An optical path design device suitable for chip tiling

CN224720301UActive Publication Date: 2026-09-04JIANGSU JUXIN PRECISION TECH CO LTD
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Patent Information

Application Number
CN202521098758.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-30
Publication Date
2026-09-04
Estimated Expiration
2035-05-30

AI Technical Summary

Technical Problem

[0006]本申请提供一种适用芯片拼接的光路设计装置,用以解决现有技术中多摄组件的结构复杂、算法复杂的缺陷,实现相同光程的前提下镜头尺寸小、触发使用共同光路成像不会出现过大偏差、降低物理组装精度不足导致的成像不清晰可能性

Benefits of technology

[0017]根据本申请提供的适用芯片拼接的光路设计装置,利用一组镜头模块,并利用棱镜模块,将光路分成多条分光路,芯片模块可以对多条分光路分别进行处理。在保证相同光程的前提下进行棱镜外形设计,减小镜头尺寸,降低物理限制。此外,本申请因采用单镜头和棱镜分光的光学结构,不依赖AI数据处理,还可避免背景技术中所述的由算法和AI带来的算力消耗及隐私泄露风险。

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Abstract

The application relates to the technical field of optical equipment, in particular to a light path design device suitable for chip splicing. The light path design device suitable for chip splicing comprises a lens module, a prism module and a chip module. After passing through the lens module, light is split by the prism module into multiple light paths. The chip module is used for receiving the multiple light paths. The light path design device suitable for chip splicing utilizes a set of lens modules and a prism module to divide the light path into multiple light paths, and the chip module can process the multiple light paths respectively. The prism shape is designed under the premise of ensuring the same optical path, the lens size is reduced, and the physical limitation is reduced.
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Description

Technical Field

[0001] This application relates to the field of optical equipment technology, specifically to an optical path design device suitable for chip splicing. Background Technology

[0002] Camera lens design needs to integrate optical engineering, chip computing power, and algorithm optimization, especially in smart devices where multi-camera systems are prevalent. Currently, most devices on the market use a multi-camera system architecture, employing a combination of binocular or multi-lens fisheye lenses. Horizontal / vertical in-field mode can improve the effective pixel utilization rate. It is recommended to set the overlap area of ​​a single lens's field of view to 15% to reduce the impact of parallax. Compact optical structures can shorten the entrance pupil distance of multiple lenses, significantly reducing parallax problems. For example, consumer-grade binocular panoramic cameras achieve seamless stitching through miniaturization design.

[0003] Currently, there are no lenses on the market that directly use chip stitching and then match them. Our chip stitching and matching optical path can achieve a large image sensor camera after chip stitching by directly passing through the lens optical path.

[0004] Currently, most multi-camera system architectures use "filler lenses" (such as 2-megapixel macro / depth secondary cameras), relying solely on the main camera in 90% of scenarios. This results in low utilization of secondary cameras and wasted hardware resources. The design of multi-camera systems also limits sensor size and optical specifications; for example, smartphones cannot freely change lenses like DSLR cameras, and image quality improvements are physically restricted.

[0005] Furthermore, existing technologies generally suffer from the following problems: Multi-camera collaboration requires complex algorithm support. For example, Megvii's multi-camera smooth zoom requires neural networks to align the field of view and color differences of different lenses, and insufficient computing power can easily lead to stitching misalignment or delay. Multi-camera systems rely on AI data acquisition and processing, posing a risk of user privacy leaks. For example, facial recognition or environmental information may be stolen by malicious programs. Insufficient physical assembly precision can easily lead to deviations in the focus plane of multiple lenses, requiring a six-axis calibration mechanism to dynamically compensate for tolerances; otherwise, image clarity and consistency will be affected. Utility Model Content

[0006] This application provides an optical path design device suitable for chip splicing, which solves the defects of complex structure and algorithm of multi-camera components in the prior art, and achieves small lens size under the premise of the same optical path, triggering the use of common optical path imaging without excessive deviation, and reducing the possibility of unclear imaging caused by insufficient physical assembly precision.

[0007] This application provides an optical path design device suitable for chip splicing, comprising: Lens module; The prism module splits light into multiple beam paths after it passes through the lens module. A chip module, which is used to receive multiple optical splitters.

[0008] According to the optical path design device for chip splicing provided in this application, the prism module has an incident surface, a first exit surface, a second exit surface, and a third exit surface, wherein the incident surface is perpendicular to both the first and second exit surfaces, the first and second exit surfaces are parallel to each other, and the incident surface is located between the first and second exit surfaces. The third exit surface is parallel to the incident surface, and the second exit surface is located between the third exit surface and the incident surface. The corresponding beam splitting path is adapted to exit from the corresponding first exit surface, second exit surface and third exit surface.

[0009] According to the optical path design device for chip splicing provided in this application, the prism module includes a first prism, a second prism, and a third prism. The first prism has an incident surface and a second exit surface, the second prism has a second exit surface, and the third prism has a third exit surface.

[0010] According to the optical path design device for chip splicing provided in this application, the cross-section of the first prism is a right trapezoid.

[0011] According to the optical path design device for chip splicing provided in this application, the cross-sections of the second prism and the third prism are both triangular.

[0012] According to the optical path design device for chip splicing provided in this application, the cross-sections of the second prism and the third prism are both isosceles right triangles.

[0013] According to the optical path design device for chip splicing provided in this application, the surfaces of the first prism, the second prism and the third prism that are not through which light passes are coated with matte paint.

[0014] According to the optical path design device for chip splicing provided in this application, the lens module is a symmetrical lens with a double Gaussian structure.

[0015] According to the optical path design device for chip splicing provided in this application, the chip module includes multiple chips, and each chip receives a corresponding optical splitter.

[0016] According to the optical path design device for chip splicing provided in this application, multiple chips are integrated together by splicing.

[0017] According to the optical path design device for chip splicing provided in this application, a set of lens modules and a prism module are used to divide the optical path into multiple beam splitters. The chip module can process each beam splitter separately. The prism shape is designed to reduce lens size and alleviate physical limitations while maintaining the same optical path length. Furthermore, because this application uses a single-lens and prism beam splitting optical structure, it does not rely on AI data processing and avoids the computational power consumption and privacy leakage risks associated with algorithms and AI, as described in the background art. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is an exploded view of the optical path design device for chip splicing provided in this application; Figure 2 This is an exploded view of the lens module provided in this application; Figure 3 This is a schematic diagram of the prism module provided in this application.

[0020] Figure label: Lens module; 1. Large-aperture meniscus lens; 2. Biconvex lens; 3. Biconcave lens; 4. Meniscus lens; 5. Plano-convex lens; 6. Second biconcave lens; 7. Second plano-convex lens; 8. Prism module; 80. Matte varnish; 81. First prism; 82. Incident surface; 83. First exit surface; 84. Second prism; 85. Second exit surface; 86. Third prism; 87. Third exit surface; 9. Chip module. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] The following is combined Figures 1-3This application describes an optical path design apparatus for chip splicing according to embodiments of the present application. It is important to understand that the following description is merely illustrative and not intended to limit the scope of the application.

[0023] It should be noted that, like Figure 1 As shown, the optical path design device for chip splicing according to an embodiment of this application includes: a lens module, a prism module 8, and a chip module 9.

[0024] Specifically, light enters the device through the lens module, and after passing through the lens module, it enters the prism module 8, where it is split by the prism module 8. The light is split by the prism module 8 to form multiple beam paths. The chip module 9 is used to receive the multiple beam paths, that is, the chip module 9 can process the received light signals.

[0025] According to the applicable chip splicing optical path design device of the present application embodiment, a set of lens modules and a prism module 8 are used to divide the optical path into multiple beam splitters, and the chip module 9 can process the multiple beam splitters separately. The prism shape is designed to reduce the lens size and alleviate physical limitations while ensuring the same optical path length.

[0026] In some embodiments, the lens module includes a large-aperture meniscus lens 41, a biconvex lens 2, a biconcave lens 3, a meniscus lens 4, a plano-convex lens 5, a second biconcave lens 63, and a second plano-convex lens 75 stacked sequentially. Light rays emitted from the second plano-convex lens 75 can enter the prism module 8.

[0027] Furthermore, the data parameters of the large-aperture meniscus lens 41, biconvex lens 2, biconcave lens 3, meniscus lens 4, plano-convex lens 5, second biconcave lens 63, and second plano-convex lens 75 are shown in Table 1.

[0028] Table 1

[0029] like Figure 2 and Figure 3As shown, in the optical path design device for applicable chip splicing according to an embodiment of this application, the prism module 8 has an incident surface 82, a first exit surface 83, a second exit surface 85, and a third exit surface 87. The incident surface 82 is perpendicular to the first exit surface 83 and the second exit surface 85. The first exit surface 83 and the second exit surface 85 are parallel to each other. The incident surface 82 is located between the first exit surface 83 and the second exit surface 85. The third exit surface 87 is parallel to the incident surface 82. The second exit surface 85 is located between the third exit surface 87 and the incident surface 82. The corresponding beam splitting path is adapted to emit from the corresponding first exit surface 83, second exit surface 85, and third exit surface 87.

[0030] According to the applicable chip splicing optical path design device of the present application embodiment, the prism module 8 includes a first prism 81, a second prism 84 and a third prism 86, wherein the first prism 81 has an incident surface 82 and a second exit surface 85, the second prism 84 has a second exit surface 85, and the third prism 86 has a third exit surface 87.

[0031] Specifically, the cross-section of the first prism 81 is a right trapezoid, and the cross-sections of the second prism 84 and the third prism 86 are both triangles. Further, the cross-sections of the second prism 84 and the third prism 86 are both isosceles right triangles.

[0032] like Figure 3 As shown, in the optical path design apparatus for chip splicing according to an embodiment of this application, the surfaces of the first prism 81, the second prism 84, and the third prism 86 that are not through which light rays pass are coated with matte varnish 80. This prevents light rays from escaping from other surfaces of the prisms.

[0033] According to the applicable chip splicing optical path design device of the embodiments of this application, the lens module is a symmetrical lens with a double Gaussian structure. It should be noted that the double Gaussian symmetrical lens embodies the balance process of optical design from theory to practical application, and its core symmetry concept is still an important foundation for high-performance lens design. Utilizing the semi-system mirror symmetry characteristics of the double Gaussian structure, lateral aberrations are automatically canceled, and longitudinal aberrations are balanced mainly through optical power distribution and thickness adjustment.

[0034] Based on the lens application, a double Gaussian arrangement is used as the initial structure of the optical path. On the basis of a general double Gaussian imaging lens, the prism size and prism form are determined according to the size after chip splicing. The determined prism size and glass material are then added to the optical path for simulation.

[0035] It should be noted that, following the Nyquist frequency theory, the resolution of the imaging system must be less than 50% of the sensor's Nyquist frequency to avoid image blurring caused by micro-displacements.

[0036] The lens module may include a large-aperture meniscus lens 41, a biconvex lens 2, a biconcave lens 3, a meniscus lens 4, a plano-convex lens 5, a second biconcave lens 63, and a second plano-convex lens 75 stacked in sequence. This allows for a large field of view. The first lens uses a large-aperture meniscus lens 41 to receive the object under test into the optical path, with a field of view ≥40°. The subsequent lenses are all of the classic double Gaussian structure, with a biconvex lens 2 next to a biconcave lens 3. A thick meniscus lens 4 is added to reduce the light aperture as the front half. A variable aperture is added between the front and rear halves of the double Gaussian structure, after which a plano-convex lens 5 is added to diverge the light. Then, a second biconcave lens 63 is added to further diverge the light. Finally, a second plano-convex lens 75 is added as the rear half of the double Gaussian optical path.

[0037] The symmetrical layout of the double Gaussian structure can effectively counteract monochrome aberrations such as spherical aberration, coma, and astigmatism, and improve the consistency of image quality between the center and the edges. This structure is especially suitable for the 35-90mm focal length range, matching the human eye's perspective to meet shooting needs.

[0038] After the lens module is installed, add the prism module 8. The prism module 8 can split the light path.

[0039] In some embodiments, the chip module 9 includes multiple chips, each chip corresponding to a specific optical splitter. Further, the multiple chips are integrated together by splicing.

[0040] To ensure that the light energy received by each chip is approximately consistent, the optical path length of the beam splitter must be consistent. The prism module is adjusted to make the optical path more closely resemble practical applications, ensuring image quality, bringing the MTF close to the diffraction limit, and achieving a dot pattern smaller than the minimum resolution required for the optical path.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An optical path design device suitable for chip splicing, characterized in that, include: Lens module; The prism module splits light into multiple beam paths after it passes through the lens module. A chip module, which is used to receive multiple optical splitters.

2. The optical path design device for chip splicing according to claim 1, characterized in that, The prism module has an incident surface, a first exit surface, a second exit surface, and a third exit surface. The incident surface is perpendicular to both the first and second exit surfaces, and the first and second exit surfaces are parallel to each other. The incident surface is located between the first and second exit surfaces. The third exit surface is parallel to the incident surface, and the second exit surface is located between the third exit surface and the incident surface. The corresponding beam splitting path is adapted to exit from the corresponding first exit surface, second exit surface and third exit surface.

3. The optical path design device for chip splicing according to claim 2, characterized in that, The prism module includes a first prism, a second prism, and a third prism. The first prism has an incident surface and a second exit surface, the second prism has a second exit surface, and the third prism has a third exit surface.

4. The optical path design device for chip splicing according to claim 3, characterized in that, The cross-section of the first prism is a right trapezoid.

5. The optical path design device for chip splicing according to claim 3, characterized in that, The cross-sections of both the second prism and the third prism are triangular.

6. The optical path design device for chip splicing according to claim 5, characterized in that, The cross-sections of the second prism and the third prism are both isosceles right triangles.

7. The optical path design device for chip splicing according to claim 3, characterized in that, The surfaces of the first prism, the second prism, and the third prism that are not through which light passes are coated with matte paint.

8. The optical path design device for chip splicing according to claim 1, characterized in that, The lens module is a symmetrical lens with a double Gaussian structure.

9. The optical path design device for chip splicing according to claim 1, characterized in that, The chip module includes multiple chips, each of which receives a corresponding optical splitter.

10. The optical path design device for chip splicing according to claim 9, characterized in that, Multiple chips are integrated together by splicing.