gripping element, actuating element and actuating device

Abstract

A clamping element for manipulating a panel of a semi-finished product of a component carrier is described, wherein the clamping element is configured to clamp the panel at a clamping surface of the panel, wherein the clamping surface is arranged at a side edge of the panel or is arranged at a distance from the side edge of the panel, the clamping element comprising: at least two holders, each holder comprising a clamping region configured to abut a surface of the panel during the manipulation; wherein at least one of the holders comprises at least one opening extending through a portion of the holder, wherein the portion of the holder is located outside or adjacent to the clamping region, wherein the opening is suitable for fluidically connecting a surface of the panel (P) positioned between the side edge and the respective clamping surface of the panel with a surface of the holder and / or the outside of the holder. The present application also provides a manipulating element and a manipulating device.

Description

Technical Field

[0001] This invention relates to a clamping element for a semi-finished panel of a manipulating component carrier. The clamping element is a component of the manipulating element designed to hold the panel during a manufacturing process, such as electroplating. The clamping element includes two retainers that abut and hold the semi-finished panel during manufacturing. At least one of the retainers includes at least one opening extending through a portion of the retainer. This opening allows a surface of the clamped semi-finished panel to be fluidly connected to the exterior of the retainer. This invention also relates to a manipulating device having a semi-finished panel, and a method for electroplating the semi-finished panel using the manipulating element. Background Technology

[0002] With the increasing functionality of products equipped with component carriers containing one or more electronic components, the miniaturization of these electronic components, and the growing number of electronic components to be mounted on component carriers such as printed circuit boards, there is a growing trend towards more powerful arrays or packages with multiple electronic components. These components or packages have multiple contacts or connections with increasingly smaller spacing between them. During operation, the heat generated by removing these electronic components and the component carrier itself has become an increasingly prominent issue. Simultaneously, effective protection against electromagnetic interference (EMI) is becoming increasingly important. Meanwhile, component carriers must be mechanically robust and electrically and magnetically reliable to operate normally even under harsh conditions.

[0003] Manufacturing such load-bearing components is a specialized task. It requires multiple sequential production or process steps.

[0004] Electroplating is an effective manufacturing process for constructing electrically conductive structures or components that serve as carriers for parts. A semi-finished panel of the carrier is placed in a liquid electrolyte. This panel is electrically connected to the cathode of a current source, while the electrolyte is electrically connected to the anode. As current flows, ions from the electrolyte deposit onto the panel, thus creating the electrically conductive structure. Typically, constructing complex electrically conductive structures requires several electroplating steps. During each of these steps, the panel must remain in the electrolyte, and the panel must be electrically connected to the current source.

[0005] To hold the panel in the electrolyte, clamping or holding elements are present, which abut against and hold the panel during manufacturing. The clamping elements abut against the clamping surface of the panel. The portion of the clamping element that abuts against the panel is the clamping area. Because the electrolyte cannot reach the clamping surface abutted by the clamping area of ​​the panel, no metal ions are deposited in this area. Therefore, it becomes more difficult to electrically connect the panel in the same area in different consecutive manufacturing steps, because the panel does not have sufficiently good electrical connectivity on the same clamping surface. As electrical connectivity decreases, it may be necessary to increase the voltage to provide sufficient current for electroplating. However, the increased voltage during electroplating may cause damage to the panel or the clamping elements. To avoid such problems, the panel can be rotated between two clamping elements between two consecutive electroplating steps. In the first step, the panel is clamped at two opposite edges. In subsequent steps, the panel is rotated, for example, 90°, and then clamped at different opposite edges. In this way, the electrolyte can reach the clamping surface of the panel in every two steps. This method of rotating the panel requires large clamping surfaces at different edges of the panel. These clamping surfaces cannot be used to place and manufacture component carriers, and reduce the number of component carriers on the panel. Furthermore, rotating the panel between manufacturing steps is complex and requires additional equipment and / or manpower. Utility Model Content

[0006] During several consecutive steps in the manufacturing process, efficient manipulation of the panel of the component carrier may be required.

[0007] The invention describes a clamping element, a control element, a control device, and a method for electroplating a semi-finished panel of a component carrier.

[0008] According to one aspect of the present invention, a clamping element is described for manipulating a semi-finished panel (which may include one or more component carriers) of component carriers, wherein the clamping element is configured to clamp the panel at a clamping surface of the panel, wherein the clamping surface is disposed at or spaced apart from a side edge of the panel. The clamping element includes: At least two retainers (for holding the panel between the retainers), each retainer including a clamping area configured to abut against the surface of the panel during manipulation.

[0009] At least one retainer includes at least one opening extending through a portion of the retainer, wherein this portion of the retainer is located outside or adjacent to the clamping area, wherein the opening is adapted to allow fluid communication between the surface of the panel positioned between the side edge and the corresponding clamping surface of the panel and the surface of the retainer and / or the exterior of the retainer. During manufacturing, a liquid, such as an electrolyte, may be allowed to reach the surface of the panel from the exterior of the retainer.

[0010] According to another aspect of the present invention, a control element for manipulating a semi-finished panel of a component carrier is described, the control element comprising: At least two clamping elements according to the above aspects of this utility model, The clamping elements are connected by a support structure (for supporting and holding the clamping elements), wherein the clamping elements are arranged to face each other in the longitudinal direction through the clamping areas of the clamping elements, and wherein at least one of the clamping elements is movably connected to the support structure in the longitudinal direction, thereby making the distance between the clamping elements in the longitudinal direction adjustable.

[0011] According to another aspect of the present invention, a control device for a semi-finished panel having a component carrier is described, the control device comprising: The control element according to the above aspects of this utility model, A semi-finished panel for a component carrier, the panel including two clamping surfaces disposed at opposite side edges of the panel or spaced apart from opposite side edges by a distance. The control element holds the panel, and each clamping element clamps one of the clamping surfaces of the panel, wherein the clamping area of ​​each clamping element abuts against the clamping surface of the panel.

[0012] According to another aspect of this utility model, a method for electroplating a semi-finished panel of a component carrier is described, wherein a manipulating element is used when carrying out the method. The control element includes: At least two clamping elements are configured to clamp the panel at a clamping surface of the panel, the clamping surface being disposed at or spaced apart from a side edge of the panel, the clamping elements comprising: At least two retainers, each retainer including a clamping area configured to abut against the surface of the panel during operation. Wherein, at least one retainer includes at least one opening extending through a portion of the retainer, wherein the portion of the retainer is located outside the clamping area, the opening being adapted to allow a surface of the panel positioned between a side edge and a corresponding clamping surface of the panel to be fluidly connected to the surface of the retainer and / or the exterior of the retainer; The clamping elements are connected by a support structure. The clamping elements are arranged to face each other in the longitudinal direction through their clamping areas. At least one of the clamping elements is movably connected to the support structure in the longitudinal direction, so that the distance between the clamping elements in the longitudinal direction is adjustable. The method includes the following steps: A) Clamping the panel in the actuating elements, wherein the clamping areas of at least two clamping elements abut against the clamping surfaces (of the panel), wherein each clamping surface is located at a side edge of the panel or is spaced apart from the side edge of the panel by a distance. B) Electroplating a metal layer on a panel, wherein an actuating element having the panel being held is at least partially immersed in an electrolyte containing metal ions, and wherein the panel is connected to the cathode of a current source and the electrolyte is connected to the anode of the current source. C) Change the position of the clamping area relative to the panel, wherein the clamping elements are shifted relative to the side edge of the panel in the longitudinal direction, and the panel in the shifted position is clamped in the manipulation element; D) Electroplating the metal layer onto the panel according to method step B).

[0013] In this context, the term "semi-finished panel" can refer to a panel comprising one or more component carriers in a semi-finished state. The panel may be rectangular in shape, with multiple component carriers arranged in a matrix on or within the panel. These component carriers are not yet fully manufactured but are in a state of manufacturing, particularly with one or more manufacturing steps remaining to be completed. The semi-finished panel may be in a state between multiple electroplating steps.

[0014] In this context, the term "clamping surface" can refer to an area of ​​a semi-finished panel intended to be clamped by clamping elements during manufacturing. When in a clamped state during manufacturing, the clamping area of ​​the clamping elements abuts against the clamping surface. In this clamped state, the clamping surface is covered by the clamping area. In this state, any liquid, such as electrolytes, cannot reach the clamping surface of the panel. During manufacturing, the clamping surface may be located in different areas of the panel. This means that in a first manufacturing step, the clamping surface may be located in a different location in a second manufacturing step.

[0015] In this context, the term "side edge" can refer to the edge of a panel located at the boundary of the panel. For example, a panel with a rectangular shape has four side edges that serve as boundary sections. Two side edges face each other accordingly. Side edges can have a linear shape. However, side edges can also have a curved shape.

[0016] In this context, the term "clamping area" may refer to the area of ​​the retainer that abuts against and covers the surface of the panel when the panel is clamped within the clamping element. The clamping area may have different shapes, depending on the geometry of the retainer.

[0017] In this context, the term "opening" may refer to a cavity or through-hole protruding through a portion of the retainer. This opening leads to two different surfaces of the retainer. The opening may be shaped as a channel that fluidly connects the two different surfaces of the retainer. The opening is located outside or adjacent to the clamping area of ​​the retainer. Therefore, the fluid connection within the retainer provided by this opening is located in a region different from the clamping area.

[0018] In this context, the term "holder" can refer to a device involved in holding an object, such as a semi-finished panel of a component carrier. Two holders can jointly hold or clamp such an object. When two holders jointly hold a semi-finished panel of a component carrier, the clamping areas of the holders can abut against the semi-finished panel at the same location in the thickness direction, on opposite surfaces of the panel. In this state, the panel can be held or clamped between the two holders when the two holders abut against the semi-finished panel from opposite sides. Alternatively, the holder can be a frame combined with top and bottom frames constructed for holding or clamping the object.

[0019] In the context of this article, the term "outer exterior of the retainer" may refer to all the space surrounding the retainer. The outer exterior of the retainer is defined by the combination of all the outer surfaces of the retainer.

[0020] In this context, the term "support structure" can refer to a device for holding and supporting at least two clamping elements. The support structure may include a plurality of rigid members that define the position of the two clamping elements relative to each other. Furthermore, the support structure may include an interface for connection to other devices or machines. Such other devices or machines may be manipulating robots that move manipulating elements during a manufacturing process, such as immersing the manipulating elements and the clamped panels in an electrolyte. The clamping elements, or at least one of the clamping elements, may be movably connected to the support structure. This means that at least one of the clamping elements can move its position relative to the other clamping element.

[0021] In this context, the term "clamping" or "performing clamping" can refer to securing the panel within a clamping element. Preferably, this securing is achieved by force closure. Alternatively, securing can also be achieved by form closure.

[0022] In this context, the term "component carrier" can refer to a carrier or substrate formed by laminating several electrically conductive layer structures with several electrically insulating layer structures, for example, by applying pressure and / or by supplying heat. In addition to embedding one or more components within a component carrier, a component carrier is typically configured to accommodate one or more components on one or two opposite surfaces. These components can be soldered to their respective main surfaces. The dielectric portion of the component carrier may consist of resin with reinforcing fibers, such as glass fiber. The term "component carrier" includes finished component carriers where all functions have been manufactured. The term "component carrier" also includes any preform of a finished component carrier that appears between manufacturing steps. A component carrier can also be a panel comprising multiple unfinished products that require further processing to complete product manufacturing, or a finished product that has not yet been divided into units.

[0023] According to an exemplary embodiment, the present invention is based on the idea of ​​changing the position and area of ​​the clamping element holding the semi-finished panel during manufacturing. According to existing technology, during manufacturing, the clamping element covers the area of ​​the panel adjacent to the side edge of the panel, i.e., the clamping surface of the panel. In this way, liquids such as electrolytes cannot reach the area adjacent to and perpendicular to the side edge of the panel. During electroplating, metal ions cannot be deposited in this area. According to the present invention, the clamping element is designed such that liquids, such as electrolytes, can reach an area of ​​the panel surface adjacent to and perpendicular to the side edge of the panel through at least one opening. The clamping element can be positioned relative to the panel such that the clamping surface covered by the clamping element is positioned spaced apart from the side edge of the panel. Due to the opening in the holder, the area adjacent to the side edge of the panel can come into contact with the liquid, such as an electrolyte. This allows metal ions to be deposited in the area near the side edge of the panel. However, in current manufacturing steps, liquids such as electrolytes cannot reach the clamping surface covered by the clamping element. According to the present invention, in subsequent manufacturing steps, the position of the clamping element relative to the panel is offset. The position is offset such that the clamping surface for the next or subsequent step is placed in an area adjacent to the side edge of the panel, an area that has been in contact with a liquid, such as an electrolyte, in the previous manufacturing step. By offsetting the relative position of the clamping element with respect to the panel between two positions on the clamping surface, the clamping element can always contact or abut against the clamping surface that has been metallized in the previous step. Therefore, a very reliable electrical connection can always be provided between the clamping element and the panel. This reliable electrical connection ensures that the resistance between the clamping element and the panel is always low, and electroplating can be performed using a low voltage that will not damage the panel or the clamping element. In fact, according to the concept of this invention, for each successive manufacturing step, the position of the clamping surface on the panel is offset linearly between two defined positions. This linear offset of the clamping element relative to the panel is easily achieved; linear movement is, for example, moving a distance of a few millimeters. A simple device placed at or on the support structure of the actuating element is sufficient to move the clamping element in this linear manner; a simple device is, for example, a linear actuator. Therefore, changing the position of the clamping surface is easier and faster than using prior art solutions. According to the concept of this invention, it is not necessary to completely remove the panel from the clamping elements of the manipulator, nor is it necessary to rotate the panel between the clamping elements. Therefore, using this invention can significantly reduce the time between consecutive electroplating manufacturing steps. Furthermore, the total area required on the panel for use as the clamping surface can be significantly reduced. Therefore, a larger area on the panel can be used to produce component carriers, thereby making production more efficient.

[0024] The described clamping element includes two retainers, between which a panel is clamped during manufacturing. At least one of these retainers includes an opening extending through the body of the retainer to provide a passage for liquid. This opening opens outside or is adjacent to a clamping area that abuts against a clamping surface of the panel. Thus, liquid can reach a surface on the panel positioned adjacent to both the abutting clamping surface of the retainer and the clamping area. When the clamping surface is positioned spaced apart from a side edge of the panel, liquid passing through the opening can reach the area between the clamping surface and the side edge. In this relative position of the clamping element to the panel, the area between the clamping surface and the side edge can be metallized during electroplating.

[0025] The described actuating element comprises two clamping elements connected by a support structure. The support structure holds the clamping elements and provides the possibility of moving at least one of the clamping elements relative to at least one other clamping element, preferably linearly. Using the described actuating element for manufacturing a panel of a component carrier, the position of a clamping area abutting the panel clamping surface can be easily offset. The described actuating element is configured to move at least one of the clamping elements relative to the panel between each successive manufacturing step. This configuration ensures that in each successive manufacturing step, another clamping surface of the panel is covered by the clamping area of ​​the clamping element. By continuously offsetting the position, it can be ensured that the clamping area always contacts the clamping surface that has been metallized in the previous step. The described actuating element includes a simple and reliable design and is lightweight. Therefore, the actuating element can be effectively used in the production of panels for component carriers.

[0026] The described method for electroplating the panel of a semi-finished component carrier is implemented using the described manipulating element. According to this method, the relative position of the clamping element with respect to the panel is offset between each electroplating manufacturing step. This offset allows the area used as a clamping surface in the previous electroplating step to be metallized. By returning the position offset in a subsequent step, the clamping area of ​​the clamping element is placed on a clamping surface with low resistance, thereby allowing reliable electrical connection of the panel for electroplating.

[0027] The clamping element, actuating element, actuating device, and method simplify the manufacturing process of component carrier panels that undergo multiple consecutive electroplating steps. Compared to existing technologies, the time required to construct the actuating element is reduced. Furthermore, the available space on the panel for placing and producing component carriers is increased, and the final production efficiency is improved.

[0028] Exemplary Implementation In this implementation, at least one retainer is movable relative to the other retainer in the thickness direction to clamp the panel between the retainers. In this context, the term "thickness direction" may refer to the thickness direction of the panel clamped between the two retainers. At least one of the retainers is movable in this direction to introduce and clamp the panel between the two retainers.

[0029] In one embodiment, both retainers are movable relative to the other in the thickness direction to clamp the panel between them. Specifically, the two retainers are movably connected to each other in a connecting region, preferably pivotally connected within the connecting region. In this embodiment, the two retainers are movable relative to each other and relative to the panel to be clamped. The two retainers can be connected in the connecting region, for example, by including a hinge to pivotally connect the two retainers. Alternatively, the two retainers can also be connected by a linear actuator that allows the two retainers to move relative to each other in the thickness direction. By providing this possibility of moving the two retainers, a method for effectively holding and releasing, for example, a semi-finished panel can be achieved.

[0030] In the implementation, the longitudinal direction is perpendicular to the thickness direction and points along the width direction of the retainer, while the axial direction is perpendicular to both the thickness direction and the longitudinal direction and points along the length direction of the retainer. In this context, the term "longitudinal direction" may refer to the width direction of the retainer. The longitudinal direction may also be the direction of the second maximum dimension of the retainer. In the longitudinal direction, the clamping area, the opening, and the optional connecting area are positioned adjacent to each other. In this context, the term "axial direction" may refer to the length direction of the retainer, where the axial direction is also the direction of the maximum dimension of the retainer. When the panel is clamped between the retainers, the axial direction is oriented parallel to the side edges of the panel. Directions such as the thickness direction, longitudinal direction, and axial direction are defined to simplify the description of the clamping and retaining elements.

[0031] In this embodiment, the clamping area is at least partially planar, particularly including at least a planar portion oriented perpendicular to the thickness direction. Since the surface of the panel is planar in most cases, the planar portion of the clamping area provides reliable retention and clamping of the panel. The planar portion of the clamping area abuts against the surface of the panel over a large area. By providing a planar, preferably large-area, abutting clamping area, warping of the panel during the manufacturing process can be prevented or at least significantly reduced, for example, warping of the panel during the electroplating process can be prevented or at least significantly reduced.

[0032] In this embodiment, at least one retainer is at least partially covered by a protective cover. This protective cover protects the surface of the retainer from corrosive substances in the liquid, such as an electrolyte. Since the retainer is preferably made of metal, the cover protects this metal from acids or other corrosive or erosive substances. Therefore, the protective cover extends the service life of the clamping element. Simultaneously, the protective cover also prevents wear on the retainer caused by foreign matter buildup, which contaminates the liquid and leads to product defects.

[0033] In this embodiment, the cover layer comprises a soft or resilient material, particularly rubber, and / or has a hardness in the range of 10 Shore 00 to 90 Shore A. The soft and resilient material ensures that the cover layer can compensate for unevenness or roughness of the panel surface. Furthermore, the soft and resilient cover layer ensures that the panel will not be damaged during clamping. A suitable material for such a cover layer is rubber, which is also impermeable to liquids to protect the surface of the retainer from liquids and corrosive substances.

[0034] In one embodiment, the cover layer includes a shaped corrugated surface on at least a portion of its surface facing the retainer, specifically wherein the shaped corrugated surface includes a plurality of lugs and / or bosses spaced apart from each other. In this embodiment, the cover layer has a corrugated surface, some portions of which protrude beyond adjacent portions. In this way, the clamping force is concentrated on the protruding portions of the corrugated profile, generating higher pressure in these areas. This helps to reliably clamp the panel. Furthermore, concentrating pressure only on some protruding portions can help to reliably make electrical contact with the panel.

[0035] In one embodiment, the cover layer includes an electrically conductive material. In this embodiment, the cover layer can conduct current from the retainer to the surface of the clamped panel. Only a portion of the cover layer can be made of an electrically conductive material, for example, by inserting a metal wire or a protruding conductive tip. Alternatively, the entire cover layer can be made of an electrically conductive material. This material can also be a resin material bonded with conductive particles, and only the portion conductively connected to the panel is used to transfer current from the retainer to the panel.

[0036] In one embodiment, the cover layer includes at least one perforation through which a portion of the electrically conductive material of the retainer passes, or protrudes from the outer surface of the cover layer. In this embodiment, the cover layer may be made of an electrically insulating material. For electrical contact with the panel, at least one perforation is provided in the cover layer through which a conductive portion of the retainer protrudes through the cover layer. During clamping, this protruding conductive portion can make electrical contact with the panel, while the remainder of the retainer surface is protected by the cover layer. The perforation may, for example, have a circular shape or a linear shape extending in an axial direction.

[0037] In one embodiment, the retainer includes a contact area, preferably located within a clamping region, configured to make electrical contact with the panel. The contact area comprises an electrically conductive material, which can be a metal such as copper, or a non-metallic electrically conductive material. Such a contact area is intended to make electrical contact with the panel, for example, during electroplating. The contact area may be located within the clamping region, or alternatively, outside the clamping region. The contact area may be electrically connected to a current source that provides current for electroplating.

[0038] In one embodiment, at least one retainer is at least partially covered by a cover layer made of a non-electrically conductive material, and a contact area is disposed in at least one perforation in the cover layer and extends through the cover layer. In this embodiment, a non-conductive cover layer, such as that made of rubber, can protect the surface of the retainer from corrosive or abrasive environments, as well as from abrasion caused by foreign matter. To provide good electrical contact between the retainer and the panel, the electrically conductive contact area is guided through the perforation in the cover layer and provides an electrically conductive surface during clamping.

[0039] In this embodiment, the contact area comprises an elongated shape extending in the axial direction, specifically, the contact area extends in the axial direction for at least 70% of the length of the retainer. This elongated shape of the contact area provides reliable electrical contact between the retainer and the clamped panel. The large contact surface between the contact area and the panel provides a very low current density during electroplating, thereby helping to prevent damage to the panel or clamping elements due to high current density. This not only extends the life of the retainer but also reduces the impact of equipment failures that cause machine downtime during processing due to component damage.

[0040] In one embodiment, the opening comprises an elongated shape extending in the axial direction. The opening can have a linear, elliptical, or circular shape. This shape is sufficient to allow high liquid flow rates through the opening. Alternatively, multiple smaller openings, having, for example, a circular cross-section, can be provided.

[0041] In this embodiment, the retainer includes a plurality of openings, particularly arranged in an array, preferably in a linear array extending axially. These openings provide a very high fluid flow rate through them. Furthermore, the distance between the openings helps to rigidify the retainer, allowing for the application of high clamping forces. Preferably, the openings are arranged in an array extending axially. In this way, the surface of the clamped panel is in full contact with the fluid flowing through the openings along one of its side edges. Multiple small openings can regulate the current by guiding the fluid flowing into different channels of the panel. A two-dimensional array of openings can also be provided to further increase the fluid flow rate through a portion of the retainer. Providing multiple spaced-apart openings (preferably small openings) provides a robust structure for the retainer. In this case, the mechanical properties of the retainer are less affected compared to providing larger openings.

[0042] In this embodiment, the distance between the openings is less than the length or diameter of the openings. In this embodiment, the openings are positioned very close to each other. In this configuration, the total cross-sectional area of ​​the openings is greater than the total cross-sectional area of ​​the remaining enclosed portion of the retainer located between the openings. This provides a very good liquid flow rate through this portion of the retainer. This good flow rate allows liquids, such as electrolytes, to effectively contact the portion between the clamping surface and the panel side edges, which greatly helps to increase the ion exchange rate and accelerate the electroplating process of this portion, allowing it to be fully metallized within a reasonable processing time.

[0043] In one embodiment, a cavity is provided between two retainers, preferably located between portions of each retainer that are outside or near the clamping area. The cavity is fluidly connected to the surface of the retainer and / or the exterior of the retainer through at least one opening. With the panel clamped between the retainers, the cavity can be positioned in the space between the two retainers. The cavity is preferably positioned adjacent to the clamping area abutting the panel. A portion of the clamped panel can protrude into the cavity. The cavity is fluidly connected to the exterior of the retainer through at least one opening. In this way, a liquid, such as an electrolyte, can flow through the opening and fill the cavity. The portion or part of the panel protruding into the cavity comes into contact with the electrolyte and can be well metallized during electroplating, even when located within the clamping element.

[0044] In this embodiment, the cavity extends in the axial direction. Preferably, the cavity extends along the entire length of the clamping element in the axial direction. Therefore, during manufacturing, the protruding portion of the clamped panel can come into contact with a liquid, such as an electrolyte.

[0045] In one embodiment, the cavity is connected to a support channel within the holder, wherein the support channel is configured to connect to a liquid source, particularly an electrolyte source for electroplating. In addition to the opening within the holder, the support channel can be provided to actively pump liquid, such as electrolyte, into the cavity. This support channel can facilitate faster filling of the cavity with liquid. The support channel can be connected to a pump that delivers liquid from outside the holder into the cavity.

[0046] In one embodiment of the actuating element, the clamping elements and the support structure form a U-shape, wherein the clamping elements are oriented to be parallel to each other and spaced apart. In this embodiment, the support structure and two clamping elements are combined to form a U-shape. The axial direction of each clamping element is oriented perpendicular to the support structure. This configuration provides a rectangular space between the two clamping elements for clamping a rectangular panel.

[0047] In one embodiment of the actuating element, the support structure includes a frame, wherein clamping elements are vertically connected to each other in the frame and are spaced apart in the vertical direction. In this embodiment, the support structure includes a frame, which may have a rectangular shape and may be composed of multiple rigid rods or profiles. During application, the frame may be oriented vertically. When the semi-finished panel is clamped by the clamping elements, the semi-finished panel is also oriented vertically.

[0048] In one embodiment of the actuating element, a receiving area exists between the clamping elements for receiving a panel clamped between them. Two clamping elements are connected to a support structure such that a distance exists between them in the longitudinal direction. The receiving area is provided within this distance. When the panel is clamped between the two clamping elements, the receiving area receives the panel held by the two clamping elements. The receiving area may have a rectangular shape. The area of ​​the receiving area may change as one or both clamping elements move longitudinally relative to the support structure.

[0049] In embodiments of the manipulating element, a guide element is provided that guides the movement of at least one clamping element relative to the surface of the semi-finished panel. The guide element may be positioned or fixed at a support structure or clamping area. The guide element may be configured to limit the movement distance of the clamping element to ensure that the clamping area is always positioned correctly on a defined clamping surface of the semi-finished panel. The guide element may include a guide rail and at least one stop to allow the panel to move smoothly within the panel holder without scratches. When the clamping element is in the correct position relative to the clamping surface, a portion of the clamping element may abut against the stop. The guide element prevents damage to the semi-finished panel from movement of the clamping element. Therefore, damage to the surface of the semi-finished panel, such as scratches, can be effectively prevented.

[0050] In embodiments of the actuating element, multiple clamping elements are arranged adjacent to and / or facing each other. The actuating element may include more than two clamping elements. Several clamping elements may be arranged adjacent to each other in the axial direction, for example, to clamp more than one panel. Alternatively or additionally, additional opposing clamping elements may be provided.

[0051] In embodiments of the manipulating device, at least one clamping region abuts against a clamping surface arranged at a distance spaced from a side edge. According to the basic concept of this invention, the clamping element provides at least one opening to allow the surface of the clamped panel positioned within the clamping element to contact a liquid, such as an electrolyte. To provide the surface of the panel positioned within the clamping element, for example, within a cavity of the clamping element, the clamping region is positioned against a clamping surface arranged at a distance spaced from a side edge of the panel. The surface area between the clamping surface and the side edge is in contact with the liquid and can be metallized within the clamping element. In an exemplary embodiment, a clamping element is positioned relative to the panel such that the clamping region of the clamping element abuts against a clamping surface arranged at a distance spaced from a side edge. A second clamping element can be positioned such that the clamping region of the second clamping element abuts against a clamping surface that may be adjacent to a side edge without distance. After performing an electroplating step in this configuration, the first clamping element can be moved to a clamping surface adjacent to the side edge, and the second clamping element can be moved to a clamping surface arranged at a distance from the corresponding side edge. The clamping areas of the two opposite clamping elements can also abut against clamping surfaces arranged at a distance from the corresponding side edge. Furthermore, the clamping areas of the two opposite clamping elements can also abut against clamping surfaces arranged without distance from the side edges, i.e., directly adjacent to the two opposite side edges.

[0052] In embodiments of the manipulating device, at least one opening in the retainer fluidly connects the surface of the panel positioned between a side edge of the panel and a corresponding clamping surface of the panel to the surface of the retainer and / or the exterior of the retainer. The opening may provide a passage through a portion of the retainer connecting the exterior of the retainer to the surface of the panel, which in turn connects the exterior of the retainer to the surface of the panel, preferably positioned within a cavity of the clamping element. In this way, the surface of the panel positioned between the side edge and the corresponding clamping surface can be metallized within the clamping element.

[0053] In an embodiment of the manipulating device, one or both clamping elements are movably connected to a support structure in a longitudinal direction, wherein at least one clamping area is adjustable in position relative to the panel in the longitudinal direction. In this embodiment, one or both clamping elements are movable relative to the support structure. Therefore, the distance between the two clamping elements in the longitudinal direction can be adjusted. By moving the clamping elements in the longitudinal direction, the corresponding clamping areas of the clamping elements can be positioned at different locations on the panel or on the clamping surfaces. The mobility of the clamping areas allows movement between different clamping surfaces in each successive manufacturing step, particularly each electroplating step. Preferably, both clamping elements are movably connected to the support structure. The mobility of at least one clamping element is used to move the abutment position of the clamping area on the panel between two or more different clamping surfaces. This movement of the clamping surfaces ensures that at least one of the clamping surfaces is always in contact with the electrolyte and thus sufficiently metallized during a manufacturing step. Therefore, since sufficient electrically conductive metallic material is always present on the clamping surfaces, resistance non-uniformity at the connection between the clamping areas can be avoided. Due to the stable and low resistance between the clamping element and the semi-finished panel, the voltage increase of the rectifier during electroplating and its potential damage to the retainer or semi-finished panel can be effectively avoided. Furthermore, this configuration provides flexible mobility for clamping and can meet diverse production requirements in a highly efficient manner. This clamping mobility offers a significant advantage for producing reliable products, especially when the form factor of products used in high-performance computing applications increases and the keep-out zone area on the panel edges decreases.

[0054] In an embodiment of the method, during steps B) and D), the electrolyte flows from the outside of the holder through the opening and contacts at least a portion of the surface of the clamped panel in the portion of the panel not covered by the clamping area, particularly the surface of the panel positioned between the side edges of the panel and the corresponding clamping surfaces. During electroplating in steps B) and D), the electrolyte flows through the opening and contacts the surface of the clamped panel, preferably the surface of the clamped panel located in the cavity within one or more clamping elements. Due to this contact with the electrolyte, the surface of the panel will be well metallized in all areas of the panel except for the clamping surfaces. Since the position of the clamping area in step C) is offset between step B) and step D), the clamping surface covered by the clamping area in step B) will be metallized in the subsequent electroplating step D). After completing step D), the method can be repeated starting from step A). ​​By repeating the method, the clamping area is alternately offset between at least two clamping surfaces. Therefore, each clamping surface alternately contacts the electrolyte and is alternately metallized. During the next offset of the clamping area, it is ensured that the clamping area remains in contact with the surface of the panel that has been well metallized in the previous electroplating step.

[0055] In an embodiment of the method, during steps A) and B), at least one clamping region abuts against a clamping surface arranged at a distance spaced from the side edge of the panel. To provide the possibility of offsetting the positions of the two clamping regions relative to the panel in the longitudinal direction between each step of electroplating, preferably in step A), at least one clamping region is positioned such that it abuts against a clamping surface arranged at a distance spaced from the corresponding side edge of the panel. In step C), the positions of the clamping regions of the two clamping elements can be offset by a distance d in the same direction. By doing so, the clamping region abutting against the clamping surface spaced from the side edge in step A) can be offset to a position adjacent to the corresponding side edge. Then, another clamping region, which can be positioned on a clamping surface adjacent to a second side edge, can be offset to a clamping surface positioned at a distance spaced from the corresponding second side edge of the panel.

[0056] In this implementation, the component carrier is shaped as a plate. This facilitates a compact design, where the component carrier still provides a large base for mounting components thereon. Furthermore, bare wafers, particularly examples of embedded electronic components, can be conveniently embedded in thin plate-like structures such as printed circuit boards due to their small thickness.

[0057] In this embodiment, the component carrier is configured as one of a printed circuit board, a substrate (especially an IC substrate), a panel, and an interposer.

[0058] In the context of this application, the term "printed circuit board" (PCB) can specifically refer to a plate-shaped component carrier formed by laminating several electrically conductive layer structures and several electrically insulating layer structures, for example, by applying pressure and / or supplying heat. As preferred materials for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures may include resin and / or glass fiber, so-called prepreg, or FR4 material. The various electrically conductive layer structures can be connected to each other in a desired manner by forming holes through the laminate, for example, by laser drilling or mechanical drilling, and partially or completely filling the holes with an electrically conductive material (particularly copper), thereby forming vias or any other through-hole connections. The filled holes connect the entire stack (extending through-hole connections through several layers or the entire stack), or the filled holes connect at least two electrically conductive layers, i.e., so-called vias. Similarly, optical interconnects can be formed through the various layers of the stack to receive electro-optical circuit boards (EOCBs). In addition to being able to embed one or more components, printed circuit boards are typically configured to house one or more components on one or both opposite surfaces of a board-shaped printed circuit board. The one or more components can be soldered to their respective main surfaces. The dielectric portions of the PCB can be made of resin with reinforcing fibers, such as glass fiber.

[0059] In the context of this application, the term "substrate" can specifically refer to a small component carrier. A substrate can be a relatively small component carrier in relation to a PCB, on which one or more components can be mounted, and which can serve as a connection medium between one or more chips and another PCB. For example, a substrate can have approximately the same dimensions as the components (particularly electronic components) to be mounted thereon (e.g., in the case of a chip-scale package (CSP)). More specifically, a substrate can be understood as a carrier for electrical connections or electrical networks, and a component carrier with a relatively high density of lateral and / or vertically arranged connectors, comparable to a printed circuit board (PCB). Lateral connectors are, for example, conductive paths, while vertical connectors can be, for example, drilled holes. These lateral and / or vertical connectors can be arranged within the substrate and can be used to provide electrical, thermal, and / or mechanical connections between accommodated or unaccommodated components (e.g., bare wafers), particularly IC chips, and printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes "IC substrate." The dielectric portion of the substrate may include a resin with reinforcing particles (such as reinforcing spheres, particularly glass spheres).

[0060] In the context of this application, the term "inorganic layer structure" may specifically refer to a layer structure comprising inorganic materials, such as inorganic compounds. Specifically, the dielectric material of the inorganic layer structure, or even the entire inorganic layer structure, may be made entirely or at least substantially entirely of inorganic materials. In another embodiment, the inorganic layer structure may include an inorganic dielectric material and an additional dielectric material. The inorganic compound may be a chemical compound without carbon-hydrogen bonds or a chemical compound that is not organic. In examples, the inorganic layer structure may include glass, such as silicon-based glass, particularly soda-lime-silicon glass and / or borosilicate glass and / or aluminosilicate glass and / or lithium silicate glass and / or alkali-free glass. In another example, the inorganic layer structure may include ceramic materials, such as aluminum nitride and / or alumina and / or silicon nitride and / or boron nitride and / or tungsten containing ceramic materials. However, in another example, the inorganic layer structure may include semiconductor materials, such as silicon and / or germanium and / or silicon oxide and / or germanium oxide and / or silicon carbide and / or gallium nitride. In another embodiment, the inorganic layer structure may include (primarily) metals and / or metal alloys, such as copper and / or tin and / or brass. In yet another embodiment, the inorganic layer structure may include inorganic materials not listed in the above examples, such as: MoS2, CuGaO2, AgAlO2, LiGaTe2, AgInSe2, CuFeS2, BeO.

[0061] The substrate or interlayer may include or be composed of at least one of the following: glass; silicon (Si) and / or a photosensitive or dry-etchable organic material, such as an epoxy-based laminate (e.g., an epoxy-based laminate film); or a polymer compound (which may or may not include photosensitive and / or thermosensitive molecules), such as polyimide or polybenzoxazole.

[0062] In embodiments, at least one electrically insulating layer structure (and / or curable dielectric element) comprises at least one of the following: resins or polymers, such as epoxy resins, cyanate ester resins, benzocyclobutene resins; bismaleimide triazine resins; polyphenylene derivatives (e.g., based on polyphenylene ether, PPE), polyimide (PI), polyamide (PA), liquid crystal polymers (LCP), polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), and / or combinations thereof. Reinforcing structures made of, for example, glass (multilayer glass)—such as meshes, fibers, spheres, or other types of filler particles—can also be used to form composites. The semi-cured resin combined with the reinforcing agent, such as fibers impregnated with the aforementioned resins, is called a prepreg. These prepregs are typically named according to their properties, such as FR4 or FR5, which describe their flame-retardant properties. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based laminates (e.g., epoxy-based films) or photosensitive dielectrics, can also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and / or cyanate resins are preferred. In addition to these polymers, low-temperature co-fired ceramics (LTCC) or other low, very low, or ultra-low DK materials can be used as electrical insulation structures in component carriers.

[0063] In embodiments, at least one electrically conductive layer structure comprises at least one of the following: copper, aluminum, nickel, silver, gold, palladium, tungsten, carbon, platinum, (doped) silicon, and magnesium. While copper is generally preferred, other materials or their coating schemes, particularly those coated with superconducting materials or conductive polymers, are also possible, such as graphene or poly(3,4-ethylenedioxythiophene) (PEDOT).

[0064] At least one component may be embedded in and / or surface-mounted onto a component carrier. Such a component may be selected from at least one of the following: non-electrically conductive inlays, electrically conductive inlays (e.g., metallic inlays, preferably copper or aluminum), heat transfer units (e.g., heat pipes), optical guiding elements (e.g., optical waveguides or optical conductor connectors), electronic components, or combinations thereof. The inlay may be, for example, a metal block (IMS inlay) with or without an insulating material coating, which may be embedded or surface-mounted to facilitate heat dissipation. Suitable materials are defined by their thermal conductivity, which should be at least 2 W / mK. Such materials are typically based on, but not limited to, metals, metal oxides, and / or ceramics, such as copper, alumina (Al₂O₃), or aluminum nitride (AlN). Other geometries with increased surface area are also frequently used to improve heat exchange capacity. In addition, components can be active electronic components (having at least one implemented pn junction), passive electronic components (such as resistors, inductors, or capacitors), electronic chips, storage devices (such as DRAM or other data memories), filters, integrated circuits (such as field-programmable gate arrays (FPGAs), programmable array logic (PALs), general-purpose array logic (GALs), and complex programmable logic devices (CPLDs)), signal processing components, power management components (such as field-effect transistors (FETs), metal-oxide-semiconductor field-effect transistors (MOSFETs), complementary metal-oxide-semiconductor (CMOS) transistors, junction field-effect transistors (JFETs), or insulators. Gate field-effect transistors (IGFETs), all based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), and / or any other suitable inorganic compound, are used in optoelectronic interface elements, light-emitting diodes (LEDs), optical connectors, voltage converters (e.g., DC / DC or AC / DC converters), cryptographic components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips, and energy harvesting units. However, other components can be embedded within component carriers. For example, magnetic elements can be used as components. Such magnetic elements can be permanent magnets (e.g., ferromagnetic, antiferromagnetic, multiferroic, or ferrimagnetic elements, such as ferrite cores) or paramagnetic elements. However, the component can also be an IC substrate, an interposer, or another component carrier, such as a board-in-board configuration. The component can be surface-mounted on a component carrier and / or embedded within the component carrier. Furthermore, other components, particularly those that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment, can also be used as components.

[0065] In one embodiment, the component carrier is a laminated component carrier. In this embodiment, the component carrier is a multilayer composite structure that is stacked and connected together by applying pressure and / or heat.

[0066] After the internal layer structure of the component carrier has been processed, one or more additional electrically insulating and / or electrically conductive layer structures can be used (particularly by lamination) to symmetrically or asymmetrically cover one or both opposing main surfaces of the processed layer structure. In other words, lamination can continue until the desired number of layers is obtained.

[0067] After the stacked structure of the electrical insulation layer and the electrical conductivity layer is formed, the surface of the obtained layer structure or component carrier can be treated.

[0068] Specifically, regarding surface treatment, an electrically insulating solder resist can be applied to one or both opposing main surfaces of the laminate or component carrier. For example, this solder resist can be formed over the entire main surface, and the layer of solder resist can then be patterned to expose one or more electrically conductive surface portions that will be used to electrically connect the component carrier to electronic peripherals. The surface portions of the component carrier still covered by the solder resist, particularly those containing copper, can be effectively protected against oxidation or corrosion.

[0069] Regarding surface treatment, the surface treatment can also be selectively applied to the exposed electrically conductive surface portion of the component carrier. This surface treatment can be an electrically conductive covering material on the exposed electrically conductive layer structure (such as pads, conductive traces, etc., especially including or made of copper) on the surface of the component carrier. If this exposed electrically conductive layer structure is not protected, the exposed electrically conductive component carrier material (especially copper) may oxidize, resulting in lower reliability of the component carrier.

[0070] The surface-treated section can then be formed as a joint between, for example, a surface-mounted component and a component carrier. The surface-treated section functions to protect exposed conductive layer structures (particularly copper circuits) and enables connection to one or more components, for example, by soldering. Examples of suitable materials for the surface-treated section are organic solderable corrosion inhibitors (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (particularly hard gold), electroless tin, nickel-gold, nickel-palladium, etc. Attached Figure Description

[0071] The above-defined aspects and other aspects of this utility model will become apparent from the examples of embodiments that are described below, and will be explained with reference to these examples of embodiments.

[0072] Figure 1 A three-dimensional view of a clamping element according to an exemplary embodiment of the present invention is shown.

[0073] Figure 2A A side view of two clamping elements according to an exemplary embodiment of the present invention is shown, wherein a panel is clamped between the two clamping elements in a first state.

[0074] Figure 2B A side view of two clamping elements according to an exemplary embodiment of the present invention is shown, wherein the panel is clamped between the two clamping elements in a second state.

[0075] Figure 3 It shows Figure 2B A top view of the two clamping elements, wherein the panel is clamped between the two clamping elements.

[0076] Figure 4 A top view of a control element according to an exemplary embodiment of the present invention is shown. Detailed Implementation

[0077] Figure 1 A three-dimensional view of a clamping element 2 according to an exemplary embodiment of the present invention is shown. The clamping element 2 includes two retainers 3. These two retainers 3 are configured to clamp the panel P of a semi-finished component carrier between the retainers. Figure 1 In the diagram, such a panel P is indicated by a dashed line. Each retainer 3 includes a clamping area 4 designed to abut against the surface of the panel P. Figure 1 In the diagram, the clamping area 4 of the lower retainer 3 is shown as a shaded rectangular surface. However, the clamping area 4 can also have other shapes, such as being curved or including curved portions. During manipulation of the panel P, the clamping area 4 contacts the clamping surface CS. This clamping surface CS, for example, is located on... Figure 3 As shown in [the image]. Figure 1 In the illustrated embodiment, each of the two retainers includes a plurality of openings 5 ​​extending through a portion of the retainer 3. Each of these openings 5 ​​penetrates that portion of the retainer 3. The portion of the retainer 3 through which the openings extend is located outside the clamping region 4. In the illustrated embodiment, the openings 5 ​​open to the inner surface of the retainer 3 at a distance from the clamping region 4. This distance can be, for example, 0.5 mm to 10 mm. Figure 1 As seen in the diagram, the two retainers 3 abut against the panel P with their clamping areas, securing the panel P between the two retainers 3. This securing is achieved through force closure. Because the clamping area 4 covers the clamping surface CS, liquid cannot reach or touch the clamping surface CS. Figure 1In the illustrated state, a portion of panel P protrudes to the right from the area of ​​clamping region 4 that contacts panel P. This protruding portion of panel P is located in cavity 9 between the two retainers 3. Opening 5 connects this cavity 9 to the outside of the retainers 3 in a fluid manner. In other words, a fluid, such as an electrolyte, can flow into cavity 9 through opening 5. Inside cavity 9, the fluid contacts the protruding portion of panel P. Therefore, when clamping element 2 and the clamped panel P are placed in the electrolyte and electroplating is performed, the protruding portion of panel P will be metallized by electroplating. This means that in Figure 1 In the illustrated state, the clamping surface CS covered by clamping region 4 will not contact the electrolyte and therefore will not be metallized. However, the protruding portion of panel P located within cavity 9 will be metallized, making the surface of the protruding portion conductive. When performing the next electroplating step, clamping element 2 can be offset to the right relative to panel P, so that in the next step, clamping region 4 contacts the surface of panel P. Figure 1 The area protruding into cavity 9 in the shown state. In this offset state, Figure 1 The clamping surface CS, covered by clamping region 4, will be located outside the clamping element and can then be metallized. This is achieved by positioning the clamping elements 2 relative to each other. Figure 1 The position shown is offset from the position of the part of the clamping area 4 that protrudes into the cavity 9 of the panel P, which is in contact with the panel P. This ensures that the clamping area 4 always abuts the surface of the panel P in the area that has been well metallized in the previous electroplating step.

[0078] The thickness direction D1 is defined as the thickness direction of panel P. Figure 1 In the illustrated embodiment, the two retainers 3 are movable relative to each other in the thickness direction D1. The two retainers 3 are movably connected to the connecting region 8. The connecting region 8 pivotally connects the two retainers 3. The connecting region 8 may, for example, include a hinge to which both retainers 3 are connected. The connecting region 8 may also include a spring or actuator. In this case, the spring or actuator can cause the two retainers 3 to move automatically relative to each other and press the two retainers 3 against the panel P.

[0079] The longitudinal direction D2 is defined along the width direction of the retainer 3, and in Figure 1 It extends horizontally in the diagram. Along the longitudinal direction D2, the connecting area 8 is located to the right of the clamping area 4.

[0080] The axial direction D3 is defined along the length of the retainer 3 and is perpendicular to the thickness direction D1 and the longitudinal direction D2. Figure 1In the illustrated embodiment, each retainer is shaped linearly in a portion of the clamping region 4. On the right side of the clamping region 4, the retainer 3 is curved in the longitudinal direction, thus providing a cavity 9 between the two retainers 3. Figure 1 In the illustrated embodiment, the clamping region 4 of the retainer 3 is completely planar. The planar clamping region 4 is oriented perpendicular to the thickness direction D1. Therefore, in Figure 1 In the clamping state shown, the clamping area 4 is oriented parallel to the main surface of the panel P, so the panel P can be firmly fixed in the clamping area 4.

[0081] exist Figure 1 In the illustrated embodiment, both retainers 3 are partially covered by a protective cover layer 6. This protective cover layer 6 comprises an elastic material that can compensate for unevenness on the surface of the panel P. Therefore, a good mechanical connection can be provided between the retainers 3 and the panel P. Each protective cover layer 6 includes a perforation 6a extending in the axial direction D3. A portion of the retainer 3 comprising electrically conductive material passes through the perforation 6a accordingly. This penetrating portion of the retainer 3 is a contact area 7, designed to electrically connect the retainer 3 to the electrically conductive surface of the panel P. The contact area 7 is located within the clamping area 4. Because the protective cover layer 6 comprises a non-conductive material, the contact area 7 penetrates the protective cover layer 6 through the perforation 6a. The protective cover layer 6 can increase the service life of the clamping element 2. In an alternative embodiment, the contact area 7 may be located outside the clamping area 4. Furthermore, one or both retainers may not include the electrically insulating protective cover layer 6. In this case, the entire surface of the clamping area 4 can serve as the contact area 7. In this configuration, a more efficient manufacturing process can be achieved. Figure 1 In the embodiment shown, the contact area 7 includes an elongated shape extending along the axial direction D3.

[0082] exist Figure 1 In the illustrated embodiment, each retainer 3 includes a plurality of openings 5. These openings 5 ​​are arranged in a linear array extending along the axial direction D3. The openings include an elongated shape that also extends along the axial direction D3. The arrangement and distribution of the plurality of openings 5 ​​in each retainer 3 allows fluid, such as an electrolyte, to flow efficiently from the outside of the retainer 3 into the cavity 9. More openings 5 ​​may also be provided in each retainer, for example in… Figure 1 The portion between the shown opening 5 and the connecting area 8 is provided with more openings 5.

[0083] Figure 1 The clamping element 2 shown can be connected to the support structure 10 to form the manipulation element 1. Figure 4 The diagram shows an actuating element 1 with two clamping elements 2 and a support structure 10.

[0084] Figure 2A A side view of two clamping elements 2 according to an exemplary embodiment of the present invention is shown, with panel P clamped between the two clamping elements 2 in a first state. Figure 2A and 2B Two steps or stages of a method for electroplating a semi-finished panel P according to an exemplary embodiment of the present invention are shown. Figure 2A The state after method step A) is shown. Panel P is clamped in actuating element 1, which is not fully shown for better understanding. The clamping areas 4 of the two clamping elements 2 respectively abut against the clamping surface CS. For the relative positions of the clamping areas 4 and the clamping surface CS, please refer to [link to relevant documentation]. Figure 3 .

[0085] exist Figure 2A In the middle, the left clamping element 2 abuts against the surface of panel P at the clamping surface CS, which is positioned at a distance d from the lateral left edge E of the panel. The right clamping element 2 abuts against the surface of panel P at the clamping surface CS, which is arranged to be directly adjacent to the right edge E.

[0086] exist Figure 2A In the state shown, step B of method is performed, and a metal layer is electroplated on panel P. The clamped panel P is immersed in an electrolyte containing metal ions, and panel P is electrically connected to the cathode of a current source, wherein the electrolyte is electrically connected to the anode of the current source. Figure 2A As can be seen, the electrolyte flows into the cavity 9 through the opening 5 of the clamping element 2. Within these cavities 9, the electrolyte comes into contact with the protrusions of the panel. On the left side, the protrusion of the panel P located on the left side of the clamping region 4 is metallized. However, on the right side, there is no protrusion of the panel P within the cavity 9. Therefore, no metallization of such a protrusion occurs on the right side.

[0087] After step B) of the electroplating process, step C) is performed, and the position of the clamping element 2 relative to the panel P is changed. From Figure 2A Starting from the relative position of the clamping area 4 shown with respect to the panel P, both clamping elements 2 are offset to the left in the longitudinal direction D2 relative to the side edge E of the panel P. Figure 2B The image shows the state after changing position in step C) of the completed method.

[0088] Figure 2B A side view of two clamping elements 2 according to an exemplary embodiment of the present invention is shown, with panel P clamped between the two clamping elements 2 in a second state. Figure 2B The state is shown after method step C) and during method step D). Figure 2BIn the illustrated state, the clamping areas 4 of the two clamping elements 2 abut against different clamping surfaces CS' on the panel P. In the illustrated embodiment, the clamping surfaces CS and CS' are positioned adjacent in the longitudinal direction D2. Figure 2B In the shown state, a portion of panel P now protrudes into the cavity 9 of the right-side clamping element 2, while on the left side, panel P does not protrude into the cavity 9 of the left-side clamping element 2. Method step D) is performed in this position, where an additional metal layer is electroplated onto panel P. In this electroplating step, the portion of panel P protruding into the cavity 9 of the right-side clamping element 2 is metallized. This protruding portion... Figure 2A The area shown is covered by clamping region 4 in the previous electroplating step. On the left side, in Figure 2A In the electroplating step B) shown, the clamping surface CS, covered by the clamping area 4 of the left clamping element 2, is... Figure 2B The second electroplating step shown was not covered. Therefore, in Figure 2A In the state covered by clamping area 4, the two clamping surfaces CS are in Figure 2B The clamping surfaces CS are in contact with the electrolyte during the continuous electroplating step D). Therefore, these clamping surfaces CS will be metallized during electroplating step D). However, in Figure 2B In the continuous electroplating step D) shown, in Figure 2A In the first electroplating step B), the clamping surface CS', which was not covered by clamping area 4, is now covered by clamping area 4. By performing steps A) to D), the offset of the connection resistance between clamping area 4 and clamping surface CS can be avoided because there is always sufficient electrically conductive metal material on clamping surface CS. Since the resistance between clamping element 2 and the semi-finished panel P is stable and low, it is effective to prevent the rectifier from increasing the voltage during electroplating and damaging the holder 3 or the semi-finished panel P.

[0089] Figure 2A and Figure 2BThe basic idea of ​​this invention is illustrated as follows: In the first electroplating step, the clamping region 4 covers the clamping surface CS, which will not be metallized in this first electroplating step. After the first electroplating step, the position of the clamping region 4 is shifted so that the clamping region 4 abuts against a different clamping surface CS'. After this shift, a second electroplating step is performed. In the second electroplating step, the clamping surface CS covered in the first step is metallized. After the second electroplating step is completed, the clamping region 4 is shifted back to the position of the clamping surface CS in the first electroplating step. By doing so, the clamping surface CS' covered in the second electroplating step will no longer be covered and will be metallized again. Preferably, the position of the clamping region 4 shifts back and forth between the clamping surface CS and the clamping surface CS' between each successive electroplating step. The described positional change of the clamping region 4 relative to the panel P ensures that the clamping region 4 always abuts against the clamping surfaces CS and CS', which have been well metallized in the previous electroplating step. Figure 2B The state shown in the side view is Figure 3 The image is shown in a top-down view for better understanding.

[0090] Figure 3 It shows Figure 2B A top view of the two clamping elements 2 and the panel P clamped between the two clamping elements 2. Figure 3 middle, Figure 2B The state shown is presented in a top view. Figure 3 In the top view, the clamping surfaces CS and CS' are compared... Figure 2B It is more clearly visible in the middle. Figure 3 and Figure 2B In the illustrated state, the clamping region 4 of the clamping element 2 abuts against and covers the clamping surface CS'. Therefore, in the illustrated state, these clamping surfaces CS' are not metallized during electroplating. However, the clamping surface CS is not covered and thus comes into contact with the electrolyte. Figure 3 The clamping surface CS shown on the left is completely outside the clamping element 2. Figure 3 The clamping surface CS shown on the right is located within the cavity 9 of the right-side clamping element 2. This clamping surface CS on the right side of panel P also contacts the electrolyte, as the electrolyte flows into the cavity 9 through the opening 5. (The last sentence is incomplete and likely refers to a different topic.) Figure 2A The top view shown indicates that the two clamping elements 2 must be... Figure 3 The state shown shifts to the right until the clamping area 4 abuts the clamping surface CS.

[0091] Figure 4 A top view of a control element 1 according to an exemplary embodiment of the present invention is shown. The control element 1 is intended for control of elements not in... Figure 4The semi-finished panel P of the component carrier shown is held in place. The operating element 1 includes two clamping elements 2. These clamping elements 2 can, for example, be based on... Figure 1 The embodiment shown. For details regarding the clamping element 2, please refer to [link to relevant documentation]. Figure 1 The description.

[0092] The control element 1 also includes a support structure 10, which connects and holds the two control elements 2. Figure 4 In the illustrated embodiment, the clamping element 2 and the support structure 10 form a U-shape in the top view. The two clamping elements 2 are oriented parallel to each other. There is a distance D2 between the two clamping elements 2 in the longitudinal direction. There is a receiving area 11 between the two clamping elements 2 for receiving a panel P, which is clamped between the clamping elements 2. Figure 4 The embodiment of the manipulation element 1 shown is designed to manipulate a rectangular panel P.

[0093] Two clamping elements 2 face each other in the longitudinal direction D2 through the clamping area 4. Figure 4 In the illustrated embodiment, two clamping elements are movably connected to the support structure 10 in the longitudinal direction D2. Therefore, each clamping element 2 can move relative to the support structure 10 in the longitudinal direction D2. Figure 4 In this embodiment, each clamping element 2 includes a connecting rod 21 connected to a retainer 3 of the clamping element 2. The connecting rod 21 may also be connected to a connection region 8 of the clamping element 2. The connecting rod 21 extends in the axial direction D3. The front end of each connecting rod 21, away from the retainer 3, is introduced into the support structure 10. Within the support structure 10, there is an actuator for each connecting rod 21 that causes the front face of the connecting rod 21 to move along the longitudinal direction D2. These actuators may include a combination of an electric motor and a threaded spindle. The front face of each connecting rod 21 may include an internal thread into which the threaded spindle of the actuator is introduced. The rotation of the threaded spindle generated by the electric motor is converted into linear movement of the front face of the connecting rod 21, enabling the two clamping elements 2 to move relative to the support structure 10 in the longitudinal direction D2, respectively. The support structure 10 may also include a controller for moving the clamping elements 2 and the two retainers 3 of each clamping element 2 in the thickness direction D1 to clamp the panel P between the two retainers.

[0094] Figure Labels 1 control element 2 clamping elements 3 retainers 4 clamping areas 5 openings 6 protective covering layers 6a perforation 7 Contact Area 8 connection areas 9 chambers 11 Acceptance Area 21 connecting rods CS, CS' clamping surface D1 Thickness Direction D2 Longitudinal direction D3 Axial Direction E-side edge P panel.

Claims

1. A clamping element (2) for manipulating the panel (P) of a semi-finished component carrier, characterized in that, The clamping element (2) is configured to clamp the panel (P) at a clamping surface (CS), wherein the clamping surface (CS) is located at a side edge (E) of the panel (P) or is spaced apart from the side edge (E) of the panel (P) by a distance (d), and the clamping element (2) includes: At least two retainers (3), each retainer (3) including a clamping area (4) configured to abut against the surface of the panel (P) during manipulation; At least one of the retainers (3) includes at least one opening (5) extending through a portion of the retainer (3), wherein the portion of the retainer (3) is located outside or adjacent to the clamping area (4), wherein the opening (5) is adapted to fluidly connect the surface of the panel (P) positioned between the side edge (E) and the corresponding clamping surface (CS) of the panel (P) to the surface of the retainer (3) and / or the exterior of the retainer (3).

2. The clamping element according to claim 1, characterized in that, At least one retainer (3) is movable relative to another retainer (3) in the thickness direction (D1) to clamp the panel (P) between the retainers.

3. The clamping element according to claim 1, characterized in that, Both retainers (3) are movable relative to the other retainer (3) in the thickness direction (D1) to clamp the panel (P) between the retainers.

4. The clamping element according to claim 1 or 3, characterized in that, The two retainers (3) are movably connected to each other in the connection area (8).

5. The clamping element according to claim 4, characterized in that, The two retainers are pivotally connected in the connection area (8).

6. The clamping element according to claim 2 or 3, characterized in that, The longitudinal direction (D2) is perpendicular to the thickness direction (D1) and points along the width direction of the retainer (3), and the axial direction (D3) is perpendicular to the thickness direction (D1) and the longitudinal direction (D2) and points along the length direction of the retainer (3).

7. The clamping element according to any one of claims 1 to 3, characterized in that, The clamping area (4) is at least partially on the ground plane.

8. The clamping element according to claim 2 or 3, characterized in that, The clamping area (4) includes at least a planar portion oriented perpendicular to the thickness direction (D1).

9. The clamping element according to claim 6, characterized in that, At least one of the retainers (3) is at least partially covered by the protective cover layer (6).

10. The clamping element according to claim 9, characterized in that, The protective covering layer (6) comprises a soft or elastic material.

11. The clamping element according to claim 9, characterized in that, The protective covering layer (6) comprises rubber.

12. The clamping element according to claim 9, characterized in that, The protective covering layer (6) has a hardness in the range of 10 Shore 00 to 90 Shore A.

13. The clamping element according to claim 9, characterized in that, The protective cover (6) includes a shaped wavy surface at least a portion of the surface of the protective cover (6) facing the retainer (3).

14. The clamping element according to claim 13, characterized in that, The shaped corrugated surface includes a plurality of lugs and / or bosses that are spaced apart from each other.

15. The clamping element according to claim 9, characterized in that, The protective covering layer (6) includes an electrically conductive material.

16. The clamping element according to claim 9, characterized in that, The protective cover (6) includes at least one perforation (6a), wherein a portion of the retainer (3) comprising an electrically conductive material penetrates or protrudes from the outer surface of the protective cover (6) through the perforation (6a).

17. The clamping element according to claim 9, characterized in that, The retainer (3) includes a contact area (7) configured to make electrical contact with the panel (P), wherein the contact area (7) includes an electrically conductive material.

18. The clamping element according to claim 17, characterized in that, The contact area (7) is located in the clamping area (4).

19. The clamping element according to claim 17, characterized in that, At least one of the retainers (3) is at least partially covered by a protective cover layer (6) made of a non-electrically conductive material, and wherein the contact area (7) is disposed in at least one perforation (6a) of the protective cover layer (6) and penetrates the protective cover layer (6).

20. The clamping element according to claim 17, characterized in that, The contact area (7) includes an elongated shape extending along the axial direction (D3).

21. The clamping element according to claim 17, characterized in that, The contact area (7) extends at least 70% of the length of the retainer (3) in the axial direction (D3).

22. The clamping element according to claim 6, characterized in that, The opening (5) includes an elongated shape extending along the axial direction (D3).

23. The clamping element according to any one of claims 1 to 3, characterized in that, The retainer (3) includes a plurality of openings (5), wherein the plurality of openings (5) are arranged in an array.

24. The clamping element according to claim 6, characterized in that, The retainer (3) includes a plurality of openings (5), wherein the plurality of openings (5) are arranged in a linear array extending along the axial direction (D3).

25. The clamping element according to claim 23, characterized in that, The distance between the openings (5) is less than the length or diameter of the openings (5).

26. The clamping element according to claim 6, characterized in that, A cavity (9) is provided between the two retainers (3), wherein the cavity (9) is fluidly connected to the surface of the retainer and / or the exterior of the retainer (3) through at least one of the openings (5).

27. The clamping element according to claim 26, characterized in that, The cavity (9) is located between the portions of each retainer (3) that are positioned outside or adjacent to the clamping area (4).

28. The clamping element according to claim 26, characterized in that, The cavity (9) extends in the axial direction (D3).

29. The clamping element according to claim 26, characterized in that, The cavity (9) is connected to a support channel within the retainer (3), wherein the support channel is configured to be connected to a liquid source.

30. The clamping element according to claim 29, characterized in that, The support channel is configured to connect to an electrolyte source used for electroplating.

31. A control element (1) for manipulating a panel (P) of a semi-finished component carrier, characterized in that, The manipulation element (1) includes: At least two clamping elements (2) according to any one of claims 1 to 30; The clamping elements (2) are connected via a support structure (10), wherein the clamping elements (2) are configured to face each other in the longitudinal direction (D2) through the clamping areas (4) of the clamping elements (2), wherein at least one of the clamping elements (2) is movably connected to the support structure (10) in the longitudinal direction (D2), thereby the distance between the clamping elements (2) in the longitudinal direction (D2) is adjustable.

32. The actuating element according to claim 31, characterized in that, The clamping element (2) and the support structure (10) form a U-shape, wherein the clamping element (2) is oriented to be parallel to each other and spaced apart from each other.

33. The actuating element according to claim 31 or 32, characterized in that, There is a receiving area (11) between the clamping elements (2) for receiving the panel (P), which is clamped between the clamping elements (2).

34. The actuating element according to claim 31 or 32, characterized in that, Multiple clamping elements (2) are arranged to be adjacent to each other and / or facing each other.

35. A control device, characterized in that, The control device includes: The actuating element (1) according to any one of claims 31 to 34; A semi-finished panel (P) of a component carrier, wherein the panel (P) includes two clamping surfaces (CS), wherein the clamping surfaces (CS) are disposed at two opposite side edges (E) of the panel (P) or are disposed at a distance (d) spaced apart from the two opposite side edges (E) of the panel (P). The manipulation element (1) holds the panel (P), and each clamping element (2) clamps one of the clamping surfaces (CS) of the panel, wherein the clamping area (4) of each clamping element (2) abuts against the clamping surface (CS) of the panel (P).

36. The operating device according to claim 35, characterized in that, At least one clamping area (4) abuts against a clamping surface (CS) that is configured to be spaced apart from the side edge (E) by a distance (d).

37. The operating device according to claim 35 or 36, characterized in that, At least one opening (5) of the retainer (3) fluidly connects the surface of the panel (P) positioned between the side edge (E) and the corresponding clamping surface (CS) of the panel (P) to the surface of the retainer (3) and / or the exterior of the retainer (3).

38. The operating device according to claim 35 or 36, characterized in that, One or both of the clamping elements (2) are movably connected to the support structure (10) in the longitudinal direction (D2), wherein at least one clamping area (4) is adjustable relative to the panel (P) in the longitudinal direction (D2).

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