A clamped integrated circuit test tool

Abstract

The utility model relates to integrated circuit test technical field discloses a clamping type integrated circuit test frock. Including base, its top is equipped with fixed component, contains matrix type distribution's splayed elastic frame, the sliding rod of splayed elastic frame upper end sliding joint with pressure block, the arc surface contact integrated circuit body of pressure block, the rubber cover of outside, is connected with splayed elastic frame through spring. The negative pressure sucking disc fixed integrated circuit is equipped on the base, and the low -speed cylinder drives splayed elastic frame to move and clamps. The tee -screw pipe is installed between pressure blocks, and the positive and negative ion airflow generated by the nozzle injection electrostatic eliminator, neutralizes static electricity and reduces temperature. The carrier is connected with the base through the bolt, and the electric push rod is arranged on the carrier to drive the test module. The frock can flexibly clamp integrated circuits of different sizes, correct positioning, and simultaneously reduce temperature and remove static electricity during testing. The risk of static damage is reduced, a stable test environment is maintained, and the reliability and safety of integrated circuit testing are improved.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit testing technology, specifically a clamping integrated circuit testing fixture. Background Technology

[0002] Integrated circuit (IC) testing refers to the process of verifying whether the design, manufacturing, and packaging of a chip meet the expected performance, reliability, and quality standards through electrical, functional, or environmental testing methods. Its core objectives are to screen for defects, ensure yield, and verify functionality, making it an indispensable and crucial link in the semiconductor industry chain.

[0003] An existing patent (publication number: CN221378168U) discloses a clamping integrated circuit testing fixture, including a base, a first lead screw movably connected to the upper part of the inner cavity of the base, a handwheel connected to one end of the first lead screw, a movable block sleeved on the surface of the first lead screw, a test platform connected to the top of the movable block, a bracket connected to the top of the base, a first motor connected to the upper part of one side of the bracket, a second lead screw connected to the output end of the first motor, a moving block sleeved on the surface of the second lead screw, an electric telescopic rod connected to the bottom end of the moving block, and an integrated circuit testing module connected to the output end of the electric telescopic rod. This utility model, through the first lead screw, handwheel, movable block, first motor, second lead screw, moving block, electric telescopic rod, and integrated circuit testing module, can achieve the effect of position correction after the integrated circuit board is clamped and fixed, so that the test probe can be accurately aligned with the pin to be tested on the integrated circuit board.

[0004] The aforementioned fixture can achieve the effect of position correction after the integrated circuit board is clamped and fixed, so that the test probe can be accurately aligned with the pin to be tested on the integrated circuit board. However, during the test, the integrated circuit is relatively fragile. During the repeated correction of the position of the integrated circuit board, static electricity will be generated due to friction. The clamped integrated circuit is easily damaged by the oxide layer, PN junction or metal interconnection inside the IC, resulting in permanent device failure. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a clamping integrated circuit testing fixture, which is flexible and can clamp, calibrate, and position integrated circuit boards of different sizes. It also cools the integrated circuit boards during testing and removes static electricity from the surface of the integrated circuits, thus solving the problems mentioned in the background technology.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a clamping integrated circuit testing fixture, comprising a base, a fixing component disposed above the base, the fixing component comprising a plurality of matrix-distributed figure-eight shaped elastic frames, a set of sliding rods slidably inserted into the upper end of each elastic frame, a pressure block fixedly connected to the upper end of each sliding rod, an integrated circuit body disposed above the base, each pressure block having an arc-shaped side near the integrated circuit body, and a spring fixedly connected to the bottom end of each pressure block, the bottom end of the spring being fixedly connected to the elastic frame.

[0007] The above scheme uses multiple clamping blocks to hold the integrated circuit body while simultaneously applying downward pressure, thus locking the integrated circuit in place.

[0008] Furthermore, each of the pressure blocks has a rubber sleeve fitted on its outer surface, and each of the rubber sleeves is in contact with the integrated circuit body.

[0009] The above solution allows the rubber sleeve to compress the integrated circuit body when it comes into contact with the integrated circuit body. This deformation of the rubber sleeve causes the edge of the integrated circuit body to embed into the rubber sleeve, thus providing a more stable clamping effect on the integrated circuit body.

[0010] Furthermore, a negative pressure suction cup is rotatably connected to the upper surface of the substrate, and the integrated circuit body is located on the upper surface of the negative pressure suction cup.

[0011] The above solution uses a negative pressure suction cup to adhere to the integrated circuit body, keeping it stable and preventing it from falling during clamping.

[0012] Furthermore, a plurality of low-speed cylinders arranged in a matrix are fixedly connected to the upper surface of the substrate, and the output end of each low-speed cylinder is fixedly connected to its corresponding elastic frame.

[0013] The above scheme allows the low-speed cylinder to slowly push the elastic frame closer to the integrated circuit body, and clamps the integrated circuit body with the pressure block.

[0014] Furthermore, a three-way pipe is installed between every two adjacent pressure blocks, and each of the three-way pipes is fixedly connected to a nozzle at both ends near the integrated circuit body;

[0015] A carrier is provided below the base, and the base and the carrier are fixedly connected by bolts. An electrostatic eliminator is provided inside the carrier. Both output ends of the electrostatic eliminator are fixedly connected to a connecting pipe. Every two adjacent T-pipes are fixedly connected to their adjacent connecting pipes. Both connecting pipes pass through the base and the carrier. Each T-pipe passes through its adjacent elastic frame.

[0016] Through the above scheme, the static eliminator can generate an airflow that carries away positive and negative ions, allowing the airflow to be transmitted through the connecting pipe to the three-way pipe and sprayed onto the surface of the integrated circuit body through the nozzle. While neutralizing static electricity, it can also cool down the integrated circuit body.

[0017] Furthermore, a support frame is mounted on the upper surface of the carrier, and an electric push rod is fixedly connected to the upper surface of the support frame. An integrated circuit test module is fixedly connected to the output end of the electric push rod.

[0018] The above scheme enables the testing of integrated circuits on the negative pressure suction cup by setting up an electric push rod and an integrated circuit testing module. When the electric push rod lifts the integrated circuit testing module, it is easy for staff to pick up the tested integrated circuit.

[0019] Compared with the prior art, the technical solution of this utility model has the following beneficial effects:

[0020] This testing fixture, by setting multiple pressure blocks, can clamp the integrated circuit body while simultaneously applying downward pressure to the integrated circuit body, thus locking the integrated circuit. In conjunction with the deformation force of the elastic frame and the action of the rubber sleeve, it can flexibly clamp the integrated circuit body, avoiding damage to the integrated circuit body during clamping.

[0021] The combined clamping of multiple clamping blocks on the integrated circuit body allows the corners of the integrated circuit body to be located within the elastic frame, further protecting the integrated circuit. When the integrated circuit body is fixed, it can rotate on the negative pressure suction cup to adjust its angle, keeping the integrated circuit body in a square position, which facilitates the testing work.

[0022] By combining the three-way tube with the nozzle, an airflow carrying positive and negative ions can be sprayed onto the integrated circuit body after it is clamped. This not only neutralizes the static electricity on the surface of the integrated circuit through the positive and negative ions, but also cools the integrated circuit during testing, ensuring the stability of the testing process. The fixing component enables flexible fixation of the integrated circuit body and provides calibration and positioning. It also has the ability to remove static electricity from the surface of the integrated circuit body, reducing the potential harm of static electricity to the integrated circuit. During the testing phase, the fixing component can play a cooling role, maintaining the integrated circuit at a suitable operating temperature. Attached Figure Description

[0023] Figure 1 This is a cross-sectional view of the overall structure of this application;

[0024] Figure 2 This is a schematic diagram of the flexible frame structure of this application;

[0025] Figure 3 This is a schematic diagram of the overall structure of this application;

[0026] Figure 4 This is a schematic diagram of the fixed component structure of this application;

[0027] Figure 5 This is a schematic diagram of the tee pipe structure of this application.

[0028] In the picture:

[0029] 1. Matrix; 2. Fixing components;

[0030] 201. Flexible frame; 202. Slide bar; 203. Pressure block; 204. Integrated circuit body; 205. T-joint; 206. Nozzle;

[0031] 3. Rubber sleeve; 4. Spring; 5. Negative pressure suction cup; 6. Low-speed cylinder; 7. Carrier; 8. Static eliminator; 9. Connecting pipe; 10. Support frame; 11. Electric push rod; 12. Integrated circuit test module. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] Please see Figures 1-5 This embodiment of a clamping integrated circuit testing fixture includes a base 1, a fixing component 2 on top of the base 1, and a plurality of matrix-distributed figure-eight shaped elastic frames 201. Each elastic frame 201 has a set of sliding rods 202 slidably inserted on its upper surface. Each sliding rod 202 has a pressure block 203 fixedly connected to its upper end. An integrated circuit body 204 is disposed on top of the base 1. Each pressure block 203 has an arc-shaped side near the integrated circuit body 204. A three-way tube 205 is installed between every two adjacent pressure blocks 203. Each three-way tube 205 has a nozzle 206 fixedly connected to both ends near the integrated circuit body 204. By setting multiple pressure blocks 203, the integrated circuit body 204 can be clamped and a downward pressure can be applied to the integrated circuit body 204 at the same time, so that the integrated circuit can be locked.

[0034] Each pressure block 203 has a rubber sleeve 3 fitted onto its outer surface. Each rubber sleeve 3 contacts the integrated circuit body 204. The rubber sleeve 3 allows the integrated circuit body 204 to compress the rubber sleeve 3 upon contact, thereby causing the edge of the integrated circuit body 204 to embed into the rubber sleeve 3 through deformation, thus providing a more stable clamping of the integrated circuit body 204. Simultaneously, a spring 4 is fixedly connected to the bottom end of each pressure block 203. The bottom end of the spring 4 is fixedly connected to the elastic frame 201. The spring 4 can exert a traction force on the pressure block 203 through its deformation force, allowing the pressure block 203 to apply downward pressure to the integrated circuit body 204 and preventing instability of the integrated circuit body 204 during testing.

[0035] A negative pressure suction cup 5 is rotatably connected to the upper surface of the substrate 1. The integrated circuit body 204 is located on the upper surface of the negative pressure suction cup 5. The negative pressure suction cup 5 can adsorb the integrated circuit body 204, so that the integrated circuit body 204 can remain stable and avoid falling during the clamping process. Multiple low-speed cylinders 6 are fixedly connected to the upper surface of the substrate 1 in a matrix arrangement. The output end of each low-speed cylinder 6 is fixedly connected to its corresponding elastic frame 201. The low-speed cylinder 6 can slowly push the elastic frame 201 closer to the integrated circuit body 204 and clamp the integrated circuit body 204 through the pressure block 203.

[0036] A carrier 7 is disposed below the substrate 1, and the substrate 1 and the carrier 7 are fixedly connected by bolts. An electrostatic eliminator 8 is disposed inside the carrier 7. Both output ends of the electrostatic eliminator 8 are fixedly connected to connecting pipes 9. Each pair of adjacent three-way pipes 205 are connected to their corresponding connecting pipes 9. Both connecting pipes 9 penetrate the substrate 1 and the carrier 7. Each three-way pipe 205 penetrates its corresponding elastic frame 201. The electrostatic eliminator 8 can generate an airflow that carries away positive and negative ions, allowing the airflow to be transmitted through the connecting pipes 9 into the three-way pipes 205 and then sprayed onto the integrated circuit through nozzles 206. The surface of the body 204 can cool down the integrated circuit body 204 while neutralizing static electricity. A support frame 10 is installed on the upper surface of the carrier 7. An electric push rod 11 is fixedly connected to the upper surface of the support frame 10. An integrated circuit test module 12 is fixedly connected to the output end of the electric push rod 11. The electric push rod 11 and the integrated circuit test module 12 are set to perform testing on the integrated circuit body 204 on the negative pressure suction cup 5. When the electric push rod 11 drives the integrated circuit body 204 test module to lift up, it is convenient for the staff to pick up the tested integrated circuit body 204.

[0037] It should be noted that the static eliminator 8 is a device or system used to detect, neutralize or eliminate static charge on the surface of an object. Its core function is to balance the static charge through active or passive means, thereby avoiding the adverse effects of static accumulation. Its function is to generate positive and negative ions through high voltage electric fields, radioactive sources or ultraviolet rays, etc., to neutralize the opposite charge on the surface of the object.

[0038] Each elastic frame 201 is formed by elastic metal stamping.

[0039] The working principle of the above embodiment is as follows: When testing the integrated circuit body 204, the integrated circuit body 204 is placed on the negative pressure suction cup 5. The negative pressure suction cup 5 works to adsorb the integrated circuit body 204, so that the integrated circuit body 204 can be stably positioned on the negative pressure suction cup 5. Subsequently, multiple low-speed cylinders 6 push multiple elastic frames 201 closer to the integrated circuit body 204, so that the pressure block 203 presses against the integrated circuit body 204. The static eliminator 8 delivers airflow with positive and negative ions to the three-way pipe 205 through the connecting pipe 9, so that the airflow can be sprayed onto the surface of the integrated circuit body 204 through the nozzle 206. The positive and negative ions in the airflow neutralize the static electricity on the surface of the integrated circuit body 204, reducing the impact of static electricity on the integrated circuit body 204 during testing. During clamping, the rubber sleeve 3 contacts the integrated circuit body 204. Through the deformation of the rubber sleeve 3, the edge of the integrated circuit body 204 is embedded into the rubber sleeve 3, and because the pressure block 203 and the integrated circuit body 204 are clamped, the integrated circuit body 204 is clamped against the integrated circuit body 204. One side of the circuit contact is arc-shaped, thus it can press down on the integrated circuit body 204. By flexibly clamping the integrated circuit body 204 and applying downward pressure, the integrated circuit body 204 is stably positioned on the negative pressure suction cup 5. When the pressure block 203 contacts the integrated circuit body 204, the elastic frame 201 will deform, thereby flexibly clamping the integrated circuit body 204 and avoiding damage to the integrated circuit body 204 during clamping. At the same time, multiple pressure blocks 203 can correct the integrated circuit body 204 during the clamping process, so that the integrated circuit body 204 can maintain a regular state. The electric push rod 11 drives the integrated circuit test module 12 to move downward and contact the integrated circuit body 204 to perform testing on the integrated circuit body 204. The nozzle 206 sprays airflow onto the surface of the integrated circuit body 204 to cool the integrated circuit body 204 and maintain the integrated circuit at a suitable working temperature.

[0040] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0041] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A clamping integrated circuit testing fixture, comprising a substrate (1), characterized in that: A fixing component (2) is provided above the substrate (1). The fixing component (2) includes multiple matrix-distributed figure-eight elastic frames (201). A set of slide rods (202) is slidably inserted into the upper end of each elastic frame (201). A pressure block (203) is fixedly connected to the upper end of each slide rod (202). An integrated circuit body (204) is provided above the substrate (1). The side of each pressure block (203) near the integrated circuit body (204) is arc-shaped. A spring (4) is fixedly connected to the bottom end of each pressure block (203). The bottom end of the spring (4) is fixedly connected to the elastic frame (201).

2. The clamping integrated circuit testing fixture according to claim 1, characterized in that: Each of the pressure blocks (203) has a rubber sleeve (3) fitted on its outer surface, and each of the rubber sleeves (3) is in contact with the integrated circuit body (204).

3. The clamping integrated circuit test fixture according to claim 1, characterized in that: The upper surface of the substrate (1) is rotatably connected to a negative pressure suction cup (5), and the integrated circuit body (204) is located on the upper surface of the negative pressure suction cup (5).

4. The clamping integrated circuit test fixture according to claim 1, characterized in that: The upper surface of the substrate (1) is fixedly connected to a plurality of low-speed cylinders (6) arranged in a matrix, and the output end of each low-speed cylinder (6) is fixedly connected to its corresponding elastic frame (201).

5. The clamping integrated circuit test fixture according to claim 1, characterized in that: A three-way tube (205) is installed between each two adjacent pressure blocks (203), and each three-way tube (205) is fixedly connected to a nozzle (206) at both ends near the integrated circuit body (204). A carrier (7) is provided below the base (1). The base (1) and the carrier (7) are fixedly connected by bolts. An electrostatic eliminator (8) is provided inside the carrier (7). Both output ends of the electrostatic eliminator (8) are fixedly connected to a connecting pipe (9). Each pair of adjacent three-way pipes (205) are fixedly connected to the adjacent connecting pipe (9). Both connecting pipes (9) penetrate the base (1) and the carrier (7). Each three-way pipe (205) penetrates the adjacent elastic frame (201).

6. The clamping integrated circuit test fixture according to claim 5, characterized in that: The upper surface of the carrier (7) is equipped with a support frame (10), and an electric push rod (11) is fixedly connected to the upper surface of the support frame (10). An integrated circuit test module (12) is fixedly connected to the output end of the electric push rod (11).

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