A board level calibration test mechanism

Abstract

The utility model discloses a kind of board-level calibration test mechanisms, belong to chip detection equipment technical field, including connecting plate, test component support seat, side push subassembly, connecting piece, conveying guide rail, jacking subassembly, tray and test component, test component support seat is set up in pairs, top is equipped with connecting plate, test component is installed between two test component support seats, connecting piece is installed between two test component support seats, jacking subassembly is drivingly connected in connecting piece, conveying guide rail is set up in pairs, is installed in connecting piece upper end, conveying guide rail upper end drivingly connected has tray, side push subassembly is installed in connecting piece bottom side wall, side push subassembly output end passes through connecting piece, and drivingly connected in connecting piece. The problem that cannot let chip be in completely sealed space, affect test effect due to the limited displacement of jacking mechanism and the too close distance between jacking mechanism and cold and heat source in the prior art is solved. Improve detection accuracy and application range.

Description

Technical Field

[0001] This utility model relates to the field of chip testing equipment technology, specifically to a board-level calibration testing mechanism. Background Technology

[0002] After the chip is manufactured, it needs to be tested under high temperature, low temperature and various pressure conditions to determine whether the chip can operate normally under harsh conditions.

[0003] In existing technologies, the power source for traditional lifting and positioning calibration testing mechanisms is typically located directly below the tray. Due to limited lifting space, for smaller chips, the power source cannot lift the tray to the testing device, preventing the chip from being tested in a sealed space. Furthermore, if the lifting mechanism is located below the tray, it means that the lifting mechanism is close to a heat source, which can affect the lifting mechanism's movement and thus its clamping effect, leading to measurement errors and making it impossible to accurately determine chip performance.

[0004] Therefore, how to provide a board-level calibration test mechanism that overcomes the structural defects of existing calibration test mechanisms is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] To address this issue, this invention provides a board-level calibration testing mechanism to solve the problem in the prior art where the limited displacement of the lifting mechanism and its proximity to the heat source prevent the chip from being placed in a completely sealed space, thus affecting the testing results.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] This utility model discloses a board-level calibration test mechanism, comprising:

[0008] Test component support base, set in pairs, with a connecting plate mounted on top;

[0009] A test component is installed between two test component supports, and the test component is positioned below the connecting plate.

[0010] A connector is installed between the two test component supports, and a lifting component is drivenly connected to the connector.

[0011] A pair of conveyor rails are installed on the upper end of the connector. A pallet is drivenly connected to the upper end of the conveyor rails, and the top of the lifting assembly abuts against the bottom of the pallet.

[0012] A side-push assembly is installed on the bottom side wall of the connector, and the output end of the side-push assembly passes through the connector and is connected in a driving manner within the connector.

[0013] In one possible implementation, the test component support has two mounting holes on its side wall, and one end of the test component and connector is inserted into the mounting holes.

[0014] In one possible implementation, the test component includes:

[0015] The positioning plate is snapped between the mounting holes of the two test component support seats;

[0016] The connecting housing is installed at the bottom of the positioning plate;

[0017] A probe mount adapter plate is installed in the connecting housing, and a number of probes are installed on the bottom of the probe mount adapter plate;

[0018] A probe holder is installed at the bottom of the connecting housing, the bottom of the probe is in contact with the probe holder, and a plurality of probes are installed at the bottom of the probe holder;

[0019] A sealing ring is installed at the bottom of the probe holder, and the sealing ring is disposed on the outside of several of the probes.

[0020] In one possible implementation, the connector includes:

[0021] The connecting block has limit holes on its two outer side walls at the top, and a placement groove is provided on the top of the connecting block.

[0022] A horizontal through hole is formed on the lower side of the connecting block. A vertical through hole is also formed in the connecting block. The vertical through hole is located above the horizontal through hole and its bottom is connected to the horizontal through hole. The lifting assembly is drivenly connected in the vertical through hole.

[0023] In one possible implementation, the lifting component includes:

[0024] Linear bearings, arranged in pairs, are installed in the vertical through holes, and a displacement rod is driven through each linear bearing;

[0025] Top block, installed on top of the displacement rod;

[0026] A drive shaft is installed in the connecting block, and a lifting plate is flipped and connected to the drive shaft. A first inclined surface is provided at the bottom of one end of the lifting plate.

[0027] In one possible implementation, the side-pushing component includes:

[0028] A drive cylinder is installed on the side of the connecting block, with the output end of the drive cylinder facing the horizontal through-hole port.

[0029] The movable rod is driven to the output end of the drive cylinder at one end and driven to the horizontal through hole at the other end, and a side push plate is installed at the end. A second inclined surface is opened on the top surface of one end of the side push plate.

[0030] In one possible implementation, the conveying guide rail includes:

[0031] A rectangular block, with a limit block installed at the top of the rectangular block, and a pallet drive connected to the rectangular block, with the side of the pallet abutting against the inner wall of the limit block.

[0032] This invention places the side-pushing component on the side of the connector. Then, the movement of a portion of the side-pushing component within the connector drives the lifting component to produce a vertical displacement, thereby driving the tray upward. This allows the chip product carried on the tray to move into the testing component, forming a sealed space between the testing component and the tray. This allows various pressure conditions to be applied within the sealed space to test chip performance. This method increases the displacement range of the lifting component, thus adapting to the testing of various chip models. Furthermore, the driving mechanism is located away from high and low temperature environments, which does not affect its driving effect, further ensuring the stability of the test and resulting in a higher product yield. Attached Figure Description

[0033] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0034] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0035] Figure 1 A perspective view of the plate-level calibration test mechanism provided by this utility model;

[0036] Figure 2 A cross-sectional view of the test component provided by this utility model;

[0037] Figure 3 A cross-sectional view of the connector provided by this utility model;

[0038] Figure 4 A cross-sectional view of the lifting assembly provided by this utility model;

[0039] Figure 5 A cross-sectional view of the side thrust assembly provided by this utility model;

[0040] Figure 6 A perspective view of the conveyor rail provided by this utility model;

[0041] In the diagram: 1. Connecting plate; 2. Test component support base; 21. Mounting hole; 3. Side push component; 31. Drive cylinder; 32. Movable rod; 33. Side push plate; 34. Second inclined surface; 4. Connecting piece; 41. Vertical through hole; 42. Horizontal through hole; 43. Connecting block; 5. Conveying guide rail; 51. Limiting block; 52. Rectangular block; 6. Lifting component; 61. Top block; 62. Displacement rod; 63. Linear bearing; 64. Lifting plate; 65. First inclined surface; 66. Drive shaft; 7. Tray; 8. Test component; 81. Probe; 82. Sealing ring; 83. Probe base adapter plate; 84. Connecting shell; 85. Positioning plate; 86. Probe base. Detailed Implementation

[0042] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0043] Please refer to Figures 1-6 The present invention discloses a plate-level calibration and testing mechanism, as follows: Figure 1The system includes a connecting plate 1, a test component support base 2, a side push component 3, a connector 4, a conveying guide rail 5, a lifting component 6, a tray 7, and a test component 8. The test component support bases 2 are arranged in pairs, with the connecting plate 1 installed on top. The test component 8 is installed between the two test component support bases 2 and is located below the connecting plate 1. The connector 4 is installed between the two test component support bases 2, and the lifting component 6 is drivenly connected to the connector 4. The conveying guide rails 5 are arranged in pairs and installed on the upper end of the connector 4. The tray 7 is drivenly connected to the upper end of the conveying guide rails 5. The top of the lifting component 6 rests against the bottom of the tray 7. The side push component 3 is installed on the bottom side wall of the connector 4, and the output end of the side push component 3 passes through the connector 4 and is drivenly connected to the connector 4. Regarding the setting of the connecting plate 1, the spacing between the two test component support seats 2 is adjusted to install different styles of test components 8 and connectors 4, making the entire mechanism more applicable. If the conveyor rail 5 adopts a conveyor belt structure, then a detection unit must be set at the bottom of the test component 8, and a detection hole adapted to the detection unit is set on the tray 7 to ensure that the product carried by the tray 7 is always directly below the test component 8, and to ensure that the product is not crushed by the test component 8 when it moves upward.

[0044] In a specific embodiment, such as Figure 1 The test component support 2 has two mounting holes 21 on its side wall, and one end of the test component 8 and the connector 4 is inserted into the mounting holes 21. If the test component support 2 is used to clamp the test component 8 and the connector 4, the limiting effect is not particularly good. Therefore, this structure adopts a preferred method, by setting the mounting holes 21, to further prevent the test component 8 and the connector 4 from moving up and down, so as to better limit the position.

[0045] In a specific embodiment, such as Figure 2The test assembly 8 includes probes 81, sealing rings 82, probe holder adapter plates 83, connecting housings 84, positioning plates 85, and probe holders 86. The positioning plates 85 are snapped between the mounting holes 21 of the two test assembly support bases 2. The connecting housings 84 are installed at the bottom of the positioning plates 85. The probe holder adapter plates 83 are installed in the connecting housings 84. Several probes 81 are installed at the bottom of the probe holder adapter plates 83. The probe holders 86 are installed at the bottom of the connecting housings 84. The bottoms of the probes 81 are in contact with the probe holders 86. Several probes 81 are installed at the bottom of the probe holders 86. The sealing rings 82 are installed at the bottom of the probe holders 86 and are located on the outside of the probes 81. In the first embodiment, the described method involves slotting the bottom of the probe holder 86 and then feeding the product into the slot to connect with the probe 81. In this embodiment, a more preferred method is used: the bottom of the probe holder 86 is flat, and a sealing ring 82 is installed at the bottom of the probe holder 86. When the tray 7 moves upward, it contacts the sealing ring 82, forming a sealed space between the sealing ring 82, the probe holder 86, and the tray 7, before pressure feeding and other operations are performed. Compared to the previous method, this method, because the slot depth is fixed, restricts the product from being too tall or irregularly shaped. The method in this embodiment… This method avoids the aforementioned problems and allows for the installation of more probes of different models for testing, resulting in better testing performance and a wider range of applications. Furthermore, the sealing ring 82 prevents the product from directly impacting the probe holder 86 and causing damage. Unlike the first embodiment, the product does not need to be placed at the center of the test assembly 8; it only needs to be within the sealing ring 82. As long as the probe 81 can contact all the chips, even if a position sensor is installed in the test assembly 8, it is not necessary to use a particularly precise position sensor, which can effectively reduce costs.

[0046] In this embodiment, probe 81 is provided in two parts, which are connected end to end. Circuit boards are provided on both probe base adapter plate 83 and probe base 86. Probe 81 is mounted on the circuit board, and the two circuit boards can be used to detect the situation under different working conditions, making the detection more accurate. A wireless signal unit is set on the circuit board to transmit the detection signal. Probe 81 is used to transmit current, which is equivalent to a wire. It connects the product to the circuit board. The product itself has a program set up to use the circuit board to reproduce the signal operation, thereby providing feedback on the product's operation under different working conditions.

[0047] In a specific embodiment, such as Figure 3The connecting component 4 includes a vertical through hole 41, a horizontal through hole 42, and a connecting block 43. Limiting holes are formed on the two outer side walls at the upper end of the connecting block 43, and a placement groove is formed on the top of the connecting block 43. The horizontal through hole 42 is located on the lower side of the connecting block 43, and the vertical through hole 41 is also formed in the connecting block 43, positioned above the horizontal through hole 42. The bottom of the vertical through hole 41 communicates with the horizontal through hole 42. The lifting assembly 6 is drivenly connected in the vertical through hole 41. The vertical through hole 41 is used for the displacement of the displacement rod 62, while the horizontal through hole 42 is used for the displacement of the side push plate 33.

[0048] In a specific embodiment, such as Figure 4 The lifting assembly 6 includes a top block 61, a displacement rod 62, a linear bearing 63, a lifting plate 64, a first inclined surface 65, and a drive shaft 66. The linear bearings 63 are arranged in pairs and installed in the vertical through hole 41. The displacement rod 62 is driven through the linear bearing 63. The top block 61 is installed on the top of the displacement rod 62. The drive shaft 66 is installed in the connecting block 43. The lifting plate 64 is flipped and connected to the drive shaft 66. The first inclined surface 65 is provided at the bottom of one end of the lifting plate 64. The linear bearing 63 is used primarily to ensure more precise displacement of the displacement rod 62, and secondly to prevent the displacement rod 62 from tilting. The top block 61 is used to lift the tray 7, while the drive shaft 66 is used to rotate the lifting plate 64. This rotational drive method can generate more positional displacement. Under the constraint of the side push plate 33, even if high or low temperature affects the drive cylinder 31, as long as the side push plate 33 does not move too far, the lifting plate 64 will not flip, and the top block 61 will not move down. The first inclined surface 65 serves two purposes: one is to allow the side push plate 33 to better enter under the lifting plate 64 when the side push plate 33 is driven; the other is to allow the lifting plate 64 to generate more flipping angles, thereby controlling the displacement of the displacement rod 62.

[0049] In a specific embodiment, such as Figure 5 The side-push assembly 3 includes a drive cylinder 31, a movable rod 32, a side-push plate 33, and a second inclined surface 34. The drive cylinder 31 is installed on the side of the connecting block 43, with its output end facing the port of the horizontal through hole 42. One end of the movable rod 32 is drivenly connected to the output end of the drive cylinder 31, and the other end is drivenly connected to the horizontal through hole 42, with the side-push plate 33 installed at its end. The second inclined surface 34 is formed on the top surface of one end of the side-push plate 33. The drive cylinder 31 is a common cylinder structure, which drives the movable rod 32 to translate, causing the side-push plate 33 to translate as well. The second inclined surface 34 is designed to facilitate the side-push plate 33 entering the area under the lifting plate 64, and also allows the lifting plate 64 to rotate at more angles.

[0050] In a specific embodiment, such as Figure 6The conveying guide rail 5 includes a limiting block 51 and a rectangular block 52. The limiting block 51 is installed at the top of the rectangular block 52. The pallet 7 is drivenly connected to the rectangular block 52, and the side of the pallet 7 abuts against the inner wall of the limiting block 51. The purpose of setting the limiting block 51 is to allow the pallet 7 to move horizontally better and prevent it from rotating.

[0051] In use, the chip product is placed or fixed on the tray 7. The fixing method can be magnetic or adhesive. After fixing the product, the tray 7 is placed on the conveyor rail 5. The conveyor rail can be a conveyor belt or a manual push method. The conveyor rail 5 transports the tray 7 to below the test assembly 8. At this time, the drive cylinder 31 drives the movable rod 32 to move outward. The movable rod 32 carries the side push plate 33 and moves it horizontally through the through hole 42, gradually approaching the lifting plate 64. During the movement, the second inclined surface 34 of the side push plate 33 gradually approaches and contacts the lifting plate 64, and the side push plate 33 gradually... During movement, the lifting plate 64 rotates counterclockwise. During this counterclockwise rotation, the displacement rod 62 moves upward, and the displacement rod 62, carrying the top block 61, pushes the tray 7 upward, causing the top of the tray 7 to press against the bottom surface of the test assembly 8. The product in the tray 7 enters the interior of the test assembly 8, forming a sealed space between the tray 7 and the test assembly 8. After the product enters the test assembly 8, the probe 81 contacts the product and establishes a contact connection. After venting air pressure into the sealed space, the chip's performance under various air pressures is tested. The input air pressure is typically 20 kPa, 1.6 MPa, or 3.2 MPa.

[0052] When testing under high or low temperature conditions, it is only necessary to attach the high or low temperature heat source to the connecting shell 84 to change the temperature of the sealed space. However, due to the influence of heat conduction, because this structure uses side propulsion and the drive source is far from the temperature input position, even if heat conduction occurs, the heat will reach the drive cylinder 31, affecting gas activity. Although the side push plate 33 moves slightly, it does not completely leave the lifting plate 64. Therefore, the lifting effect will not be eliminated, the top block 61 will not move down, and the sealed space will not be released, affecting the test. However, for existing equipment... If the lifting mechanism is located below the tray 7, the amount of movement is limited. Moreover, once heat conduction occurs, affecting the activity of the gas in the cylinder, the tray 7 will inevitably move up and down. Once the sealed space is released, the test performance will inevitably be affected. After the test is completed, the drive cylinder 31 pulls back the side push plate 33, and the lifting plate 64 rotates clockwise under the influence of the gravity of the displacement rod 62, which causes the displacement rod 62 to move down. The tray 7 moves down synchronously and returns to the conveying guide rail 5. The conveying guide rail 5 continues to convey the tray 7, allowing the tray to enter the next process.

[0053] Although the present invention has been described in detail above with general descriptions and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A board-level calibration and testing mechanism, characterized in that, include: Test component support base (2), set in pairs, with a connecting plate (1) mounted on top; Test component (8) is installed between two test component supports (2), and the test component (8) is located below the connecting plate (1); A connector (4) is installed between two test component support seats (2), and a lifting component (6) is drivenly connected in the connector (4); Conveying guide rails (5) are arranged in pairs and installed on the upper end of the connector (4). The upper end of the conveying guide rail (5) is connected to a tray (7), and the top of the lifting component (6) abuts against the bottom of the tray (7). The side-push assembly (3) is installed on the bottom side wall of the connector (4). The output end of the side-push assembly (3) passes through the connector (4) and is connected to the connector (4) in a driving manner.

2. The board-level calibration and testing mechanism as described in claim 1, characterized in that, The test component support base (2) has two mounting holes (21) on its side wall, and one end of the test component (8) and the connector (4) is inserted into the mounting holes (21).

3. The board-level calibration and testing mechanism as described in claim 2, characterized in that, The test component (8) includes: The positioning plate (85) is snapped between the mounting holes (21) of the two test component support bases (2); Connect the outer casing (84) and install it at the bottom of the positioning plate (85); A probe base adapter plate (83) is installed in the connecting housing (84), and a plurality of probes (81) are installed at the bottom of the probe base adapter plate (83); A probe holder (86) is installed at the bottom of the connecting housing (84), the bottom of the probe (81) is in contact with the probe holder (86), and a plurality of the probes (81) are installed at the bottom of the probe holder (86); A sealing ring (82) is installed at the bottom of the probe holder (86) and the sealing ring (82) is disposed on the outside of a plurality of the probes (81).

4. The board-level calibration and testing mechanism as described in claim 2, characterized in that, The connector (4) includes: The connecting block (43) has limit holes on its two outer side walls at the upper end, and a placement groove is opened on the top of the connecting block (43); A horizontal through hole (42) is provided on the lower side of the connecting block (43). A vertical through hole (41) is also provided in the connecting block (43). The vertical through hole (41) is provided above the horizontal through hole (42). The bottom of the vertical through hole (41) is connected to the horizontal through hole (42). The lifting assembly (6) is drivenly connected in the vertical through hole (41).

5. The board-level calibration test mechanism as described in claim 4, characterized in that, The lifting assembly (6) includes: Linear bearings (63) are arranged in pairs and installed in the vertical through hole (41). A displacement rod (62) is drivenly connected in the linear bearing (63). Top block (61) is installed on top of the displacement rod (62); A drive shaft (66) is installed in the connecting block (43), and a lifting plate (64) is flipped and connected to the drive shaft (66). A first inclined surface (65) is provided at the bottom of one end of the lifting plate (64).

6. The board-level calibration test mechanism as described in claim 4, characterized in that, The side-push assembly (3) includes: A drive cylinder (31) is installed on the side of the connecting block (43), and the output end of the drive cylinder (31) is directly opposite the port of the horizontal through hole (42). The movable rod (32) is connected at one end to the output end of the drive cylinder (31) and at the other end to the horizontal through hole (42), and a side push plate (33) is installed at the end. A second inclined surface (34) is opened on the top surface of one end of the side push plate (33).

7. The board-level calibration and testing mechanism as described in claim 1, characterized in that, The conveying guide rail (5) includes: A rectangular block (52) is provided with a limiting block (51) installed at the top of the rectangular block (52). The tray (7) is connected to the rectangular block (52) in a transmission manner, and the side of the tray (7) abuts against the inner wall of the limiting block (51).

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