Combined sensor and electronic device

Abstract

The utility model discloses a combined sensor and electronic equipment relates to sensor technical field, this combined sensor includes package body, first sensor, second sensor and waterproof membrane, and package body includes base plate and shell, and the shell is enclosed with base plate and forms the accommodation cavity, and the outer wall surface of shell is equipped with the sound hole of intercommunication accommodation cavity, first sensor includes first MEMS chip and first ASIC chip, and first MEMS chip is located in the accommodation cavity and is electrically connected with base plate, and first ASIC chip is electrically connected with first MEMS chip, second sensor includes second MEMS chip and second ASIC chip, and second MEMS chip is located in the accommodation cavity and is electrically connected with base plate, and second ASIC chip is electrically connected with second MEMS chip, and waterproof membrane is pasted in the inner wall surface of shell and covers the sound hole to the base plate. The utility model aims at improving the waterproof performance of sensor and reducing the size of sensor.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and in particular to a combined sensor and electronic device. Background Technology

[0002] Currently, modular sensor devices are becoming the packaging trend for sensor devices. Modular sensors integrate two or more independent sensor modules into a single package, which reduces the overall assembly space and the need for waterproofing.

[0003] However, existing technologies often employ a waterproof membrane coating on the outside of the enclosure to achieve waterproof functionality. Since devices inevitably experience friction, scratches, or impacts during use, this damage directly affects the external waterproof membrane, easily leading to breakage, detachment, or seal failure. Once the waterproof membrane is damaged, the sealing effect of the enclosure is significantly reduced, ultimately affecting the long-term reliability of the sensor. Utility Model Content

[0004] The main objective of this invention is to propose a combined sensor and electronic device that aims to improve the waterproof performance of the sensor and reduce its size.

[0005] To achieve the above objectives, this utility model proposes a combined sensor, comprising: The package includes a substrate and a housing, the housing and the substrate enclosing each other to form a cavity, and the outer wall of the housing has an acoustic hole communicating with the cavity; A first sensor, comprising a first MEMS chip and a first ASIC chip, wherein the first MEMS chip is disposed within the accommodating cavity and electrically connected to the substrate, and the first ASIC chip is electrically connected to the first MEMS chip; The second sensor includes a second MEMS chip and a second ASIC chip. The second MEMS chip is disposed within the accommodating cavity and electrically connected to the substrate. The second ASIC chip is electrically connected to the second MEMS chip. A waterproof membrane is attached to the inner wall of the outer casing facing the substrate and covers the acoustic hole. The waterproof membrane is configured to prevent external water from entering the accommodating cavity through the acoustic hole.

[0006] In one embodiment, the combined sensor includes an inner housing disposed in the accommodating cavity. The inner housing includes a support plate disposed between the waterproof membrane and the substrate. The support plate is connected to the inner wall surface of the outer housing. The side of the support plate facing the substrate, the inner wall surface of the outer housing, and the side of the substrate facing the support plate enclose an isolation cavity. The waterproof membrane is attached to the side of the support plate facing away from the substrate; the first MEMS chip and the second MEMS chip are disposed in the isolation cavity.

[0007] In one embodiment, the inner housing further includes a partition plate disposed on the side of the support plate facing the substrate, and the partition plate is connected to the inner wall surface of the outer housing and the side of the substrate facing the support plate. The partition, the side of the support plate facing the substrate, the side of the substrate facing the support plate, and the inner wall of the outer shell together form a first sub-isolation cavity and a second sub-isolation cavity. The first MEMS chip and the second MEMS chip are respectively disposed in the first sub-isolation cavity and the second sub-isolation cavity. In one embodiment, the support plate has a first through hole communicating with the first sub-isolation cavity on the side opposite to the substrate; and / or The support plate has a second through hole on the side opposite to the substrate, which connects to the second sub-isolation cavity.

[0008] In one embodiment, the first MEMS chip is electrically connected to the substrate via a wire; and / or The second MEMS chip is electrically connected to the substrate via wires.

[0009] In one embodiment, the conductor is a gold wire.

[0010] In one embodiment, the accommodating cavity includes a first sub-isolation cavity and a second sub-isolation cavity that are isolated from each other; The first MEMS chip and the second MEMS chip are respectively disposed in the first sub-isolation cavity and the second sub-isolation cavity.

[0011] In one embodiment, the first MEMS chip is a barometer MEMS chip, and the first ASIC chip is a pressure ASIC chip; and / or The second MEMS chip is a microphone MEMS chip, and the second ASIC chip is a microphone chip.

[0012] In one embodiment, the first ASIC chip is embedded inside the substrate, and the first ASIC chip is electrically connected to the first MEMS chip through the substrate; and / or The second ASIC chip is embedded inside the substrate, and the second ASIC chip is electrically connected to the first MEMS chip through the substrate.

[0013] This invention also provides an electronic device, including the combined sensor as described above.

[0014] The combined sensor provided by this invention solves the problem of poor sensor reliability caused by the use of external waterproof membranes in existing technologies by adopting a structural design in which a waterproof membrane is attached to the inner wall of the outer casing and covers the acoustic hole. Specifically, in this solution, the combined sensor includes a cavity formed by a substrate and an outer casing, which integrates a first sensor (containing a first MEMS chip and a first ASIC chip) and a second sensor (containing a second MEMS chip and a second ASIC chip). The outer wall of the outer casing has an acoustic hole for a specific function (such as acoustic sensing), which connects the cavity to the external environment. The waterproof membrane is attached to the inner wall of the outer casing facing the substrate and covers the acoustic hole, so that the waterproof membrane is located inside the package. This not only directly isolates the cavity from the external environment entering through the acoustic hole, preventing external moisture from penetrating into the sensitive MEMS chip and ASIC chip inside, but also prevents the waterproof membrane from being directly exposed to the external environment of the device, avoiding the risk of damage, detachment, or sealing failure caused by friction, scratches, or collisions that may occur during device use, thereby greatly improving the long-term reliability and stability of the waterproof structure. In addition, this internally integrated design simplifies the packaging structure and avoids the problems of extra thickness and installation complexity caused by external coating. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of an embodiment of the combined sensor provided by this utility model; Figure 2 A schematic diagram of the structure of an embodiment of the inner shell provided by this utility model; Figure 3 A schematic diagram of the structure of an embodiment of the substrate provided by this utility model.

[0017] Explanation of icon numbers: 100. Combined sensor; 1. Package; 11. Substrate; 111. First welding position; 112. Second welding position; 113. Third welding position; 114. Fourth welding position; 12. Outer shell; 13. Receiving cavity; 131. First sub-isolation cavity; 132. Second sub-isolation cavity; 14. Acoustic hole; 2. First sensor; 21. First MEMS chip; 22. First ASIC chip; 3. Second sensor; 31. Second MEMS chip; 32. Second ASIC chip; 4. Waterproof membrane; 5. Inner shell; 51. Support plate; 511. First through hole; 512. Second through hole; 52. Partition; 6. Wire.

[0018] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0020] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0021] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0022] This utility model proposes a combined sensor 100.

[0023] Please see Figure 1 To achieve the above objectives, this utility model proposes a combined sensor 100, comprising a package 1, a first sensor 2, a second sensor 3, and a waterproof membrane 4. The package 1 includes a substrate 11 and a housing 12, which together form a cavity 13. The outer wall of the housing 12 has an acoustic hole 14 communicating with the cavity 13. The first sensor 2 includes a first MEMS chip and a first ASIC chip. The first MEMS chip is disposed in the cavity 13 and electrically connected to the substrate 11, and the first ASIC chip is electrically connected to the first MEMS chip. The second sensor 3 includes a second MEMS chip and a second ASIC chip. The second MEMS chip is disposed in the cavity 13 and electrically connected to the substrate 11, and the second ASIC chip is electrically connected to the second MEMS chip. The waterproof membrane 4 is attached to the inner wall of the housing 12 facing the substrate 11 and covers the acoustic hole 14. The waterproof membrane 4 is configured to prevent external water from entering the cavity 13 through the acoustic hole 14.

[0024] As can be seen, the substrate 11 is part of the sensor package 1, and together with the outer shell 12, it encloses a cavity 13 that houses all the sensing chips (MEMS chips and ASIC chips), and provides the main physical support for all the components within the cavity, ensuring that the components can be securely fixed in the correct position. Since both the first and second MEMS chips need to be "electrically connected to the substrate 11", conductive paths or conductive layers (usually printed copper foil traces) need to be laid on the substrate 11. These traces are connected from the solder joints or pads of the MEMS chips and extend to the edge of the substrate 11 or other designated areas to connect with other chips (ASIC chips) or external circuits (such as FPCs).

[0025] It should be noted that the combined sensor 100 provided by this utility model can be applied to wearable devices (such as smartwatches monitoring motion and altitude), smartphones, automotive electronics (airbags, tire pressure monitoring), etc. Therefore, the first MEMS chip and the second MEMS chip can be combined in many ways, depending on the function that the combined sensor 100 wants to achieve. For example, the MEMS sensor includes one of an acoustic sensor, humidity sensor, pressure sensor, or temperature sensor, which can detect sound or airflow entering through a sound hole to achieve the function of detecting sound pressure, temperature, or humidity, and the first MEMS sensor and the second MEMS sensor are of different types. In addition, each MEMS chip is equipped with an ASIC (Application-Specific Integrated Circuit) chip. The ASIC is responsible for reading the raw signal of the MEMS chip, performing signal processing, amplification, filtering, and executing calibration algorithms, and finally outputting a digital signal for use by external systems. The two independent ASICs independently optimize the signals of the two MEMS chips. The following description uses the example of the first MEMS chip being a barometer MEMS chip, the second MEMS chip being a microphone MEMS chip, the first ASIC chip being a barometer sensing chip, and the second ASIC chip being a microphone sensing chip.

[0026] The combined sensor 100 provided by this utility model solves the problem of poor sensor reliability caused by the use of an external waterproof membrane in the prior art by adopting a structural design in which a waterproof membrane 4 is attached to the inner wall of the outer shell 12 and covers the acoustic hole 14. Specifically, in this solution, the combined sensor 100 includes an accommodating cavity 13 formed by the substrate 11 and the outer shell 12, and a first sensor 2 (including a first MEMS chip and a first ASIC chip) and a second sensor 3 (including a second MEMS chip and a second ASIC chip) are integrated in the cavity. The outer wall of the housing 12 has an acoustic aperture 14 for a specific function (such as acoustic sensing). This acoustic aperture 14 connects the accommodating cavity 13 to the external environment. A waterproof membrane 4 is attached to the inner wall of the housing 12 facing the substrate 11 and covers the acoustic aperture 14. This allows the waterproof membrane 4 to be located inside the package 1, directly isolating the accommodating cavity 13 from the external environment entering through the acoustic aperture 14, preventing external moisture from penetrating into the sensitive MEMS and ASIC chips inside. Furthermore, the waterproof membrane 4 is no longer directly exposed to the external environment, avoiding the risk of damage, detachment, or seal failure caused by friction, scratches, or collisions that may occur during device use. This greatly improves the long-term reliability and stability of the waterproof structure. In addition, this internally integrated design simplifies the packaging structure and avoids the additional thickness and installation complexity associated with external coatings.

[0027] In addition, there are various structures and methods for achieving electrical connection in the above structure. For example, metal wire bonding technology can be used, by preparing tiny metal contact points on the substrate 11 and the chip pads, and then using metal wires (usually gold wires or copper wires) for precision welding, which can effectively transmit electrical signals out or introduce them into the chip; another example is that conductive adhesive can be used for bonding or welding.

[0028] A waterproof membrane 4 typically includes a membrane body and a substrate connecting both sides of the membrane body. The membrane body and the substrate are sealed together, giving the waterproof membrane both highly efficient waterproof and breathable functions, as well as sufficient mechanical strength and ease of use. Here, the waterproof membrane 4 can be a waterproof and breathable membrane or a waterproof and sound-permeable membrane.

[0029] In one embodiment, the size of the waterproof membrane 4 matches the cross-sectional area of ​​the acoustic hole 14; or, the size of the waterproof membrane 4 matches the cross-sectional size of the accommodating cavity 13.

[0030] In the first embodiment, since the waterproof membrane 4 needs to cover the sound hole 14, the above-mentioned "the size of the waterproof membrane 4 matches the cross-sectional area of ​​the sound hole 14" means that the size of the waterproof membrane 4 can be designed to be slightly larger than the cross-sectional area of ​​the sound hole 14. In this way, when the waterproof membrane 4 is attached to the inner wall surface of the housing 12 facing the substrate 11 and covers the sound hole 14, the waterproof membrane 4 can naturally cover the sound hole 14, and its edge will extend slightly to the area around the sound hole 14.

[0031] In the second embodiment, the phrase "the size of the waterproof membrane 4 matches the cross-sectional size of the accommodating cavity 13" means that the size of the waterproof membrane 4 is designed to be approximately the same as the cross-sectional size of the entire accommodating cavity 13 (i.e., it can be slightly larger than the cross-sectional size of the accommodating cavity 13, slightly smaller than the cross-sectional size of the accommodating cavity 13, or exactly the same as the cross-sectional size of the accommodating cavity 13). Those skilled in the art will understand that in this embodiment, the effective area of ​​the waterproof membrane 4 is much larger than the effective area of ​​the waterproof membrane 4 directly attached to the sound hole 14. The larger the effective area of ​​the waterproof membrane 4, the better the vibration sound transmission effect, which helps to reduce sound loss and improve product performance.

[0032] In one embodiment, the combined sensor 100 includes an inner housing 5 disposed in a receiving cavity 13. The inner housing 5 includes a support plate 51 disposed between a waterproof membrane 4 and a substrate 11. The support plate 51 is connected to the inner wall surface of the outer housing 12. The side of the support plate 51 facing the substrate 11, the inner wall surface of the outer housing 12, and the side of the substrate 11 facing the support plate 51 enclose an isolation cavity. The waterproof membrane 4 is attached to the side of the support plate 51 facing away from the substrate 11. A first MEMS chip and a second MEMS chip are disposed in the isolation cavity.

[0033] In this embodiment, the waterproof membrane 4 cleverly forms a "sandwich" sealing structure with the inner wall of the outer shell 12 through the support plate 51. This design effectively avoids the edge warping or uneven adhesion problems that easily occur when the outer membrane is directly attached to the outer shell 12 in the traditional way. Moreover, the support plate 51 also provides solid physical support for the waterproof membrane 4 attached to it. When external water pressure acts directly on the waterproof membrane 4, the support plate 51 can effectively prevent the membrane material from being excessively deformed, avoiding the risk of being crushed or torn under greater pressure. This greatly ensures the long-term waterproof performance and overall reliability of the sensor, and significantly improves the reliability of the seal. At the same time, the isolation cavity formed by the support plate 51, the inner wall of the outer shell, and the substrate 11 not only further blocks external moisture from possibly intruding through the shell gaps by utilizing its sealing properties, but also creates a highly stable working environment for the sensitive first MEMS chip and second MEMS chip inside, effectively reducing thermal noise and electromagnetic interference from other devices.

[0034] In addition, under the above structure, the combined sensor 100 can be assembled upside down so that the sound hole 14 faces the external environment. While directly sensing environmental changes and picking up sound, it can also ensure that residual moisture can be quickly discharged from the product.

[0035] Please see Figure 1 and Figure 2 In one embodiment, the inner housing 5 further includes a partition 52, which is disposed on the side of the support plate 51 facing the substrate 11. The partition 52 is connected to the inner wall surface of the outer housing 12 and the side of the substrate 11 facing the support plate 51. The partition 52, the side of the support plate 51 facing the substrate 11, the side of the substrate 11 facing the support plate 51, and the inner wall surface of the outer housing 12 together form a first sub-isolation cavity 131 and a second sub-isolation cavity 132. The first MEMS chip and the second MEMS chip are respectively disposed in the first sub-isolation cavity 131 and the second sub-isolation cavity 132.

[0036] In this embodiment, the inner housing 5 includes a support plate 51 and a partition plate 52, the cross-section of which resembles a "T" shape (the support plate 51 is the upper horizontal part of the "T", and the partition plate 52 is the vertical part of the "T"). The vertical part of the partition plate 52 is tightly connected to the inner wall surface of the outer housing 12 and the side of the substrate 11 facing the support plate 51, thereby clearly dividing the internal space into two independent regions, namely the first sub-isolation cavity 131 and the second sub-isolation cavity 132. Since the outer contour shape of the package 1 is usually a roughly annular square cylindrical structure (or a cylindrical structure), the support plate 51 is connected to the inner wall surface of the outer housing 12, and the partition plate 52 is connected to the substrate 11. Thus, after the inner housing 5 is assembled, both the first sub-isolation cavity 131 and the second sub-isolation cavity 132 are roughly cuboid cavities, and their dimensions are roughly the same. The first MEMS chip and the second MEMS chip are respectively placed in these two sub-isolation cavities defined by the "T" shape. In this way, the arrangement of the inner housing 5 achieves the isolation of the dual MEMS chip environment. On the one hand, the inner shell 5 constructs two thermally independent microenvironments. When a MEMS chip generates heat during operation, its temperature rise is mainly confined to its own sub-isolation cavity, significantly reducing the efficiency of heat transfer to the other cavity. This effectively suppresses thermal crosstalk between chips, enabling each chip to operate in a more stable temperature field closer to the design baseline, greatly improving the temperature stability of the sensor. On the other hand, the physical barrier formed by the partition 52 and the support plate 51 greatly enhances the electromagnetic isolation performance. The electromagnetic radiation generated by the MEMS chip (including signal transmission and drive circuits, etc.) is effectively confined within its respective sub-isolation cavity, making it difficult to interfere with adjacent MEMS chips and their sensitive circuits. This significantly reduces electromagnetic crosstalk between the two MEMS chips, ensuring the purity of their respective signal transmissions and measurement accuracy. Therefore, by adding the partition 52 to form independent sub-isolation cavities, dual physical isolation from thermal noise and electromagnetic interference can be achieved, effectively improving the independent operating performance and overall reliability of each chip inside the combined sensor 100.

[0037] Of course, the formation of the first sub-isolation cavity 131 and the second sub-isolation cavity 132 can be independent of the inner shell 5. In one embodiment, the accommodating cavity 13 includes a first sub-isolation cavity 131 and a second sub-isolation cavity 132 that are isolated from each other; the first MEMS chip and the second MEMS chip are respectively disposed in the first sub-isolation cavity 131 and the second sub-isolation cavity 132. That is, the outer shell 12 itself is designed as a structure with a separation function. For example, the outer shell 12 can directly divide two physically isolated spaces in the accommodating cavity 13 through a specific shape, protrusion, groove or integrally formed partition. The first MEMS chip is placed in one space and the second MEMS chip is placed in the other space.

[0038] It should be added that the connection methods between the inner housing 5, the outer housing 12, and the base plate 11 are diverse, including fixing with screws and studs, gluing, snap-fitting, or welding. For example, for applications requiring a high sealing level, gluing or welding may be preferred; while for scenarios requiring rapid assembly and disassembly, snap-fitting may be more suitable.

[0039] Please refer to Figure 3 In a preferred embodiment, the substrate 11 has pads on the side facing the outer shell 12. Both the inner shell 5 and the outer shell 12 are grounded by soldering to the pads on the substrate 11 with solder paste, thus fixing both the inner shell 5 and the outer shell 12 to the substrate 11. Specifically, the substrate 11 has a first soldering position 111 and a second soldering position 112. The first soldering position 111 is soldered to the outer shell 12, and the second soldering position 112 is soldered to the partition 52 of the inner shell 5. This method not only provides a very strong mechanical connection, ensuring the stability and reliability of the entire sensor structure, but also achieves electrical connection, providing a good electromagnetic shielding environment for the internal sensitive MEMS chip, reducing electromagnetic interference (EMI) from the outside, and preventing internal signals from radiating outwards and interfering with other devices.

[0040] In one embodiment, the support plate 51 has a first through hole 511 communicating with the first sub-isolation cavity 131 on the side opposite to the substrate 11; and / or, the support plate 51 has a second through hole 512 communicating with the second sub-isolation cavity 132 on the side opposite to the substrate 11.

[0041] In the first embodiment, for the barometer MEMS chip, the first through-hole 511 provides a channel for pressure exchange between the first sub-isolation cavity 131 and the external environment. External gas can slowly and steadily enter the first isolation cavity through this through-hole 511, ensuring that the pressure value sensed by the barometer chip accurately reflects changes in external atmospheric pressure and avoiding measurement errors caused by inconsistencies between the cavity pressure and the external environment. In the second embodiment, for the microphone MEMS chip, the second through-hole 512 is directly connected to the second sub-isolation cavity 132, providing an acoustic channel for external sound signals to enter the second sub-isolation cavity 132 and act on the microphone MEMS chip. Sound waves can be transmitted unimpeded to the sensitive element of the microphone MEMS chip through this through-hole, ensuring the sensitivity and accuracy of the microphone MEMS chip in receiving sound. Thus, on the one hand, the accuracy of the barometer function is ensured, and on the other hand, the normal reception of the microphone function is guaranteed. The two functions do not interfere with each other and together provide the sensor with reliable environmental sensing and sound acquisition capabilities, improving the overall performance and practicality of the sensor.

[0042] Furthermore, multiple first through holes 511 and second through holes 512 can be evenly provided on the support 51, and all of them are small-sized through holes (such as 0.1mm~0.3mm in diameter).

[0043] In one embodiment, the first MEMS chip is electrically connected to the substrate 11 via a wire 6; and / or, the second MEMS chip is electrically connected to the substrate 11 via a wire 6.

[0044] In both the first and second embodiments, the wire connection 6 is a very mature and commonly used interconnection technology in microelectronics manufacturing. It establishes an electrical connection by forming bonding points between the chip pads and the substrate 11 pads using fine metal wires (such as gold, copper, or aluminum wires). The process is relatively mature, cost-effective, and applicable to various substrate 11 and chip materials. Besides the wire connection 6, the first and second MEMS chips can also be connected to the substrate 11 using flip-chip bonding. This involves inverting the chip and directly aligning and connecting it to the pads on the substrate 11 via solder balls or bumps on the back of the chip.

[0045] Furthermore, since gold wire has a high conductivity and good ductility, making it easy to work with, the conductor 6 in this embodiment is preferably gold wire. In practical applications, silver wire can also be used for conductor 6, and this embodiment does not impose any restrictions on this.

[0046] In one embodiment, a first ASIC chip is embedded inside a substrate 11 and is electrically connected to a first MEMS chip through the substrate 11; and / or a second ASIC chip is embedded inside a substrate 11 and is electrically connected to the first MEMS chip through the substrate 11.

[0047] In the first and second embodiments, this "embedding" method is achieved through an "embedded process," meaning that the ASIC chip is typically placed at a specific location during the manufacturing process of the substrate 11, and then the chip is covered and fixed inside the substrate 11 by molding, lamination, or other methods. The electrical signals of the ASIC chip embedded inside the substrate 11 are not directly led out through wire bonding or other methods, but rather through pre-designed circuitry within the substrate 11 to lead the signals of the first and second ASIC chips to the third soldering position 113 and the fourth soldering position 114 of the substrate 11, respectively. Simultaneously, corresponding solder pads are also provided on the side of the substrate 11 facing away from the housing 12 to enable signal transmission between external components and the first and second ASIC chips embedded inside the substrate 11. It is readily apparent that by embedding the microphone ASIC chip and the barometer ASIC chip into the substrate 11 using an embedded process, the space occupied and the overall size of the product can be effectively reduced. Furthermore, the embedded process makes the signal transmission path shorter and more direct, reducing signal attenuation and noise interference caused by the length of the line, and improving signal integrity and anti-interference capability. In addition, after the ASIC chip is embedded in the substrate 11, heat can be quickly conducted through the substrate 11. Combined with a good heat dissipation design (such as thermally conductive materials or heat dissipation channels), the temperature of the chip during operation can be further reduced, and the stability of the device can be improved.

[0048] This utility model also provides an electronic device, including a combined sensor 100. The specific structure of this combined sensor is as described in the above embodiments. Since the electronic device adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be elaborated further here. The electronic device can be a smart wearable device, such as a smart headset, smart bracelet, smartwatch, or smart speaker, microphone, recording device, or any electronic device that requires precise sensing of vibration and acoustic environment.

[0049] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A combined sensor, characterized in that, include: The package includes a substrate and a housing, the housing and the substrate enclosing each other to form a cavity, and the outer wall of the housing has an acoustic hole communicating with the cavity; A first sensor, comprising a first MEMS chip and a first ASIC chip, wherein the first MEMS chip is disposed within the accommodating cavity and electrically connected to the substrate, and the first ASIC chip is electrically connected to the first MEMS chip; The second sensor includes a second MEMS chip and a second ASIC chip. The second MEMS chip is disposed in the accommodating cavity and electrically connected to the substrate. The second ASIC chip is electrically connected to the second MEMS chip. as well as A waterproof membrane is attached to the inner wall of the outer casing facing the substrate and covers the acoustic hole. The waterproof membrane is configured to prevent external water from entering the accommodating cavity through the acoustic hole.

2. The combined sensor as described in claim 1, characterized in that, The combined sensor includes an inner housing disposed in the accommodating cavity. The inner housing includes a support plate disposed between the waterproof membrane and the substrate. The support plate is connected to the inner wall surface of the outer housing. The side of the support plate facing the substrate, the inner wall surface of the outer housing, and the side of the substrate facing the support plate enclose an isolation cavity. The waterproof membrane is attached to the side of the support plate facing away from the substrate; the first MEMS chip and the second MEMS chip are disposed in the isolation cavity.

3. The combined sensor as described in claim 2, characterized in that, The inner shell also includes a partition, which is disposed on the side of the support plate facing the base plate, and the partition is connected to the inner wall surface of the outer shell and the side of the base plate facing the support plate; The partition, the side of the support plate facing the substrate, the side of the substrate facing the support plate, and the inner wall of the outer shell together form a first sub-isolation cavity and a second sub-isolation cavity. The first MEMS chip and the second MEMS chip are respectively disposed in the first sub-isolation cavity and the second sub-isolation cavity.

4. The combined sensor as described in claim 3, characterized in that, The support plate has a first through hole on the side opposite to the substrate, which connects to the first sub-isolation cavity; and / or The support plate has a second through hole on the side opposite to the substrate, which connects to the second sub-isolation cavity.

5. The combined sensor as described in any one of claims 1 to 4, characterized in that, The first MEMS chip is electrically connected to the substrate via wires; and / or The second MEMS chip is electrically connected to the substrate via wires.

6. The combined sensor as described in claim 5, characterized in that, The conductor is gold wire.

7. The combined sensor as described in any one of claims 1 to 4, characterized in that, The dimensions of the waterproof membrane match the cross-sectional area of ​​the acoustic pore; or, The dimensions of the waterproof membrane are matched to the dimensions of the cross-section of the accommodating cavity.

8. The combined sensor as described in any one of claims 1 to 4, characterized in that, The first MEMS chip is a barometer MEMS chip, and the first ASIC chip is a pressure ASIC chip; and / or The second MEMS chip is a microphone MEMS chip, and the second ASIC chip is a microphone chip.

9. The combined sensor as described in any one of claims 1 to 4, characterized in that, The first ASIC chip is embedded inside the substrate, and the first ASIC chip is electrically connected to the first MEMS chip through the substrate; and / or The second ASIC chip is embedded inside the substrate, and the second ASIC chip is electrically connected to the first MEMS chip through the substrate.

10. An electronic device, characterized in that, Including the combined sensor as described in any one of claims 1 to 9.

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