A refrigeration fan

Abstract

The application relates to the fan field and provides a refrigeration fan, which comprises a shell, a fan air duct and a heat dissipation air duct, the air outlet direction of the fan air duct is different from the air outlet direction of the heat dissipation air duct, semiconductor refrigerating sheets are fixed to the shell and have a first end in the fan air duct and a second end in the heat dissipation air duct, a fan is fixed to the shell and is used for blowing air to a user through the fan air duct and blowing air to the heat dissipation air duct so that the second end is rapidly exchanged with airflow, and the semiconductor refrigerating sheets have at least two sheets distributed around the fan air duct. The semiconductor refrigerating sheet arrangement mode adopted by the application can effectively utilize limited space to improve the cold air effect, and the surrounding distribution of the semiconductor refrigerating sheets can multi-angle act on the airflow of the fan air duct, thereby improving the cold air effect, and each semiconductor refrigerating sheet can be well radiated.

Description

Technical Field

[0001] This application relates to the field of fan technology, specifically to a cooling fan. Background Technology

[0002] In the sweltering summer, users often have an urgent need to use fans for cooling. With the development of technology, fans with cooling functions have gradually emerged. This is achieved by introducing a thermoelectric cooler into the fan. However, the working characteristics of the thermoelectric cooler mean that while one side is working for cooling, the other side is simultaneously heating. When placing the thermoelectric cooler in the air duct, the air duct needs to be isolated to reduce the impact of the heated air on the blown-out cool air. Existing fans also provide corresponding isolation solutions. Referring to the patent document with patent publication number CN119712590A, a horizontal air intake fan has a bracket set in the middle of the ventilation section. The fan module and the thermoelectric cooler are arranged horizontally in the ventilation section. The hot and cold zones of the thermoelectric cooler are arranged vertically. The air inlet is located on one side of the ventilation section and is used to guide the airflow from the air inlet to the cold and hot zones of the thermoelectric cooler. The cold air generated in the cold zone is discharged from the cold air outlet on the opposite side of the ventilation section from the air inlet, and the hot air generated in the hot zone is discharged from the hot air outlet at the top of the ventilation section. Summary of the Invention

[0003] The purpose of this application is to provide a cooling fan that improves the cooling effect and enables the semiconductor cooling chips to dissipate heat effectively.

[0004] This application provides a cooling fan, comprising: a housing having a fan duct and a heat dissipation duct, wherein the air outlet direction of the fan duct is different from that of the heat dissipation duct; a thermoelectric cooler fixed to the housing, having a first end located in the fan duct and a second end located in the heat dissipation duct; a fan fixed to the housing for blowing air to a user through the fan duct and for blowing air into the heat dissipation duct to rapidly exchange heat between the second end and the airflow; the thermoelectric cooler having at least two pieces distributed around the fan duct.

[0005] As can be seen from the above, the thermoelectric cooler in this application has at least two chips distributed around the fan duct. The cooling fan has space to install multiple thermoelectric coolers. With multiple thermoelectric coolers, it is beneficial to improve the cooling effect of the cooling fan on the airflow. Especially for handheld fans, which require small size and more compact structure, the space available for design is more limited. The thermoelectric cooler arrangement method adopted in this application can effectively utilize the limited space to improve the cooling effect. Moreover, the surrounding distribution of the thermoelectric coolers can act on the airflow of the fan duct from multiple angles, thereby improving the cooling effect.

[0006] In addition, the thermoelectric coolers are distributed around the fan duct. For the second end of the heat dissipation duct of the thermoelectric cooler, they will also be distributed around the heat dissipation duct. Compared with the case where the fan and thermoelectric coolers are arranged along the air outlet direction of the fan duct, the solution of this application is beneficial to reduce the situation where the heat dissipation effect deteriorates when the airflow passes through the second end of one thermoelectric cooler and then blows to the second end of the next thermoelectric cooler. It is also beneficial to reduce the mutual thermal influence between each thermoelectric cooler, so that all thermoelectric coolers can be well dissipated.

[0007] Especially in scenarios where the airflow from a fan duct blows directly at the user, the arrangement of semiconductor cooling chips distributed around the fan duct allows the airflow processed by the semiconductor cooling chips to be more evenly distributed across the cross-section of the fan duct. This helps to make the airflow temperature from the fan duct outlet more uniform and reduces the situation where the airflow near the cold end of the semiconductor cooling chip is too cold while the airflow at the edge is relatively hot, thus preventing uneven temperature formation.

[0008] In one possible implementation, the housing has a first wall for forming a fan duct, the fan duct being formed radially inside the first wall, at least a portion of a heat dissipation duct being formed radially outside the first wall, and a semiconductor cooling chip being fixed to the first wall.

[0009] In one possible implementation, the fan duct extends along a first direction, and the heat dissipation duct has an air inlet section and a curved section connected in sequence. Both the air inlet section and the curved section are formed on the radially outer side of the first wall. The air inlet section extends along the first direction, and the curved section causes the air outlet direction of the heat dissipation duct to deviate from the air outlet direction of the fan duct.

[0010] As can be seen from the above, the heat dissipation duct of this application is provided with an air inlet section and a curved section connected in sequence. The air inlet section and the fan duct both extend in the first direction. The curved section deviates the extension direction of the heat dissipation duct from the first direction, thus making the air outlet direction of the heat dissipation duct different from that of the fan duct. This reduces the interference of heat from the airflow in the heat dissipation duct on the air blown out by the fan duct, improving the cooling effect of the fan duct. Furthermore, in this application, the heat dissipation duct and the fan duct use the same air inlet direction and a unified air inlet path, eliminating the need for separate air inlets for the heat dissipation duct and the fan duct. This reduces internal space waste and makes the cooling fan structure more compact.

[0011] In one possible implementation, the housing further includes a second wall and a third wall, all of which are cylindrical with their axes aligned along a first direction. The first and second walls are located within the cavity of the third wall, with a portion of the first wall located within the cavity of the second wall at its positive end along the first direction. The positive end of the first wall along the first direction is closedly connected to the positive end of the third wall along the first direction. The heat dissipation duct further includes an air outlet section, an air inlet section, a curved section, and an air outlet section connected sequentially. The air inlet section is formed between the second and first walls, and the air outlet section is formed between the second and third walls. The curved section connects the positive ends of the air inlet and air outlet sections along the first direction.

[0012] In one possible implementation, the second wall is installed inside the cavity of the third wall; the housing also includes a protective cover, which is installed at the negative end of the second and third walls along a first direction. The protective cover has a connecting inner ring and a connecting outer ring protruding in the first direction. The connecting outer ring is fixedly connected to the third wall, and the connecting inner ring is fixedly connected to the second wall. The protective cover includes an air inlet that covers the negative end of the cavity of the second wall along the first direction. The air inlet has an air inlet hole communicating with the cavity of the second wall. The protective cover is used to fix the second wall inside the cavity of the third wall.

[0013] As can be seen from the above, this application achieves fixed connection between the outer connecting ring of the protective cover and the third wall body, and fixed connection between the inner connecting ring and the second wall body, thereby installing the second wall body into the cavity of the third wall body. All structures to be installed in the housing are fixedly connected to the protective cover. This not only achieves the fixed connection between the protective cover and the housing, but also achieves the installation and fixation of the second and third walls in the housing. The installation is completed through the inner and outer connecting rings provided in the protective cover, without the need to add fasteners in other locations to complete the installation of the second and third walls. This helps to simplify the structure of the refrigeration fan and improve the structural compactness.

[0014] In one possible implementation, the protective cover further includes an air outlet section covering the negative end of the air outlet section along the first direction, and an air outlet hole is provided on the air outlet section, which is connected to the air outlet section; the air inlet section is recessed in the positive direction of the first direction relative to the air outlet section, or protrudes in the negative direction of the first direction.

[0015] As can be seen from the above, the protective cover includes an air inlet and an air outlet. The air inlet covers the negative end of the cylindrical cavity of the second wall along the first direction, and the air inlet has an air inlet hole communicating with the cylindrical cavity of the second wall. The air outlet covers the negative end of the air outlet section along the first direction, and the air outlet has an air outlet hole. The airflow in the heat dissipation duct is discharged through the air outlet hole in the air outlet section. When both the air inlet and the air outlet are located at the negative end of the shell along the first direction, the airflow discharged from the air outlet section will be re-inhaled through the air inlet hole in the air inlet section. This application separates the air inlet and the air outlet section in the first direction by making the air inlet section recessed in the positive direction of the first direction or protruding in the negative direction of the first direction relative to the air outlet section. This helps to reduce the amount of airflow discharged through the air outlet hole in the air outlet section being drawn in through the air inlet hole in the air inlet section, thereby improving the cooling effect of the cooling fan.

[0016] In one possible implementation, the outer ring is connected to the third wall body by a snap-fit ​​connection, and the inner ring is connected to the second wall body by a snap-fit ​​connection.

[0017] As can be seen from the above, by using the protective cover as a fixing component to assemble the shell, there is no need to add other fixing components, which helps to simplify the structure of the cooling fan; the snap-fit ​​structure can be embedded into the component body, without the need to reserve screw holes and tool operation space, which helps to save space and make the fan structure more compact; especially for handheld cooling fans, in the scenario where the cooling fan structure is required to be small, it helps to reduce the size and weight of the cooling fan.

[0018] Moreover, the snap-fit ​​connection can usually be locked by pressing or sliding directly, eliminating the need for tools such as screwdrivers and wrenches. The fixation can be completed in one operation (such as a "click" when it is in place), without the need for complicated tightening actions (such as screws needing to be rotated multiple times), which helps to improve assembly efficiency.

[0019] In one possible implementation, the second wall body includes a first half-wall and a second half-wall that are fixedly connected to each other, the distribution direction of the first half-wall and the second half-wall is perpendicular to the first direction, and the fan is installed in the cavity formed by the first half-wall and the second half-wall.

[0020] In this application, the second wall body includes a first half wall and a second half wall that are fixedly connected to each other. During the assembly of the refrigeration fan, the fan can be installed on one of the first half wall and the second half wall first, and then the other half wall can be assembled to install the fan in the cavity formed by the first half wall and the second half wall, thus completing the installation of the fan and the second wall body. This makes the assembly of the fan and the second wall body convenient and quick, which helps to improve the assembly efficiency of the refrigeration fan.

[0021] In one possible implementation, the cooling fan further includes a first heat-conducting element disposed in the fan duct and thermally connected to a first end; and / or, the cooling fan further includes a second heat-conducting element disposed in the heat dissipation duct and thermally connected to a second end.

[0022] As can be seen from the above, this application expands the contact area between the semiconductor cooling chip and the airflow by adding a heat-conducting component, which is conducive to obtaining a better heat conduction effect.

[0023] In one possible implementation, when the cooling fan includes a first heat-conducting element, the first heat-conducting element has a first substrate and a first heat exchange extension, the first substrate being thermally connected to a first end, and the first heat exchange extension extending from the first substrate toward the fan duct; when the cooling fan includes a second heat-conducting element, the second heat-conducting element includes a second substrate and a second heat exchange extension, the second substrate being thermally connected to a second end, and the second heat exchange extension extending from the second substrate toward the heat dissipation duct.

[0024] As can be seen from the above, when the first heat-conducting element has a first substrate and a first heat exchange extension extending from the first substrate to the fan duct, the contact area between the first heat-conducting element and the airflow can be increased, which is beneficial to further improve the cooling effect.

[0025] Similarly, when the second heat conductor has a second substrate and a second heat exchange extension extending from the second substrate to the heat dissipation channel, the contact area between the second heat conductor and the airflow can be increased, the heat exchange efficiency can be improved, and thus the heat dissipation effect on the second end of the semiconductor cooling chip can be further improved. Attached Figure Description

[0026] Figure 1 This is a perspective view of an embodiment of the cooling fan provided by this utility model; Figure 2 This is a perspective sectional view of an embodiment of the cooling fan provided by this utility model; Figure 3 This is a perspective sectional view and a partial enlarged view of an embodiment of the cooling fan provided by this utility model; Figure 4 This is an exploded view of an embodiment of the cooling fan provided by this utility model. Detailed Implementation

[0027] This application embodiment Figures 1 to 4 A unified spatial rectangular coordinate system (right-handed system) is adopted to represent the relative positional relationship between the features, wherein the X-axis direction is the first direction.

[0028] For details, please refer to Figures 1 to 4This application provides a cooling fan 100, which includes a fan head 10 and a handle 20 connected together. The fan head 10 includes a housing 11, a fan 12, a thermoelectric cooler 13, and a protective cover 14. A main control circuit board 21 and a battery 22 are installed inside the handle 20. The battery 22, the thermoelectric cooler 13, and the fan 12 are all electrically connected to the main control circuit board 21. The battery 22 provides power to the fan 12, the thermoelectric cooler 13, and the main control circuit board 21.

[0029] The fan head 10 in this embodiment will be described below, and the handle 20 will be described in detail later: In this embodiment, the housing 11 has a fan duct 15, a heat dissipation duct 16, and an air inlet duct 17, with the air inlet duct extending along the X-axis. The airflow from the air inlet duct 17 is blown by the fan 12 to the heat dissipation duct 16 and the fan duct 15. The air outlet direction of the fan duct 15 is different from that of the heat dissipation duct 16. In this embodiment, the air outlet direction of the fan duct is in the positive X-axis direction, and the air outlet direction of the heat dissipation duct is in the negative X-axis direction.

[0030] In this embodiment, the housing 11 has a first wall 111, a second wall 112, and a third wall 113. The first wall 111, the second wall 112, and the third wall 113 are all cylindrical, and the axis of the cylinder is along the X-axis. The first wall 111 and the second wall 112 are both located in the cavity of the third wall 113. A portion of the negative end of the first wall 111 along the X-axis is located in the cavity of the positive end of the second wall 112 along the X-axis. The positive end of the first wall 111 along the X-axis is closedly connected to the positive end of the third wall 113 along the X-axis.

[0031] Specifically, in this embodiment, the housing also has an annular wall 114, which has an inner ring portion and an outer ring portion that protrude negatively in the X-axis direction. The positive end of the first wall 111 in the X-axis direction and the positive end of the third wall 113 in the X-axis direction are closedly connected through the annular wall 114.

[0032] Specifically, the outer ring of the annular wall 114 is connected to the positive end of the third wall 113 along the X-axis, and the annular wall 114 and the third wall 113 are integrally formed, meaning that the annular wall 114 extends radially inward from the positive end of the third wall 113 along the X-axis. The inner ring of the annular wall 114 is sealed to the positive end of the first wall 113 along the X-axis. Specifically, the first wall 111 is stepped, and the diameter of the positive end of the first wall 111 along the X-axis is larger than the diameter of the negative end of the first wall 111 along the X-axis. The radially outer surface of the inner ring of the annular wall 114 directly abuts against the radially inner surface of the positive end of the first wall 111 along the X-axis for a sealed installation. Alternatively, the installation point between the annular wall 114 and the first wall 111 can also be sealed using materials such as sealing rings or sealant; this is not limited here.

[0033] In this embodiment, the first wall 111 and the second wall 112 are connected by multiple support ribs, the first wall 111 and the second wall 112 are integrally formed, and the second wall 112 is installed in the cavity of the third wall 113.

[0034] In this embodiment, the first wall 111, the second wall 112, and the third wall 113 together define a fan duct 15 and a heat dissipation duct 16. The fan duct 15 is formed radially inside the first wall 111 and extends along the X-axis. The heat dissipation duct 16 has an air inlet section 161, a curved section 162, and an air outlet section 163, which are sequentially connected. The air inlet section is formed between the second wall and the first wall and extends along the X-axis. The air outlet section is formed between the second wall and the third wall and extends along the X-axis. The curved section connects the positive ends of the air inlet section and the air outlet section along the X-axis. The curved section causes the extension direction of the heat dissipation duct 16 to deviate from the air outlet direction of the fan duct 15, that is, deviate from the positive X-axis direction.

[0035] Specifically, in this embodiment of the application, the airflow of the heat dissipation duct 16 is blown into the air inlet section 161 along the positive X-axis through the gap between the support ribs, turns around after passing through the bending section 162, that is, the airflow deviates from the positive X-axis through the bending section 162 and turns towards the negative X-axis, realizing the "U" shaped turn of the airflow direction, and finally blown out from the air outlet section 163 along the negative X-axis.

[0036] In this embodiment, the thermoelectric cooler 13 is fixed on the first wall 111 and has a first end located in the fan duct 15 and a second end located in the heat dissipation duct 16; the fan 12 is fixed on the second wall 112 and is used to blow air to the user through the fan duct 15 and to blow air to the heat dissipation duct 16 so that the second end of the thermoelectric cooler 13 can quickly exchange heat with the airflow.

[0037] Specifically, the thermoelectric cooler 13 has multiple chips evenly distributed around the fan duct. By distributing them around the duct, the cooling fan has space to install multiple thermoelectric coolers. This arrangement improves the cooling effect of the fan on the airflow, especially for handheld fans where small size and compact structure are required, and space is limited. The thermoelectric cooler arrangement used in this application effectively utilizes limited space to improve the cooling effect. Furthermore, the surrounding distribution of the thermoelectric coolers allows for multi-angle action on the airflow in the fan duct, further enhancing the cooling effect. Additionally, the thermoelectric coolers located at the second end of the heat dissipation duct are also distributed around it, reducing mutual thermal influence between each thermoelectric cooler and ensuring good heat dissipation for each chip.

[0038] In this embodiment of the application, the cooling fan further includes a second heat-conducting element 18, which is disposed in the heat dissipation duct 15 and is thermally connected to the second end of the semiconductor cooling chip 13. The second heat-conducting element 18 is annular and connects the second ends of each semiconductor cooling chip 13 through one second heat-conducting element 18.

[0039] Specifically, in this embodiment, the second heat-conducting element 18 includes a second substrate 181 and fins 182 (an example of a second heat exchange extension). The second substrate 181 is thermally connected to the second end of the thermoelectric cooler 13, and the fins 182 extend from the second substrate 181 toward the heat dissipation channel. In this embodiment, by adding the second heat-conducting element, the contact surface between the second end of the thermoelectric cooler and the airflow is expanded, which is beneficial to obtaining a better heat conduction effect and improving the heat dissipation effect on the second end. Moreover, by having fins extending from the second substrate to the heat dissipation channel, the heat dissipation surface area can be increased or airflow disturbance can be guided, which is beneficial to improving the heat dissipation effect on the second end of the thermoelectric cooler 13.

[0040] Furthermore, in this embodiment, the second heat-conducting element 18 and the second end of the thermoelectric cooler 13 are thermally connected via a thermal interface material. By using a thermal interface material with high thermal conductivity to fill the uneven gap between the second heat-conducting element 18 and the second end of the thermoelectric cooler 13, air can be expelled, an effective heat conduction channel can be established, which is beneficial for significantly reducing contact thermal resistance and improving the heat conduction effect between the second heat-conducting element 18 and the thermoelectric cooler 13. The thermal interface material can be silicone grease, silicone, a heat dissipation pad, a phase change material, a phase change metal sheet, thermally conductive adhesive, etc., and is specifically chosen according to requirements; no limitation is made here.

[0041] In this embodiment, the cooling fan further includes a protective cover 14, which is installed at the negative end of the second wall 112 and the third wall 113 along the X-axis. Specifically, the protective cover 14 has a connecting inner ring 141 and a connecting outer ring 142 protruding in the X-axis direction. The connecting outer ring 142 is fixedly connected to the third wall 113, and the connecting inner ring 141 is fixedly connected to the second wall 112. The protective cover 14 is used to fix the second wall 112 inside the cavity of the third wall 113. By using the protective cover as a fixing component to assemble the various parts of the housing, no other fixing components need to be added, which simplifies the structure of the cooling fan.

[0042] In this embodiment, the second wall 112 includes a first half-wall 1121 and a second half-wall 1122 fixedly connected to each other. The distribution direction of the first half-wall 1121 and the second half-wall 1122 is perpendicular to the X-axis direction, that is, the first half-wall 1121 and the second half-wall 1122 are assembled in a direction perpendicular to the X-axis direction. Specifically, the first half-wall 1121 and the second half-wall 1122 are connected by snap-fit. During the assembly of the cooling fan, the fan can be installed on one of the first half-wall 1121 and the second half-wall 1122 first, and then the other half can be assembled to complete the installation of the fan 12 in the cavity of the second wall 112. This facilitates the assembly of the fan 12 and the second wall 112 and helps to improve the assembly efficiency of the cooling fan.

[0043] Specifically, in this embodiment, after installing the fan 12 on the second wall 112, installing the thermoelectric cooler 13 on the first wall 111, and thermally connecting the second heat-conducting component 18 with the thermoelectric cooler 13, the integrally formed second wall 112 and first wall 111 are sealed and connected with the integrally formed third wall 113 and annular wall. Finally, the outer ring 142 of the protective cover 14 is fixedly connected to the third wall 113, and the inner ring 141 is fixedly connected to the second wall 112, thus completing the assembly of the fan head.

[0044] Specifically, in this embodiment, the outer ring 142 is connected to the third wall 113 by a snap-fit, and the inner ring 141 is connected to the second wall 112 by a snap-fit. Alternatively, in other embodiments of this application, the fixing method for the outer ring 142 and the third wall 113, and the fixing method for the inner ring 141 and the second wall 112, can also be a screw fixing connection, an adhesive fixing connection, etc., and is not limited here. A detachable connection method is preferred to facilitate subsequent disassembly and maintenance of the cooling fan. Furthermore, a snap-fit ​​connection method is preferred. The snap-fit ​​structure can be embedded into the component body, eliminating the need for pre-drilled screw holes and tool operation space, which helps save space and makes the cooling fan structure more compact. Especially for handheld cooling fans, where a small cooling fan structure is required, this method helps to reduce the size and weight of the cooling fan. Moreover, snap-fit ​​connections can usually be locked manually by pressing or sliding, eliminating the need for tools such as screwdrivers and wrenches. A single operation can complete the fixing (such as a "click" sound), without the need for complex tightening actions (such as screws needing to be rotated multiple times), which helps to improve assembly efficiency.

[0045] In this embodiment, the first half-wall 1121 and the second half-wall 1122 are connected by a snap-fit. Alternatively, in other embodiments of this application, the first half-wall and the second half-wall can also be connected by screws, glue, etc., which is not limited here. In addition, in this embodiment, when the outer ring of the protective cover is connected to the third wall body by a snap-fit ​​and the inner ring is connected to the second wall body by a snap-fit, the protective cover can enable the second wall body to be installed in the cavity of the third wall body, and at the same time, it can also fix the first half-wall and the second half-wall in the second wall body. At this time, the first half-wall and the second half-wall in the second wall body can be assembled and limited by limiting structures such as boss-groove fit, pin hole fit, or dovetail groove fit, and then fixed by the protective cover. This helps to simplify the shell structure, simplify the locking action during installation, and improve assembly efficiency.

[0046] In this embodiment, the protective cover includes an air inlet 143 and an air outlet 144. Specifically, in this embodiment, an air outlet is formed between the inner connecting ring 141 and the outer connecting ring 142 of the protective cover 14, and an air inlet 143 is formed inside the inner connecting ring 141. The air inlet 143 covers the negative end of the cavity of the second wall 112 along the X-axis direction. An air inlet hole communicating with the cavity of the second wall 112 is provided on the air inlet 143. The air outlet 144 covers the negative end of the air outlet section 163 along the X-axis direction. An air outlet hole is provided on the air outlet 144, and the air outlet hole communicating with the air outlet section 163. The air inlet 143 is recessed in the positive direction of the X-axis direction or protrudes in the negative direction of the X-axis direction relative to the air outlet 144. That is, there is a height difference between the air inlet 143 and the air outlet 144 in the X-axis direction, so that one of them protrudes relative to the other. Since both the air inlet and outlet are located at the negative end of the housing along the X-axis, the airflow discharged from the outlet will be re-drawn in through the air inlet in the air inlet. At this time, the airflow discharged through the air outlet in the outlet is the airflow in the heat dissipation duct, which has a high temperature and will interfere with the cooling effect of the cooling fan. This application separates the air inlet and outlet in the X-axis by making the air inlet recessed in the positive direction of the X-axis or protruding in the negative direction of the X-axis relative to the air outlet. This helps to reduce the amount of airflow discharged through the air outlet in the outlet being drawn in through the air inlet in the air inlet, thereby improving the cooling effect of the cooling fan.

[0047] In this embodiment, the annular wall 114 and the third wall 113 are integrally formed, and the inner ring of the annular wall 114 is sealed and installed with the positive end of the first wall 111 along the X-axis. Alternatively, in other embodiments of this application, the annular wall and the third wall may not be integrally formed. The outer ring of the annular wall and the positive end of the third wall along the X-axis are connected and installed through a sealing component. The first wall and the annular wall are integrally formed. Alternatively, the annular wall and the third wall, and the annular wall and the first wall are all connected and installed through sealing components. Alternatively, the first wall, the annular wall and the third wall may be integrally formed. Alternatively, the first wall and the annular wall may be integrally formed.

[0048] In this embodiment, the positive end of the first wall 111 along the X-axis and the positive end of the third wall 113 along the X-axis are closedly connected by an annular wall 114. Alternatively, in other embodiments of this application, the annular wall may be omitted, and the positive end of the first wall 111 along the X-axis and the positive end of the third wall 113 along the X-axis may be directly closedly connected. Preferably, the positive end of the first wall along the X-axis and the positive end of the third wall along the X-axis are closedly connected by an annular wall. The annular wall allows for a larger space in the curved section of the heat dissipation airflow, and the annular amplitude of the annular wall can guide the airflow direction, reducing the impact between the airflow and the wall, reducing wind noise, and also improving the appearance.

[0049] In this embodiment, the thermoelectric cooler 13 has multiple pieces evenly distributed around the fan duct 15; alternatively, in other embodiments of this application, the thermoelectric cooler may also have at least two pieces unevenly distributed around the fan duct. Preferably, the thermoelectric cooler is evenly distributed around the fan duct so that the airflow after being processed by the thermoelectric cooler is more evenly distributed on the cross-section of the fan duct, which is beneficial to make the airflow temperature blown out of the fan duct outlet more uniform.

[0050] In this embodiment, the second heat exchange extension 182 is finned. Alternatively, in other embodiments of this application, the second heat exchange extension may be other three-dimensional geometric structures that extend from the substrate surface toward the heat dissipation duct, have a large surface area, and have channels through which airflow passes, which can increase the heat dissipation surface area or guide airflow disturbance, such as mesh grids, arrayed cylindrical heat dissipation columns, etc.

[0051] In this embodiment, the second heat-conducting element 18 and the second end of the semiconductor cooling chip 13 are connected by a thermal interface material for heat conduction. Alternatively, the second heat-conducting element 18 and the second end of the semiconductor cooling chip 13 can also be connected by direct contact for heat conduction.

[0052] Alternatively, in other embodiments of this application, the cooling fan may further include a first heat-conducting element, which is disposed in the fan duct and thermally connected to the first end of the semiconductor cooling chip. By adding the first heat-conducting element, the contact area for heat exchange can be increased, thereby further improving the cooling effect. The cooling fan may include both a first heat-conducting element and a second heat-conducting element, or it may only have the first heat-conducting element or only the second heat-conducting element, depending on the specific requirements.

[0053] Furthermore, in other embodiments of this application, if the cooling fan includes a first heat-conducting element, the first heat-conducting element may also have a first substrate and a first heat exchange extension. The first substrate is thermally connected to a first end, and the first heat exchange extension extends from the first substrate to the fan duct. The first heat exchange extension refers to a three-dimensional geometric structure with a large surface area and a channel through which airflow passes. For example, the first heat exchange extension may be a mesh covering the fan duct, or it may be a fin extending from the first substrate to the fan duct, or it may be an array of cylindrical heat dissipation columns extending from the first substrate to the fan duct. When the first heat-conducting element has a first substrate and a first heat exchange extension extending from the first substrate to the fan duct, the contact area between the first heat-conducting element and the airflow can be further increased or the airflow disturbance can be guided, thereby further improving the cooling effect.

[0054] Specifically, in this embodiment, an air outlet 144 is formed between the inner ring 141 and the outer ring 142 of the protective cover 14, and an air inlet 143 is formed inside the inner ring 141. The airflow of the heat dissipation duct 16 is blown in from the air inlet section 161 along the positive X-axis through the gap between the support ribs, turns around in a "U" shape after the bending section 162, and is blown out from the air outlet section 163 along the negative X-axis. That is, the air outlet of the heat dissipation duct is located at the negative end of the housing along the X-axis. Alternatively, in other embodiments of this application, the air outlet of the heat dissipation duct can be located on the side of the housing. In this case, the housing also has a fourth wall, which is connected to the radially outer side of the second wall and the radially inner side of the third wall, and is sealed to both the second and third walls. The air outlet section is formed between the second, third, and fourth walls. The air outlet direction of the heat dissipation duct deviates from the negative X-axis. After the airflow deviates from the positive X-axis through the curved section, it turns to the air outlet section and is blown out from the side of the housing under the guidance of the air outlet section. Air inlets are formed between the inner and outer connecting rings of the protective cover, as well as within the inner connecting ring, to increase the air intake.

[0055] It should be noted that the embodiment of this application provides a cooling fan. The cold end (an example of the first end) of the semiconductor cooling chip is located in the fan duct, and the fan duct blows out cold air. The hot end (an example of the second end) of the semiconductor cooling chip is located in the heat dissipation duct. It should be clear that the two ends of the semiconductor cooling chip can be changed according to control. That is, the first end can be the hot end. For the sake of clarity, the embodiment of this application uses the first end as the cold end and the cold air blown out by the fan duct for description. However, regardless of whether the first end of the semiconductor cooling chip is the cold end or the hot end, the fan duct blows out cold air and hot air, which are applicable to the fan structure in the embodiment of this application, the fan structure will not be changed as a result, and all are within the protection scope of this application.

[0056] The specific description of the handle portion 20 in this embodiment is as follows: In this embodiment, the main control circuit board 21 in the handle 20 integrates necessary circuits and components, such as a processor, drive circuit, and power management circuit, to ensure the stable operation of the cooling fan. The main control circuit board 21 is also connected to the charging interface 211, the button 212, and the switch component 213. The main control circuit board 21 is responsible for receiving and processing signals from the button 212 and the switch component 213, as well as managing the charging and discharging of the battery. The charging interface 211, the button 212, and the switch component 213 are all disposed on the surface of the handle 20.

[0057] Specifically, the user can connect the charger to the charging interface 211 to charge the battery 22. The user can also control the cooling fan to turn on and off using the switch component 213. For example, pushing the switch component 213 along the positive direction of the Z-axis turns the cooling fan on, and pushing it along the negative direction of the Z-axis turns it off. The user can also adjust the fan speed and the power of the semiconductor cooling chip 13 by pressing the two ends of the button 212 along the Z-axis. For example, adjusting the fan speed is triggered by the positive end of the button 212 along the Z-axis. The cooling fan has three fan speed levels. When the fan is turned on, the default fan speed is level 1. Pressing the positive end of the button 212 once increases the fan speed to level 2, pressing it again increases it to level 3, and pressing it again returns it to level 1.

[0058] In this embodiment, the adjustment of the fan speed setting and the power adjustment of the thermoelectric cooler are achieved through a single button 212. The button 212 is triggered and controlled at both ends along the Z-axis. Alternatively, in other embodiments of this application, the adjustment of the fan speed setting and the power adjustment of the thermoelectric cooler can be set on two separate buttons, or only a button for adjusting the power of the thermoelectric cooler can be set, or only a button for adjusting the fan speed setting can be set.

[0059] Alternatively, in other embodiments of this application, the start and stop of the thermoelectric cooler can be controlled separately by a button. Specifically, when the user controls the thermoelectric cooler to be off, the fan can blow ambient air; when the user controls the thermoelectric cooler to be on, the fan can blow cool air, thereby meeting different user needs and usage environments and improving the user experience.

[0060] In this embodiment, the switch component 213 is pushed along the Z-axis to control the cooling fan's on and off states. Alternatively, the switch component can be pushed in other directions to achieve control. The on / off states of the cooling fan can also be set as buttons. The on / off states of the cooling fan can also be combined with the fan speed adjustment into a single button. For example, when the cooling fan is off, pressing the button turns the cooling fan on. At this time, the cooling fan is at the lowest fan speed setting. Pressing the button again increases the fan speed setting. Pressing the button again increases the fan speed setting again. Pressing the button again raises the fan speed setting to the highest setting. When the cooling fan is at the highest setting, pressing the button again turns the cooling fan off.

[0061] Finally, it should be emphasized that the above description is only a preferred embodiment of this application and is not intended to limit this application. For those skilled in the art, this application can have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A cooling fan, comprising: The housing has a fan duct and a heat dissipation duct, wherein the air outlet direction of the fan duct is different from the air outlet direction of the heat dissipation duct. A semiconductor cooling chip is fixed to the housing and has a first end located in the fan duct and a second end located in the heat dissipation duct; A fan, fixed to the housing, is used to blow air to the user through the fan duct and to blow air into the heat dissipation duct so that the second end can quickly exchange heat with the airflow. Its features are: The semiconductor cooling chip has at least two chips distributed around the fan duct.

2. The cooling fan according to claim 1, characterized in that: The housing has a first wall for forming the fan duct, the fan duct being formed on the radially inner side of the first wall, at least a portion of the heat dissipation duct being formed on the radially outer side of the first wall, and the semiconductor cooling chip being fixed to the first wall.

3. The cooling fan according to claim 2, characterized in that: The fan duct extends along a first direction, and the heat dissipation duct has an air inlet section and a curved section connected in sequence. The air inlet section and the curved section are both formed on the radial outer side of the first wall. The air inlet section extends along the first direction, and the curved section causes the air outlet direction of the heat dissipation duct to deviate from the air outlet direction of the fan duct.

4. The cooling fan according to claim 3, characterized in that: The housing also has a second wall and a third wall, wherein the first wall, the second wall and the third wall are all cylindrical, and the axis of the cylinder is along the first direction; Both the first wall and the second wall are located in the cavity of the third wall. A portion of the first wall is located in the cavity of the second wall at the positive end along the first direction. The positive end of the first wall along the first direction is closedly connected to the positive end of the third wall along the first direction. The heat dissipation duct also has an air outlet section. The air inlet section, the curved section and the air outlet section are connected in sequence. The air inlet section is formed between the second wall and the first wall. The air outlet section is formed between the second wall and the third wall. The curved section is connected to the positive end of the air inlet section and the air outlet section along the first direction.

5. The cooling fan according to claim 4, characterized in that: The second wall is installed inside the cylindrical cavity of the third wall; The housing further includes a protective cover, which is installed on the negative end of the second wall and the third wall along the first direction. The protective cover has a connecting inner ring and a connecting outer ring protruding in the first direction. The connecting outer ring is fixedly connected to the third wall, and the connecting inner ring is fixedly connected to the second wall. The protective cover includes an air inlet, which covers the negative end of the cylindrical cavity of the second wall along the first direction, and the air inlet has an air inlet hole communicating with the cylindrical cavity of the second wall. The protective cover is used to fix the second wall body inside the cavity of the third wall body.

6. The cooling fan according to claim 5, characterized in that: The protective cover also includes an air outlet, which covers the negative end of the air outlet section along the first direction. The air outlet has an air outlet hole, which communicates with the air outlet section. The air inlet is recessed in the positive direction of the first direction or protrudes in the negative direction of the first direction compared to the air outlet.

7. The cooling fan according to claim 5, characterized in that: The outer connecting ring is connected to the third wall body by a snap fastener, and the inner connecting ring is connected to the second wall body by a snap fastener.

8. The cooling fan according to claim 5, characterized in that: The second wall includes a first half-wall and a second half-wall that are fixedly connected to each other. The distribution direction of the first half-wall and the second half-wall is perpendicular to the first direction. The fan is installed in the cylindrical cavity formed by the first half-wall and the second half-wall.

9. The cooling fan according to any one of claims 1 to 8, characterized in that: The cooling fan also includes a first heat-conducting component, which is disposed in the fan duct and is thermally connected to the first end. And / or, the cooling fan further includes a second heat-conducting element, which is disposed in the heat dissipation duct and is thermally connected to the second end.

10. The cooling fan according to claim 9, characterized in that: When the cooling fan includes a first heat-conducting element, the first heat-conducting element has a first substrate and a first heat exchange extension, the first substrate is thermally connected to the first end, and the first heat exchange extension extends from the first substrate to the fan duct. When the cooling fan includes a second heat-conducting element, the second heat-conducting element includes a second substrate and a second heat exchange extension, the second substrate is thermally connected to the second end, and the second heat exchange extension extends from the second substrate to the heat dissipation duct.

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