Display module and display device

Abstract

The display module and the display device are disclosed in the embodiments of the present disclosure. The display module comprises a display panel and a support assembly located on the non-display side of the display panel. The support assembly comprises a support layer, a copper foil layer located on the side of the support layer away from the display panel, the copper foil layer comprising a flexible circuit board binding area and a connecting area, and an insulating protective layer located on the side of the copper foil layer away from the display panel, the insulating protective layer covering at least the area of the copper foil layer other than the flexible circuit board binding area and the connecting area.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] With the market demand for ultra-thin and lightweight products, foldable display modules have optimized the material of the support bracket on the back of the display panel. Carbon fiber reinforced polymer (CFRP) sheets with lower density are typically used as the support bracket to achieve overall weight reduction. Since CFRP is non-conductive, copper foil is usually attached to the back of the module to achieve electrical and thermal conductivity; that is, the carbon fiber sheet and copper foil together constitute the support bracket. Because the main components of the mid-frame are iron and aluminum, during salt spray testing, the copper foil in the support bracket and the mid-frame form a galvanic cell in the salt spray environment, generating an alkaline environment. The panel is intolerant of alkaline environments, leading to delamination of the panel's internal interfaces. Utility Model Content

[0003] This disclosure provides a display module and display device to prevent the mid-frame of the display from forming a galvanic cell with the copper foil layer in the support component under salt spray conditions, generating an alkaline environment and causing delamination of the internal interface of the display panel.

[0004] This disclosure provides a display module, including a display panel and a support component located on the non-display side of the display panel; the support component includes:

[0005] Support layer;

[0006] A copper foil layer is located on the side of the support layer opposite to the display panel, and the copper foil layer includes a flexible circuit board bonding area and a contact area;

[0007] An insulating protective layer is located on the side of the copper foil layer opposite to the display panel, and the insulating protective layer covers at least the area of ​​the copper foil layer other than the flexible circuit board bonding area and the contact area.

[0008] In one possible implementation, in the display module provided in the embodiments of this disclosure, both the flexible circuit board bonding area and the contact area are provided with a hollow structure that penetrates the copper foil layer and the insulating protective layer, and each hollow structure is filled with conductive adhesive.

[0009] In one possible implementation, in the display module provided in the embodiments of this disclosure, the insulating protective layer completely covers the copper foil layer.

[0010] In one possible implementation, in the display module provided in the embodiments of this disclosure, the support component further includes a conductive adhesive layer located between the support layer, the copper foil layer, and the conductive adhesive, the conductive adhesive layer completely covering the overall structure formed by the copper foil layer and the conductive adhesive.

[0011] In one possible implementation, in the display module provided in the embodiments of this disclosure, the sum of the thicknesses of the conductive adhesive layer and the copper foil layer is 10 to 30 μm.

[0012] In one possible implementation, in the display module provided in the embodiments of this disclosure, the support component further includes a conductive layer located in the flexible circuit board bonding area and the contact area respectively, and located between the support layer and the conductive adhesive, with each conductive layer covering a portion of the copper foil layer surrounding the hollow structure.

[0013] In one possible implementation, in the display module provided in the embodiments of this disclosure, the thickness of the copper foil layer is 10 to 30 μm, and the thickness of the conductive layer is less than 1 μm.

[0014] In one possible implementation, in the display module provided in the embodiments of this disclosure, the material of the conductive layer includes at least one of nickel, gold, silver, and graphite.

[0015] In one possible implementation, in the display module provided in the embodiments of this disclosure, the material of the insulating protective layer includes acrylic resin.

[0016] In one possible implementation, in the display module provided in the embodiments of this disclosure, the material of the insulating protective layer is insulating tape, and the insulating tape has a hollow structure in the bonding area of ​​the flexible circuit board and the contact area, and the hollow structure exposes the copper foil layer.

[0017] In one possible implementation, in the display module provided in the embodiments of this disclosure, the material of the insulating protective layer is conductive resin, and the insulating protective layer completely covers the copper foil layer.

[0018] In one possible implementation, in the display module provided in the embodiments of this disclosure, the conductive resin includes an acrylic resin and conductive particles dispersed within the acrylic resin.

[0019] Accordingly, embodiments of this disclosure also provide a display device, including:

[0020] The display module described above is provided in the embodiments of this disclosure;

[0021] A metal frame having a receiving cavity, the display module being located within the receiving cavity. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a display module provided in related technologies;

[0023] Figure 2 This is a schematic diagram illustrating the reaction principle of the middle frame and copper foil layer forming a galvanic cell in related technologies.

[0024] Figure 3 This is a schematic diagram of a planar structure of the back of a display module provided in an embodiment of the present disclosure;

[0025] Figure 4 for Figure 3 A schematic diagram of the cross-section along the CC' direction;

[0026] Figure 5 This is a schematic diagram of another planar structure of the back of a display module provided in an embodiment of this disclosure;

[0027] Figure 6 for Figure 5 A schematic diagram of the cross-section along the CC' direction;

[0028] Figure 7 for Figure 6 A magnified view of a portion of the image;

[0029] Figure 8 A cross-sectional schematic diagram of yet another display module provided in an embodiment of this disclosure;

[0030] Figure 9 A cross-sectional schematic diagram of yet another display module provided in an embodiment of this disclosure;

[0031] Figure 10 This is a plan view of a display device provided in an embodiment of the present disclosure. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Furthermore, the embodiments and features in the embodiments of this disclosure can be combined with each other without conflict. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0033] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "comprising" or "including," and similar terms as used in this disclosure, mean that an element or object preceding the term encompasses the elements or objects listed following the term and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. Terms such as "inner," "outer," "upper," and "lower" are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0034] It should be noted that the dimensions and shapes of the figures in the accompanying drawings do not reflect actual proportions and are intended only to illustrate the content of this disclosure. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0035] like Figure 1 As shown, Figure 1 This is a schematic diagram of a display module provided in related technologies. The display module includes: a cover plate 10, an optical adhesive layer 20 located on one side of the cover plate, a display panel 30 located on the side of the optical adhesive layer 20 away from the cover plate 10, an adhesive layer 40 located on the side of the display panel away from the cover plate 10, a support layer 50 located on the side of the adhesive layer 40 away from the cover plate 10, and a copper foil layer 60 located on the side of the support layer 50 away from the cover plate 10. To achieve overall weight reduction, the support layer 50 is made of carbon fiber reinforced polymer (CFRP). Since the display module needs to be assembled with the mid-frame of the entire device, the copper foil layer 60 is connected to the mid-frame. Because the main components of the mid-frame are iron and aluminum, and it has no coating treatment, during salt spray testing, the mid-frame forms a galvanic cell with the copper foil layer 60 in the salt spray environment. Figure 2 As shown, Figure 2 This is a schematic diagram of the reaction principle of a galvanic cell. The middle frame (taking iron as an example) is the negative electrode, and the copper foil layer 60 is the positive electrode. The reaction formula for forming a galvanic cell is as follows:

[0036] Negative electrode: 2Fe-4e - =2Fe 2+ ;

[0037] Positive electrode: O2 + 2H2O + 4e - =4OH - ;

[0038] Overall reaction: 2Fe + O₂ + 2H₂O = 2Fe(OH)₂.

[0039] In a salt spray environment, the aforementioned frame (Fe) forms a galvanic cell with the copper foil layer 60 (Cu), generating an alkaline environment (pH=11). Since the display panel 30 includes inorganic layers (SiO2, etc.) and a PI layer (polyimide), on one hand, SiO2 reacts with the alkali, weakening the bond between the inorganic layer and the upper and lower film layers, leading to delamination of the internal interface of the display panel 30. The reaction mechanism of SiO2 and alkali is: SiO2 (or Si) + 2NaOH → Na2SiO3 + H2O, meaning the reaction of alkali with the inorganic layer weakens its bond. On the other hand, the imide bonds in the PI layer can break and degrade under specific conditions (acid / alkali / long-term exposure). Therefore, the alkali generated in the aforementioned galvanic cell causes delamination of the PI layer and the upper and lower film layers. If the copper foil layer 60 is removed, the support layer 50 (carbon fiber plate) is non-conductive, making it impossible to ground the entire device. Therefore, it is necessary to prevent the frame (Fe) from forming a galvanic cell with the copper foil layer 60 (Cu) in a salt spray environment and to achieve overall grounding.

[0040] To address the aforementioned problems, embodiments of this disclosure provide a display module, such as... Figures 3-9 As shown, Figure 3 This is a schematic diagram showing a planar structure on the back of the module. Figure 4 for Figure 3 A schematic diagram of the cross-section along the CC' direction. Figure 5 This is a schematic diagram showing another planar structure on the back of the module. Figure 6 for Figure 5 A schematic diagram of the cross-section along the CC' direction. Figure 7 for Figure 6 A partially enlarged schematic diagram, Figure 8 To show another cross-sectional schematic diagram of the module, Figure 9 This is a cross-sectional schematic diagram of another display module, which includes a display panel 1 and a support component 2 located on the non-display side of the display panel 1; the support component 2 includes:

[0041] Support layer 21, the material of support layer 21 can be carbon fiber;

[0042] The copper foil layer 22 is located on the side of the support layer 21 away from the display panel 1. The copper foil layer 22 includes a flexible circuit board bonding area (FPC) and a grounding area (GND).

[0043] An insulating protective layer 23 is located on the side of the copper foil layer 22 away from the display panel 1. The insulating protective layer 23 covers at least the area of ​​the copper foil layer 22 except for the flexible circuit board bonding area FPC and the grounding area GND.

[0044] The display module provided in this embodiment of the present disclosure provides an insulating protective layer on the side of the copper foil layer away from the display panel. This insulating protective layer can effectively prevent the formation of a galvanic cell between the frame of the whole machine and the copper foil layer under salt spray environment, thereby avoiding electrochemical reactions, preventing the formation of an alkaline environment, avoiding interface delamination inside the display panel, and improving the tolerance of the display panel. In addition, the copper foil layer can realize the grounding of the whole machine and realize the heat dissipation function of the whole machine.

[0045] In some embodiments, in the display module provided in the present disclosure, such as Figures 3-7 As shown, both the flexible circuit board bonding area (FPC) and the grounding area (GND) have perforated structures V that penetrate the copper foil layer 22 and the insulating protective layer 23, and each perforated structure V is filled with conductive adhesive 3. By perforating the copper foil layer 22 and the insulating protective layer 23 in the flexible circuit board bonding area (FPC) and the grounding area (GND), and filling them with conductive adhesive 3 of the same overall thickness as the copper foil layer 22 and the insulating protective layer 23, the insulating protective layer 23 and the conductive adhesive 3 surround the copper foil layer 22, preventing the copper foil layer 22 from forming a galvanic cell with the middle frame in a salt spray environment. Furthermore, the filled conductive adhesive 3 enables the copper foil layer 22 to conduct electricity with the conductive adhesive 3, thus achieving bonding between the conductive adhesive 3 and the flexible circuit board and grounding of the entire device.

[0046] In some embodiments, in the display module provided in the present disclosure, such as Figure 4 and Figure 6 As shown, the insulating protective layer 23 completely covers the copper foil layer 22, so that the insulating protective layer 23 can prevent the copper foil layer 22 from being exposed, thereby preventing the copper foil layer 22 from forming a galvanic cell with the middle frame.

[0047] In some embodiments, in the display module provided in the present disclosure, such as Figure 4 As shown, the support component 2 also includes a conductive adhesive layer 24 located between the support layer 21, the copper foil layer 22, and the conductive adhesive 3. The conductive adhesive layer 24 completely covers the overall structure formed by the copper foil layer 22 and the conductive adhesive 3. Specifically, the sum of the thicknesses of the conductive adhesive layer 24 and the copper foil layer 22 can be 10-30 μm. In the prior art, the thickness of the copper foil layer is generally 30 μm. The copper foil layer 22 of this disclosure can be thinned by 10 μm or 15 μm compared to the prior art. This embodiment takes a 10 μm reduction as an example, that is, the thickness of the copper foil layer 22 in this embodiment can be 20 μm. Thus, the thickness of the conductive adhesive layer 24 located between the support layer 21, the copper foil layer 22, and the conductive adhesive 3 can be 10 μm. That is, a 10 μm thick conductive adhesive layer 24 is used to bond the support layer 21 to the copper foil layer 22 and the support layer 21, keeping the longitudinal (Z-direction) thickness of the display module unchanged and not affecting the overall device. In some embodiments, in the above-mentioned display module provided in the embodiments of this disclosure, such as Figure 3 and Figure 4As shown, the thickness of the conductive adhesive layer 24 is [value], and the thickness of the copper foil layer 22 is [value]. Furthermore, the copper foil layer 22 can achieve full-surface conductivity with the bottom conductive adhesive layer 24 through the filled conductive adhesive 3, ensuring the grounding effect of the entire machine.

[0048] In some embodiments, in the display module provided in the present disclosure, such as Figure 3 and Figure 4 As shown, the light gray copper foil layer 22 represents the area requiring conductivity for the entire device, while the dark gray conductive adhesive layer 3 represents the flexible circuit board (FPC) bonding area and the device's grounding area (GND). The FPC bonding area adheres to the back of the flexible circuit board after bonding, and this area will not be exposed to the testing environment. Therefore... Figure 3 and Figure 4 The structure shown can improve the salt spray resistance of the copper foil layer 22 itself, while reducing the exposed area of ​​the copper foil layer 22 surface. This prevents the copper foil layer 22 from forming a galvanic cell with the frame of the whole machine to generate alkali under salt spray related test environment, thereby avoiding alkali damage to the display panel 1 and avoiding delamination of the display panel 1.

[0049] In some embodiments, in the display module provided in the present disclosure, such as Figures 5-7 As shown, the thickness of the copper foil layer 22 can be 10–30 μm. The support component 2 also includes conductive layers 25 located in the flexible circuit board bonding area (FPC) and the grounding area (GND), respectively, and located between the support layer 21 and the conductive adhesive 3. Each conductive layer 25 covers a portion of the copper foil layer 22 surrounding the hollow structure V. Specifically, the material of the conductive layer 25 includes, but is not limited to, at least one of nickel, gold, silver, and graphite. The thickness of the conductive layer 25 is generally less than 1 μm and does not affect the overall thickness of the support component 2. Specifically, in this embodiment, the thickness of the copper foil layer 22 can be the same as in related technologies, for example, 30μm. An insulating protective layer 23 is formed on the surface of the copper foil layer 22 facing away from the display panel 1, which can prevent the copper foil layer 22 from forming a galvanic cell in the frame under salt spray environment without affecting the overall thickness. In this embodiment, the support layer 21 is nickel-plated at the cutout position of the copper foil layer 22 to form a conductive layer 25. Each conductive layer 25 covers part of the copper foil layer 22 outside the cutout structure V, that is, the nickel-plated area is larger in shape than the cutout area of ​​the copper foil layer 22 (it can be expanded according to the nickel plating accuracy, copper foil layer die-cutting accuracy and copper foil layer attachment accuracy to ensure that the copper foil layer 22 is connected to the nickel-plated area and the conductive adhesive 3). The copper foil layer 22 can achieve full-surface conductivity through the conductive layer 25 (nickel-plated area) and the conductive adhesive 3 to ensure the grounding effect of the whole machine. Meanwhile, this embodiment can reduce the exposed area of ​​the copper foil layer 22, preventing the copper foil layer 22 and the whole frame from forming a galvanic cell and generating alkali under salt spray related test environment, avoiding alkali damage to the display panel and avoiding delamination of the internal interface of the display panel.

[0050] In some embodiments, in the display module provided in the present disclosure, such as Figure 5 and Figure 6 As shown, the light gray copper foil layer 22 is the area requiring conductivity for the entire device, the dark gray conductive adhesive 3 area is the flexible circuit board bonding area (FPC) and the device's grounding area (GND), and the square area surrounding the grounding area (GND) is the conductive layer 25 (nickel-plated area). Specifically, the cutout area between the conductive adhesive 3 and the copper foil layer 22 can be formed through a transfer process. Therefore, the attachment tolerance needs to be considered. That is, the conductive adhesive 3 needs to be shrunk inward or the cutout area of ​​the copper foil layer 22 needs to be expanded outward according to the attachment tolerance. Since the copper foil layer 22 and the conductive adhesive 3 are not connected, the conductive layer 25 (nickel-plated area) needs to expand the cutout area of ​​the copper foil layer 22 to ensure that the conductive layer 25 (nickel-plated area) and the copper foil layer 22 are in complete contact. After the conductive adhesive 3 is bonded to the conductive layer 25 (nickel-plated area), the copper foil layer 22 can achieve full-surface conductivity through the conductive layer 25 (nickel-plated area) and the filled conductive adhesive 3, ensuring the grounding effect of the entire device. This embodiment can improve the salt spray resistance of the copper foil layer 22 itself, while reducing the exposed area of ​​the copper foil layer 22 surface. This prevents the copper foil layer 22 from forming a galvanic cell with the frame of the whole machine to generate alkali under salt spray related test environment, thus avoiding alkali damage to the display panel 1 and avoiding delamination of the internal interface of the display panel 1.

[0051] It should be noted that the area of ​​the conductive layer 25 (nickel-plated area) is not limited to the hollow area of ​​the copper foil layer 22. The surface plating treatment can be carried out according to the shape of the copper foil layer 22 to improve the electrical and thermal conductivity of the copper foil layer 22 and the conductive layer 25 (nickel-plated area).

[0052] In some embodiments, in the display module provided in the present disclosure, such as Figures 3-7 As shown, the insulating protective layer 23 can be made of acrylic resin, which can prevent the copper foil layer 22 from forming a galvanic cell with the middle frame.

[0053] In some embodiments, in the display module provided in the present disclosure, such as Figure 8 As shown, the insulating protective layer 23 can be made of insulating tape. The insulating tape has a cutout structure V in the flexible circuit board bonding area (FPC) and the grounding area (GND), exposing the copper foil layer 22. Specifically, compared with the prior art, this embodiment can reduce the thickness of the copper foil layer 22 by 10μm, for example, the thickness of the thinned copper foil layer 22 is 20μm. A 10μm layer of insulating tape is attached to the surface of the copper foil layer 22 facing away from the display panel 1. The insulating tape can prevent the copper foil layer 22 from forming a galvanic cell with the middle frame in a salt spray environment, avoiding corrosion. It also prevents the copper foil layer 22 from forming a galvanic cell with the middle frame of the whole machine to generate alkali in salt spray related test environments, avoiding alkali damage to the display panel 1 and preventing delamination of the internal interface of the display panel 1. Furthermore, the insulating tape is cut out in the flexible circuit board bonding area (FPC) and the grounding area (GND) to ensure that the grounding position of the whole machine is conductive.

[0054] In some embodiments, in the display module provided in the present disclosure, such as Figure 9 As shown, the insulating protective layer 23 can be made of conductive resin, and the insulating protective layer 23 completely covers the copper foil layer 22. Specifically, in this embodiment, a layer of conductive resin is coated on the surface of the copper foil layer 22 away from the display panel 1. The conductive resin can include acrylic resin and conductive particles dispersed in the acrylic resin. That is, conductive particles are added when coating the acrylic resin. This design can prevent the copper foil layer 22 from oxidizing and also prevent the copper foil layer 22 from corroding in the salt spray environment. It can also prevent the copper foil layer 22 from forming a galvanic cell with the frame of the whole machine to generate alkali under salt spray related test environment, avoid alkali damage to the display panel, avoid delamination of the internal interface of the display panel, and the conductive resin can be electrically connected to the flexible circuit board and ensure the grounding effect of the whole machine.

[0055] In some embodiments, in the display module provided in the present disclosure, such as Figure 4 , Figure 6 , Figure 8 and Figure 9 As shown, it also includes: an adhesive layer 4 located between the display panel 1 and the support layer 21, an optical adhesive layer 5 located on the side of the display panel 1 away from the support layer 21, and a cover plate 6 located on the side of the optical adhesive layer 5 away from the support layer 21.

[0056] It should be noted that other essential components in the display module are all known to those skilled in the art and will not be described in detail here, nor should they be construed as limiting this disclosure.

[0057] Based on the same inventive concept, this utility model embodiment also provides a display device, including:

[0058] The display module described above is provided in the embodiments of this disclosure;

[0059] The metal frame has a receiving cavity in which the display module is located.

[0060] The display device provided in this embodiment of the present disclosure, by using the display module provided in this embodiment of the present disclosure, can prevent the formation of a galvanic cell between the frame and the copper foil layer in a salt spray environment, thereby avoiding electrochemical reactions, preventing the formation of an alkaline environment, avoiding interface delamination inside the display panel, and improving the durability of the display panel.

[0061] The display device provided in this disclosure can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. Implementation of this display device can refer to the embodiments of the display panel described above; repeated details will not be repeated.

[0062] In specific implementation, the display module provided in the embodiments of this disclosure is a liquid crystal display module or an OLED display module. The display module also includes other necessary components and parts, such as a housing, a main circuit board, a power cord, etc. Those skilled in the art can make corresponding additions according to the specific usage requirements of the display device, which will not be elaborated here and should not be regarded as a limitation of this disclosure.

[0063] In specific implementation, the display device provided in the embodiments of this disclosure can be as follows: Figure 10 The image shows a full-screen mobile phone. Of course, the display device provided in this embodiment can also be any product or component with display function, such as a tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. Other essential components of this display device are understood by those skilled in the art and will not be described in detail here, nor should they be construed as limitations on this disclosure. This display device includes, but is not limited to: a radio frequency unit, a network module, an audio output & input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. Furthermore, those skilled in the art will understand that the above structure does not constitute a limitation on the display device provided in this embodiment. In other words, the display device provided in this embodiment may include more or fewer of the above components, or combine certain components, or have different component arrangements.

[0064] The present invention discloses a display module and display device. By providing an insulating protective layer on the side of the copper foil layer away from the display panel, the insulating protective layer can effectively prevent the formation of a galvanic cell between the frame of the whole machine and the copper foil layer under salt spray environment, thereby avoiding electrochemical reaction, preventing the formation of an alkaline environment, avoiding interface delamination inside the display panel, and improving the tolerance of the display panel; and the copper foil layer can realize the grounding of the whole machine and realize the heat dissipation function of the whole machine.

[0065] Although preferred embodiments of this disclosure have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this disclosure.

[0066] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this disclosure without departing from the spirit and scope of the embodiments of this disclosure. Therefore, if these modifications and variations to the embodiments of this disclosure fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include these modifications and variations.

Claims

1. A display module, wherein, Includes a display panel and a support assembly located on the non-display side of the display panel; The support components include: Support layer; A copper foil layer is located on the side of the support layer opposite to the display panel, and the copper foil layer includes a flexible circuit board bonding area and a contact area; An insulating protective layer is located on the side of the copper foil layer opposite to the display panel, and the insulating protective layer covers at least the area of ​​the copper foil layer other than the flexible circuit board bonding area and the contact area.

2. The display module as described in claim 1, wherein, Both the flexible circuit board bonding area and the contact area are provided with a hollow structure that penetrates the copper foil layer and the insulating protective layer, and each hollow structure is filled with conductive adhesive.

3. The display module as described in claim 2, wherein, The insulating protective layer completely covers the copper foil layer.

4. The display module as described in claim 3, wherein, The support assembly also includes a conductive adhesive layer located between the support layer, the copper foil layer, and the conductive adhesive, the conductive adhesive layer completely covering the overall structure formed by the copper foil layer and the conductive adhesive.

5. The display module as described in claim 4, wherein, The combined thickness of the conductive adhesive layer and the copper foil layer is 10~30μm.

6. The display module as described in claim 3, wherein, The support assembly further includes conductive layers located in the flexible circuit board bonding area and the contact area, respectively, and located between the support layer and the conductive adhesive, with each conductive layer covering a portion of the copper foil layer surrounding the hollow structure.

7. The display module as described in claim 6, wherein, The thickness of the copper foil layer is 10~30μm, and the thickness of the conductive layer is less than 1μm.

8. The display module as described in any one of claims 2-7, wherein, The material of the insulating protective layer includes acrylic resin.

9. The display module as described in claim 1, wherein, The insulating protective layer is made of insulating tape, and the insulating tape has a hollow structure in the bonding area of ​​the flexible circuit board and the contact area, and the hollow structure exposes the copper foil layer.

10. The display module as claimed in claim 1, wherein, The insulating protective layer is made of conductive resin and completely covers the copper foil layer.

11. The display module as claimed in claim 10, wherein, The conductive resin includes acrylic resin and conductive particles dispersed within the acrylic resin.

12. A display device, wherein, include: The display module as described in any one of claims 1-11; A metal frame having a receiving cavity, the display module being located within the receiving cavity.

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