A plating solution supply device for semiconductor plating

Abstract

The utility model discloses a kind of electroplating solution supply devices for semiconductor electroplating, including Tank, four Tanks are set into first group Tank and second two groups Tank with two Tanks as a group;First circulation pipeline and second circulation pipeline are respectively arranged in each Tank, first control valve is arranged in each first circulation pipeline, second control valve is arranged in each second circulation pipeline;First pipeline is communicated with four first circulation pipelines respectively;Second pipeline is communicated with four second circulation pipelines respectively;Two Tanks in each group are communicated by fourth control valve;Two ends of liquid pump are communicated with two ends of second pipeline by third pipeline and fourth pipeline respectively, the utility model can guarantee the consistency of the concentration of multiple Tank's liquid medicine, the consistency of whole machine electroplating effect, can make multiple Tank between break off after individually supplying different process liquid medicine, analytical instrument connected with fourth connecting pipe analyzes electroplating solution in Tank, and cost is low.

Description

Technical Field

[0001] This utility model relates to an electroplating solution supply device, and more particularly to an electroplating solution supply device for semiconductor electroplating. Background Technology

[0002] Currently, the electroplating solution supply system in electroplating processes uses a large tank to supply all electroplating chambers. The electroplating solution enters the equipment from the plant interface, passing through manual valves, pneumatic valves, pressure reducing valves, flow meters, etc., before entering the tank. Simultaneously, various additives are added to the tank to control the internal temperature and supply the solution to each electroplating chamber. As the number of electroplating chambers increases, the required capacity of the electroplating solution tank also increases. Mechanically increasing the tank's size would make the mechanism excessively bulky, uneconomical, and difficult to maintain. Therefore, a dual-tank structure is typically used, with two tanks supplying solution to specific electroplating chambers.

[0003] However, in practical use, it has been found that if the dual-tank structure and process are identical, the concentration of the chemical solution in the two tanks will differ when they operate independently. Furthermore, when several electroplating chambers supplied by one tank are not used for an extended period, the chemical solution within the tank will decompose and become contaminated due to prolonged stagnation. This can easily lead to plating defects when electroplating is resumed, resulting in high recovery costs and increased production costs. Therefore, the existing dual-tank structure and process have many drawbacks and are not suitable for practical needs. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art by providing a semiconductor electroplating solution supply device. The device provides a consistent electroplating effect, high flexibility of use, low cost, and can meet the needs of multiple electroplating solutions.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: an electroplating solution supply device for semiconductor electroplating, comprising:

[0006] The four Tanks are arranged in groups of two, and then adjacent to each other to form the first group of Tanks and the second group of Tanks.

[0007] A first circulation pipeline and a second circulation pipeline are respectively provided in each of the Tanks, wherein each first circulation pipeline is provided with a first control valve and each second circulation pipeline is provided with a second control valve;

[0008] The first pipeline is connected to the first circulation pipeline in each of the four Tanks;

[0009] The second pipeline is connected to the second circulation pipeline of each of the four Tanks; wherein, each group of two Tanks is connected by a fourth control valve;

[0010] The liquid pump has two ends connected to the two ends of the second pipeline via a third pipeline and a fourth pipeline, respectively. The ends of the third pipeline and the fourth pipeline connected to the second pipeline are also connected to the second circulation pipeline located on the left side of the first group of Tanks and the second circulation pipeline located on the right side of the second group of Tanks, respectively.

[0011] Furthermore, the first control valve, the second control valve, the third control valve, and the fourth control valve are all pneumatically controlled valves.

[0012] Furthermore, the fourth pipeline is also equipped with analytical instruments.

[0013] Furthermore, a flow meter is also installed at the second circulation pipeline.

[0014] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0015] This invention adds a first control valve and a second control valve to the first and second circulation pipelines on each Tank, and connects multiple Tanks to each other through the first, second, third, and fourth pipelines, the third and fourth control valves, and the liquid pump. When the electroplating chambers supplied by multiple Tanks are working simultaneously and the process is the same, all valves except the third control valve are opened to ensure that the concentration of the chemical solution in multiple Tanks is consistent and the electroplating effect of the whole machine is consistent.

[0016] When multiple tanks supply electroplating chambers using different processes, the first, second, third, or fourth control valves on the corresponding tanks can be closed, disconnecting the multiple tanks. Each tank can then supply different process solutions, enhancing the overall flexibility and adaptability of the machine.

[0017] In addition, an analytical instrument is also installed on the fourth connecting pipe, so that the electroplating solution in multiple tanks can be analyzed by one analytical instrument during operation, reducing the number of analytical instruments required and lowering the operating cost. Attached Figure Description

[0018] The technical solution of this utility model will be further described below with reference to the accompanying drawings:

[0019] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0020] Figure 2 for Figure 1 A partial schematic diagram;

[0021] Figure 3 This is a schematic diagram of the flow direction structure when Tank A is not circulated in one embodiment of this utility model;

[0022] Figure 4 This is a schematic diagram of the flow direction structure when Tank A and Tank B are not circulated in one embodiment of the present invention;

[0023] Figure 5 This is a schematic diagram of the flow direction structure when Tank A and Tank C do not circulate in one embodiment of the present invention;

[0024] Figure 6 This is a schematic diagram of another embodiment of the present invention;

[0025] Among them: 1. Tank; 2. First circulation pipeline; 3. Second circulation pipeline; 4. First pipeline; 5. Second pipeline; 6. Liquid pump; 7. First control valve; 8. Second control valve; 9. Third control valve; 10. Fourth control valve; 11. Third pipeline; 12. Fourth pipeline; 13. Analytical instrument. Detailed Implementation

[0026] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0027] This invention provides an electroplating solution supply device for semiconductor electroplating, which solves the problems in the prior art where, when the two tanks have the same structure and process, the concentration of the chemical solution in the two tanks is different when they work independently, and the chemical solution in the unused tank will decompose if it stays for a long time, which will easily cause product electroplating defects when it is restarted, thus increasing production costs.

[0028] For ease of understanding, the specific processes in the embodiments of this application are described below. Please refer to [link / reference]. Figures 1 to 2An electroplating solution supply device for semiconductor electroplating according to an embodiment of this application includes a Tank 1, a first circulation pipeline 2, a second circulation pipeline 3, a first pipeline 4, a second pipeline 5, and a liquid pump 6; the four Tanks are arranged adjacently in pairs to form a first group of Tanks and a second group of Tanks; each Tank 1 is provided with a first circulation pipeline 2 and a second circulation pipeline 3, wherein each first circulation pipeline 2 is provided with a first control valve 7, and each second circulation pipeline 3 is provided with a second control valve 8.

[0029] The first pipeline 4 is connected to the first circulation pipeline 2 of the four Tank 1 respectively; the second pipeline 5 is connected to the second circulation pipeline 3 of the four Tank 1 respectively; wherein, each pair of Tank 1 is connected by a fourth control valve 10.

[0030] The two ends of the liquid pump 6 are connected to the two ends of the second pipe 5 via the third pipe 11 and the fourth pipe 12, respectively. Furthermore, the ends of the third pipe 11 and the fourth pipe 12 connected to the second pipe 5 are also connected to the second circulation pipe 3 located on the left side of the first group of Tank 1 and the second circulation pipe 3 located on the right side of the second group of Tank 1, respectively. Thus, the second circulation pipe 3, the third pipe 11, and the second pipe 5 on the left side form a structure similar to a three-way valve. The second circulation pipe 3, the fourth pipe 12, and the second pipe 5 on the right side also form a structure similar to a three-way valve. In this embodiment, the fourth pipe 12 consists of three pipe segments.

[0031] Furthermore, in this embodiment, the first control valve 7, the second control valve 8, the third control valve 9, and the fourth control valve 10 are all pneumatic control valves, which can quickly and effectively control the opening and closing of the passage.

[0032] Furthermore, the second circulation pipeline 2 is also equipped with a flow meter, which can observe the flow rate of the liquid in the corresponding tank in real time, ensuring that the liquid can circulate normally between multiple tanks.

[0033] See Figures 1 to 3 In this embodiment, the four Tanks from right to left are designated as Tank A, Tank B, Tank C, and Tank D, respectively; the four first circulation pipes 2 in the four Tanks 1 are connected in parallel on the first pipe 4, and the two second circulation pipes 3 in the four Tanks are connected in parallel on the second pipe 5; each Tank is provided with a corresponding first circulation pipe 2 and second circulation pipe 3, which are used for the entry and exit of the medicine liquid, respectively.

[0034] When four Tanks are in use, the first control valve 7 and the second control valve 8, as well as the fourth pneumatic control valve 10, corresponding to Tank A, Tank B, Tank C, and Tank D are all in the open state, while the third pneumatic control valve 9 is in the closed state. At this time, the four Tanks can circulate. The third pneumatic control valve 9 is closed to prevent the liquid from circulating between the liquid pump 6, the second pipeline 5, the third pipeline 11, and the fourth pipeline 12.

[0035] See Figure 3 If Tank A is not circulating, the first control valve 7, the second control valve 8, and the third pneumatic control valve 9 corresponding to Tank A are closed, while the remaining valves are open. The electroplating solution flows out of the second circulation pipe 3 in Tank B and into the second pipe 5. Then, the electroplating solution in the second pipe 5 first flows into the liquid pump 6, and then from the liquid pump 6 flows from the second circulation pipe 3 into Tank C and Tank D respectively. The electroplating solution then flows from the first circulation pipe 2 in Tank C and Tank D into the first pipe 4, and finally flows back into Tank B from the first pipe 4, thus achieving the circulation flow of Tank B, Tank C, and Tank D. The same logic applies if any of Tank B, Tank C, or Tank D is not circulating.

[0036] See Figure 4 If Tank A and Tank B do not circulate, then the corresponding first control valve 7 and second control valve 8 in Tank A and Tank B, as well as the fourth control valve 10 on the right, are closed. At this time, the liquid flows out from the second circulation pipe 3 of Tank C, through the second pipe 5 and the third pipe 11 into the liquid pump 6, flows out from the fourth pipe 12, through the second circulation pipe 3 of Tank D into Tank D, and then flows out from the first circulation pipe 2 of Tank D, through the first pipe 4 and the first circulation pipe 2 of Tank C into Tank C, thus realizing the circulation of the electroplating solution in Tank C and Tank D.

[0037] See Figure 5 If Tank A and Tank C do not circulate, then the corresponding first control valve 7, second control valve 8, and third pneumatic control valve 9 in Tank A and Tank C, as well as the fourth control valve 10 on the right, are closed, while the remaining valves are open. The electroplating solution flows out from the second circulation pipe 3 of Tank B, enters the liquid pump 6 through the second pipe 5 and the third pipe 11, flows out through the fourth pipe 12, flows into Tank D through the second circulation pipe 3 of Tank D, then flows out from the first circulation pipe 2 of Tank D, enters Tank B through the first pipe 4 and the first circulation pipe 2 of Tank B, thus realizing the circulation of the electroplating solution in Tank B and Tank D.

[0038] See Figure 6 The second connecting pipe is also equipped with an analytical instrument 13, so that during operation, the electroplating solution in multiple tanks can be analyzed by one analytical instrument 13, reducing the number of analytical instruments required, lowering the cost of use, and meeting the actual use needs.

[0039] This invention adds a first control valve and a second control valve to the first and second circulation pipelines on each tank. Multiple tanks are interconnected via the first, second, third, and fourth pipelines, the third and fourth control valves, and a liquid pump. When multiple tanks supply electroplating chambers with the same process operate simultaneously, all valves can be opened to ensure consistent solution concentration across all tanks, resulting in a consistent electroplating effect throughout the machine. When multiple tanks supply electroplating chambers with different processes, the corresponding first and second control valves, as well as the third or fourth control valve, can be closed to disconnect the multiple tanks. Each tank can then be supplied with solutions for different processes, enhancing the flexibility and adaptability of the entire machine.

[0040] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A semiconductor electroplating solution supply device, characterized in that, include: Tank(1), four of the Tank(1) are arranged adjacently in groups of two Tank(1) to form the first group of Tank(1) and the second group of Tank(1); The first circulation pipeline (2) and the second circulation pipeline (3) are provided in each of the Tank (1), wherein each of the first circulation pipelines (2) is provided with a first control valve (7) and each of the second circulation pipelines (3) is provided with a second control valve (8); The first pipeline (4) is connected to the first circulation pipeline (2) of each of the four Tanks (1); The second pipeline (5) is connected to the second circulation pipeline (3) of each of the four Tanks (1); wherein each pair of Tanks (1) is connected by a fourth control valve (10); The liquid pump (6) has two ends connected to the two ends of the second pipeline (5) through the third pipeline (11) and the fourth pipeline (12), respectively. The ends of the third pipeline (11) and the fourth pipeline (12) connected to the second pipeline (5) are also connected to the second circulation pipeline (3) located on the left side of the first group Tank (1) and the second circulation pipeline (3) located on the right side of the second group Tank (1), respectively.

2. The electroplating solution supply device for semiconductor electroplating as described in claim 1, characterized in that: The first control valve (7), the second control valve (8), the third control valve (9) and the fourth control valve (10) are all pneumatic control valves.

3. The electroplating solution supply device for semiconductor electroplating as described in claim 1, characterized in that: The fourth pipeline (12) is also equipped with an analytical instrument (13).

4. The electroplating solution supply device for semiconductor electroplating as described in claim 1, characterized in that: A flow meter is also installed at the second circulation pipeline (3).

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