An erbium fiber temperature control circuit and EDFA

Abstract

The utility model discloses a kind of erbium-doped fiber temperature control circuit and EDFA, it is related to optical fiber communication technical field, comprising: including temperature sensor, microcontroller, control module, driving module, TEC and heating sheet, wherein, the temperature sensor is connected with microcontroller and control module, the microcontroller is connected with control module, the control module is connected with TEC and heating sheet by driving module;The temperature sensor is used to collect erbium-doped fiber temperature and transmit to microcontroller and control module, the microcontroller provides target temperature to control module;When the collected erbium-doped fiber temperature is less than target temperature, control module is used to control TEC and heating sheet simultaneously heating erbium-doped fiber by driving module;When the collected erbium-doped fiber temperature is greater than target temperature, control module is used to control TEC refrigeration erbium-doped fiber by driving module.The circuit has the advantages of high temperature control precision, temperature regulation speed is fast, and the range of environmental temperature is wide.

Description

Technical Field

[0001] This utility model relates to the field of optical fiber communication technology, and in particular to an erbium fiber temperature control circuit and an EDFA. Background Technology

[0002] Erbium-doped fiber amplifiers (EDFAs) are core components of optical communication, and their performance directly affects communication quality. Erbium fiber is the core component of an EDFA, and its gain characteristics are extremely sensitive to temperature. Temperature fluctuations can lead to problems such as gain instability and increased noise figure. Existing EDFA modules typically use a combination of heating elements and ambient heat dissipation to control the temperature of the erbium fiber. Current EDFA erbium fiber temperature control schemes suffer from low temperature control accuracy, difficulty in stabilizing within ±0.1℃, slow temperature maintenance, and a long time required to reach a stable temperature after startup. Therefore, there is an urgent need to develop an erbium fiber temperature control circuit that also offers high-efficiency temperature control. Utility Model Content

[0003] In response to the aforementioned problems and technical requirements, the applicant has proposed an erbium fiber temperature control circuit and an EDFA.

[0004] The technical solution of this utility model is as follows: An erbium fiber temperature control circuit includes a temperature sensor, a microcontroller, a control module, a drive module, a TEC (thermal energy distribution unit), and a heating element. The temperature sensor is connected to the microcontroller and the control module. The microcontroller is connected to the control module. The control module is connected to the TEC and the heating element through the drive module. The temperature sensor is used to collect the temperature of the erbium fiber and transmit it to the microcontroller and control module. The microcontroller provides the target temperature to the control module. When the collected erbium fiber temperature is lower than the target temperature, the control module controls the TEC and heating element to heat the erbium fiber simultaneously via the drive module; when the collected erbium fiber temperature is higher than the target temperature, the control module controls the TEC to cool the erbium fiber via the drive module.

[0005] A further technical solution is that the control module includes a TEC controller U33, resistors R332, R333, R336, R337, R339, R340, R341, R342, R343, R344, R5, R346, capacitor C209, and capacitor C210. ​​The TEC controller U33 is of model ADN8831, and includes the following pins: ILIMIC, IN1P, IN1N, IN2P, IN2N, ILIMH, OUT1, OUT2, VLIM, and Vref. One end of resistor R341 is connected to the ILIMIC pin and one end of resistor R340. The other end of resistor R341 is grounded. The other end of resistor R340 is connected to one end of resistor R336, one end of resistor R332, one end of resistor R342 and one end of resistor R339, and is connected to the reference voltage VREF. The other end of resistor R332 is connected to the VLIM pin and one end of resistor R333, and the other end of resistor R333 is grounded; the other end of resistor R336 is connected to the ILIMH pin and one end of resistor R337, and the other end of resistor R337 is grounded. The other end of resistor R342 is connected to the IN1P pin and one end of resistor R343, and the other end of resistor R343 is grounded; the other end of resistor R339 is connected to the IN1N pin and one end of resistor R344, the other end of resistor R344 is connected to one end of temperature sensor and microcontroller, and is grounded through capacitor C209, and the other end of temperature sensor is grounded. The IN2P pin is connected to the microcontroller through resistor R5 and grounded through resistor R346, while the Vref pin is grounded through capacitor C210.

[0006] A further technical solution is that the control module also includes resistors R328, R329, R392, R399, R349, R350, R351, R352, R353, R354, R355, R356, R359, R386, capacitors C202, C203, C213, C214, C215, C216, C217, C218, and C222. The TEC controller U33 includes VTEC pin, ITEC pin, AVDD pin, PHASE pin, TMPGD pin, AGND pin, FREO pin, SS pin, and SYNCI pin; One end of resistor R328 is connected to the ITEC pin, and the other end of resistor R328 is connected to the microcontroller. The other end of resistor R328 is grounded through capacitor C202. One end of resistor R329 is connected to the VTEC pin, and the other end of resistor R329 is connected to the microcontroller. The other end of resistor R329 is grounded through capacitor C203.

[0007] A further technical solution is that the PHASE pin is connected to one end of resistor R399 and one end of resistor R392, the other end of resistor R399 is grounded, and the other end of resistor R392 is connected to the Vref pin. One end of capacitor C215 is connected to the AVDD pin, which is connected to the power supply voltage VCC, and the other end of capacitor C215 is grounded; one end of resistor R352 is connected to the TMPGD pin, and the other end of resistor R352 is connected to the microcontroller and one end of resistor R356, and the other end of resistor R356 is grounded. One end of the resistor R353 is connected to the FREO pin, one end of the capacitor C217 is connected to the SS pin, and the AGND pin, the other end of the resistor R353, and the other end of the capacitor C217 are grounded. The SYNCI pin is connected to one end of capacitor C218, one end of resistor R355, one end of resistor R359, and one end of resistor R386. The other end of resistor R386 is connected to the power supply voltage VCC, the other end of resistor R359 is connected to the microcontroller, and the other end of resistor R355 is grounded.

[0008] A further technical solution is as follows: one end of resistor R349 is connected to the IN1N pin; the other end of resistor R349 is connected to the OUT1 pin, one end of capacitor C213, and one end of resistor R354; the other end of capacitor C213 is connected to one end of resistor R350; the other end of resistor R350 is connected to one end of resistor R351, the other end of resistor R354, and the IN2N pin; the other end of resistor R354 is connected to one end of capacitor C216; the other end of resistor R351 is connected to one end of capacitors C222 and C214; the other ends of capacitors C222 and C214 are connected to the other end of capacitor C216; and the other end of capacitor C216 is connected to the OUT2 pin.

[0009] The further technical solution is that the TEC controller U33 also includes CS pin, LFB pin, LNGATE pin, LPGATE pin, SFB pin, PGND pin, SNGATE pin, SW pin, SPGATE pin, PVDD pin and MPOSC pin; The driving module includes a TEC driving circuit and a heating element driving circuit. The TEC driving circuit includes a dual-channel MOS chip U35, resistors R330, R334, R335, and R347, capacitors C120, C121, C122, C123, C207, and C204, an inductor L4, and resistor R347. The model of the dual-channel MOS chip U35 includes CJAB2003A. The LNGATE pin is connected to the second pin of the dual-channel MOS chip U35, the LPGATE pin is connected to the fourth pin of the dual-channel MOS chip U35, the first pin of the dual-channel MOS chip U35 is grounded, the third pin of the dual-channel MOS chip U35 is connected to the power supply voltage VCC and grounded through capacitor C120, capacitors C121, C122 and C123 are connected in parallel with capacitor C120, the fifth to eighth pins of the dual-channel MOS chip U35 are connected to the LFB pin, one end of resistor R330, one end of resistor R334 and one end of resistor R335, the other end of resistors R330, R334 and R335 are connected to one end of capacitor C204 to form the TEC+ terminal and connected to the positive terminal of TEC, the other end of capacitor C204 is grounded; One end of the resistor R347 is connected to the SW pin, the other end of the resistor R347 is connected to one end of the inductor L4, the other end of the inductor L4 is connected to the SFB pin and one end of the capacitor C207 to form the TEC- terminal, which is connected to the negative terminal of the TEC. The other end of the capacitor C207 is grounded.

[0010] A further technical solution is that the TEC drive circuit also includes a dual-channel MOS chip U36, capacitors C116, C117, C118, and C119, a Schottky diode VD1, and a Schottky diode VD2, wherein... The first pin of the dual-channel MOS chip U36 is grounded. The second pin of the dual-channel MOS chip U36 is connected to the SNGATE pin. The third pin of the dual-channel MOS chip U36 is grounded through capacitor C116 and connected to the power supply voltage VCC. The fourth pin of the dual-channel MOS chip U36 is connected to the SPGATE pin. Capacitors C117, C118, and C119 are connected in parallel with capacitor C116. The fifth to eighth pins of the dual-channel MOS chip U36 are connected to the other end of resistor R347 and one end of inductor L4. The fifth to eighth pins of the dual-channel MOS chip U36 are also connected to the negative terminals of Schottky diodes VD1 and VD2. The positive terminals of Schottky diodes VD1 and VD2 are grounded.

[0011] A further technical solution is that the heating element driving circuit includes an NMOS chip U32, a PMOS chip U34, resistors R42, R43, R44, and R45, an inductor L5, capacitors C219, C220, C223, C224, and C225, a Schottky diode VD3, and a Schottky diode VD4, wherein... The fourth pin of the PMOS chip U34 is connected to one end of resistor R44 and one end of resistor R45. The other end of resistor R44 is connected to the SPGATE pin. The first to third pins of the PMOS chip U34 are grounded through capacitor C223. Capacitors C224, C219, and C220 are connected in parallel with capacitor C223. The fifth to eighth pins of the PMOS chip U34 are connected to one end of inductor L5. The other end of inductor L5 is connected to one end of capacitor C225, forming the Heater+ terminal, which is connected to the positive terminal of the heating element. The other end of capacitor C225 is grounded. The fifth to eighth pins of the PMOS chip U34 are also connected to the negative terminals of Schottky diodes VD3 and VD4. The positive terminals of Schottky diodes VD3 and VD4 are grounded. The first to third pins of the NMOS chip U32 are grounded, the fourth pin of the NMOS chip U32 is connected to one end of resistor R42 and one end of resistor R43, the other end of resistor R42 is connected to the LNGATE pin, and the fifth to eighth pins of the NMOS chip U32 are connected to form the Heater- terminal, which is connected to the negative terminal of the heating element.

[0012] A further technical solution is that the temperature sensor includes a thermistor.

[0013] An EDFA includes the aforementioned erbium fiber temperature control circuit.

[0014] The beneficial technical effects of this utility model are: The erbium fiber temperature control circuit provided by this utility model is equipped with a heating element and a TEC (Thermoelectric Cooler). Under the control of the TEC controller, it can heat / cool the erbium fiber according to the target temperature, and has bidirectional temperature regulation capability. It can stabilize the erbium fiber temperature within ±0.1℃ of the target temperature, ensuring stable erbium fiber performance. The TEC controller uses a PID algorithm for temperature regulation, which has high temperature control accuracy. With reasonable TEC power selection and PID parameter tuning, the heat preservation time can be less than 1 minute, improving start-up efficiency. The circuit can also operate stably in an environment of -20~70℃, meeting the application requirements of different scenarios and having good wide temperature adaptability. Attached Figure Description

[0015] Figure 1 This is a structural block diagram of one embodiment of the erbium fiber temperature control circuit provided by this utility model.

[0016] Figure 2 This is a circuit diagram of one embodiment of the control module and drive module provided by this utility model. Detailed Implementation

[0017] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0018] This utility model provides an erbium fiber temperature control circuit, including a temperature sensor, a microcontroller, a control module, a drive module, a TEC (thermal energy distribution unit), and a heating element, such as... Figure 1 As shown, the temperature sensor is connected to the microcontroller and the control module, the microcontroller is connected to the control module, and the control module is connected to the TEC and the heating element through the drive module; The temperature sensor is used to collect the temperature of the erbium fiber and transmit it to the microcontroller and control module. The microcontroller provides the target temperature to the control module. When the collected erbium fiber temperature is lower than the target temperature, the control module controls the TEC and heating element to heat the erbium fiber simultaneously through the drive module; when the collected erbium fiber temperature is higher than the target temperature, the control module controls the TEC to cool the erbium fiber through the drive module.

[0019] Specifically, the temperature sensor can be a thermistor with an accuracy of ±0.05℃, and is mounted close to the outer wall of the erbium fiber. The microcontroller can be an STM32F103, integrating a 12-bit ADC to acquire the temperature signal output by the temperature sensor. As those skilled in the art know, when the temperature sensor is a thermistor, the microcontroller can acquire the voltage divided by the thermistor, and the ADC can convert the voltage divided voltage into a temperature value. The temperature sensor is used to acquire the erbium fiber temperature and transmit it to the microcontroller and control module; that is, it transmits the voltage signal corresponding to the acquired erbium fiber temperature to the microcontroller and control module. The microcontroller provides a target temperature to the control module; specifically, the microcontroller outputs a voltage signal corresponding to the target temperature to the control module.

[0020] The control module compares the target temperature with the voltage signal corresponding to the acquired erbium fiber temperature, and outputs a corresponding drive signal to the drive module. The drive module includes a TEC drive circuit and a heating element drive circuit. The drive signal controls the magnitude and direction of the current / voltage applied to the TEC by the TEC drive circuit, thereby controlling the power and temperature adjustment direction of the TEC. The drive signal also controls the magnitude of the current / voltage applied to the heating element by the heating element drive circuit, thereby controlling the power of the heating element. Thus, the rapid adjustment of the erbium fiber temperature is achieved according to the above heating / cooling logic. The drive signal can be a PWM signal.

[0021] Furthermore, such as Figure 2As shown, the control module includes a TEC controller U33, resistors R332, R333, R336, R337, R339, R340, R341, R342, R343, R344, R5, R346, capacitor C209, and capacitor C210. The TEC controller U33 includes model ADN8831, and the TEC controller includes ILIMIC pin, IN1P pin, IN1N pin, IN2P pin, IN2N pin, ILIMH pin, OUT1 pin, OUT2 pin, VLIM pin, and Vref pin; One end of resistor R341 is connected to the ILIMIC pin and one end of resistor R340, and the other end of resistor R341 is grounded. The other end of resistor R340 is connected to one end of resistor R336, one end of resistor R332, one end of resistor R342, and one end of resistor R339, and is connected to the reference voltage VREF. The other end of resistor R332 is connected to the VLIM pin and one end of resistor R333, and the other end of resistor R333 is grounded. The other end of resistor R336 is connected to the ILIMH pin and one end of resistor R337, and the other end of resistor R337 is grounded. The other end of R342 is connected to the IN1P pin and one end of resistor R343, the other end of which is grounded; the other end of resistor R339 is connected to the IN1N pin and one end of resistor R344, the other end of which forms the TS terminal and is connected to one end of the temperature sensor and the microcontroller, and is grounded through capacitor C209, the other end of which is grounded; the IN2P pin is connected to one end of resistor R5, the other end of which forms the Heater_TMPSet terminal and is connected to the microcontroller, and is grounded through resistor R346, the Vref pin is grounded through capacitor C210.

[0022] Specifically, the voltage divided by the thermistor, resistors R344 and R339 is a voltage signal corresponding to the acquired erbium fiber temperature. This voltage signal is applied to the TS terminal and the microcontroller. The voltage signal corresponding to the target temperature provided by the microcontroller is applied to the Heater_TMPSet terminal. In this embodiment, the reference voltage is 2.5V. Resistors R342 and R343 have the same resistance value and are used to set the IN1P pin voltage to 1.25V. Resistors R340 and R341 are used to set the maximum cooling current of the TEC. Resistors R336 and R337 are used to set the maximum heating current of the TEC. Resistors R332 and R333 are used to set the maximum cooling / heating voltage of the TEC.

[0023] The control module also includes resistors R328, R329, R392, R399, R349, R350, R351, R352, R353, R354, R355, R356, R359, R386, capacitors C202, C203, C213, C214, C215, C216, C217, C218, and C222; The TEC controller U33 includes VTEC pin, ITEC pin, AVDD pin, PHASE pin, TMPGD pin, AGND pin, FREO pin, SS pin, and SYNCI pin; One end of resistor R328 is connected to the ITEC pin, and the other end of resistor R328 forms the ITEC_j terminal, which is connected to the microcontroller. The other end of resistor R328 is grounded through capacitor C202. One end of resistor R329 is connected to the VTEC pin, and the other end of resistor R329 forms the VTEC_j terminal, which is connected to the microcontroller. The other end of resistor R329 is grounded through capacitor C203. The PHASE pin is connected to one end of resistor R399 and one end of resistor R392. The other end of resistor R399 is grounded, and the other end of resistor R392 is connected to the Vref pin. One end of capacitor C215 is connected to the AVDD pin, which is connected to the power supply voltage VCC. The other end of capacitor C215 is grounded. One end of resistor R352 is connected to the TMPGD pin, and the other end of resistor R352 forms the TEC_GD terminal, which is connected to the microcontroller and one end of resistor R356. The other end of resistor R356... The AGND pin is grounded; one end of resistor R353 is connected to the FREO pin, one end of capacitor C217 is connected to the SS pin, and the other end of AGND pin, resistor R353, and capacitor C217 are grounded; the SYNCI pin is connected to one end of capacitor C218, one end of resistor R355, one end of resistor R359, and one end of resistor R386, the other end of resistor R386 is connected to the power supply voltage VCC, the other end of resistor R359 forms the TEC_con terminal and is connected to the microcontroller, and the other end of resistor R355 is grounded.

[0024] Specifically, the microcontroller can acquire the cooling / heating voltage and current of the TEC through the VTEC_j terminal and the ITEC_j terminal. The microcontroller can determine whether the TEC controller U33 is working properly by sampling the voltage of the TEC_GD terminal. The microcontroller can also control the opening and closing of the TEC controller U33 by controlling the voltage of the TEC_con terminal.

[0025] Furthermore, the TEC controller U33 generates a drive signal using a PID control algorithm based on the collected erbium fiber temperature and the target temperature. The resistor R349, capacitor C213, resistor R350, resistor R351, resistor R354, capacitor C213, capacitor C214, capacitor C216, and capacitor C222 form a PID circuit. One end of resistor R349 is connected to the IN1N pin, and the other end of resistor R349 is connected to the OUT1 pin. One end of capacitor C213 and one end of resistor R354 are also connected. The other end of capacitor C213 is connected to one end of resistor R350. The other end of resistor R350 is connected to one end of resistor R351, the other end of resistor R354, and the IN2N pin. The other end of resistor R354 is connected to one end of capacitor C216. The other end of resistor R351 is connected to one end of capacitors C222 and C214. The other ends of capacitors C222 and C214 are connected to the other end of capacitor C216. The other end of capacitor C216 is connected to the OUT2 pin. The specific method by which the PID control algorithm used by the TEC controller U33 generates drive signals is consistent with existing technologies.

[0026] PID control algorithms include proportional control, integral control, and derivative control. Proportional control adjusts the drive current proportionally to the temperature deviation. Integral control integrates the temperature deviation to eliminate steady-state error. Derivative control predicts the temperature trend based on the rate of change of the temperature deviation and adjusts accordingly. Under different ambient temperatures, by appropriately adjusting the PID parameters (proportional coefficient Kp, integral coefficient Ki, and derivative coefficient Kd), the temperature settling time can be less than 1 minute, and the temperature can be stabilized within ±0.1℃ of the target temperature. For example, at an ambient temperature of -20℃, the proportional and integral coefficients can be increased to accelerate the heating rate; at an ambient temperature of 70℃, the derivative coefficient can be increased to enhance the control of the temperature decrease trend.

[0027] Specifically, the PID parameters can be adjusted by adjusting the parameters of the capacitor / resistor in the PID circuit. The specific method of adjusting the PID parameters through the PID circuit is consistent with the prior art. In some embodiments, the target temperature can be set to 55℃, and the initial PID parameters can be set to a proportional coefficient Kp=5.0, an integral time constant Ti=10s (Ki=Kp / Ti), and a derivative time constant Td=2s (Kd=Kp×Td). Tests have shown that at an ambient temperature of -20℃, adjusting Kp=7.0 and Ti=8s can shorten the time for the erbium fiber to rise from -20℃ to the target temperature of 55℃ to 45 seconds; at an ambient temperature of 70℃, adjusting Td=3s can control the time for the erbium fiber to drop from 70℃ to the target temperature of 55℃ to 50 seconds, and the temperature fluctuation after stabilization is less than ±0.1℃.

[0028] The TEC controller U33 also includes CS pin, LFB pin, LNGATE pin, LPGATE pin, SFB pin, PGND pin, SNGATE pin, SW pin, SPGATE pin, COMPSW pin, PVDD pin, and MPOSC pin; The driving module includes a TEC driving circuit and a heating element driving circuit. The TEC driving circuit includes a dual-channel MOS chip U35, resistors R330, R334, R335, and R347, capacitors C120, C121, C122, C123, C207, and C204, an inductor L4, and resistor R347. The model of the dual-channel MOS chip U35 includes CJAB2003A. The LNGATE pin is connected to the second pin (G1) of the dual-channel MOS chip U35, the LPGATE pin is connected to the fourth pin (G2) of the dual-channel MOS chip U35, the first pin (S1) of the dual-channel MOS chip U35 is grounded, the third pin (S2) of the dual-channel MOS chip U35 is connected to the power supply voltage VCC and grounded through capacitor C120, and capacitors C121, C122, and C123 are connected in parallel with capacitor C120. The fifth to eighth pins of the dual-channel MOS chip U35 are connected to the LFB pin, one end of resistor R330, and resistor... One end of resistor R334 and one end of resistor R335 are connected. The other ends of resistors R330, R334, and R335 are connected to one end of capacitor C204 to form the TEC+ terminal, which is connected to the positive terminal of the TEC. The other end of capacitor C204 is grounded. One end of resistor R347 is connected to the SW pin. The other end of resistor R347 is connected to one end of inductor L4. The other end of inductor L4 is connected to the SFB pin and one end of capacitor C207 to form the TEC- terminal, which is connected to the negative terminal of the TEC. The other end of capacitor C207 is grounded.

[0029] The TEC drive circuit also includes a dual-channel MOS chip U36, capacitors C116, C117, C118, and C119, a Schottky diode VD1, and a Schottky diode VD2. The first pin (S1) of the dual-channel MOS chip U36 is grounded. The second pin (G1) of the dual-channel MOS chip U36 is connected to the SNGATE pin. The third pin (S2) of the dual-channel MOS chip U36 is grounded through capacitor C116 and connected to the power supply voltage VCC. The fourth pin (G2) of the dual-channel MOS chip U36 is connected to the SPGATE pin. Capacitors C117, C118, and C119 are connected in parallel with capacitor C116. The fifth to eighth pins of the dual-channel MOS chip U36 are connected to the other end of resistor R347 and one end of inductor L4. The fifth to eighth pins of the dual-channel MOS chip U36 are also connected to the negative terminals of Schottky diodes VD1 and VD2. The positive terminals of Schottky diodes VD1 and VD2 are grounded.

[0030] Specifically, the COMPSW pin is connected to one end of capacitor C206 and one end of resistor R338. The other end of resistor R338 is connected to one end of capacitor C205. The other ends of capacitors C205 and C206 are grounded. The TEC- terminal is also connected to one end of capacitor C221 through resistor R357. The other end of capacitor C221 is grounded. The TEC- terminal is connected to solder joint RT3, and the negative terminal of the TEC is soldered to solder joint RT3 to connect to the TEC- terminal. The TEC+ terminal is connected to solder joint RT1, and the positive terminal of the TEC is soldered to solder joint RT1 to connect to the TEC+ terminal. The specific principle of the TEC driving circuit driving the TEC according to the driving signal is consistent with the prior art.

[0031] Furthermore, the heating element driving circuit includes an NMOS chip U32, a PMOS chip U34, resistors R42, R43, R44, and R45, an inductor L5, capacitors C219, C220, C223, C224, and C225, a Schottky diode VD3, and a Schottky diode VD4, wherein... The fourth pin (G) of the PMOS chip U34 is connected to one end of resistor R44 and one end of resistor R45. The other end of resistor R44 is connected to the SPGATE pin. The other end of resistor R45 forms the con2 terminal. The first to third pins (S) of the PMOS chip U34 are grounded through capacitor C223. Capacitors C224, C219, and C220 are connected in parallel with capacitor C223. The fifth to eighth pins (D) of the PMOS chip U34 are connected to one end of inductor L5. The other end of inductor L5 is connected to one end of capacitor C225, forming the Heater+ terminal, which is connected to the positive terminal of the heating element. The other end of capacitor C225 is grounded. The fifth to eighth pins of the PMOS chip U34 are also connected to the negative terminals of Schottky diodes VD3 and VD4. The positive terminals of Schottky diodes VD3 and VD4 are grounded. The first to third pins (S) of the NMOS chip U32 are grounded. The fourth pin (G) of the NMOS chip U32 is connected to one end of resistor R42 and one end of resistor R43. The other end of resistor R43 forms the con1 terminal. The other end of resistor R42 is connected to the LNGATE pin. The fifth to eighth pins of the NMOS chip U32 are connected to form the Heater- terminal, which is connected to the negative terminal of the heating element.

[0032] The Heater+ terminal is connected to solder joint RT2, and the positive electrode of the heating element is soldered to solder joint RT2 to connect to the Heater+ terminal. The Heater- terminal is connected to solder joint RT4, and the negative electrode of the heating element is soldered to solder joint RT4 to connect to the Heater- terminal. The specific principle of the heating element driving circuit driving the TEC according to the driving signal is consistent with the existing technology. The con1 and con2 terminals are redundantly designed. In specific implementation, the con1 and con2 terminals can be connected to a microcontroller, and the microcontroller can directly control the heating element to heat the erbium fiber.

[0033] This invention also provides an EDFA (Erbium-doped fiber amplifier) ​​in which the above-mentioned erbium fiber temperature control circuit is provided to control the temperature of the erbium fiber in the EDFA.

[0034] In summary, the erbium fiber temperature control circuit provided by this utility model is equipped with a heating element and a TEC (thermal control circuit). Under the control of the TEC controller, it can heat / cool the erbium fiber according to the target temperature, and has bidirectional temperature regulation capability. It can stabilize the erbium fiber temperature within the target temperature range of ±0.1℃, ensuring stable erbium fiber performance. It has the advantages of high temperature control accuracy, fast temperature adjustment speed, and wide applicable ambient temperature range.

[0035] In the description of this specification, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature.

[0036] The use of terms such as "one embodiment / mode," "some embodiments / modes," "example," "specific example," or "some examples," etc., refers to a specific feature, structure, material, or characteristic described in connection with that embodiment / mode or example, which is included in at least one embodiment / mode or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment / mode or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments / modes or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments / modes or examples described in this specification, as well as the features of different embodiments / modes or examples.

[0037] Those skilled in the art should understand that the above embodiments are merely for illustrating the present disclosure and are not intended to limit the scope of the disclosure. Those skilled in the art can make other changes or modifications based on the above disclosure, and these changes or modifications still fall within the scope of the present disclosure.

Claims

1. An erbium fiber temperature control circuit, characterized in that, It includes a temperature sensor, microcontroller, control module, drive module, TEC, and heating element, among which, The temperature sensor is connected to the microcontroller and the control module. The microcontroller is connected to the control module. The control module is connected to the TEC and the heating element through the drive module. The temperature sensor is used to collect the temperature of the erbium fiber and transmit it to the microcontroller and control module. The microcontroller provides the target temperature to the control module. When the collected erbium fiber temperature is lower than the target temperature, the control module controls the TEC and heating element to heat the erbium fiber simultaneously via the drive module; when the collected erbium fiber temperature is higher than the target temperature, the control module controls the TEC to cool the erbium fiber via the drive module.

2. The erbium fiber temperature control circuit according to claim 1, characterized in that, The control module includes a TEC controller U33, resistors R332, R333, R336, R337, R339, R340, R341, R342, R343, R344, R5, R346, capacitor C209, and capacitor C210. The TEC controller U33 includes model ADN8831, and the TEC controller includes ILIMIC pin, IN1P pin, IN1N pin, IN2P pin, IN2N pin, ILIMH pin, OUT1 pin, OUT2 pin, VLIM pin, and Vref pin; One end of resistor R341 is connected to the ILIMIC pin and one end of resistor R340. The other end of resistor R341 is grounded. The other end of resistor R340 is connected to one end of resistor R336, one end of resistor R332, one end of resistor R342 and one end of resistor R339, and is connected to the reference voltage VREF. The other end of resistor R332 is connected to the VLIM pin and one end of resistor R333, and the other end of resistor R333 is grounded; the other end of resistor R336 is connected to the ILIMH pin and one end of resistor R337, and the other end of resistor R337 is grounded. The other end of resistor R342 is connected to the IN1P pin and one end of resistor R343, and the other end of resistor R343 is grounded; the other end of resistor R339 is connected to the IN1N pin and one end of resistor R344, the other end of resistor R344 is connected to one end of temperature sensor and microcontroller, and is grounded through capacitor C209, and the other end of temperature sensor is grounded. The IN2P pin is connected to the microcontroller through resistor R5 and grounded through resistor R346, while the Vref pin is grounded through capacitor C210.

3. The erbium fiber temperature control circuit according to claim 2, characterized in that, The control module also includes resistors R328, R329, R392, R399, R349, R350, R351, R352, R353, R354, R355, R356, R359, R386, capacitors C202, C203, C213, C214, C215, C216, C217, C218, and C222; The TEC controller U33 includes VTEC pin, ITEC pin, AVDD pin, PHASE pin, TMPGD pin, AGND pin, FREO pin, SS pin, and SYNCI pin; One end of resistor R328 is connected to the ITEC pin, and the other end of resistor R328 is connected to the microcontroller. The other end of resistor R328 is grounded through capacitor C202. One end of resistor R329 is connected to the VTEC pin, and the other end of resistor R329 is connected to the microcontroller. The other end of resistor R329 is grounded through capacitor C203.

4. The erbium fiber temperature control circuit according to claim 3, characterized in that, The PHASE pin is connected to one end of resistor R399 and one end of resistor R392. The other end of resistor R399 is grounded, and the other end of resistor R392 is connected to the Vref pin. One end of capacitor C215 is connected to the AVDD pin, which is connected to the power supply voltage VCC, and the other end of capacitor C215 is grounded; one end of resistor R352 is connected to the TMPGD pin, and the other end of resistor R352 is connected to the microcontroller and one end of resistor R356, and the other end of resistor R356 is grounded. One end of the resistor R353 is connected to the FREO pin, one end of the capacitor C217 is connected to the SS pin, and the AGND pin, the other end of the resistor R353, and the other end of the capacitor C217 are grounded. The SYNCI pin is connected to one end of capacitor C218, one end of resistor R355, one end of resistor R359, and one end of resistor R386. The other end of resistor R386 is connected to the power supply voltage VCC, the other end of resistor R359 is connected to the microcontroller, and the other end of resistor R355 is grounded.

5. The erbium fiber temperature control circuit according to claim 4, characterized in that, One end of resistor R349 is connected to the IN1N pin, and the other end of resistor R349 is connected to the OUT1 pin, one end of capacitor C213, and one end of resistor R354. The other end of capacitor C213 is connected to one end of resistor R350. The other end of resistor R350 is connected to one end of resistor R351, the other end of resistor R354, and the IN2N pin. The other end of resistor R354 is connected to one end of capacitor C216. The other end of resistor R351 is connected to one end of capacitors C222 and C214. The other ends of capacitors C222 and C214 are connected to the other end of capacitor C216. The other end of capacitor C216 is connected to the OUT2 pin.

6. The erbium fiber temperature control circuit according to claim 2, characterized in that, The TEC controller U33 also includes CS pin, LFB pin, LNGATE pin, LPGATE pin, SFB pin, PGND pin, SNGATE pin, SW pin, SPGATE pin, PVDD pin, and MPOSC pin; The driving module includes a TEC driving circuit and a heating element driving circuit. The TEC driving circuit includes a dual-channel MOS chip U35, resistors R330, R334, R335, and R347, capacitors C120, C121, C122, C123, C207, and C204, an inductor L4, and resistor R347. The model of the dual-channel MOS chip U35 includes CJAB2003A. The LNGATE pin is connected to the second pin of the dual-channel MOS chip U35, the LPGATE pin is connected to the fourth pin of the dual-channel MOS chip U35, the first pin of the dual-channel MOS chip U35 is grounded, the third pin of the dual-channel MOS chip U35 is connected to the power supply voltage VCC and grounded through capacitor C120, capacitors C121, C122 and C123 are connected in parallel with capacitor C120, the fifth to eighth pins of the dual-channel MOS chip U35 are connected to the LFB pin, one end of resistor R330, one end of resistor R334 and one end of resistor R335, the other end of resistors R330, R334 and R335 are connected to one end of capacitor C204 to form the TEC+ terminal and connected to the positive terminal of TEC, the other end of capacitor C204 is grounded; One end of the resistor R347 is connected to the SW pin, the other end of the resistor R347 is connected to one end of the inductor L4, the other end of the inductor L4 is connected to the SFB pin and one end of the capacitor C207 to form the TEC- terminal, which is connected to the negative terminal of the TEC. The other end of the capacitor C207 is grounded.

7. The erbium fiber temperature control circuit according to claim 6, characterized in that, The TEC drive circuit also includes a dual-channel MOS chip U36, capacitors C116, C117, C118, and C119, a Schottky diode VD1, and a Schottky diode VD2. The first pin of the dual-channel MOS chip U36 is grounded. The second pin of the dual-channel MOS chip U36 is connected to the SNGATE pin. The third pin of the dual-channel MOS chip U36 is grounded through capacitor C116 and connected to the power supply voltage VCC. The fourth pin of the dual-channel MOS chip U36 is connected to the SPGATE pin. Capacitors C117, C118, and C119 are connected in parallel with capacitor C116. The fifth to eighth pins of the dual-channel MOS chip U36 are connected to the other end of resistor R347 and one end of inductor L4. The fifth to eighth pins of the dual-channel MOS chip U36 are also connected to the negative terminals of Schottky diodes VD1 and VD2. The positive terminals of Schottky diodes VD1 and VD2 are grounded.

8. The erbium fiber temperature control circuit according to claim 6, characterized in that, The heating element driving circuit includes an NMOS chip U32, a PMOS chip U34, resistors R42, R43, R44, and R45, an inductor L5, capacitors C219, C220, C223, C224, and C225, a Schottky diode VD3, and a Schottky diode VD4. The fourth pin of the PMOS chip U34 is connected to one end of resistor R44 and one end of resistor R45. The other end of resistor R44 is connected to the SPGATE pin. The first to third pins of the PMOS chip U34 are grounded through capacitor C223. Capacitors C224, C219, and C220 are connected in parallel with capacitor C223. The fifth to eighth pins of the PMOS chip U34 are connected to one end of inductor L5. The other end of inductor L5 is connected to one end of capacitor C225, forming the Heater+ terminal, which is connected to the positive terminal of the heating element. The other end of capacitor C225 is grounded. The fifth to eighth pins of the PMOS chip U34 are also connected to the negative terminals of Schottky diodes VD3 and VD4. The positive terminals of Schottky diodes VD3 and VD4 are grounded. The first to third pins of the NMOS chip U32 are grounded, the fourth pin of the NMOS chip U32 is connected to one end of resistor R42 and one end of resistor R43, the other end of resistor R42 is connected to the LNGATE pin, and the fifth to eighth pins of the NMOS chip U32 are connected to form the Heater- terminal, which is connected to the negative terminal of the heating element.

9. The erbium fiber temperature control circuit according to claim 1, characterized in that, The temperature sensor includes a thermistor.

10. An EDFA, characterized in that, Includes the erbium fiber temperature control circuit as described in any one of claims 1-9.

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