3.2t silicon light cpo light engine
Patent Information
- Application Number
- CN202522011354.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-18
- Publication Date
- 2026-09-04
- Estimated Expiration
- 2035-09-18
AI Technical Summary
[0002]传统3.2T硅光CPO光引擎,其包括:沿光传播方向依次耦合的DFB芯片、准直透镜、偏振无关光隔离器、汇聚透镜以及硅光芯片,DFB芯片的发射光依次经准直透镜、偏振无关光隔离器、汇聚透镜后耦合入硅光芯片内,并由硅光芯片将光分为8路或16路,为保证高性能高光功率,DFB(激光器芯片)芯片光功率一般要≥200mW,普通硅光引擎的DFB芯片光功率一般≤100mW,偏振无关光隔离器为4片式,依次为起偏片、法拉第片、检偏片和半波片,起偏片的厚度为0.2mm,法拉第片的厚度为0.31mm,检偏片的厚度为0.2mm,半波片的厚度为0.078mm,总厚度为0.788mm,如图1所示,该方案中,采用普通光路,即准直透镜处在DFB芯片与偏振无关光隔离器之间,准直透镜的反射光会导致DFB芯片噪声、性能下降,原因为:偏振无关光隔离器在准直透镜之后,偏振无关光隔离器无法解决准直透镜表面导致的反射光;若将偏振无关光隔离器移动到DFB芯片与准直透镜之间(DFB芯片与准直透镜之间的最远距离可以参考申请号为2023104345880的专利文献),则会导致耦合效率下降,原因为偏振无关光隔离器厚度太大,偏振无关光隔离器与DFB芯片和准直透镜之间还需要保留贴片间隙,所以该办法也不行,如图2所示
[0012] The beneficial effects of this invention are: it splits a complete polarization-independent optical isolator into two parts. The first part consists of a polarizer and a Faraday plate, and the second part consists of an analyzer and a half-wave plate. The combination of the polarizer and the Faraday plate can function as half an optical isolator, effectively preventing the reflected light from the collimating lens from affecting the DFB chip and having no impact on the coupling efficiency. At the same time, the polarizer and the Faraday plate are located in the diverging optical path, so their size can be made smaller, which can save costs.
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Figure CN224720262U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical engine technology, specifically to a 3.2T silicon photonic CPO optical engine. Background Technology
[0002] A traditional 3.2T silicon photonics CPO optical engine comprises: a DFB chip, a collimating lens, a polarization-independent optical isolator, a converging lens, and a silicon photonics chip, sequentially coupled along the light propagation direction. The emitted light from the DFB chip passes sequentially through the collimating lens, polarization-independent optical isolator, and converging lens before being coupled into the silicon photonics chip. The silicon photonics chip then splits the light into 8 or 16 paths. To ensure high performance and high optical power, the DFB (laser chip) chip's optical power is generally ≥200mW, while the DFB chip's optical power in ordinary silicon photonics engines is generally ≤100mW. The polarization-independent optical isolator is a four-piece design: a polarizer, a Faraday plate, an analyzer, and a half-wave plate. The polarizer's thickness is 0.2mm, the Faraday plate's thickness is 0.31mm, the analyzer's thickness is 0.2mm, and the half-wave plate's thickness is 0.078mm, for a total thickness of 0.788mm. Figure 1 As shown, this scheme uses a conventional optical path, where the collimating lens is positioned between the DFB chip and the polarization-independent optical isolator. The reflected light from the collimating lens causes noise and performance degradation in the DFB chip because the polarization-independent optical isolator, located after the collimating lens, cannot handle the reflected light from the collimating lens surface. Moving the polarization-independent optical isolator between the DFB chip and the collimating lens (the maximum distance between the DFB chip and the collimating lens can be found in patent application number 2023104345880) would decrease coupling efficiency because the polarization-independent optical isolator is too thick, and a patch gap needs to be maintained between the polarization-independent optical isolator, the DFB chip, and the collimating lens. Therefore, this method is also unsuitable. Figure 2 As shown. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide a 3.2T silicon photonics CPO optical engine to overcome the shortcomings of the prior art.
[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A 3.2T silicon photonics CPO optical engine includes: a DFB chip, a polarizer, a Faraday plate, a collimating lens, an analyzer, a half-wave plate, a converging lens, and a silicon photonics chip, which are sequentially coupled along the light propagation direction. The polarizer and the Faraday plate are fixed together, and the analyzer and the half-wave plate are fixed together.
[0005] Based on the above technical solution, the present invention can be further improved as follows.
[0006] Furthermore, the gap between the polarizer and the DFB chip is 0.05 mm, and the gap between the Faraday plate and the collimating lens is 0.1 mm.
[0007] Furthermore, the refractive index of the polarizer is 1.48, and the thickness of the polarizer is 0.2 mm; the refractive index of the Faraday film is 2.3, and the thickness of the Faraday film is 0.31 mm.
[0008] Furthermore, the thickness of the analyzer is 0.2 mm, and the thickness of the half-wave plate is 0.078 mm.
[0009] Furthermore, the optical power of the DFB chip is ≥200mW.
[0010] Furthermore, the silicon photonics chip has one input waveguide and eight output waveguides, with the input waveguide coupled to the eight output waveguides. The single-wavelength output of each output waveguide of the silicon photonics chip is 400G.
[0011] Furthermore, the silicon photonics chip has one input waveguide and sixteen output waveguides. The input waveguide is coupled to the sixteen output waveguides, and the single output wave of each output waveguide of the silicon photonics chip is 200G.
[0012] The beneficial effects of this invention are: it splits a complete polarization-independent optical isolator into two parts. The first part consists of a polarizer and a Faraday plate, and the second part consists of an analyzer and a half-wave plate. The combination of the polarizer and the Faraday plate can function as half an optical isolator, effectively preventing the reflected light from the collimating lens from affecting the DFB chip and having no impact on the coupling efficiency. At the same time, the polarizer and the Faraday plate are located in the diverging optical path, so their size can be made smaller, which can save costs. Attached Figure Description
[0013] Figure 1 This is the first layout diagram of a 3.2T silicon photonics CPO optical engine in the prior art; Figure 2 This is a second layout diagram of a 3.2T silicon photonics CPO optical engine in the prior art; Figure 3 This is a structural diagram of the 3.2T silicon photonics CPO optical engine in this utility model.
[0014] The attached diagram lists the components represented by each number as follows: 1. DFB chip, 2. Polarizer, 3. Faraday film, 4. Collimating lens, 5. Analyzer, 6. Half-wave plate, 7. Converging lens, 8. Silicon photonics chip. Detailed Implementation
[0015] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.
[0016] Example 1 like Figure 3 As shown, a 3.2T silicon photonics CPO optical engine includes: a DFB chip 1, a polarizer 2, a Faraday plate 3, a collimating lens 4, an analyzer 5, a half-wave plate 6, a converging lens 7, and a silicon photonics chip 8. The DFB chip 1, polarizer 2, Faraday plate 3, collimating lens 4, analyzer 5, half-wave plate 6, converging lens 7, and silicon photonics chip 8 are coupled sequentially along the light propagation direction. The polarizer 2 is fixed to the Faraday plate 3, and the analyzer 5 is fixed to the half-wave plate 6. The emitted light from the DFB chip 1 is coupled into the silicon photonics chip 8 after passing sequentially through the polarizer 2, Faraday plate 3, collimating lens 4, analyzer 5, half-wave plate 6, and converging lens 7.
[0017] A complete polarization-independent optical isolator is divided into two parts: the first part is polarizer 2 and Faraday plate 3, and the second part is analyzer 5 and half-wave plate 6. The combination of polarizer 2 and Faraday plate 3 can serve as half an optical isolator, effectively preventing the reflected light from collimating lens 4 from affecting DFB chip 1, without affecting coupling efficiency. At the same time, polarizer 2 and Faraday plate 3 are located in the diverging optical path, so their size can be made smaller, which can save costs.
[0018] Example 2 like Figure 3 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The gap between the polarizer 2 and the DFB chip 1 is 0.05 mm, and the gap between the Faraday plate 3 and the collimating lens 4 is 0.1 mm.
[0019] Furthermore, the refractive index of polarizer 2 is 1.48, and its thickness is 0.2mm, consistent with existing technology. Therefore, its equivalent air thickness is 0.2mm ÷ 1.48 = 0.135mm. The refractive index of Faraday film 3 is 2.3, and its thickness is 0.31mm, also consistent with existing technology. Therefore, its equivalent air thickness is 0.31mm ÷ 2.3 = 0.1348mm. The total equivalent air thickness is 0.135mm + 0.1348mm ≈ 0.27mm. Since the gap between polarizer 2 and DFB chip 1 is 0.05mm, and the gap between Faraday film 3 and collimating lens 4 is 0.1mm, the total thickness is 0.05mm + 0.27mm + 0.1mm = 0.42mm < 0.5mm, which has no impact on coupling efficiency.
[0020] The thickness of the polarizer 5 is 0.2mm, which is consistent with the existing technology. The thickness of the half-wave plate 6 is 0.078mm, which is also consistent with the existing technology. Therefore, the total thickness of the polarization-independent optical isolator is 0.2mm + 0.31mm + 0.2mm + 0.078mm = 0.788mm, which is also consistent with the existing technology.
[0021] Example 3 like Figure 3 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below: The optical power of DFB chip 1 is ≥200mW, which is consistent with the existing technology.
[0022] Example 4 like Figure 3 As shown, this embodiment is a further improvement on embodiment 1, 2, or 3, as detailed below: The silicon photonics chip 8 has one input waveguide and eight output waveguides. The input waveguide is coupled to the eight output waveguides. The output single wave of each output waveguide of the silicon photonics chip 8 is 400G, and 400G×8=3.2T.
[0023] Example 5 like Figure 3 As shown, this embodiment is a further improvement on embodiment 1, 2, or 3, as detailed below: The silicon photonics chip 8 has one input waveguide and sixteen output waveguides. The input waveguide is coupled to the sixteen output waveguides. The output single wave of each output waveguide of the silicon photonics chip 8 is 200G, and 200G×16=3.2T.
[0024] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. A 3.2T silicon photonics CPO optical engine, characterized in that, include: The following components are coupled sequentially along the light propagation direction: DFB chip (1), polarizer (2), Faraday plate (3), collimating lens (4), analyzer (5), half-wave plate (6), converging lens (7), and silicon photonic chip (8). The polarizer (2) is fixed to the Faraday plate (3), and the analyzer (5) is fixed to the half-wave plate (6).
2. A 3.2T silicon photonics CPO optical engine according to claim 1, characterized in that, The gap between the polarizer (2) and the DFB chip (1) is 0.05 mm, and the gap between the Faraday plate (3) and the collimating lens (4) is 0.1 mm.
3. A 3.2T silicon photonics CPO optical engine according to claim 2, characterized in that, The polarizer (2) has a refractive index of 1.48 and a thickness of 0.2 mm; the Faraday plate (3) has a refractive index of 2.3 and a thickness of 0.31 mm.
4. A 3.2T silicon photonics CPO optical engine according to claim 1, characterized in that, The thickness of the polarizer (5) is 0.2 mm, and the thickness of the half-wave plate (6) is 0.078 mm.
5. A 3.2T silicon photonics CPO optical engine according to claim 1, characterized in that, The optical power of the DFB chip (1) is ≥200mW.
6. A 3.2T silicon photonics CPO optical engine according to any one of claims 1 to 5, characterized in that, The silicon photonic chip (8) has one input waveguide and eight output waveguides. The input waveguide is coupled to the eight output waveguides. The output single wave of each output waveguide of the silicon photonic chip (8) is 400G.
7. A 3.2T silicon photonics CPO optical engine according to any one of claims 1 to 5, characterized in that, The silicon photonic chip (8) has one input waveguide and sixteen output waveguides. The input waveguide is coupled to the sixteen output waveguides. The output single wave of each output waveguide of the silicon photonic chip (8) is 200G.