A porous ceramic chuck self-cleaning semiconductor sputtering transfer device

Abstract

The utility model relates to a kind of semiconductor sputtering transmission devices of porous ceramic chuck self-cleaning, including processing kettle, the side wall of processing kettle is equipped with feed hole;Sealing assembly, sealing assembly is installed in the outside of processing kettle, sealing assembly is used to seal feed hole, sealing assembly includes servo motor, gear, fixed ring and sealing plate, servo motor is fixedly installed in the outside of processing kettle, gear is fixedly connected with the output shaft of servo motor, fixed ring is rotatably sleeved in the outside of processing kettle, fixed ring is equipped with gear slot in the outside, gear is engaged with gear slot, by the use of sealing assembly, more sufficient sealing treatment can be carried out to feed opening, prevent the poor sealing effect of feed opening to cause the vacuum effect reduction inside transmission device, beneficial to keep the vacuum state of transmission device inside more sufficient, can sufficiently improve the quality of the surface processing of porous ceramic chuck, convenient to use.

Description

Technical Field

[0001] This utility model relates to the field of ceramic suction cup processing technology, and in particular to a self-cleaning semiconductor sputtering transfer device for porous ceramic suction cups. Background Technology

[0002] Porous ceramic chucks are adsorption devices used in semiconductor manufacturing, photolithography, etching, and precision processes. The self-cleaning function of porous ceramic chucks refers to the ability of special structures and materials to automatically remove stains and microorganisms from the surface of the porous ceramic chuck, reducing the frequency of manual cleaning. The self-cleaning process of porous ceramic chucks requires the use of semiconductor sputtering transport devices. Its core function is to transport and deposit sputtered atoms onto the substrate surface by bombarding the target material with ions in a vacuum environment, enabling self-cleaning processing on the surface of porous ceramic chucks.

[0003] A search revealed Chinese Patent CN118345335A, which discloses a magnetron sputtering coating apparatus, relating to the field of semiconductor processing equipment technology. It includes at least a vacuum sample introduction chamber, a vacuum coating chamber, and a sample vacuum transfer channel. The sample vacuum transfer channel connects the vacuum sample introduction chamber and the vacuum coating chamber to transfer the sample from the vacuum sample introduction chamber to the vacuum coating chamber for coating. The sample transfer device transports the sample from the outside to a heatable sample stage, which is suitable for preheating the sample. A magnetron sputtering nozzle is positioned above the sample tray in the coating chamber for magnetron sputtering coating of the sample. The stage is vertically adjustable within the vacuum coating chamber to control the height between the sample and the magnetron sputtering nozzle. A process gas delivery pipeline is connected outside the vacuum coating chamber. This magnetron sputtering apparatus exhibits high process compatibility.

[0004] The above technical solutions can only improve the process compatibility of the equipment, but cannot provide a more thorough sealing treatment for the feed inlet. This can easily lead to a problem of poor sealing effect at the feed inlet, resulting in a reduction in the vacuum effect inside the transmission device. This is not conducive to maintaining a sufficient vacuum state inside the transmission device and cannot fully improve the quality of surface processing of porous ceramic suction cups. Utility Model Content

[0005] The above-mentioned technical solutions only improve the process compatibility of the equipment, but cannot provide a more thorough sealing treatment for the feed inlet. This can easily lead to a poor sealing effect at the feed inlet, resulting in a reduction in the vacuum effect inside the transmission device. This is not conducive to maintaining a sufficient vacuum state inside the transmission device and cannot fully improve the quality of surface processing of porous ceramic chucks. Therefore, this utility model provides a self-cleaning semiconductor sputtering transmission device for porous ceramic chucks.

[0006] The technical solution adopted in this utility model is: a porous ceramic suction cup self-cleaning semiconductor sputtering transfer device, comprising:

[0007] A processing vessel, wherein a feed hole is provided on the side wall of the processing vessel;

[0008] A sealing assembly is installed outside the processing vessel to seal the feed port. The sealing assembly includes a servo motor, a gear, a retaining ring, and a sealing plate. The servo motor is fixedly installed outside the processing vessel. The gear is fixedly connected to the output shaft of the servo motor. The retaining ring is rotatably sleeved outside the processing vessel. The retaining ring has a toothed groove on its outer side. The gear meshes with the toothed groove. The sealing plate is fixedly installed between the retaining rings and outside the feed port. A sealing gasket is bonded to the inner sidewall of the sealing plate. The sealing gasket is located between the sidewall of the feed port and the sealing plate. A push block is fixedly installed on the retaining ring.

[0009] Furthermore, the processing vessel is equipped with a clamping assembly, which is used to improve the sealing performance between the feed hole and the sealing plate.

[0010] Furthermore, the clamping assembly includes a second push block, a clamping plate, a pull rod, a spring, and a slide rail. The second push block is slidably connected to the first push block and is fixedly mounted on the clamping plate. The pull rod is fixedly connected to the clamping plate and slides through the slide rail. The spring is located inside the slide rail, and both ends of the spring are fixedly connected to the inner walls of the pull rod and the slide rail. A second sealing gasket is bonded inside the clamping plate, and the clamping plate and the second sealing gasket are fitted onto the upper and lower ends of the feed hole and the sealing plate.

[0011] Furthermore, a retaining ring is fixedly installed on the outside of the processing vessel, and the retaining ring is rotatably inserted inside the retaining ring.

[0012] Furthermore, the processing vessel is externally fixedly equipped with a housing, and the sealing assembly, the clamping assembly, and the collar are located within the housing.

[0013] Furthermore, the sidewall of the outer casing is provided with an external through hole.

[0014] The beneficial effects of this utility model are:

[0015] This invention, through the setting of the sealing component, can achieve a more thorough sealing effect on the feed inlet, preventing a reduction in the vacuum effect inside the transmission device due to poor sealing effect of the feed inlet. This helps to maintain a relatively sufficient vacuum state inside the transmission device, which can significantly improve the quality of surface processing of porous ceramic suction cups. Attached Figure Description

[0016] Figure 1 This is a cross-sectional structural diagram of the present invention;

[0017] Figure 2 This is a schematic diagram showing the disassembled structure of the sealing component and clamping component of this utility model;

[0018] Figure 3 This is a cross-sectional structural diagram of the sealing component and clamping component of this utility model;

[0019] Figure 4 This is a front view structural diagram of this utility model.

[0020] The markings in the diagram are as follows: 1. Processing vessel; 2. Feed hole; 3. Sealing assembly; 301. Servo motor; 302. Gear; 303. Fixing ring; 304. Sealing plate; 305. Sealing gasket one; 306. Push block one; 4. Gear groove; 5. Clamping assembly; 501. Push block two; 502. Clamping plate; 503. Pull rod; 504. Spring; 505. Slide rail; 506. Sealing gasket two; 6. Collar; 7. Outer shell; 8. External through hole. Detailed Implementation

[0021] In the description of this utility model, it should be noted that the terms "front", "up", "down", "left", "right", "vertical", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] The following is in conjunction with the appendix Figure 1-4 The present invention will be further described below.

[0024] To address the problems existing in the background art, this application proposes the following technical solution: a porous ceramic suction cup self-cleaning semiconductor sputtering transfer device.

[0025] The specific technical solution includes a processing vessel 1 and a sealing assembly 3;

[0026] like Figure 1-4 As shown, a feed hole 2 is provided on the side wall of the processing vessel 1; a sealing assembly 3 is installed on the outside of the processing vessel 1. The sealing assembly 3 is used to seal the feed hole 2. The sealing assembly 3 includes a servo motor 301, a gear 302, a fixing ring 303, and a sealing plate 304. The servo motor 301 can drive the gear 302 to rotate, and the gear 302 can drive the fixing ring 303 to rotate through the tooth groove 4. The fixing ring 303 can support the sealing plate 304, and the sealing plate 304 can block the feed hole 2. The servo motor 301 is fixedly installed on the outside of the processing vessel 1. The gear 302 and the output of the servo motor 301 are connected. The shaft is fixedly connected, and the fixed ring 303 is rotatably sleeved on the outside of the processing vessel 1. The fixed ring 303 has a toothed groove 4 on its outside. The gear 302 meshes with the toothed groove 4. The sealing plate 304 is fixedly installed between the fixed rings 303 and located outside the feed hole 2. The inner side wall of the sealing plate 304 is bonded with a sealing gasket 305. The sealing gasket 305 can improve the sealing between the sealing plate 304 and the feed hole 2. The sealing gasket 305 is located between the side wall of the feed hole 2 and the sealing plate 304. The fixed ring 303 is fixedly installed with a push block 306. The push block 306 can easily push the push block 501 to move.

[0027] according to Figure 1 and Figure 2 The servo motor 301 is started to drive the gear 302 to rotate. The gear 302 can drive the fixed ring 303 to rotate around the central axis of the processing vessel 1 in the horizontal plane through the tooth groove 4. The rotation of the fixed ring 303 can drive the sealing plate 304 and the push block 306 to rotate. The sealing plate 304 can drive the sealing gasket 305 to rotate. The sealing plate 304 can cover the outside of the feed hole 2, and the inner side wall of the sealing plate 304 can be pressed against the left and right side walls of the feed hole 2 through the sealing gasket 305. The sealing plate 304 can block the outside of the feed hole 2. During the process of the sealing plate 304 blocking the feed hole 2, the push block 306 is driven to rotate by the fixed ring 303 and can press the push block 501.

[0028] like Figure 1-4As shown, the processing vessel 1 is equipped with a clamping assembly 5, which is used to improve the sealing between the feed hole 2 and the sealing plate 304. The clamping assembly 5 includes a second push block 501, a clamping plate 502, a pull rod 503, a spring 504, and a slide rail 505. There are two push blocks 501 and two push blocks 306. Both push blocks 306 and push blocks 501 are triangular structures. The upper push block 306 is located above the upper push block 501, and the lower push block 306 is located below the lower push block 501. The push blocks 306 and push blocks 501 that are in contact with each other are pressed against each other by the inclined surfaces. There are two clamping plates 502 located above and below the sealing plate 304. The clamping plates 502 can limit and clamp the sealing plate 304. The pull rod 504... 3. The clamping plate 502 can be limited and supported by the limiting of the slide rail 505. The spring 504 can drive the pull rod 503 to reset. The second push block 501 is slidably connected to the first push block 306. The second push block 501 is fixedly installed on the clamping plate 502. The pull rod 503 is fixedly connected to the clamping plate 502. The pull rod 503 slides through the inside of the slide rail 505. The spring 504 is located inside the slide rail 505. The two ends of the spring 504 are fixedly connected to the pull rod 503 and the inner wall of the slide rail 505. The second sealing gasket 506 is bonded inside the clamping plate 502. The second sealing gasket 506 can improve the sealing between the clamping plate 502 and the upper and lower ends of the feed hole 2 and the sealing plate 304. The clamping plate 502 and the second sealing gasket 506 are sleeved on the upper and lower ends of the feed hole 2 and the sealing plate 304.

[0029] According to the steps described above, where the fixed ring 303 drives the push block 306 to rotate, when the push block 306 rotates, its triangular inclined surface can press against the triangular inclined surface of the push block 501. The slide rail 505 is fixed by the processing vessel 1, so the slide rail 505 can limit the pull rod 503 horizontally. The pull rod 503 can limit the clamping plate 502 horizontally, and the clamping plate 502 can limit the push block 501 horizontally. The push block 501 can only move up and down, so it can move up and down under the push of the push block 306. The upper push block 501 descends while the lower push block 501 rises, and the upper and lower push blocks 501 can respectively drive the upper and lower push blocks 501. The clamping plate 502 descends and rises, and the clamping plate 502 can drive the sealing gasket 2 506 to squeeze and seal the upper and lower ends of the feed hole 2 and the sealing plate 304, which can improve the sealing effect of the feed hole 2. When the clamping plate 502 rises and falls, it can pull the pull rod 503 to rise and fall within the slide rail 505. The pull rod 503 can pull the spring 504. The end of the spring 504 away from the pull rod 503 is fixed by the slide rail 505. The spring 504 is extended, so the spring 504 can give the pull rod 503 a reverse pulling force. When the feed hole 2 is opened, the push block 2 501 loses the squeezing of the push block 1 306, and the spring 504 can drive the pull rod 503 to reset. The pull rod 503 can drive the clamping plate 502 to reset.

[0030] like Figure 1-3As shown, a collar 6 is fixedly installed on the outside of the processing vessel 1. The collar 6 can limit the fixed ring 303 and prevent the fixed ring 303 from moving in the vertical direction. The fixed ring 303 is rotatably inserted inside the collar 6.

[0031] like Figure 1 and Figure 4 As shown, the processing vessel 1 is externally fixedly equipped with a housing 7, which can protect the sealing assembly 3, the clamping assembly 5 and the collar 6. The sealing assembly 3, the clamping assembly 5 and the collar 6 are located in the housing 7.

[0032] like Figure 4 As shown, the side wall of the outer shell 7 is provided with an external through hole 8. When the external through hole 8 is opened, it is convenient to feed the porous ceramic suction cup into the feed hole 2, and to facilitate the processing of the outer surface of the porous ceramic suction cup.

[0033] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0034] Although embodiments of the present invention have been shown and described, the scope of the present invention will be defined by the appended claims and their equivalents for those skilled in the art.

Claims

1. A self-cleaning semiconductor sputtering transport device with a porous ceramic chuck, characterized in that, include: Processing vessel (1), wherein a feed hole (2) is provided on the side wall of the processing vessel (1); A sealing assembly (3) is installed outside the processing vessel (1) to seal the feed hole (2). The sealing assembly (3) includes a servo motor (301), a gear (302), a retaining ring (303), and a sealing plate (304). The servo motor (301) is fixedly installed outside the processing vessel (1). The gear (302) is fixedly connected to the output shaft of the servo motor (301). The retaining ring (303) is rotatably sleeved on the processing vessel. (1) Outside the fixed ring (303), a toothed groove (4) is provided on the outside of the fixed ring (303), the gear (302) meshes with the toothed groove (4), the sealing plate (304) is fixedly installed between the fixed ring (303) and located outside the feed hole (2), a sealing gasket (305) is bonded to the inner side wall of the sealing plate (304), the sealing gasket (305) is located between the side wall of the feed hole (2) and the sealing plate (304), and a push block (306) is fixedly installed on the fixed ring (303).

2. The porous ceramic chuck self-cleaning semiconductor sputtering transport device according to claim 1, characterized in that, The processing vessel (1) is equipped with a clamping assembly (5), which is used to improve the sealing between the feed hole (2) and the sealing plate (304).

3. The porous ceramic chuck self-cleaning semiconductor sputtering transport device according to claim 2, characterized in that, The clamping assembly (5) includes a second push block (501), a clamping plate (502), a pull rod (503), a spring (504), and a slide rail (505). The second push block (501) is slidably connected to the first push block (306). The second push block (501) is fixedly mounted on the clamping plate (502). The pull rod (503) is fixedly connected to the clamping plate (502). The pull rod (503) slides through the inside of the slide rail (505). The spring (504) is located inside the slide rail (505). The two ends of the spring (504) are fixedly connected to the inner walls of the pull rod (503) and the slide rail (505). A second sealing gasket (506) is bonded inside the clamping plate (502). The clamping plate (502) and the second sealing gasket (506) are sleeved on the upper and lower ends of the feed hole (2) and the sealing plate (304).

4. The porous ceramic chuck self-cleaning semiconductor sputtering transport device according to claim 3, characterized in that, The processing vessel (1) is fixedly equipped with a collar (6) on its outside, and the fixed ring (303) is rotatably inserted inside the collar (6).

5. The porous ceramic chuck self-cleaning semiconductor sputtering transport device according to claim 4, characterized in that, The processing vessel (1) is externally fixedly equipped with a shell (7), and the sealing assembly (3), the clamping assembly (5) and the collar (6) are located on the shell (7).

6. The porous ceramic chuck self-cleaning semiconductor sputtering transport device according to claim 5, characterized in that, The outer casing (7) has an external through hole (8) on its side wall.

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