a second distance, and the first distance is not equal to the second distance.

[0007] In some embodiments, the first buffer unit extends along a first direction between the surface layer and the intermediate layer, and the second buffer unit extends along a second direction between the intermediate layer and the bottom layer, wherein the first direction and the second direction are different directions.

[0008] In some embodiments, the first direction is perpendicular to the second direction.

[0009] In some embodiments, the number of the first buffer units is multiple, each first buffer unit having a first end, a second end, and multiple first bends located between the first end and the second end, the first end being connected to the surface layer, the second end being connected to the intermediate layer, and each of the multiple second buffer units having a third end, a fourth end, and multiple second bends located between the third end and the fourth end, the third end being connected to the intermediate layer, and the fourth end being connected to the bottom layer.

[0010] Secondly, this utility model provides a buffer structure, comprising: a first buffer component having a first surface layer, a first bottom layer, a first intermediate layer, a first buffer unit, and a second buffer unit, wherein the first bottom layer is disposed opposite to the first surface layer, the first intermediate layer is located between the first surface layer and the first bottom layer, the first buffer unit is disposed between the first surface layer and the first intermediate layer, and the second buffer unit is disposed between the first intermediate layer and the first bottom layer, wherein the first distance between the first surface layer and the first intermediate layer is not equal to the second distance between the first bottom layer and the first intermediate layer; and a second buffer component connected to the first buffer component, having a second surface layer, a second bottom layer, a second intermediate layer, a third buffer unit, and a fourth buffer unit, wherein the second bottom layer is disposed opposite to the second surface layer, the second intermediate layer is located between the second surface layer and the second bottom layer, the third buffer unit is disposed between the second surface layer and the second intermediate layer, and the fourth buffer unit is disposed between the second intermediate layer and the second bottom layer, wherein the third distance between the second surface layer and the second intermediate layer is not equal to the fourth distance between the second bottom layer and the second intermediate layer.

[0011] In some embodiments, the first buffer component is stacked with the second buffer component, and the first bottom layer is bonded to the second top layer.

[0012] In some embodiments, the first buffer component has an opening that extends from the first surface layer through the first bottom layer and exposes the second surface layer of the second buffer structure.

[0013] In some embodiments, the first buffer unit extends along a first direction between the first surface layer and the first intermediate layer, and the third buffer unit extends along a second direction between the second surface layer and the second intermediate layer, wherein the first direction and the second direction are different directions.

[0014] In some embodiments, the first surface layer, the first intermediate layer, and the first bottom layer of the first buffer component are bonded to the second surface layer of the second buffer component.

[0015] In some embodiments, the first buffer unit has a plurality of first upper connecting portions and a plurality of first lower connecting portions, the plurality of first upper connecting portions being connected to the first surface layer and the plurality of first lower connecting portions being connected to the first intermediate layer; the second buffer unit has a plurality of second upper connecting portions and a plurality of second lower connecting portions, the plurality of second upper connecting portions being connected to the first intermediate layer and the plurality of second lower connecting portions being connected to the first bottom layer.

[0016] In some embodiments, two adjacent first upper connecting portions have a first distance, two adjacent second upper connecting portions have a second distance, and the first distance is not equal to the second distance.

[0017] In some embodiments, the third buffer unit has a plurality of third upper connecting portions and a plurality of third lower connecting portions, the plurality of third upper connecting portions being connected to the second surface layer and the plurality of third lower connecting portions being connected to the second intermediate layer; the fourth buffer unit has a plurality of fourth upper connecting portions and a plurality of fourth lower connecting portions, the plurality of fourth upper connecting portions being connected to the second intermediate layer and the plurality of fourth lower connecting portions being connected to the second bottom layer.

[0018] In some embodiments, two adjacent third upper connecting portions have a third distance, two adjacent fourth upper connecting portions have a fourth distance, and the third distance is not equal to the fourth distance.

[0019] This application provides a buffer assembly and a buffer structure. The buffer assembly includes a surface layer, a bottom layer, a middle layer, a first buffer unit, and a second buffer unit. The combination of the first and second buffer units provides a buffer structure. The buffer structure of this invention involves stacking two sets of buffer assemblies into a box, with an opening in the center of the box for accommodating electronic devices. By splicing and configuring buffer units with different wave sizes and densities, the packaging structure simultaneously possesses the pressure resistance provided by large wave buffer units and the support stability provided by small wave buffer units, thus forming a composite buffer structure. Attached Figure Description

[0020] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which: Figure 1 This is a schematic diagram of the buffer component according to the first embodiment of this application; Figure 2 This is a schematic diagram of the buffer component according to the second embodiment of this application; Figure 3 This is a schematic diagram of the buffer component according to the third embodiment of this application; Figure 4 This is a schematic diagram of the buffer component according to the fourth embodiment of this application; Figure 5 This is a schematic diagram of the buffer assembly according to the fifth embodiment of this application; Figure 6 This is a schematic diagram of the buffer component according to the sixth embodiment of this application; Figure 7 This is a schematic diagram of the buffer component according to the seventh embodiment of this application; Figure 8 This is a schematic diagram of the buffer unit of this application; Figure 9 This is another schematic diagram of the buffer unit of this application; Figure 10 This is another schematic diagram of the buffer unit of this application; Figure 11 This is a schematic diagram of the buffer structure according to the first embodiment of this application; Figure 12 yes Figure 11 A magnified view of a portion of region A; Figure 13 This is an exploded view of the buffer structure according to the first embodiment of this application; Figure 14 This is a schematic diagram of the use and assembly of the buffer structure according to the first embodiment of this application; Figure 15 This is a schematic diagram of the buffer structure according to the second embodiment of this application; and Figure 16 This is a schematic diagram of the buffer structure according to the third embodiment of this application.

[0021] The following description is based on the attached figures: 1: Buffer assembly; 10: Buffer structure; 11: Surface layer; 12: Bottom layer; 13: Intermediate layer; 132: Bottom layer; 14: First buffer unit; 1401: First end; 1402: Second end; 141: First upper connecting part; 142: First lower connecting part; 143: First bending part; 15: Second buffer unit; 1501: Third end; 1502: Fourth end; 151: Second upper connecting part; 152: Second lower connecting part; 153: Second bending part; H: Height; h1: Depth; h2: Groove bottom thickness; 1H: First spacing; 2H: Second spacing; 1A: First buffer assembly; 11A: First surface layer; 12A: First bottom layer; 13A: First intermediate layer; 14A: First buffer unit 15A: Second buffer unit; 1B: Second buffer assembly; 11B: Second surface layer; 12B: Second bottom layer; 13B: Second intermediate layer; 14B: Third buffer unit; 15B: Fourth buffer unit; 14W: First wave pitch; 14H: First height; 15W: Second wave pitch; 15H: Second height; 10A: First waveform; 10B: Second waveform; 10C: Third waveform; 10D: Fourth waveform; 100: Housing; 101: Opening; 102: Side opening; 20: Electronic device; 1D: First direction; 2D: Second direction; 3D: Third direction; 4D: Fourth direction; 5D: Stacking direction; AH: First spacing; Ah: Second spacing; BH: Third spacing; Bh: Fourth spacing. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] Please see Figure 1 This is a schematic diagram of a buffer assembly provided in the first embodiment of this application. As shown in the figure, this embodiment provides a buffer assembly 1, which can be used as one of the packaging structures of an electronic device 20. The buffer assembly 1 includes a surface layer 11, a bottom layer 12, an intermediate layer 13, a first buffer unit 14, and a second buffer unit 15. The bottom layer 12 is disposed opposite to the surface layer 11, and the intermediate layer 13 is located between the surface layer 11 and the bottom layer 12. The buffer assembly 1 has a first buffer unit 14 and a second buffer unit 15. The first buffer unit 14 is disposed between the surface layer 11 and the intermediate layer 13, and the second buffer unit 15 is disposed between the intermediate layer 13 and the bottom layer 12, wherein the first distance 1H between the surface layer 11 and the intermediate layer 13 is not equal to the second distance 2H between the bottom layer 12 and the intermediate layer 13.

[0024] As described above, the first buffer unit 14 is wavy and has multiple first upper connecting portions 141 and multiple first lower connecting portions 142. The multiple first upper connecting portions 141 and multiple first lower connecting portions 142 are arranged alternately. The multiple first upper connecting portions 141 are disposed below the surface layer 11, and the multiple first lower connecting portions 142 are disposed on the intermediate layer 13. Similarly, the second buffer unit 15 is also wavy and has multiple second upper connecting portions 151 and multiple second lower connecting portions 152. The multiple second upper connecting portions 151 and multiple second lower connecting portions 152 are arranged alternately. The multiple second upper connecting portions 151 are disposed below the intermediate layer 13, and the multiple second lower connecting portions 152 are disposed on the bottom layer 12.

[0025] As described above, the plurality of first upper connecting portions 141 and the plurality of first lower connecting portions 142 of the first buffer unit 14 are spaced apart by a first wave pitch 14W, and the plurality of second upper connecting portions 151 and the plurality of second lower connecting portions 152 of the second buffer unit 15 are spaced apart by a second wave pitch 15W. The distances of the first wave pitch 14W and the second wave pitch 15W are different. Furthermore, the vertical height between the first upper connecting portions 141 and the first lower connecting portions 142 of the first buffer unit 14 is a first height 14H, which is the same as or similar to the distance of the first spacing 1H. The vertical height between the second upper connecting portions 151 and the second lower connecting portions 152 of the second buffer unit 15 is a second height 15H, which is the same as or similar to the distance of the second spacing 2H. The heights of the first height 14H and the second height 15H are different. The above description indicates that the first buffer unit 14 and the second buffer unit 15 provided in this embodiment are different types of wave-like structures. Users can adjust the wave pitch and the height of the wave undulations according to their needs.

[0026] The buffer assembly 1 in this embodiment refers to a structure composed of upper and lower sets of buffer units. The buffer assembly 1 is a planar structure consisting of a surface layer 11, a middle layer 13, and a bottom layer 12. The first buffer unit 14 provides a wave-shaped buffer structure. The second buffer unit 15 provides another wave-shaped buffer structure. The buffer assembly 1 has two buffer layers, which provides better compressive strength, bending resistance, and cushioning force. The buffer unit portions of the buffer assembly 1 (i.e., the first buffer unit 14 and the second buffer unit 15) can be a combination of two different waveforms.

[0027] Please refer to further information. Figures 1 to 5 As shown in the figure, buffer component 1 includes a wave-like combination of any two of the following waveforms: first waveform 10A, second waveform 10B, third waveform 10C, and fourth waveform 10D (e.g.,...). Figures 1 to 5(As shown). Users can combine the above-mentioned buffer structure characteristics to form the thickness and rigidity required for corresponding buffering needs.

[0028] Please refer to the following: Figure 1 In this embodiment, the buffer component 1 is a combination of a first waveform 10A and a second waveform 10B, with the second waveform 10B stacked on top of the first waveform 10A. The thickness of the buffer component 1 in this embodiment is approximately 7mm to 8mm.

[0029] Please see Figure 2 This is a schematic diagram of a buffer assembly provided in the second embodiment of this application. As shown in the figure, the buffer assembly 1 in this embodiment is a combination of a first waveform 10A and a third waveform 10C, with the first waveform 10A stacked on top of the third waveform 10C. The thickness of the buffer assembly 1 in this embodiment is approximately 8mm to 9mm.

[0030] Please see Figure 3 This is a schematic diagram of a buffer assembly provided in the third embodiment of this application. As shown in the figure, the buffer assembly 1 in this embodiment is a combination of a second waveform 10B and a third waveform 10C, with the second waveform 10B stacked on top of the third waveform 10C. The thickness of the buffer assembly 1 in this embodiment is approximately 6mm to 7mm.

[0031] Please see Figure 4 Figure 1 is a schematic diagram of a buffer assembly provided in the fourth embodiment of this application. As shown, the buffer assembly 1 in this embodiment is a combination of a second waveform 10B and a fourth waveform 10D, with the second waveform 10B stacked on top of the fourth waveform 10D. The thickness of the buffer assembly 1 in this embodiment is approximately 3.6 mm to 5 mm.

[0032] Please see Figure 5 Figure 1 is a schematic diagram of a buffer assembly provided in the fifth embodiment of this application. As shown, the buffer assembly 1 in this embodiment is a combination of a third waveform 10C and a fourth waveform 10D, with the third waveform 10C stacked on top of the fourth waveform 10D. The thickness of the buffer assembly 1 in this embodiment is approximately 4.6 mm to 6 mm.

[0033] According to the buffer components of the above embodiments, the first buffer unit 14 extends horizontally between the surface layer 11 and the intermediate layer 13, and the second buffer unit 15 extends horizontally between the intermediate layer 13 and the bottom layer 12, both in the same direction. Furthermore, the structural relationship between the first buffer unit 14 and the second buffer unit 15 can be adjusted according to the user's needs. For example, the wavy directions of the first buffer unit 14 and the second buffer unit 15 can be parallel to each other (e.g.,...). Figures 1 to 5As shown in the figure), the extension direction of the waves of the first buffer unit 14 and the second buffer unit 15 can also present a horizontal offset angle (not shown in the figure).

[0034] Regarding the buffer assembly of this embodiment, for heavy-duty products, the buffer assembly 1 of the first embodiment is preferred to enhance the support and shock absorption effect. For medium-sized household appliances and logistics transportation needs, the buffer assembly 1 of the second, third, or fourth embodiment is selected, as it offers a more suitable balance of structural support strength and cost-effectiveness.

[0035] Please see Figure 6 This is a schematic diagram of the buffer assembly according to the sixth embodiment of this application. As shown, the first buffer unit 14 extends along a first direction 1D between the surface layer 11 and the intermediate layer 13, and the second buffer unit 15 extends along a second direction 2D between the intermediate layer 13 and the bottom layer 12, wherein the first direction 1D and the second direction 2D are different directions. In this embodiment, the wave-like directions of the first buffer unit 14 and the second buffer unit 15 are perpendicular to each other, that is, the first buffer unit 14 is a combination of horizontal waves and the second buffer unit 15 is a combination of vertical waves. Furthermore, the extension directions of the waves of the first buffer unit 14 and the second buffer unit 15 can be at an angle to each other, that is, the vertical waves of the second buffer unit 15 are inclined (not shown), so that the extension direction of the inclined second buffer unit 15 forms an angle with the horizontal first buffer unit 14.

[0036] As described above, in this embodiment, the first direction 1D and the second direction 2D are perpendicular to each other. This application does not limit the extension direction of the first buffer unit 14 and the second buffer unit 15, and the extension directions of the first buffer unit 14 and the second buffer unit 15 can be adjusted to present multiple combinations of structures that are parallel to each other, perpendicular to each other, or / and at an angle to each other, according to the user's needs.

[0037] Please see Figure 7 This is a schematic diagram of the buffer assembly according to the seventh embodiment of this application. As shown in the figure, in this embodiment, there are multiple first buffer units 14. Each first buffer unit 14 has a first end 1401, a second end 1402, and multiple first bends 143. The multiple first bends 143 are located between the first end 1401 and the second end 1402. The first end 1401 is connected to the surface layer 11, and the second end 1402 is connected to the intermediate layer 13. There are also multiple second buffer units 15. Each second buffer unit 15 has a third end 1501, a fourth end 1502, and multiple second bends 153. The multiple second bends 153 are located between the third end 1501 and the fourth end 1502. The third end 1501 is connected to the intermediate layer 13, and the fourth end 1502 is connected to the bottom layer 12.

[0038] Please also refer to Figures 8 to 10 , Figure 8 This is a schematic diagram of the buffer unit of this application. Figure 9 This is another schematic diagram and Figure 10 This is another schematic diagram. As shown in the figure, in this embodiment, the structures of several buffer units are listed, and will be described below through the surface layer 11, the intermediate layer 13, and the first buffer unit 14. The first buffer unit 14 and the second buffer unit 15, in addition to the basic sine wave shape (such as...), Figures 1 to 5 In addition to (as shown), Figure 8 The first buffer unit 14 can present a continuous triangular wave shape. Figure 9 The first buffer unit 14 can be formed as a continuous trapezoidal wave shape and Figure 10 The first buffer unit 14 can be in the form of a continuous square wave, etc. This embodiment does not limit the structural shape and combination of the first buffer unit 14 or the second buffer unit 15, which can be adjusted according to the user's needs.

[0039] Please see Figures 11 to 14 , Figure 11 This is a schematic diagram of the buffer structure according to the first embodiment of this application. Figure 12 yes Figure 11 Enlarged view of area A Figure 13 This is a breakdown diagram of the use of the buffer structure and... Figure 14This is a schematic diagram of the use and assembly of the buffer structure. As shown in the figure, this embodiment provides a buffer structure 10, which includes multiple buffer components 1 as described above stacked into a box 100. This embodiment provides a buffer structure 10, which includes a first buffer component 1A and a second buffer component 1B. The first buffer component 1A has a first surface layer 11A, a first bottom layer 12A, a first intermediate layer 13A, a first buffer unit 14A, and a second buffer unit 15A. The first bottom layer 12A is disposed opposite to the first surface layer 11A. The first intermediate layer 13A is located between the first surface layer 11A and the first bottom layer 12A. The first buffer unit 14A is disposed between the first surface layer 11A and the first intermediate layer 13A. The second buffer unit 15A is disposed between the first intermediate layer 13A and the first bottom layer 12A. The first distance AH between the first surface layer 11A and the first intermediate layer 13A is not equal to the second distance Ah between the first bottom layer 12A and the first intermediate layer 13A. The second buffer component 1B is connected to the first buffer component 1A and has a second surface layer 11B, a second bottom layer 12B, a second intermediate layer 13B, a third buffer unit 14B, and a fourth buffer unit 15B. The second bottom layer 12B is disposed opposite to the second surface layer 11B. The second intermediate layer 13B is located between the second surface layer 11B and the second bottom layer 12B. The third buffer unit 14B is disposed between the second surface layer 11B and the second intermediate layer 13B. The fourth buffer unit 15B is disposed between the second intermediate layer 13B and the second bottom layer 12B. The third spacing BH between the second surface layer 11B and the second intermediate layer 13B is not equal to the fourth spacing Bh between the second bottom layer 12B and the second intermediate layer 13B.

[0040] In this embodiment, the first buffer component 1A and the second buffer component 1B may be buffer components 1 of the same specification or buffer components 1 of different specifications. The first buffer component 1A and the second buffer component 1B are stacked, with the first bottom layer 12A and the second surface layer 11B bonded together. The first buffer component 1A has an opening 101 in the middle, which extends from the first surface layer 11A through the first bottom layer 12A and exposes the second surface layer 11B of the second buffer component 1B. The opening 101 can be used to accommodate the electronic device 20. The height H of the buffer structure 10 is the stack thickness of the plurality of first buffer components 1A and the plurality of second buffer components 1B, the depth h1 of the opening 101 is the stack thickness of the plurality of first buffer components 1A, and the bottom thickness h2 of the opening 101 is the stack thickness of the plurality of second buffer components 1B.

[0041] In this embodiment, the height H of the buffer structure 10 is the stacking thickness of the first buffer component 1A and the second buffer component 1B, the depth h1 of the opening 101 is the stacking thickness of six layers of the first buffer component 1A, and the bottom thickness h2 of the opening 101 is the stacking thickness of four layers of the second buffer component 1B. There are two openings 101, arranged side-by-side, and they are not connected to each other. Furthermore, the first buffer component 1A includes at least one side opening 102, located on one side of the opening 101 and connected to it. The electronic device 20 is assembled within the opening 101, and the side opening 102 can be used to assist in removing the electronic device 20 from the opening 101.

[0042] Please review Figure 12 and Figure 13 By assembling one side of the two sets of electronic devices 20 into the two openings 101 of the buffer structure 10, and then assembling the two openings 101 of the other buffer structure 10 into the other side of the electronic device 20, the two electronic devices 20 are indeed assembled into the two buffer structures 10, which can improve the safety of the electronic devices 20.

[0043] Please see Figure 15 This is a schematic diagram of the buffer structure according to the second embodiment of this application. As shown in the figure, the difference between this embodiment and the first embodiment lies in the stacking direction of the first buffer component 1A relative to the second buffer component 1B. This embodiment provides a buffer structure 10, which includes an upper stacking layer and a lower stacking layer. The upper stacking layer is formed by stacking multiple first buffer components 1A as described above, wherein the stacking direction of the multiple first buffer components 1A is a first direction 1D. The lower stacking layer is formed by stacking multiple second buffer components 1B as described above, wherein the stacking direction of the multiple second buffer components 1B is a second direction 2D, and the first buffer component 1A is stacked on the second buffer component 1B, such that the first buffer component 1A is stacked on the second buffer component 1B according to the stacking direction 5D, wherein the first direction 1D and the second direction 2D are perpendicular to each other, and the second direction 2D is in the same direction as the stacking direction 5D. The above can be adjusted according to the user's needs.

[0044] As described above, this embodiment provides a buffer structure 10, which includes: a buffer structure 10 formed by stacking the first buffer component 1A and the second buffer component 1B as described above. The buffer structure 10 has an opening 101 in the middle, which can be used to accommodate the electronic device 20. The depth of the opening 101 is the height of the upper half of the stacked layer in the stacking direction 5D, and the bottom thickness of the opening 101 is the height of the first buffer component 1A in the stacking direction 5D. The first buffer component 1A is the outer structure of the opening 101, and the second buffer component 1B is the structure with the bottom thickness. This embodiment can form different protective structures by changing the stacking direction of the first buffer component 1A and the second buffer component 1B, which can be adjusted according to the user's needs.

[0045] Please see Figure 16 This is a schematic diagram of the buffer structure according to the third embodiment of this application. As shown in the figure, the difference between this embodiment and the second embodiment lies in the waveform extension direction of the second buffer component 1B. This embodiment provides a buffer structure 10, where the stacking direction of the first buffer component 1A is a third direction 3D. The stacking direction of the second buffer component 1B is a fourth direction 4D, where the third direction 3D and the fourth direction 4D are perpendicular to each other, and the fourth direction 4D is in the same direction as the stacking direction 5D. The waveform extension direction of the second buffer component 1B is adjusted relative to the first buffer component 1A, so that the waveform extension directions of the second buffer component 1B are perpendicular to each other. This embodiment also forms different protection structures by changing the waveform extension directions of the first buffer component 1A and the second buffer component 1B, which can be adjusted according to user needs.

[0046] In summary, this application provides a buffer assembly and a buffer structure. The buffer assembly includes a surface layer, a bottom layer, a middle layer, a first buffer unit, and a second buffer unit. The combination of the first and second buffer units provides a buffer structure. The buffer structure of this utility model, as described above, involves stacking two sets of buffer assemblies into a box, with an opening in the center of the box for accommodating electronic devices. By splicing and configuring buffer units with different wave sizes and densities, the internal buffer structure simultaneously possesses the compressive strength provided by large-wave buffer units and the support stability provided by small-wave buffer units, thus forming a composite buffer structure.

[0047] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0048] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms fall within the scope of protection of this application.

Claims

1. A buffer component, characterized in that, It includes: surface layer; The bottom layer is positioned opposite to the top layer; An intermediate layer is located between the surface layer and the bottom layer; The first buffer unit is disposed between the surface layer and the intermediate layer; as well as A second buffer unit is disposed between the intermediate layer and the bottom layer, wherein the first distance from the surface layer to the intermediate layer is not equal to the second distance from the bottom layer to the intermediate layer.

2. The buffer assembly as described in claim 1, characterized in that, The first buffer unit has a plurality of first upper connecting parts and a plurality of first lower connecting parts, the plurality of first upper connecting parts being connected to the surface layer and the plurality of first lower connecting parts being connected to the intermediate layer. The second buffer unit has a plurality of second upper connecting parts and a plurality of second lower connecting parts, the plurality of second upper connecting parts being connected to the intermediate layer and the plurality of second lower connecting parts being connected to the bottom layer.

3. The buffer assembly as described in claim 2, characterized in that, Two adjacent first upper connecting portions have a first distance, two adjacent second upper connecting portions have a second distance, and the first distance is not equal to the second distance.

4. The buffer assembly as described in claim 2, characterized in that, The first buffer unit extends along a first direction between the surface layer and the intermediate layer, and the second buffer unit extends along a second direction between the intermediate layer and the bottom layer, wherein the first direction and the second direction are different.

5. The buffer assembly as described in claim 4, characterized in that, The first direction is perpendicular to the second direction.

6. The buffer assembly as claimed in claim 1, characterized in that, The number of first buffer units is multiple. Each first buffer unit has a first end, a second end, and multiple first bends. The multiple first bends are located between the first end and the second end. The first end is connected to the surface layer, and the second end is connected to the intermediate layer. The number of second buffer units is also multiple. Each second buffer unit has a third end, a fourth end, and multiple second bends. The multiple second bends are located between the third end and the fourth end. The third end is connected to the intermediate layer, and the fourth end is connected to the bottom layer.

7. A buffer structure, characterized in that, It includes: A first buffer component has a first surface layer, a first bottom layer, a first intermediate layer, a first buffer unit, and a second buffer unit. The first bottom layer is disposed opposite to the first surface layer. The first intermediate layer is located between the first surface layer and the first bottom layer. The first buffer unit is disposed between the first surface layer and the first intermediate layer. The second buffer unit is disposed between the first intermediate layer and the first bottom layer. The first distance between the first surface layer and the first intermediate layer is not equal to the second distance between the first bottom layer and the first intermediate layer. as well as The second buffer component is connected to the first buffer component and has a second surface layer, a second bottom layer, a second intermediate layer, a third buffer unit, and a fourth buffer unit. The second bottom layer is disposed opposite to the second surface layer, the second intermediate layer is located between the second surface layer and the second bottom layer, the third buffer unit is disposed between the second surface layer and the second intermediate layer, and the fourth buffer unit is disposed between the second intermediate layer and the second bottom layer. The third spacing between the second surface layer and the second intermediate layer is not equal to the fourth spacing between the second surface layer and the second intermediate layer.

8. The buffer structure as described in claim 7, characterized in that, The first buffer component and the second buffer component are stacked together, and the first bottom layer is bonded to the second top layer.

9. The buffer structure as described in claim 7, characterized in that, The first buffer component has an opening that extends from the first surface layer through the first bottom layer and exposes the second surface layer of the second buffer component.

10. The buffer structure as described in claim 7, characterized in that, The first buffer unit extends along a first direction between the first surface layer and the first intermediate layer, and the third buffer unit extends along a second direction between the second surface layer and the second intermediate layer, wherein the first direction and the second direction are different.

11. The buffer structure as described in claim 7, characterized in that, The first surface layer, the first intermediate layer, and the first bottom layer of the first buffer component are bonded to the second surface layer of the second buffer component.

12. The buffer structure as described in claim 7, characterized in that, The first buffer unit has a plurality of first upper connecting parts and a plurality of first lower connecting parts, the plurality of first upper connecting parts being connected to the first surface layer and the plurality of first lower connecting parts being connected to the first intermediate layer. The second buffer unit has a plurality of second upper connecting parts and a plurality of second lower connecting parts, the plurality of second upper connecting parts being connected to the first intermediate layer and the plurality of second lower connecting parts being connected to the first bottom layer.

13. The buffer structure as described in claim 12, characterized in that, Two adjacent first upper connecting portions have a first distance, two adjacent second upper connecting portions have a second distance, and the first distance is not equal to the second distance.

14. The buffer structure as described in claim 7, characterized in that, The third buffer unit has multiple third upper connecting parts and multiple third lower connecting parts. The multiple third upper connecting parts are connected to the second surface layer, and the multiple third lower connecting parts are connected to the second intermediate layer. The fourth buffer unit has multiple fourth upper connecting parts and multiple fourth lower connecting parts. The multiple fourth upper connecting parts are connected to the second intermediate layer, and the multiple fourth lower connecting parts are connected to the second bottom layer.

15. The buffer structure as described in claim 14, characterized in that, Two adjacent third upper connecting portions have a third distance, two adjacent fourth upper connecting portions have a fourth distance, and the third distance is not equal to the fourth distance.

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