Cooling device and oxygen generator

Abstract

The application provides a cooling device and an oxygen generator, wherein the cooling device comprises a cylinder, a containing space is formed in the cylinder, a first gas outlet is arranged on the cylinder and communicates with the containing space, a pipeline is arranged in the cylinder in a curved shape, the pipeline comprises a gas inlet and a second gas outlet, the second gas outlet communicates with the containing space, the gas inlet communicates with the outside through the cylinder, the second gas outlet is arranged at a distance from the inner bottom wall of the cylinder, and the second gas outlet and the first gas outlet are located at two ends of the cylinder along the axial direction of the cylinder. In this way, the heat conduction area of the high-temperature gas is increased, so that the liquid water formed in the cylinder can be re-evaporated, the deposition of the liquid water in the cylinder is effectively reduced, and the gas discharged by the cooling device can be effectively cooled.

Description

Technical Field

[0001] This application relates to the technical field of vehicle-mounted oxygen generation, and in particular to a cooling device and an oxygen generator. Background Technology

[0002] The common working principle of a PSA (Pressure Swing Adsorption) oxygen concentrator is as follows: ambient air is compressed by a compressor and then, either directly or through a simple gas storage tank buffer, enters a molecular sieve tower controlled by valves. The molecular sieve adsorbs nitrogen under high pressure, thereby separating oxygen. Currently, the high-temperature, high-pressure, water-containing, oil-containing, and pulsating airflow output from the oxygen concentrator compressor is handled by a piping system consisting of multiple independent components connected in series. However, this piping system with multiple independent components leads to a complex system structure, reduces space utilization, and requires periodic manual drainage via a drain valve. This can result in the possibility of unremoved liquid water being carried into the molecular sieve by the airflow, potentially damaging it. Utility Model Content

[0003] This application provides a cooling device to solve the problem that the oxygen production process in the prior art cannot automatically remove water.

[0004] To solve the above-mentioned technical problems, this application provides a cooling device, including: a cylinder with a accommodating space formed inside the cylinder and a first air outlet communicating with the accommodating space; a pipe with a curved shape disposed inside the cylinder, the pipe including an air inlet and a second air outlet, the second air outlet communicating with the accommodating space, and the air inlet communicating with the outside through the cylinder; the second air outlet being spaced apart from the inner bottom wall of the cylinder, and the second air outlet and the first air outlet being located at opposite ends of the cylinder along the axial direction of the cylinder.

[0005] The outer wall of the pipe is spaced apart from the inner wall of the cylinder.

[0006] The air inlet and the first air outlet are equipped with filter components.

[0007] The pipes are arranged in a spiral shape.

[0008] The pipeline consists of multiple arc-shaped segments that are interconnected, or multiple straight segments that are connected together.

[0009] The pipes are made of copper or alloy.

[0010] The cross-sectional shape of the cylinder along the vertical direction of the cylinder axis is circular, rectangular, or elliptical.

[0011] The cylinder has an opening that communicates with the accommodating space. The opening is spaced apart from the first air outlet. The outer wall of the pipe is connected to the edge of the opening and communicates with the outside through the opening.

[0012] The pipes and the cylinder are integrally molded structures.

[0013] To address the aforementioned problems, a second aspect of this application provides an oxygen generator, including a cooling device according to any of the above-mentioned methods.

[0014] The beneficial effects of this application are as follows: Unlike existing technologies, this application uses a curved pipe inside the cylinder. The inlet of the pipe connects to the outside through the cylinder, and the second outlet of the pipe connects to the accommodating space of the cylinder. Along the axial direction of the cylinder, the second outlet and the first outlet are located at opposite ends of the cylinder. This effectively improves the flow path of the high-temperature gas within the pipe, increases the heat transfer area of ​​the high-temperature gas, thereby enabling the re-evaporation of liquid water formed inside the cylinder, effectively reducing the deposition of liquid water inside the cylinder, and effectively cooling the gas emitted from the cooling device. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of an embodiment of the cooling device of this application;

[0016] Figure 2 This is a structural block diagram showing the connection between the cooling device, compressor, and molecular sieve in this application. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0018] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0019] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0020] Please see Figure 1 , Figure 1 This is a schematic diagram of an embodiment of the cooling device provided in this application.

[0021] This application provides a cooling device. For example... Figure 1 and Figure 2 As shown, the cooling device of this embodiment includes a cylinder 10 and a pipe 20. A receiving space 11 is formed inside the cylinder 10, and a first air outlet 12 communicating with the receiving space 11 is provided. The pipe 20 is arranged in a curved shape inside the cylinder 10. The pipe 20 includes an air inlet 21 and a second air outlet 22. The second air outlet 22 communicates with the receiving space 11, and the air inlet 21 communicates with the outside through the cylinder 10. The second air outlet 22 is spaced apart from the inner bottom wall of the cylinder 10. Along the axial direction of the cylinder 10, the second air outlet 22 and the first air outlet 12 are located at opposite ends of the cylinder 10.

[0022] In an optional embodiment, the cylinder 10 may specifically be a cylindrical tube, and the cylinder 10 is a sealed cylindrical structure. That is, by setting the cylinder 10 as a sealed structure, when the pipe 20 is placed inside the cylinder 10, a accommodating space 11 for accommodating gas and water vapor can be formed between the cylinder 10 and the pipe 20. Specifically, the cylinder 10 is set as a sealed structure, thereby forming an accommodating space 11 inside the cylinder 10, and the pipe 20 is placed inside the accommodating space 11. Obviously, by integrating the pipe 20 inside the cylinder 10, this application can effectively reduce the volume occupied by the cylinder 10 and the pipe 20, thereby improving the layout capability of the cooling device 40 within the product when it is placed inside the product. The pipe 20 is curved and installed inside the cylinder 10. The pipe 20 includes an inlet 21 and a second outlet 22. High-temperature compressed air can enter the pipe 20 through the inlet 21 and be transmitted to the accommodating space 11 of the cylinder 10 through the second outlet 22 of the curved pipe 20. A first outlet 12 communicating with the accommodating space 11 is provided on the top of the cylinder 10. Therefore, after the high-temperature gas is transmitted to the accommodating space 11 of the cylinder 10 through the second outlet 22 of the pipe 20, it can be discharged through the first outlet 12 of the cylinder 10.

[0023] It should be noted that, in combination Figure 2 As shown, the cooling device 40 connects the compressor 30 and the molecular sieve 50. Specifically, the cooling device 40 pre-treats the high-temperature compressed gas generated by the compressor 30, and then transmits the pre-treated gas to the molecular sieve 50, whereby oxygen production is achieved. The compressor 30 compresses ambient air to generate high-temperature compressed gas, which is then pre-treated by the cooling device 40 before being transmitted to the molecular sieve 50 for oxygen production.

[0024] Furthermore, the adsorption capacity of molecular sieve 50 is closely related to temperature. Specifically, it can be expressed as a negative correlation between the adsorption capacity of molecular sieve 50 and temperature; that is, as the temperature of molecular sieve 50 increases, its adsorption capacity gradually decreases. In other words, the higher the temperature, the lower the adsorption capacity of molecular sieve 50 for nitrogen during oxygen production, resulting in a decrease in oxygen production efficiency and the concentration of oxygen produced. Therefore, after ambient air is compressed by compressor 30, the temperature of the resulting compressed gas is relatively high. If this gas is directly transferred to molecular sieve 50, the excessively high gas temperature will cause the temperature of molecular sieve 50 to rise. Under the conditions of high-temperature gas and high-temperature molecular sieve 50, the adsorption efficiency of molecular sieve 50 will be significantly reduced, leading to a decrease in the concentration of oxygen produced. In existing technology, after the compressor 30 generates high-temperature compressed gas, it is first passed into a gas storage tank for buffering before being transported to the molecular sieve 50. However, during the buffering process in the gas storage tank, water vapor in the high-temperature gas will form liquid water and deposit inside the gas storage tank. Subsequently, when the gas is transported to the molecular sieve 50 through the gas storage tank, some of the liquid water will be transported into the molecular sieve 50. However, when the liquid water enters the molecular sieve 50 with the airflow, it will cause the molecular sieve 50 to be damaged and fail.

[0025] Based on this, a pipe 20 is integrated inside the cylinder 10 in this application. The air inlet 21 of the pipe 20 can be connected to the outside. Specifically, the air inlet 21 of the pipe 20 can be connected to the compressor 30, so that after the compressor 30 generates high-temperature compressed gas, it can be transmitted to the pipe 20 through the air inlet 21, and then transmitted to the housing space 11 of the cylinder 10 through the second air outlet 22 of the pipe 20, and then discharged through the first air outlet 12 connected to the housing space 11. The first air outlet 12 can be used to connect to the molecular sieve 50, that is, after the compressor 30 generates high-temperature compressed gas, it can be transmitted to the molecular sieve 50 through a cooling device. The pipe 20 is set in a curved shape, which can effectively increase the heat dissipation area of ​​the high-temperature gas. That is, the high-temperature gas generated by the compressor 30 can be pretreated by the cooling device 40, and then the pretreated gas is transmitted to the molecular sieve 50, thereby effectively reducing the load on the molecular sieve 50 during operation.

[0026] In an optional embodiment, the pipe 20 is arranged in a curved shape inside the cylinder 10. Therefore, when the high-temperature gas generated by the compression molding machine is transmitted into the pipe 20 through the air inlet 21, the flow path of the airflow within the pipe 20 can be relatively increased. That is, the pipe 20 is integrated inside the cylinder 10, which relatively increases the flow path of the gas within the pipe 20 in a limited space, resulting in a higher integration of the cooling device 40. When the airflow enters the cylinder 10 through the pipe 20, some condensate, i.e., liquid water, is generated when the high-temperature airflow comes into contact with the low-temperature cylinder 10. In this application, an additional flow path for the airflow within the pipe 20 is added. When the airflow flows within the pipe 20, the heat from the high-temperature gas can be rapidly conducted to the cylinder 10 via the side wall of the pipe 20. This can evaporate the small amount of water droplets that initially condensed on the side wall of the pipe 20 or the inner wall of the cylinder 10 due to cooling. In other words, the water droplets that condensed after the initial high-temperature gas cooled down can be re-evaporated into water vapor by the heat transferred to the side wall of the pipe 20 by the subsequent high-temperature gas. This avoids water droplets from depositing inside the cylinder 10 and also prevents some of the condensed liquid water from being carried by the gas to the molecular sieve 50 through the first outlet 12.

[0027] In this embodiment, the second outlet 22 is spaced apart from the inner bottom wall of the cylinder 10. That is, the second outlet 22 of the pipe 20 communicates with the accommodating space 11 and is a certain distance from the bottom wall of the cylinder 10, facilitating the flow of gas from the pipe 20 into the accommodating space 11. Along the axial direction of the cylinder 10, the second outlet 22 and the first outlet 12 are located at opposite ends of the cylinder 10. For example, if the cylinder 10 is vertically positioned, the second outlet 22 of the pipe 20 is located at the bottom of the cylinder 10, and the first outlet 12 is located at the top of the cylinder 10. That is, the second outlet 22 of the pipe 20 and the first outlet 12 of the cylinder 10 are relatively far apart. Therefore, when gas enters the accommodating space 11 through the second outlet 22 of the pipe 20, it can then circulate throughout the entire accommodating space 11 and be transported to the molecular sieve 50 via the first outlet 12. By setting a curved pipe 20 inside the cylinder 10, the heat from the introduced high-temperature gas can be used to re-evaporate the condensate, thereby effectively preventing the condensate from depositing inside the cylinder 10. This eliminates the need for other structures to remove the liquid water inside the cylinder 10, such as drain valves, effectively reducing the structural complexity of the cooling device 40.

[0028] In an optional embodiment, when a curved pipe 20 is provided inside the cylinder 10, the gas introduced into the accommodating space 11 can be effectively pre-cooled, thereby relatively reducing the temperature of the gas introduced into the molecular sieve 50. Effective cooling before the gas enters the molecular sieve 50 reduces the load on the molecular sieve 50 during oxygen production, thus effectively improving the service life of the molecular sieve 50. Clearly, by providing a curved pipe 20 inside the cylinder 10, the contact area between the side wall of the pipe 20 and the gas in the accommodating space 11, as well as the flow path of the high-temperature gas within the pipe 20, can be effectively increased. This allows heat to be efficiently transferred to the side wall of the pipe 20, thereby completing the re-evaporation of condensate and the pre-cooling of the high-temperature gas, effectively reducing the temperature of the gas entering the molecular sieve 50 and eliminating the influence of liquid water on the molecular sieve 50.

[0029] In the above embodiment, a curved pipe 20 is provided inside the cylinder 10. The air inlet 21 of the pipe 20 is connected to the outside via the cylinder 10, and the second air outlet 22 of the pipe 20 is connected to the accommodating space 11 of the cylinder 10. Along the axial direction of the cylinder 10, the second air outlet 22 and the first air outlet 12 are located at opposite ends of the cylinder 10. This effectively improves the flow path of the high-temperature gas within the pipe 20, increases the heat conduction area of ​​the high-temperature gas, thereby allowing the liquid water formed inside the cylinder 10 to re-evaporate, effectively reducing the deposition of liquid water inside the cylinder 10, and effectively cooling the gas emitted from the cooling device 40.

[0030] In an optional embodiment, the pipe 20 can be specifically configured as a copper pipe, wherein the cooling device 40 connects the compressor 30 and the molecular sieve 50. Specifically, the air inlet 21 of the pipe 20 is connected to the compressor 30, and the first air outlet 12 of the cylinder 10 is connected to the molecular sieve 50. Thus, when the molecular sieve 50 and the compressor 30 are connected through the cooling device 40, the copper pipe 20 has high thermal conductivity. Therefore, after the high-temperature compressed gas generated by the compressor 30, the heat of the high-temperature gas can be dissipated through the copper pipe 20. Furthermore, the high thermal conductivity of the copper pipe 20 means that when the high-temperature gas is initially transferred to the cylinder 10 through the pipe 20, the temperature of the pipe 20 will rise due to the heat transfer of the high-temperature gas. That is, the heat of the high-temperature gas is transferred to the pipe 20, thereby causing the high-temperature gas to cool down rapidly and condense into liquid water. Then, as high-temperature gas is continuously introduced, the heat of the high-temperature gas is rapidly transferred through pipe 20, thereby re-evaporating the condensed liquid water. This allows the water vapor and gas to be transferred through the first outlet 12 into the molecular sieve 50, completing the pretreatment of the high-temperature gas. Furthermore, the heat of the high-temperature gas can be dissipated through pipe 20, achieving the corresponding cooling process. When the high-temperature gas passes through the containment space 11 formed by the cylinder 10, the heat of the high-temperature gas can also be transferred out through the side wall of the cylinder 10. In other embodiments, pipe 20 can also be made of other metal pipes with high thermal conductivity, such as alloy pipes, etc. The specific design can be determined according to actual needs, and this application does not impose specific limitations here.

[0031] In one optional embodiment, the length of the pipe 20 can be more than twice the minimum distance between the air inlet 21 and the second air outlet 22. That is, by increasing the length of the pipe 20, the contact area between the pipe 20 and the gas can be effectively increased. This allows the high-temperature compressed gas generated when the compressor 30 compresses ambient air to produce high-temperature compressed gas to be transferred into the pipe 20. Due to the relatively increased contact area between the pipe 20 and the gas, the heat from the high-temperature gas can be quickly conducted to the side wall of the pipe 20 to complete the re-evaporation of liquid water and dissipate heat through the pipe 20, effectively pre-cooling the introduced gas and thus reducing the temperature of the high-temperature gas in the cooling device 40. In other embodiments, the length of the pipe 20 can be three times the minimum distance between the air inlet 21 and the second air outlet 22. The specific length can be set according to requirements, and this application does not impose a specific limitation here.

[0032] In an optional embodiment, the outer wall of the pipe 20 is spaced apart from the inner wall of the cylinder 10. Since the cylinder 10 is a sealed structure, forming a accommodating space 11, the pipe 20 is disposed within this accommodating space 11. This means a cavity is formed between the pipe 20 and the inner wall of the sealed cylinder 10, which can form a Helmholtz resonator with the pipe 20. It should be noted that when ambient air is compressed by the compressor 30 to produce high-temperature compressed gas, low-frequency noise is generated. Therefore, when the compressor 30 generates an airflow with low-frequency noise and transmits it into the pipe 20, this application can eliminate the noise through the Helmholtz resonator formed by the pipe 20 and the cylinder 10. Specifically, when the compressed gas is transmitted into the pipe 20, the pulsation of the airflow excites the Helmholtz resonator to resonate, allowing sound energy to be consumed and absorbed during the resonance process, thereby effectively suppressing low-frequency noise.

[0033] In an optional embodiment, the pipe 20 is arranged in a spiral shape. This effectively reduces the space occupied by the pipe 20 while increasing its length, thus improving the layout capability of the pipe 20 within the cylinder 10. Furthermore, the spiral shape of the pipe 20 increases the flow path of the gas within the pipe 20 and the contact area of ​​the airflow. This allows the heat to be rapidly transferred to the sidewalls of the pipe 20 as the high-temperature gas flows through it, thereby completing the re-evaporation of liquid water and pre-cooling the high-temperature gas. When the high-temperature compressed gas generated by the compressor 30 is transferred to the molecular sieve 50 via the cooling device 40, on the one hand, liquid water is prevented from entering the molecular sieve 50 under the influence of the airflow; on the other hand, the high-temperature gas is pre-cooled, thereby reducing the temperature of the gas entering the molecular sieve 50 and effectively improving the oxygen production efficiency of the molecular sieve 50.

[0034] In one optional embodiment, the pipe 20 includes multiple arc-shaped segments (not shown), which are interconnected. Setting the pipe 20 as a series of interconnected arc-shaped segments, for example, in a "serpentine" shape, increases the length of the pipe 20, thereby increasing the contact area between the cooling device 40 and the high-temperature compressed gas. This efficiently cools the high-temperature gas, improving the oxygen production efficiency of the molecular sieve 50. The pipe 20 may consist of multiple arc-shaped segments, which can be formed by connecting multiple straight segments (not shown). In other embodiments, the pipe 20 may also be configured in other shapes, depending on the specific requirements. The key is to ensure that the increased contact area between the cooling device 40 and the high-temperature compressed gas, and that the gas temperature after cooling via the pipe 20, is sufficient to guarantee efficient oxygen production by the molecular sieve 50, is not specifically limited in this application.

[0035] In one optional embodiment, the pipe 20 and the cylinder 10 are integrally molded, that is, the pipe 20 and the cylinder 10 are manufactured using an integral molding process, such as injection molding. In other embodiments, the cooling device 40 can also be configured according to the installation scenario, that is, the pipe 20 and the cylinder 10 can be detached to cope with complex installation environments. This application does not make specific limitations here.

[0036] In one optional embodiment, the cross-sectional shape of the cylinder 10 perpendicular to its axis is circular, rectangular, or elliptical. That is, the shape of the cylinder 10 can specifically be cylindrical, cuboid, etc., so that when the cooling device 40 is installed inside the product, it can be configured according to the internal structure of the product to improve the layout capability of the cooling device 40. In other embodiments, the cylinder 10 may also have other shapes, which can be configured according to requirements, and this application does not specifically limit them.

[0037] In an optional embodiment, filter components (not shown) are provided at the air inlet 21 and the first air outlet 12. Specifically, filter components are installed at the air inlet 21 of the pipe 20 and the first air outlet 12 of the cylinder 10. When the compressor 30 compresses ambient air to generate high-temperature compressed gas, which is then transmitted to the pipe 20 through the air inlet 21, the filter components within the pipe 20 can perform oil-gas separation, i.e., preliminary gas treatment, and can also eliminate high-frequency noise from the high-temperature compressed gas. A filter component is also installed at the first air outlet 12 to further filter the gas within the containment space 11. For example, if some liquid water is carried by the gas flow through the first air outlet 12 to the molecular sieve 50, it can be further filtered by the filter device. Therefore, by installing filter components at the air inlet 21 and the first air outlet 12, further gas filtration and noise elimination can be achieved.

[0038] In an optional embodiment, such as Figure 1As shown, the cylinder 10 has an opening 13 that communicates with the accommodating space 11. The opening 13 is spaced apart from the first air outlet 12. The outer wall of the pipe 20 is connected to the edge of the opening 13 and communicates with the outside through the opening 13. The cylinder 10 has an opening 13, which is spaced apart from the first air outlet 12. Specifically, taking the cylinder 10 as a vertical structure as an example, the opening 13 is located at the top of the cylinder 10. The corresponding opening 12 is located at the top of the cylinder 10, that is, the opening 13 and the first air outlet 12 are located at the top of the cylinder 10, and the first air outlet 12 and the opening 13 are spaced apart. The pipe 20 can be installed inside the cylinder 10 through the opening 13. Furthermore, the outer wall of the pipe 20 can be connected to the side wall of the cylinder 10 at the opening 13. When the pipe 20 is connected to the cylinder 10, the accommodating space 11 of the cylinder 10 becomes a closed space, thereby forming a Helmholtz resonator between the pipe 20 and the inner wall of the cylinder 10, thus reducing noise.

[0039] In a specific application scenario, the cooling device 40 is positioned between the molecular sieve 50 and the compressor 30. Specifically, the cooling device 40 connects the compressor 30 and the molecular sieve 50; its inlet 21 is connected to the compressor 30, and its first outlet 12 is connected to the molecular sieve 50. After the compressor 30 compresses ambient air and generates high-temperature gas, it can be transferred through the inlet 21 into the pipe 20. The heat from the high-temperature gas is transferred to the sidewalls of the pipe 20, allowing the liquid water inside the cylinder 10 to re-evaporate, preventing liquid water deposition inside the cylinder 10. The heat from the high-temperature gas can also be dissipated through the pipe 20, thus pre-cooling the gas. After entering the pipe 20, the high-temperature gas can be introduced to the bottom of the cylinder 10 through the second outlet 22, and then transferred to the molecular sieve 50 via the accommodating space 11 and the first outlet 12. During gas transmission, noise can be reduced by the Helmholtz resonator formed by the pipe 20 and the cylinder 10, thereby reducing the noise generated during gas pretreatment. Furthermore, when high-temperature gas is transmitted into the pipe 20 through the inlet 21, and when the accommodating space 11 is transmitted to the molecular sieve 50 through the first outlet 12, the gas can be further filtered by the filter components installed in the inlet 21 and the first outlet 12.

[0040] During the pretreatment of high-temperature gas by the cooling device 40, some liquid water will be deposited at the bottom of the cylinder 10. However, when the high-temperature gas is transmitted into the cylinder 10 for a long time, the liquid water can be continuously re-evaporated into water vapor, so that the amount of liquid water accumulated in the cylinder 10 reaches a certain balance and there will be no excessive liquid water deposition. That is, there is no need to remove the liquid water in the cylinder 10, and there is no need to install a valve in the cylinder 10 to remove the liquid water, which effectively reduces the failure rate of the cooling device 40.

[0041] Unlike the prior art, the second aspect of this application also discloses an oxygen generator, which includes a cooling device 40, which is the cooling device 40 of any of the above embodiments.

[0042] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A cooling device, characterized in that, The cooling device includes: The cylinder has a accommodating space inside and a first air outlet communicating with the accommodating space. The pipe is curved and disposed inside the cylinder. The pipe includes an air inlet and a second air outlet. The second air outlet is connected to the accommodating space, and the air inlet is connected to the outside through the cylinder. The second air outlet is spaced apart from the inner bottom wall of the cylinder, and along the axial direction of the cylinder, the second air outlet and the first air outlet are located at opposite ends of the cylinder.

2. The cooling device according to claim 1, characterized in that, The outer wall of the pipe is spaced apart from the inner wall of the cylinder.

3. The cooling device according to claim 1, characterized in that, Filter components are provided at the air inlet and the first air outlet.

4. The cooling device according to claim 1, characterized in that, The pipe is arranged in a spiral shape.

5. The cooling device according to claim 1, characterized in that, The pipeline includes multiple arc-shaped segments, which are connected to each other, or are formed by multiple straight segments.

6. The cooling device according to claim 1, characterized in that, The pipe is a copper pipe or an alloy pipe.

7. The cooling device according to claim 1, characterized in that, The cross-sectional shape of the cylinder along the direction perpendicular to the cylinder axis is circular, rectangular, or elliptical.

8. The cooling device according to claim 1, characterized in that, An opening communicating with the accommodating space is formed on the cylinder body. The opening is spaced apart from the first air outlet. The outer wall of the pipe is connected to the edge of the opening and communicates with the outside through the opening.

9. The cooling device according to claim 1, characterized in that, The pipe and the cylinder are integrally formed.

10. An oxygen generator, characterized in that, The oxygen generator includes a cooling device, wherein the cooling device is the cooling device according to any one of claims 1-9.

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