A probe card and a chip testing system

Abstract

The embodiment of the utility model provides a kind of probe card and chip testing system, it is related to semiconductor testing technical field.It includes circuit substrate, probe group and displacement compensation component.Displacement compensation component includes detection unit, compensation device and transfer unit.One end of transfer unit is connected with the probe in probe group, and the end of transfer unit away from probe group is connected with detection unit, compensation device;Compensation device is connected with transfer unit, detection unit is used to detect the pressure signal of probe group and feedback to compensation device, and compensation device carries out displacement compensation to probe group according to pressure signal through transfer unit.The utility model can judge the needle pressure situation of each needle pressure group by displacement compensation component, and correspondingly increase or reduce the displacement of probe, so that probe can contact chip pad with appropriate pressure, reduce yield loss, avoid subsequent packaging problem of poor.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and more specifically, to a probe card and chip testing system. Background Technology

[0002] Chip Probe Test (CP) is a wafer-level electrical performance test performed in the semiconductor manufacturing process before the wafer is cut into individual chips. It is a critical testing step before mass production. Its core purpose is to connect an automated testing system by having a probe card contact the chip pads on the wafer. This system tests key parameters of each chip, such as function, voltage, current, frequency, and power consumption, to screen out qualified chips and prevent defective products from being further packaged, thereby reducing production costs and improving overall yield.

[0003] Probe cards serve as the information connection medium between test equipment and chips. By contacting the pads on the chip on the wafer with probes, they connect the automated test equipment to the chip, enabling electrical signal transmission. This is used to detect the function and performance of unpackaged chips, ensuring chip yield.

[0004] In mass production CP testing, poor contact between the probe and the chip pad often leads to yield loss. To improve this problem, the industry usually increases the OD (Overdrive) under normal OD to make the probe and chip pad make fuller contact. However, increasing the OD will cause excessive probe pressure and damage the pad, resulting in subsequent packaging defects. Utility Model Content

[0005] The purpose of this invention is to provide a probe card and chip testing system to improve the technical problem in the prior art where increasing the OD (exposure) pressure causes excessive probe pressure, which damages the chip pads and leads to subsequent poor packaging.

[0006] The embodiments of this utility model can be implemented as follows: In a first aspect, this utility model provides a probe card for electrically connecting to the pads of a test chip, comprising: Circuit board; At least one probe group, the probe group being connected to the circuit board via a probe carrier, the probe group comprising the same number of probes as the number of pads on the test chip; A displacement compensation component, which is fixed on the circuit board, includes a detection unit, a compensation device, and a transmission unit. One end of the transmission unit is connected to the probe in the probe group, and the other end of the transmission unit away from the probe group is connected to the detection unit and the compensation device. The compensation device is electrically connected to the detection unit. The detection unit is used to detect the pressure signal of the probe group and feed it back to the compensation device. The compensation device performs displacement compensation on the probe group according to the pressure signal through the transmission unit.

[0007] In an optional embodiment, the compensation device includes a data processing unit, a compensation drive connected to the data processing unit, and a compensation transmission component connected to the compensation drive. The end of the compensation transmission component that is away from the compensation drive component is connected to the transmission unit.

[0008] In an optional implementation, the compensation drive is a piezoelectric ceramic actuator.

[0009] In an optional embodiment, the compensation transmission component includes a first transmission component and a second transmission component connected to each other; The first transmission component is connected to the compensation drive component, and the second transmission component is connected to the transmission unit through the detection unit.

[0010] In an optional embodiment, the first and second transmission components are lever-type flexible hinges.

[0011] In an optional embodiment, the transmission unit includes an elastic element and insulating bases disposed at both ends of the elastic element; The insulating base disposed at the first end of the elastic element is connected to all the probes of the probe group; the insulating base disposed at the second end of the elastic element is connected to the detection unit and the compensation device.

[0012] In an optional implementation, the detection unit is a pressure sensor.

[0013] In an optional embodiment, the displacement compensation component further includes a fixing unit; the displacement compensation component is fixed on the circuit board by the fixing unit, the compensation device is disposed in the fixing unit and connected to the transmission unit, and the detection unit is disposed at the bottom of the fixing unit and connected to the transmission unit.

[0014] In an optional implementation, the number of probe groups is 5-10.

[0015] Secondly, this utility model provides a chip testing system, including the probe card described in any of the foregoing embodiments.

[0016] The beneficial effects of the probe card and chip testing system provided in this embodiment of the present invention include: This invention provides a probe card, including a circuit board, a probe group connected to the circuit board, and a displacement compensation component for monitoring the pressure and compensating the displacement of the probe group. In this invention, the displacement compensation component can determine the pressure of each probe tip and accordingly increase or decrease the probe displacement, thereby enabling the probe to contact the chip pads with appropriate pressure, reducing yield loss and avoiding subsequent packaging defects. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the probe card provided in this embodiment; Figure 2 This is a schematic diagram of the compensation device in the probe card provided in this embodiment; Figure 3 This is a flowchart illustrating the needle pressure calibration and needle pressure compensation in the probe card provided in this embodiment.

[0019] Icon: 100 - Circuit board; 200 - Probe carrier; 300-probe set; 400-Displacement compensation component; 410-Detection unit; 420-Compensation device; 421-Data processing unit; 422-Compensation drive component; 423-Compensation transmission component; 4231-First transmission component; 4232-Second transmission component; 430-Transmission unit; 431-Elastic component; 432-Insulating base; 440-Fixing unit. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0024] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0025] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0026] The following describes in detail the overall structure, working principle, and technical effects of the probe card and chip testing system provided by this utility model through embodiments and in conjunction with the accompanying drawings.

[0027] This invention provides a probe card and a chip testing system with the probe card, which is mainly used in the above-mentioned chip probe testing and is used to make electrical connections with the pads of the test chip to connect the automatic testing equipment and the chip to realize electrical signal transmission.

[0028] Please see Figure 1In one aspect, this utility model provides a probe card for electrical connection with the pads of a test chip, comprising a circuit board 100, at least one probe group, and a displacement compensation component; the probe group 300 is connected to the circuit board 100 via a probe carrier 200, and the probe group 300 includes probes in the same number as the pads of the test chip; the displacement compensation component 400 is fixed on the circuit board 100, and the displacement compensation component 400 includes a detection unit 410, a compensation device 420, and a transfer unit 430; one end of the transfer unit 430 is connected to the probes in the probe group 300 to transfer... The end of unit 430 furthest from probe group 300 is connected to detection unit 410 and compensation device 420. Compensation device 420 is electrically connected to detection unit 410, meaning detection unit 410 is connected to probes in probe group 300 via transmission unit 430. Compensation device 420, connected to the end of transmission unit 430 furthest from probe group 300, is also connected to transmission unit 430. Detection unit 410 detects the pressure signal of probe group and feeds it back to compensation device 420. Compensation device 420 performs displacement compensation on probe group 300 based on the pressure signal via transmission unit 430. Through detection unit 410 in displacement compensation component 400, the probe pressure of each probe group can be determined, and the displacement of probes can be increased or decreased accordingly through compensation device 420, thereby enabling probes to contact chip pads with appropriate pressure, reducing yield loss and avoiding subsequent packaging defects.

[0029] In this embodiment, the circuit board 100 is a PCB board, the probe carrier 200 is disposed on the circuit board 100, and the probe group 300 is connected to the side of the probe carrier 200 away from the circuit board 100.

[0030] The probe group 300 includes the same number of probes as the test chip pads. Multiple probes required for testing one chip form the probe group 300. The probe group 300 is connected to the circuit board 100 via the probe carrier 200.

[0031] Preferably, the number of probe groups 300 can be 5-10. The number of probe groups depends on the number of chips being tested in a single test and is not limited here. For example, the number of probe groups 300 is 6. Each probe group 300 can be connected to the circuit board 100 through its corresponding probe carrier 200, and all probe groups 300 can also be connected to the circuit board 100 through the same probe carrier 200. Whether multiple probe groups are individually connected to the circuit board 100 through probe carriers 200 depends on the size of the circuit board 100 and the available space for the probe cards in the chip testing system, and can be set according to the actual situation, and is not limited here.

[0032] In this embodiment, the displacement compensation component 400 and the probe group 300 have a one-to-one correspondence; in other embodiments, the displacement compensation component 400 may correspond to multiple probe groups 300, that is, one displacement compensation component 400 may be used to provide pressure monitoring and displacement compensation to multiple probe groups 300.

[0033] Specifically, the displacement compensation component 400 is fixed on the circuit board 100 and close to the probe group 300 so that the displacement compensation component 400 can be connected to the probes in the probe group 300. The displacement compensation component 400 includes a transmission unit 430 connected to the probes in the probe group 300, a detection unit 410 connected to the end of the transmission unit 430 away from the probe group, and a compensation device 420. The detection unit 410 is electrically connected to the compensation device 420. The detection unit 410 is connected to the probes in the probe group 300 through the transmission unit 430 and is used to detect the pressure signal of the probe group 300 and feed it back to the compensation device 420. The compensation device 420 performs displacement compensation on the probe group 300 according to the pressure signal through the transmission unit 430.

[0034] It should be noted that, since the detection unit 410 performs pressure testing on the probes of the probe group 300 through the transmission unit 430, and the compensation device 420 performs displacement compensation through the transmission unit 430, in order for the detection unit 410 to accurately obtain the probe pressure and for the compensation device 420 to accurately perform displacement compensation, the transmission unit 430 should be connected to the position near the end of the probe.

[0035] In one specific embodiment, the transmission unit 430 includes an elastic element 431; for example, the elastic element 431 may be a metal spring.

[0036] To prevent damage to the probe assembly 300, detection unit 410, and compensation device 420 during pressure transmission, preferably, insulating bases 432 are provided at both ends of the transmission unit 430. The insulating base 432 at the first end of the elastic element 431 is connected to all probes of the probe assembly 300; the insulating base 432 at the second end of the elastic element 431 (i.e., the end furthest from the probe assembly 300) is connected to the detection unit 410 and compensation device 420, with the detection unit 410 and compensation device 420 electrically connected. The insulating base can be made of polyimide or a composite material of polyimide and carbon fiber, ensuring its hardness, rigidity, insulation, and light weight, thus not affecting the pressure detection and displacement compensation of the probe assembly 300 by the displacement compensation component 400.

[0037] In one specific embodiment, the detection unit 410 is a pressure sensor. Preferably, the detection unit 410 can be a thin-film pressure sensor to reduce the volume and weight of the displacement compensation component 400 on the probe card, thereby reducing the risk of the test being affected by the weight of the probe card itself.

[0038] In a specific implementation, please refer to Figure 2 The aforementioned compensation device 420 includes a data processing unit 421, a compensation drive 422 connected to the data processing unit 421, and a compensation transmission 423 connected to the compensation drive 422.

[0039] The end of the compensation transmission component 423 that is away from the compensation drive component 422 is connected to the transmission unit 430 so as to amplify the force from the compensation drive component 422 and transmit it to the transmission unit 430, and then the transmission unit 430 transmits it to the probe group 300.

[0040] In practical operation, the data processing unit 421 is electrically connected to the detection unit 410 and the compensation drive 422 respectively. The data processing unit 421 judges the pressure signal received from the detection unit 410 and outputs a processing execution signal to the compensation drive 422. After receiving the electrical processing execution signal from the data processing unit 421, the compensation drive 422 generates displacement to drive the compensation transmission 423 to generate a corresponding displacement, which is then transmitted to the probe group 300 through the transmission unit 430, thereby realizing the displacement compensation of the probe group 300 to the transmission unit 430.

[0041] Specifically, the detection unit 410 detects the needle pressure of the probe group 300 and transmits the signal to the data processing unit 421 of the compensation device 420. The data processing unit 421 determines whether the needle pressure of the probe group 300 is normal. When the needle pressure of the probe group 300 is too high, the data processing unit 421 of the compensation device 420 outputs a processing execution signal to the compensation drive 422. The compensation drive 422 drives and generates displacement, which is transmitted to the compensation transmission 423. The compensation transmission 423 transmits the displacement to the transmission unit 43. 0 causes the probe tip of probe group 300 to move away from the test chip pad to reduce the probe tip pressure; conversely, when the probe tip pressure of probe group 300 is too low, data processing unit 421 outputs a processing execution signal to compensation drive 422, compensation drive 422 drives and generates displacement to compensation transmission 423, compensation transmission 423 transmits the displacement to the transmission unit 430 to move probe group 300 closer to the test chip pad to increase the probe tip pressure of probe group 300.

[0042] In one specific embodiment, the compensation drive 422 is a piezoelectric ceramic actuator. Specifically, the data processing unit 421 judges the pressure signal received from the detection unit 410, and outputs a processing execution electrical signal (for example, an alternating voltage) based on the judgment result, and outputs the electrical signal to the piezoelectric ceramic actuator. Due to the piezoelectric effect, the piezoelectric ceramic actuator undergoes mechanical deformation to form a nanometer-level displacement change, and transmits this displacement to the drive compensation transmission unit 423. The drive compensation transmission unit 423 transmits this displacement to the probe group 300 through the transmission unit, thereby realizing the displacement change of the probes in the probe group 300.

[0043] Preferably, the piezoelectric ceramic actuator can be a lead zirconate titanate piezoelectric ceramic actuator, which can still maintain 85% displacement after one hour of power failure. Even if the power is off, the compensation device 420 can compensate the displacement of the probe group 300 according to the pressure of the detection unit 410, thereby ensuring the normal needle pressure during the test process.

[0044] In one specific embodiment, the compensation transmission member 423 is a lever flexible hinge, including a first transmission member 4231 and a second transmission member 4232 connected to each other; wherein the first transmission member 4231 is connected to the compensation drive member 422, and the second transmission member 4232 can be connected to the transmission unit 430 (i.e. the end of the transmission unit 430 away from the probe group 300) through the detection unit 410.

[0045] Specifically, the aforementioned lever flexible hinge is used to transmit the displacement from the compensation drive member 422 on the one hand; on the other hand, the displacement generated by the compensation drive member 422 can be amplified through the first transmission member 4231 and the second transmission member 4232, and the amplified displacement is transmitted to the transmission unit 430, thereby causing the probe group 300 to achieve displacement through the transmission unit 430.

[0046] For example, after receiving the displacement input from the compensation drive 422, the above-mentioned lever flexible hinge can amplify the displacement by 10 times, thereby achieving a displacement output of 0μm-6μm with a resolution of 0.01μm, which in turn can finely control the displacement of the probe group 300.

[0047] Please continue reading. Figure 1 In one specific embodiment, the displacement compensation component 400 further includes a fixing unit 440.

[0048] Specifically, the displacement compensation component 400 is fixed on the circuit board 100 by the fixing unit 440, the compensation device 420 is disposed in the fixing unit 440 and connected to the transmission unit 430, and the detection unit 410 is disposed at the bottom of the fixing unit 440 and connected to the transmission unit 430.

[0049] Specifically, the compensation device 420 is disposed within the fixed unit 440, connected to the end of the transmission unit 430 away from the probe group 300, and electrically connected to the detection unit 410; the detection unit 410 is disposed at the bottom of the fixed unit 440, connected to the end of the transmission unit 430 away from the probe group 300, and electrically connected to the compensation device 420.

[0050] Please see Figure 3 The probe card provided in this embodiment implements needle pressure detection and needle pressure compensation using the following specific method: S1. Perform needle pressure calibration. First, insert the probe card onto the pad of the test chip and put it into normal testing state. At this time, the detection unit 410 transmits the detected pressure electrical signal to the data processing unit 421 of the compensation device 420. The data processing unit 421 records the piezoelectric signal value A0 received by each group of probes and makes A0 the needle pressure calibration value. It should be noted that, under ideal conditions (i.e., when the needle pressure is normal and the test can be performed normally), the pressure electrical signal values ​​of the probes in each probe group 300 detected by the detection unit 410 are similar.

[0051] S2. Perform probe pressure compensation. During the testing process of the test chip by the probe card, all chips are tested in sequence. Each time the probe card pierces the pad of the test chip, the data processing unit 421 will receive the pressure electrical signal A of each probe group. x Compare with the needle pressure calibration value A0: If A x If the value is less than 90% A0, displacement compensation will be applied to the corresponding probe group 300 through the compensation device 420. At this time, the compensation device 420 will move the probe group 300 towards the test chip pad through the transfer unit 430 to increase the probe tip pressure of the probe group 300 until A... x Stop after A=0; if A x If the pressure is greater than 110%A0, the compensation device 420 reduces the needle pressure of the corresponding probe group 300. At this time, the compensation device 420 uses the transfer unit 430 to move the probe group 300 away from the test chip pads to reduce the needle pressure of the probe group 300 until A... x Stop after =A0; If A x If the pressure is between 90%A0 and 110%A0, it means that the needle pressure of each probe group 300 meets the requirements, and subsequent chip probe testing can begin.

[0052] S3. After all probe groups have 300 probes with normal pressure, begin chip testing.

[0053] In this embodiment, the probe card can determine the needle pressure of each probe group 300 through the displacement compensation component, and increase or decrease the probe displacement accordingly, so that the probe can contact the chip pad with appropriate pressure, reduce yield loss, and avoid subsequent packaging defects.

[0054] In another aspect of this utility model, a chip testing system is provided, which includes the probe card described in any of the foregoing embodiments.

[0055] The probe card and chip testing system with the probe card provided by this utility model can, on the one hand, determine the needle pressure of the probe group 300 through the displacement compensation component 400, and increase or decrease the displacement of the probe toward the chip pad accordingly, so that the probe can contact the chip pad with appropriate pressure, avoiding the problem of inaccurate test results due to insufficient needle pressure, reducing the occurrence of pad damage due to excessive needle pressure, avoiding subsequent packaging defects, and improving chip yield.

[0056] On the other hand, since the probe can contact the chip pads with appropriate pressure, probe damage can be avoided, which helps to improve the probe's lifespan.

[0057] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A probe card, characterized in that, For electrical connection with the pads of the test chip, including: Circuit board; At least one probe group, the probe group being connected to the circuit board via a probe carrier, the probe group comprising the same number of probes as the number of pads on the test chip; A displacement compensation component, which is fixed on the circuit board, includes a detection unit, a compensation device, and a transmission unit. One end of the transmission unit is connected to the probe in the probe group, and the other end of the transmission unit away from the probe group is connected to the detection unit and the compensation device. The compensation device is electrically connected to the detection unit. The detection unit is used to detect the pressure signal of the probe group and feed it back to the compensation device. The compensation device performs displacement compensation on the probe group through the transmission unit according to the pressure signal.

2. The probe card according to claim 1, characterized in that, The compensation device includes a data processing unit, a compensation drive connected to the data processing unit, and a compensation transmission component connected to the compensation drive. The end of the compensation transmission component that is away from the compensation drive component is connected to the transmission unit.

3. The probe card according to claim 2, characterized in that, The compensation drive is a piezoelectric ceramic actuator.

4. The probe card according to claim 2, characterized in that, The compensation transmission component includes a first transmission component and a second transmission component connected to each other. The first transmission component is connected to the compensation drive component, and the second transmission component is connected to the transmission unit through the detection unit.

5. The probe card according to claim 4, characterized in that, The first and second transmission components are lever flexible hinges.

6. The probe card according to claim 1, characterized in that, The transmission unit includes an elastic element and insulating bases disposed at both ends of the elastic element; The insulating base disposed at the first end of the elastic element is connected to all the probes of the probe group; the insulating base disposed at the second end of the elastic element is connected to the detection unit and the compensation device.

7. The probe card according to claim 1, characterized in that, The detection unit is a pressure sensor.

8. The probe card according to claim 1, characterized in that, The displacement compensation component further includes a fixing unit; the displacement compensation component is fixed on the circuit board by the fixing unit, the compensation device is disposed in the fixing unit and connected to the transmission unit, and the detection unit is disposed at the bottom of the fixing unit and connected to the transmission unit.

9. The probe card according to claim 1, characterized in that, The number of probe groups is 5-10.

10. A chip testing system, characterized in that, Includes the probe card as described in any one of claims 1-9.

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