Polysilicon transport device

Abstract

The utility model provides a kind of polysilicon transport device, it is related to polysilicon transport field.The transport device includes: transport case main body, including box and lid, damping structure, including shock absorber and bearing plate, bearing plate is set in the lower portion of box inner cavity, and is connected in the bottom of box inner cavity by shock absorber;Multiple antistatic composite packing bag, and each antistatic composite packing bag is connected with conducting wire;Static electricity release structure, including conducting metal net, first wiring stake and second wiring stake, conducting metal net is set in the inner side wall of box, and first wiring stake and second wiring stake are connected with conducting metal net;Support plate;And annular buffer air bag, it is set in the inner side of conducting metal net.The application reduces friction and temperature rise by damping structure, static electricity release structure avoids static adsorption contaminant, annular buffer air bag enhances buffering protection, multi-layer placement structure improves space utilization and stability, effectively solve the problem of packing bag blackening, silicon material discoloration.

Description

Technical Field

[0001] This utility model relates to the field of polycrystalline silicon transportation technology, and more specifically, to a polycrystalline silicon transportation device. Background Technology

[0002] Polycrystalline silicon is a gray solid with a metallic luster and is the main raw material for producing monocrystalline silicon. It is widely used in semiconductors, photovoltaics, and other fields. As a key material with high purity, its quality has a significant impact on the performance of subsequent products. Therefore, it is crucial to strictly avoid contamination and oxidation during transportation. However, when polysilicon is transported in shipping containers, problems such as blackening of the packaging bags and black spots and discoloration on the surface of the silicon material often arise. This is mainly due to the bumps and vibrations during transportation: on the one hand, repeated friction between the silicon material and the packaging bag will cause localized heating, intensifying the oxidation reaction. At the same time, friction may cause damage to the packaging bag, allowing the silicon material to puncture the inner bag and directly contact the air or external contaminants; on the other hand, the static electricity generated by friction will attract metal particles from the air, further causing the packaging bag to blacken. Utility Model Content

[0003] The purpose of this invention is to provide a polycrystalline silicon transport device, which aims to solve the technical problems in the background art.

[0004] The embodiments of this utility model are implemented as follows: This application provides a polysilicon transport device, comprising: a transport box body, including a detachably fitted box body and a box cover; a shock-absorbing structure, including a shock absorber and a support plate, wherein the support plate is disposed in the lower part of the inner cavity of the box body and connected to the bottom of the inner cavity of the box body via the shock absorber, and the shock absorber is configured to allow the support plate to elastically rise and fall; a plurality of antistatic composite packaging bags, each of the antistatic composite packaging bags being connected to a conductive wire; an electrostatic discharge structure, including a conductive metal mesh, a first terminal block and a second terminal block, wherein the conductive metal mesh is disposed on the inner side wall of the box body, and both the first terminal block and the second terminal block are connected to the conductive metal mesh, wherein the first terminal block is used for grounding, and the second terminal block is configured to connect to the conductive wire; at least two support plates disposed in the inner cavity of the box body and spaced apart along the height direction of the box body; wherein any of the support plates is separable from the inner cavity of the box body; and an annular buffer airbag disposed inside the conductive metal mesh and arranged along the circumferential direction of the box body.

[0005] Furthermore, based on the aforementioned scheme, the conductive metal mesh is ring-shaped and arranged along the circumferential direction of the aforementioned box.

[0006] Furthermore, based on the aforementioned scheme, the inner sidewall of the aforementioned housing is provided with an installation groove for accommodating the installation of the aforementioned conductive metal mesh and the aforementioned annular buffer airbag.

[0007] Furthermore, based on the aforementioned scheme, the first terminal block is located on the lower part of the outer wall of the enclosure, and the second terminal block is located on the upper part of the inner wall of the enclosure.

[0008] Furthermore, based on the aforementioned solution, the lid and the opening of the box body are aligned and fitted together, and the lid and the box body are detachably fitted together by packing straps.

[0009] Furthermore, based on the aforementioned scheme, any of the aforementioned antistatic composite packaging bags includes a polyethylene inner bag and a nylon substrate outer bag, wherein the inner sidewall of the aforementioned nylon substrate outer bag is provided with an indium tin oxide conductive coating, and the aforementioned indium tin oxide conductive coating is connected to the aforementioned conductive wire.

[0010] Furthermore, based on the aforementioned scheme, a strap structure is also included, which includes a first fixing rope, a second fixing rope, and an elastic rope. The elastic rope is located at the top of the inner cavity of the box, and its two ends are respectively connected to the bottom two ends of the inner cavity of the box through the first fixing rope and the second fixing rope; wherein, the diameter of the bearing plate and the diameter of the support plate are both smaller than the diameter of the inner cavity of the box.

[0011] Furthermore, based on the aforementioned scheme, the first fixing rope and the elastic rope, as well as the second fixing rope and the elastic rope, are detachably connected by buckles.

[0012] Compared with the prior art, the embodiments of this utility model have at least the following advantages or beneficial effects: The polysilicon transport device of this application reduces friction and temperature rise through a shock-absorbing structure, avoids electrostatic adsorption of contaminants through an electrostatic release structure, enhances cushioning protection through an annular buffer airbag, and improves space utilization and stability through a multi-layer placement structure, effectively solving the problems of blackening of packaging bags and discoloration of silicon materials. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is an isometric view of a polycrystalline silicon transport device according to an embodiment of the present invention; Figure 2 This is an exploded view of a polycrystalline silicon transport device according to an embodiment of the present invention; Figure 3 This is a cross-sectional view of a polycrystalline silicon transport device according to an embodiment of the present invention; Figure 4 for Figure 3 A magnified view of part A in the image; Figure 5 This is an isometric view of the housing in an embodiment of this utility model.

[0015] Icons: 1-Box body, 2-Box lid, 3-Packing strap, 4-First wiring post, 5-Receiving slot, 6-Conductive metal mesh, 7-Annular cushioning airbag, 8-Elastic rope, 9-First fixing rope, 10-Second fixing rope, 11-Supporting plate, 12-Antistatic composite packaging bag, 1201-Polyethylene inner bag, 1202-Nylon substrate outer bag, 1203-Indium tin oxide conductive coating, 13-Conductive wire, 14-Snap fastener, 15-Bearing plate, 16-Second wiring post, 17-Shock absorber. Detailed Implementation

[0016] The embodiments of this application will now be described in detail with reference to the accompanying drawings. Example

[0017] Please refer to Figures 1-5 This application provides a polysilicon transport device, comprising: a transport box body, including a detachably fitted box body 1 and a box cover 2; a shock-absorbing structure, including a shock absorber 17 and a support plate 15, wherein the support plate 15 is disposed in the lower part of the inner cavity of the box body 1 and connected to the bottom of the inner cavity of the box body 1 through the shock absorber 17, the shock absorber 17 being configured to allow the support plate 15 to elastically rise and fall; a plurality of antistatic composite packaging bags 12, each of the antistatic composite packaging bags 12 being connected to a conductive wire 13; an electrostatic discharge structure, including a conductive metal mesh 6, a first terminal block 4 and a second terminal block 16, wherein the conductive metal mesh 6 is disposed on the inner side wall of the box body 1, the first terminal block 4 and the second terminal block 16 are both connected to the conductive metal mesh 6, the first terminal block 4 being used for grounding, and the second terminal block 16 being configured to connect to the conductive wire 13; and at least two support plates 11, which are disposed in the inner cavity of the box body 1 and are spaced apart along the height direction of the box body 1. Among them, any of the above-mentioned support plates 11 can be separably fitted with the inner cavity of the above-mentioned box body 1; and the annular buffer airbag 7 is disposed on the inner side of the above-mentioned conductive metal mesh 6 and is disposed along the circumferential direction of the above-mentioned box body 1.

[0018] When using the polysilicon transport device of this application, a support plate 11 is placed on the support plate 15, and an antistatic composite packaging bag 12 containing silicon material is placed on the support plate 11. With the support plates 11 being spaced apart and separable along the height direction of the box body 1, the silicon material can be stably placed in layers, avoiding additional friction caused by stacking and compression. The support plate 15 is connected to the bottom of the box body 1 through a shock absorber 17, which can be raised and lowered elastically to buffer the bumps and vibrations during transportation and reduce repeated friction between the silicon material and the packaging bag. The conductive wire 13 of the antistatic composite packaging bag 12 is connected to the second terminal 16, and the conductive metal mesh 6 is grounded through the first terminal 4. The static electricity generated by friction can be released to the ground in sequence through the conductive wire 13, the second terminal 16, the conductive metal mesh 6, and the first terminal 4, preventing the static electricity from adsorbing metal particles. The annular buffer airbag 7 is arranged around the circumference of the box body 1 inside the conductive metal mesh 6 to buffer side impacts and reduce the risk of packaging bag damage. Its advantages include reducing friction and temperature rise through shock-absorbing structure, preventing electrostatic adsorption of pollutants through electrostatic release structure, enhancing cushioning protection with ring-shaped buffer airbags 7, and improving space utilization and stability through multi-layer placement structure, effectively solving the problems of blackening of packaging bags and discoloration of silicon materials.

[0019] In a preferred embodiment, the conductive metal mesh 6 is annular and arranged along the circumferential direction of the housing 1.

[0020] In the above embodiment, the conductive metal mesh 6 is ring-shaped and arranged around the circumference of the box 1, which can form uniform force support around the circumference of the box 1, ensuring the force balance of the side wall of the box 1. At the same time, the ring structure itself has strong integrity, which can enhance the structural strength of the side wall of the box 1.

[0021] In a preferred embodiment, the inner wall of the housing 1 is provided with an installation groove for accommodating the installation of the conductive metal mesh 6 and the annular buffer airbag 7.

[0022] In the above embodiment, the inner wall of the box 1 is provided with an installation groove to accommodate the conductive metal mesh 6 and the annular buffer airbag 7, which can form a stable limiting and fixing for the two, preventing them from shifting due to bumps during transportation, and ensuring that the conductive metal mesh 6 and the annular buffer airbag 7 are in a balanced position around the box 1. At the same time, the installation groove allows the two to fit tightly against the inner wall of the box 1, which not only enhances the structural stability of the conductive metal mesh 6, but also makes the annular buffer airbag 7 more evenly stressed when compressed, improving the buffering effect. It also makes the spatial layout of the inner cavity of the box 1 more regular, providing a stable inner environment for multi-layer placement structures.

[0023] In a preferred embodiment, the first terminal block 4 is disposed on the lower part of the outer side wall of the enclosure 1, and the second terminal block 16 is disposed on the upper part of the inner side wall of the enclosure 1.

[0024] In the above embodiment, the first terminal block 4 is located on the lower part of the outer wall of the box 1 to facilitate grounding operation, and the second terminal block 16 is located on the upper part of the inner wall of the box 1 to facilitate connection of the conductive wire 13 of the antistatic composite packaging bag 12. The two are reasonably distributed, which not only ensures grounding stability, but also improves wiring convenience and avoids mutual interference.

[0025] In a preferred embodiment, the lid 2 is aligned with the opening of the box body 1, and the lid 2 and the box body 1 are detachably connected by a packing strap 3.

[0026] In the above embodiment, the lid 2 and the box body 1 are connected and detachably connected by the packing strap 3. This not only ensures the sealing of the lid 2 and the box body 1 to reduce the entry of external contaminants, but also enhances the connection strength through the packing strap 3. Furthermore, it is easy to disassemble, taking into account both transportation stability and loading and unloading convenience.

[0027] In a preferred embodiment, any of the above-mentioned antistatic composite packaging bags 12 includes a polyethylene inner bag 1201 and a nylon substrate outer bag 1202. The inner sidewall of the nylon substrate outer bag 1202 is provided with an indium tin oxide conductive coating 1203, and the indium tin oxide conductive coating 1203 is connected to the conductive wire 13.

[0028] In the above embodiments, any antistatic composite packaging bag 12 adopts a polyethylene inner bag 1201 and a nylon substrate outer bag 1202. The polyethylene inner bag 1201 is soft and has good chemical stability, which can reduce friction with polycrystalline silicon and prevent silicon material from being contaminated. The nylon substrate outer bag 1202 has high strength and wear resistance, which can enhance the overall damage resistance of the packaging bag and effectively cope with friction and collision during transportation. The indium tin oxide conductive coating 1203 on the inner sidewall of the nylon substrate outer bag 1202 is connected to the conductive line 13. Indium tin oxide has excellent conductivity and can quickly conduct the static electricity generated on the surface of the packaging bag due to friction to the static electricity release structure through the conductive line 13, thereby realizing static electricity release. From inner layer protection to outer layer protection to static electricity discharge, the risk of silicon material damage and packaging bag blackening is reduced in all aspects.

[0029] In a preferred embodiment, a strap structure is also included, comprising a first fixing rope 9, a second fixing rope 10, and an elastic rope 8. The elastic rope 8 is located at the top of the inner cavity of the box 1, and its two ends are connected to the bottom ends of the inner cavity of the box 1 by the first fixing rope 9 and the second fixing rope 10, respectively. The diameter of the bearing plate 15 and the diameter of the support plate 11 are both smaller than the diameter of the inner cavity of the box 1.

[0030] In the above embodiment, the diameter values ​​of the bearing plate 15 and the support plate 11 are both smaller than the diameter value of the inner cavity of the box 1, providing sufficient space for the first fixing rope 9 and the second fixing rope 10 to pass through the box 1, which facilitates the installation and fixation of the strap structure; while the elastic rope 8 located at the top of the inner cavity of the box 1 in the strap structure is connected to both ends of the bottom of the box 1 through the first fixing rope 9 and the second fixing rope 10, which can use elasticity to form a flexible constraint from top to bottom on the multi-layer placement structure, further tightening and reinforcing the multi-layer placement structure formed by multiple support plates 11, effectively preventing the support plate 11 and the antistatic composite packaging bag 12 from shifting or shaking due to bumps during transportation, enhancing the stability of the overall structure, and thus reducing the friction between the silicon material and the packaging bag.

[0031] In a preferred embodiment, the first fixing rope 9 and the elastic rope 8, and the second fixing rope 10 and the elastic rope 8 are detachably connected by buckles 14.

[0032] In the above embodiments, the first fixing rope 9 and the elastic rope 8, and the second fixing rope 10 and the elastic rope 8 are detachably connected by buckles 14, which can quickly complete the assembly and disassembly of the strap structure, improve the operational efficiency when loading and unloading silicon material, and the connection is stable and not easy to fall off.

[0033] Furthermore, unless otherwise explicitly specified or limited, the terms "installation" and "connection" in this application embodiment should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The terms "upper," "lower," "left," "right," "inner," "outer," and "side," etc., are merely for reference to the direction in the accompanying drawings or the usual placement of the product during use. They are only for clearly describing this application and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limitations on this application. The terms "first," "second," etc., are only used for distinguishing descriptions and should not be construed as indicating or implying relative importance; "multiple" refers to at least two. In this application embodiment, the limitations on relative positional relationships such as parallel, perpendicular, and aligned are all relative to the current technological level and are not absolutely strict limitations. Slight deviations are allowed; approximations of parallel, perpendicular, and aligned are all acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 degrees and 10 degrees.

[0034] The above are only some embodiments and implementation methods of this application. The protection scope of this application is not limited thereto. In the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other. Any combination of features in different embodiments is also within the protection scope of this application. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the protection scope of this application.

Claims

1. A polycrystalline silicon transport device, characterized in that, include: The main body of the transport container includes a detachable container body (1) and a container lid (2). The shock-absorbing structure includes a shock absorber (17) and a support plate (15). The support plate (15) is disposed in the lower part of the inner cavity of the housing (1) and connected to the bottom of the inner cavity of the housing (1) through the shock absorber (17). The shock absorber (17) is configured to allow the support plate (15) to be elastically raised and lowered. Multiple antistatic composite packaging bags (12), each of which is connected to a conductive wire (13); The electrostatic discharge structure includes a conductive metal mesh (6), a first terminal block (4), and a second terminal block (16). The conductive metal mesh (6) is disposed on the inner side wall of the housing (1). The first terminal block (4) and the second terminal block (16) are both connected to the conductive metal mesh (6). The first terminal block (4) is used for grounding, and the second terminal block (16) is configured to connect to the conductive wire (13). At least two support plates (11) are disposed in the inner cavity of the box (1) and are spaced apart along the height direction of the box (1); Wherein, any of the supporting plates (11) can be separably fitted with the inner cavity of the box body (1); and An annular buffer airbag (7) is disposed inside the conductive metal mesh (6) and along the circumferential direction of the housing (1).

2. The polycrystalline silicon transport device according to claim 1, characterized in that, The conductive metal mesh (6) is ring-shaped and is arranged along the circumferential direction of the box (1).

3. The polycrystalline silicon transport device according to claim 2, characterized in that, The inner wall of the box (1) is provided with an installation groove for accommodating the installation of the conductive metal mesh (6) and the annular buffer airbag (7).

4. The polycrystalline silicon transport device according to claim 1, characterized in that, The first terminal block (4) is located on the lower part of the outer side wall of the box (1), and the second terminal block (16) is located on the upper part of the inner side wall of the box (1).

5. A polycrystalline silicon transport device according to claim 1, characterized in that, The lid (2) is connected to the opening of the box body (1), and the lid (2) and the box body (1) are detachably connected by packing straps (3).

6. A polycrystalline silicon transport device according to claim 1, characterized in that, Any of the antistatic composite packaging bags (12) includes a polyethylene inner bag (1201) and a nylon substrate outer bag (1202). The inner wall of the nylon substrate outer bag (1202) is provided with an indium tin oxide conductive coating (1203), and the indium tin oxide conductive coating (1203) is connected to the conductive wire (13).

7. A polycrystalline silicon transport device according to claim 1, characterized in that, It also includes a strap structure, which includes a first fixing rope (9), a second fixing rope (10) and an elastic rope (8). The elastic rope (8) is located at the top of the inner cavity of the box (1), and its two ends are connected to the bottom two ends of the inner cavity of the box (1) through the first fixing rope (9) and the second fixing rope (10), respectively. The diameter values ​​of the bearing plate (15) and the support plate (11) are both smaller than the diameter value of the inner cavity of the box (1).

8. A polycrystalline silicon transport device according to claim 7, characterized in that, The first fixing rope (9) and the elastic rope (8), and the second fixing rope (10) and the elastic rope (8) are detachably connected by buckles (14).

Images