Sample, device, and system for temperature proficiency verification

Abstract

The utility model discloses a kind of sample, device and system for temperature capacity verification, the sample includes: pedestal, is equipped with recess;Heating component, is set in recess;Heat conduction plate, is set to the side of the bottom surface of heating component away from recess;First heat insulation component, is set to the other side of the bottom surface of heating component towards recess and / or the side of recess;Second heat insulation component, is set to the outside of first heat insulation component.By sequentially setting the composite heat insulation structure of first heat insulation component, second heat insulation component outside heating component, can greatly reduce lateral heat loss, improve the accuracy of temperature capacity verification result.

Description

Technical Field

[0001] This utility model relates to the field of novel tobacco products, and in particular to a sample, device, and system for verifying temperature capability. Background Technology

[0002] Proficiency testing is an important means of laboratory quality control, and proficiency testing samples are an indispensable tool for proficiency testing. Traditional proficiency testing sample testing methods measure whether the sample temperature reaches the preset temperature under steady state (e.g., maintaining a preset temperature for a period of time), which cannot truly reproduce the thermal conduction characteristics of the atomization area of ​​the aerosol generating device (such as the interfacial thermal resistance between the ceramic heating element and the metal heat-conducting plate, and the dynamic temperature rise curve).

[0003] Therefore, there is an urgent need for a standardized temperature capability verification sample, such as one that can simulate the thermodynamic characteristics of the atomization region of an aerosol generator to provide a more reliable sample for capability verification in the laboratory. Utility Model Content

[0004] In a first aspect, this application provides a sample for temperature capability verification, comprising:

[0005] The base has a groove.

[0006] The heating element is disposed within the groove;

[0007] A heat-conducting plate is located on the side of the bottom surface of the heating element away from the groove;

[0008] The first heat-insulating component is disposed on the other side of the bottom surface of the heating component facing the groove and / or on the side surface of the groove;

[0009] The second insulation component is disposed outside the first insulation component.

[0010] In some embodiments, the device further includes a third heat insulation component disposed outside the second heat insulation component, wherein the thermal conductivity of the third heat insulation component is less than that of the first heat insulation component and the second heat insulation component.

[0011] In some embodiments, a thermal grease is provided between the heat-conducting plate and the heat-generating component, and the thermal conductivity of the thermal grease is greater than or equal to 12 W / (m·K).

[0012] In some embodiments, the silicone grease is formed by a vacuum coating process such that the thermal resistance of the contact interface is greater than zero and less than or equal to 0.08 °C·cm² / W.

[0013] In some embodiments, the thickness of the silicone grease ranges from 0.08 to 1.02 mm; and / or, the thickness of the first thermal insulation component ranges from 0.95 to 1.05 mm; and / or, the thickness of the second thermal insulation component ranges from 1.95 to 2.05 mm; and / or, the thermal conductivity of the first thermal insulation component ranges from greater than zero to less than or equal to 0.5 W / (m·K); and / or, the thermal conductivity of the second thermal insulation component ranges from greater than zero to less than or equal to 0.02 W / (m·K); and / or, the thermal conductivity of the third thermal insulation component ranges from greater than zero to less than or equal to 0.002 W / (m·K).

[0014] In some embodiments, the heating element includes a ceramic heating element; and / or, the first insulation element includes a mica plate; and / or, the second insulation element includes a nano-aerogel felt; the third insulation element includes a vacuum insulation plate; and / or, the base is made of polytetrafluoroethylene.

[0015] Secondly, this application provides an apparatus for temperature capability verification, comprising: a power control unit and a sample as described in any of the above embodiments, wherein the power control unit and the sample are separately configured.

[0016] In some embodiments, the power control unit includes a rectifier module and a voltage regulator module, wherein the rectifier module is used to convert mains power into a stable DC power supply, and the voltage regulator module is used to adjust the voltage of the DC power supply from the rectifier module and output it.

[0017] In some embodiments, the voltage regulating module includes a first voltage regulating module and a second voltage regulating module, wherein the first voltage regulating module and the second voltage regulating module are switched by a mode switching unit so that only one of the first voltage regulating module and the second voltage regulating module is in a working state, wherein the voltages output by the first voltage regulating module and the second voltage regulating module are different.

[0018] Thirdly, this application provides a system for temperature capability verification, including multiple devices for temperature capability verification as described in the above embodiments, wherein the voltage output by the first voltage regulating module or the second voltage regulating module in each device for temperature capability verification is different. Attached Figure Description

[0019] Figure 1 A schematic diagram of an apparatus for temperature capability verification according to some embodiments of this application is shown. Figure 1 ;

[0020] Figure 2 A schematic diagram of an apparatus for temperature capability verification according to some embodiments of this application is shown. Figure 2 ;

[0021] Figure 3A schematic diagram of a sample for temperature capability verification according to some embodiments of this application is shown;

[0022] Figure 4 A top view of a sample for temperature capability verification provided according to some embodiments of this application is shown;

[0023] Figure 5 A flowchart illustrating an operation method of an apparatus for temperature capability verification according to some embodiments of this application;

[0024] Figure 6 A circuit diagram of an apparatus for temperature capability verification according to some embodiments of this application is shown. Detailed Implementation

[0025] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Although the description of this utility model will be presented in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to this embodiment. On the contrary, the purpose of describing the utility model in conjunction with the embodiments is to cover other options or modifications that may be derived based on the claims of this utility model. To provide a deep understanding of this utility model, many specific details will be included in the following description. This utility model may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this utility model, some specific details will be omitted in the description. It should be noted that, without conflict, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0026] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0027] The terms “first”, “second”, etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0028] In the description of this embodiment, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0030] Firstly, reference Figure 1 This application provides a device 100 for temperature capability verification. This device 100 can be used to evaluate the temperature detection capabilities of various laboratories. For example, by comparing the laboratory's measured temperature results with standard results, the factors affecting the detection results can be analyzed, thereby objectively evaluating the laboratory's detection capability for testing the temperature of the atomization zone of an aerosol generating device. Combined with... Figure 1 As shown, the device 100 includes a power control unit 10 and a sample 20 for temperature capability verification, with the power control unit 10 and sample 20 being separately configured. Exemplarily, the power control unit 10 receives mains power and provides the required voltage (e.g., 2~22V) to the sample 20. More specifically, the power control unit 10 has an input terminal 12, a power switch 11, and an output terminal 13. The input terminal 12 receives mains power via a power cord 14, the power switch 11 controls the power control unit 10 to turn on and off, and the output terminal 13 is electrically connected to the sample 20 via a second wire 17. Because the power control unit 10 and the sample 20 are two independent components, electromagnetic interference and temperature effects from the power control unit 10 can be reduced, improving the temperature control accuracy of the sample 20 and enhancing the convenience of the test.

[0031] In some embodiments, reference Figure 2 The power control unit 10 includes a rectifier module 18 and a voltage regulator module 19. The rectifier module 18 converts mains power (e.g., 220V AC) into a stable DC power supply (24V DC). Exemplarily, it can be based on an AC-DC conversion topology with a wide input voltage range (90~264V AC). More specifically, it can be based on a full-bridge topology and utilize pulse width modulation (PWM) technology to achieve a stable DC voltage (e.g., 24V DC) output. The voltage regulator module 19 adjusts the DC power supply from the rectifier module 18 and outputs it. Exemplarily, it can be based on a DC-DC regulated topology to output the desired voltage (e.g., 2~22V). More specifically, it can be based on a synchronous buck topology, using a dual closed-loop control mode of outer-loop DC output voltage and inner-loop inductor current, and PWM control to achieve high-precision output voltage regulation, thereby regulating the output power.

[0032] In some embodiments, the voltage regulating module 19 includes a first voltage regulating module (voltage regulating module A) and a second voltage regulating module (voltage regulating module B). The first voltage regulating module and the second voltage regulating module are switched via a mode switching unit 16, so that only one of the first voltage regulating module and the second voltage regulating module is in an operating state. The first voltage regulating module and the second voltage regulating module output different voltages. Exemplarily, the mode switching unit 16 employs a single-pole double-throw switch or a bistable relay design to construct a hardware interlock circuit, ensuring complete physical isolation between the two voltage regulating modules 19.

[0033] It should be noted that the rectifier module 18 and the voltage regulator module 19 can work independently or in concert. The concert mechanism is that the two modules achieve concert through hardware signals, which can include at least one of the following concert actions: (1) Voltage margin management, that is, the voltage regulator module 19 sends a voltage demand signal to the rectifier module 18 through the communication interface, and the rectifier module 18 dynamically adjusts the output voltage to keep the voltage difference with the input of the voltage regulator module 19 within a certain margin range; (2) Fault interlocking protection, that is, when any module (e.g., the voltage regulator module 19) detects overvoltage / overcurrent, it immediately triggers the other module (e.g., the rectifier module 18) to enter the protection state through the communication interface; (3) Efficiency optimization mode, that is, under light load (e.g., less than 30% of the rated load), the voltage regulator module 19 and the rectifier module 18 can adjust the switching frequency to reduce switching losses (e.g., reduce to 10kHz), and under heavy load (e.g., greater than 80% of the rated load), the two modules synchronize the switching frequency (e.g., 20kHz), and the subsequent stage uses a phase-locked loop to synchronize with the preceding stage to eliminate beat frequency interference.

[0034] In some other embodiments, the rectifier module 18 can simultaneously perform rectification and voltage regulation functions, using closed-loop voltage regulation control logic, in which case there is no need to set up a DC-DC voltage regulation topology in the subsequent stage.

[0035] In some embodiments, to further ensure the reliability and stability of the power control unit 10, an independent or combined heat dissipation solution using an intelligent temperature-controlled fan or heat sink fins can be adopted in the design. For example, the heat sink fins are made of aluminum with a high thermal conductivity and are formed by precision stamping process to increase the heat dissipation surface area; the intelligent temperature-controlled fan can dynamically adjust its speed according to the real-time temperature of the power control unit 10, for example, starting when the temperature reaches 55°C, to ensure that the operating temperature of the core components is always maintained within a safe range, avoiding performance degradation or failure risks caused by overheating.

[0036] In some embodiments, reference Figure 1 The device 100 also includes a temperature testing device 30. For example, refer to... Figure 2The temperature testing device 30 may include a thermocouple 40 and a data acquisition unit 31 (e.g., a data acquisition instrument). The thermocouple 40 is fixed to the sample 20, and the data acquisition unit 31 acquires the signal from the thermocouple 40 to obtain the temperature data of the sample 20 within a preset time. The preset time can range from 10 to 120 seconds, preferably 30 to 40 seconds. In other words, this application evaluates temperature capability by measuring the temperature data or temperature change value (temperature rise value) of the sample 20 within a preset time. Compared with traditional measurements of the sample 20's temperature under steady state, its temperature evaluation results are closer to the actual situation, reducing distortion. In some embodiments, the temperature testing device 30 may further include a terminal device 32. The temperature data or temperature change value (temperature rise value) acquired by the data acquisition unit 31 within the preset time is transmitted to the terminal device 32 (e.g., a computer) and saved for subsequent evaluation of the temperature capability of each laboratory.

[0037] The following section will detail sample 20 used for temperature capability verification.

[0038] Secondly, refer to Figure 3 and combined Figure 4 As shown, this application provides a sample 20 for temperature capability verification, including: a base 29, a heating element 23, a heat-conducting plate 21, a first heat-insulating component 24, and a second heat-insulating component 25. The base 29 has a groove 291, and the heating element 23 is disposed within the groove 291. Exemplarily, the base 29 can be made of polytetrafluoroethylene (PTFE), thus possessing good corrosion resistance and chemical stability, preventing material adhesion to the base 29, facilitating cleaning, and exhibiting good temperature resistance and insulation. In some embodiments, the base 29 further includes an aviation socket 28, and the heating element 23 is electrically connected to the aviation socket 28 via a first wire 27. The aviation socket 28 is connected via, for example,... Figure 2 The second wire 17 shown is electrically connected to the power control unit 10. Electrical connection and mechanical separation are achieved through the PTFE vinyl socket 29 and the aviation socket 28, reducing electromagnetic interference and heat conduction losses.

[0039] A heat-conducting plate 21 is disposed on the side of the heating element 23 away from the bottom surface of the groove 291. A first heat-insulating component 24 is disposed on the other side of the heating element 23 facing the bottom surface of the groove 291 and / or on the side surface of the groove 291. Optionally, the thermal conductivity of the first heat-insulating component 24 is greater than zero and less than or equal to 0.5 W / (m·K). In this embodiment, the first heat-insulating component 24 is provided on all four sides and the bottom surface of the groove 291, that is, the heating element 23 is surrounded except for the top surface, thereby forming a better primary thermal barrier. A second heat-insulating component 25 is disposed outside the first heat-insulating component 24. Optionally, the thermal conductivity of the second heat-insulating component 25 is greater than zero and less than or equal to 0.02 W / (m·K). Since the thermal conductivity of the second heat-insulating component 25 is much smaller than that of the first heat-insulating component 24, the heat insulation effect is further enhanced.

[0040] The sample 20 provided in this application, by sequentially setting a first heat insulation component 24 and a second heat insulation component 25 outside the heating component 23, can significantly reduce lateral heat loss and improve the accuracy of temperature capability verification results.

[0041] In some embodiments, the first thermal insulation component 24 includes a mica plate with a thickness ranging from 0.95 to 1.05 mm, capable of constructing a primary thermal barrier with a lateral thermal resistance greater than or equal to 10 °C / W. The second thermal insulation component 25 includes a nano-aerogel felt with a thickness ranging from 1.95 to 2.05 mm, such that the heat flux density attenuation rate is greater than or equal to 85%.

[0042] In some embodiments, sample 20 further includes a third insulating component 26 disposed outside the second insulating component 25, wherein the thermal conductivity of the third insulating component 26 is less than that of the first and second insulating components, respectively. Optionally, the thermal conductivity of the third insulating component 26 is greater than zero and less than or equal to 0.002 W / (m·K). Exemplarily, the third insulating component 26 includes a vacuum insulation panel, thereby constructing a closed insulating cavity such that the lateral heat loss rate is less than or equal to 3%.

[0043] In some embodiments, the heating element 23 includes a ceramic heating element, which, compared to the conventional test sample 20 using ordinary heating wire, is better able to meet the stability and uniformity requirements during the temperature rise process, thereby improving the accuracy of the temperature capability verification results.

[0044] In some embodiments, a silicone grease 22 is provided between the heat-conducting plate 21 and the heating element 23. The thermal conductivity of the silicone grease 22 is greater than or equal to 12 W / (m·K). Exemplarily, the silicone grease 22 is formed by a vacuum coating process, eliminating microscopic air gaps, thereby achieving efficient heat conduction and reducing the risk of unevenness caused by contact gaps. For example, in an environment where the coefficient of thermal expansion (CTE) is 6.5 × 10⁻⁶... -6 The ceramic heating element has a temperature of / ℃ and a coefficient of thermal expansion of 23.6×10. -6 A silicone grease 22 (e.g., boron nitride modified silicone grease 22) is precisely applied between the 6061 aluminum heat-conducting plates 21 at / ℃. The thermal conductivity of the silicone grease 22 is greater than or equal to 12 W / (m·K), the viscosity is 4800~5200 mPa·s, and the coating thickness is controlled within 0.98~1.02 mm. This ensures that the thermal resistance of the contact interface is greater than zero and less than or equal to 0.08 ℃·cm² / W.

[0045] Thirdly, this application provides a system for temperature capability verification, including multiple devices 100 for temperature capability verification according to any of the above embodiments, wherein the first voltage regulating module or the second voltage regulating module in each device 100 outputs a different voltage. For example, the system for temperature capability verification includes devices 100_1, 100_2, and 100_3, wherein the first voltage regulating module (voltage regulating module A) in devices 100_1, 100_2, and 100_3 outputs different voltages, or the second voltage regulating module (voltage regulating module B) in devices 100_1, 100_2, and 100_3 outputs different voltages.

[0046] For example, in use, three sets of devices 100_1, 100_2, and 100_3 for temperature capability verification can be assigned to laboratory 1, laboratory 2, and laboratory 3, respectively. In laboratory 1, the output voltage of voltage regulating module A is, for example, 10V, and the output voltage of voltage regulating module B is, for example, 22V; in laboratory 2, the output voltage of voltage regulating module A is, for example, 12V, and the output voltage of voltage regulating module B is, for example, 22V; and in laboratory 3, the output voltage of voltage regulating module A is, for example, 11V, and the output voltage of voltage regulating module B is, for example, 22V. The operators in laboratories 1, 2, and 3 are unaware beforehand of the output voltages of their respective voltage regulating modules A and B, nor do they know which voltage's data from sample 20 will ultimately be used to assess the laboratory's temperature capability. Therefore, the mode switching unit 16 enables the independent activation of the two voltage regulation modules 19 (only voltage regulation module A or only voltage regulation module B works), and by randomly assigning different laboratory test voltage modes through the proficiency verification program, data collusion can be effectively avoided, providing a fair and reliable testing environment for temperature proficiency verification.

[0047] Fourthly, refer to Figure 5 This application provides a method of operating an apparatus 100 for temperature capability verification, comprising:

[0048] Step S1: Determine the preset temperature rise mark point 211 of the heat conduction plate 21;

[0049] In step S2, the power control unit 10 is connected to the heating element 23 of the sample 20 via a wire;

[0050] Step S3: Fix the thermocouple 40 to the preset temperature rise mark point 211 of the heat-conducting plate 21;

[0051] Step S4: Turn on the power and, with the first voltage regulating module and the second voltage regulating module in working condition respectively, record the temperature data of the heating component 23 within a preset time period.

[0052] In some embodiments, in step S1, the preset temperature rise marker 211 can be determined in the central region based on the thermodynamic symmetry characteristics of the aluminum heat-conducting plate 21, i.e., the temperature measurement point of the unified thermocouple 40, thereby reducing laboratory positioning deviation. Specifically, a thermal simulation model is established based on the finite element simulation platform, and the temperature field distribution characteristics of the aluminum heat-conducting plate 21 are analyzed using the SST k-ω turbulence model. The results show that under the condition of a preset duration of 31 s, the effective area of ​​the surface of the heat-conducting plate 21 (i.e., the temperature measurement area with a small temperature difference) is a region with a diameter of 50 mm centered on the center point. Within this region, the temperature uniformity deviation is less than or equal to 1.2 ℃ (confidence level 95%), and the radial temperature gradient is less than or equal to 3.5 ℃ / mm, which meets the temperature control accuracy.

[0053] In addition, a work instruction manual can be provided to clarify the search logic of the temperature measurement area, the fixing specifications of thermocouple 40, and the data interception time window, thereby reducing the data dispersion caused by human operation.

[0054] Before conducting temperature capability verification tests, the reliability of sample 20 must be ensured. Specifically, an inner independent packaging, a sandwich foam filling cushioning, and an outer double hard shell packaging scheme are used to ensure the integrity of sample 20 during sample issuance, transportation, and return. The heating element 23 undergoes 72 hours of high and low temperature cycling (e.g., -30 ℃ to 65 ℃), vibration, and drop tests to ensure that the environmental stability of sample 20 meets the requirements of the capability verification provider for sample 20.

[0055] refer to Figure 6 and combined Figure 2 The specific steps for proficiency testing are as follows:

[0056] (1) Distribute 20 proficiency testing samples of the same model to different laboratories. To prevent cheating methods such as data collusion between laboratories, the test voltage mode (output voltage of voltage regulating module A and voltage regulating module B) adopted by different laboratories is specified in advance, and the target temperature (temperature answer value) is unknown to each laboratory in advance.

[0057] (2) After obtaining 20 proficiency testing samples, each laboratory shall follow the procedures outlined above. Figure 2 Connect all devices except thermocouple 40, including connecting power control unit 10 to heating element 23 of sample 20 via wires;

[0058] (3) Use high-temperature resistant glue to fix the thermocouple 40 collecting end to the preset temperature rise mark point 211. Use as little glue as possible, but ensure that the thermocouple 40 collecting end is tightly attached to the aluminum heat-conducting plate 21.

[0059] (4) Turn on the power switch 11, set the mode switching unit 16 (mode switching switch) as specified (i.e., determine whether the voltage regulating module A or voltage regulating module B is working), and turn on the test switch 15. After turning on, the power control unit 10 can stably convert 220V AC mains power into 24V DC through the rectifier module 18, and then output 2~22V DC through the voltage regulating module, matching the power of the heating element 23 (ceramic heating element), thereby obtaining a stable heating temperature. At the same time, the data acquisition instrument 31 is turned on to record data and start timing for 31 seconds, save the data to the terminal device 32 (e.g., computer), turn off all switches, and complete the test.

[0060] By using this proficiency testing sample 20, the laboratory can examine the following three main aspects of the temperature test of the atomization zone of the aerosol generating device 100, thereby helping the laboratory to find the problems affecting the accuracy of the data and then make optimizations and improvements.

[0061] 1. Effectiveness of experimental environment control: The test should be conducted in a place without forced convection air and with an ambient temperature of (20±5) ℃. If the laboratory environment does not meet this condition, it may have a significant impact on the surface temperature of the aluminum heat-conducting plate 21, thereby affecting the accuracy of proficiency testing.

[0062] 2. The rationality of the testing operation, including:

[0063] a) Whether a suitable high-temperature resistant adhesive is used to ensure that the thermocouple 40 acquisition end does not fall off during the test;

[0064] b) When the thermocouple 40 is arranged, is it attached to the aluminum heat-conducting plate 21, and is the amount of glue appropriate? Too little glue may not be firm, and too much glue may affect heat conduction.

[0065] c) Whether it has the ability to coordinate control of the data acquisition instrument 31 and the heating element;

[0066] d) Whether it can accurately and dynamically capture temperature data, for example, at 31 seconds;

[0067] 3. The accuracy of the experimental equipment, including:

[0068] a) The accuracy of the temperature sensor used, namely thermocouple 40.

[0069] b) The accuracy of the data acquisition instrument 31 mainly depends on whether parameters such as the sampling frequency and the type of thermocouple 40 are set correctly.

[0070] Although the present invention has been illustrated and described with reference to certain preferred embodiments, those skilled in the art should understand that the above description is a further detailed explanation of the present invention in conjunction with specific embodiments, and should not be construed as limiting the specific implementation of the present invention to these descriptions. Those skilled in the art can make various changes in form and detail, including some simple deductions or substitutions, without departing from the spirit and scope of the present invention.

Claims

1. A sample for temperature capability verification, characterized in that, include: The base has a groove. A heating element is disposed within the groove; A heat-conducting plate is disposed on the side of the heating element away from the bottom surface of the groove; A first heat-insulating component is disposed on the other side of the bottom surface of the heating component facing the groove and / or on the side surface of the groove; The second heat insulation component is disposed outside the first heat insulation component.

2. The sample for temperature capability verification as described in claim 1, characterized in that, Also includes: A third heat insulation component is disposed outside the second heat insulation component, and the thermal conductivity of the third heat insulation component is less than that of the first heat insulation component and the second heat insulation component.

3. The sample for temperature capability verification as described in claim 1, characterized in that, Silicone grease is provided between the heat-conducting plate and the heating element, and the thermal conductivity of the silicone grease is greater than or equal to 12 W / (m·K).

4. The sample for temperature capability verification as described in claim 3, characterized in that, The silicone grease is formed by a vacuum coating process, resulting in a thermal resistance at the contact interface that is greater than zero and less than or equal to 0.08 °C·cm² / W.

5. The sample for temperature capability verification as described in claim 3, characterized in that, The thickness of the silicone grease ranges from 0.08 to 1.02 mm; and / or, the thickness of the first thermal insulation component ranges from 0.95 to 1.05 mm; and / or, the thickness of the second thermal insulation component ranges from 1.95 to 2.05 mm; and / or, the thermal conductivity of the first thermal insulation component is greater than zero and less than or equal to 0.5 W / (m·K); and / or, the thermal conductivity of the second thermal insulation component is greater than zero and less than or equal to 0.02 W / (m·K); and / or, the thermal conductivity of the third thermal insulation component is greater than zero and less than or equal to 0.002 W / (m·K).

6. The sample for temperature capability verification as described in claim 1, characterized in that, The heating element includes a ceramic heating element; and / or, the first insulation element includes a mica board; and / or, the second insulation element includes a nano-aerogel felt; the third insulation element includes a vacuum insulation board; and / or, the base is made of polytetrafluoroethylene.

7. An apparatus for verifying temperature capability, characterized in that, include: The power control unit and the sample as described in any one of claims 1 to 6, wherein the power control unit is separately configured from the sample.

8. The apparatus for temperature capability verification as described in claim 7, characterized in that, The power control unit includes a rectifier module and a voltage regulator module. The rectifier module is used to convert AC mains power into a stable DC power supply, and the voltage regulator module is used to adjust the voltage of the DC power supply from the rectifier module and output it.

9. The apparatus for temperature capability verification as described in claim 8, characterized in that, The voltage regulating module includes a first voltage regulating module and a second voltage regulating module. The first voltage regulating module and the second voltage regulating module are switched by a mode switching unit so that only one of the first voltage regulating module and the second voltage regulating module is in a working state. The voltages output by the first voltage regulating module and the second voltage regulating module are different.

10. A system for verifying temperature capability, characterized in that, It includes multiple devices for temperature capability verification as described in claim 9, wherein the voltage output by the first voltage regulating module or the second voltage regulating module in each of the devices for temperature capability verification is different.

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