A multi-winding interleaved high frequency transformer
Patent Information
- Application Number
- CN202521370527.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-01
- Publication Date
- 2026-09-04
- Estimated Expiration
- 2035-07-01
AI Technical Summary
上述高频变压器在使用中为了优化变压器传输效率,采用了多绕组设计,而随着小体积的多绕组结构高频变压器的长时间使用,其绕组产生的热量也会堆积,这就使此类变压器使用时产生的温度会更高,而此类变压器本身并不具备有效的防止积热和降温结构,会导致长期的使用环境内存在安全隐患,为此提出了一种多绕组交错的高频变压器
1、本实用新型通过储液板内部的储液腔以及两侧与液冷通道的连通,使得微型水泵驱动形成循环冷却过程,配合风机架一侧贴合的散热鳍片和风机架形成持续散热过程,从而与内部绕组的导热过程配合,达到有效的内外部同步散热降温目的,减少使用隐患。
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Figure CN224720673U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of transformer technology, specifically to a high-frequency transformer with multiple interleaved windings. Background Technology
[0002] High-frequency transformers are core components in power electronic systems for processing high-frequency signals. Their design must consider electromagnetic performance, heat dissipation, and structural compactness. In practical applications, they can be used as high-frequency switching power supply transformers in high-frequency switching power supplies, as well as high-frequency inverter power supply transformers in high-frequency inverter welding machines. High-frequency transformers typically include a frame, a magnetic core, and coils. The coils have two or more windings, which can be used as input windings and output windings, respectively, and are wound on the frame. Through magnetoelectric reaction with the magnetic core, they achieve the transformation function. High-frequency transformers are widely used and are a common type of transformer.
[0003] The existing multi-winding interleaved core design of high-frequency transformers revolves around a high-frequency magnetic core, multiple sets of coils, and high-frequency optimization components. It generally includes a primary winding and multiple secondary windings, such as auxiliary power supply and feedback isolation. The winding turns ratio determines the output voltage. Generally, a stacked, interleaved, or mixed arrangement is adopted to reduce leakage inductance and distributed capacitance and optimize the high-frequency signal transmission efficiency.
[0004] While the aforementioned existing technologies have significant beneficial effects, they still have shortcomings: In order to optimize the transmission efficiency of the high-frequency transformers mentioned above, a multi-winding design is adopted. However, with the long-term use of high-frequency transformers with small volume and multi-winding structure, the heat generated by the windings will also accumulate, which will make the temperature generated by such transformers even higher during use. Such transformers themselves do not have an effective structure to prevent heat accumulation and cool down, which will lead to safety hazards in the long-term use environment. Therefore, a high-frequency transformer with multi-winding interleaved is proposed. Utility Model Content
[0005] To address the shortcomings of existing technologies, this utility model provides a high-frequency transformer with multiple interleaved windings. By transferring heat to the liquid storage plate through copper strips wound and embedded in the multiple windings, heat is dissipated again, achieving internal high-temperature conduction. Externally, the transformer housing is connected to the coolant in the liquid storage plate through a liquid cooling channel, forming a circulating liquid cooling process. Combined with the continuous cooling of the semiconductor refrigeration chip, this achieves effective internal and external simultaneous heat dissipation and cooling, reducing potential safety hazards during use.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a multi-winding interleaved high-frequency transformer, comprising a transformer body, an integrated heat dissipation mechanism connected to one side of the transformer body, the integrated heat dissipation mechanism comprising a liquid storage plate, an outlet pipe fixed to one side of the liquid storage plate, an inlet pipe fixed to the other side of the liquid storage plate, a micro water pump connected to the middle of the inlet pipe, a liquid storage cavity opened inside the liquid storage plate, a silicone grease layer attached to the other side of the liquid storage plate, a semiconductor cooling chip attached to one side of the silicone grease layer, a heat dissipation fin fixed to one side of the semiconductor cooling chip, and a fan frame attached to one side of the heat dissipation fin.
[0007] Preferably, the fan frame is fixedly connected to both sides of the semiconductor cooling chip, and the heat dissipation fins are arranged at equal intervals along one side of the outer wall of the semiconductor cooling chip.
[0008] Preferably, one side of the semiconductor cooling chip is attached to one side of the liquid reservoir plate, and the silicone grease layer is evenly distributed along the gap between the liquid reservoir plate and the semiconductor cooling chip.
[0009] Preferably, the liquid storage chamber is evenly distributed along the inside of the liquid storage plate, and the liquid storage plate is fixed to both sides of the transformer body through liquid inlet pipes and liquid outlet pipes on both sides.
[0010] Preferably, the micro water pump is connected to the liquid storage chamber via an inlet pipe, and the liquid storage chamber is connected to both sides of the transformer body via an inlet pipe and an outlet pipe.
[0011] Preferably, the transformer body includes a transformer housing, a base frame is fixed to the bottom of the transformer housing, a liquid cooling channel is opened inside the transformer housing, connecting pipes are connected to both sides of the liquid cooling channel, a winding is arranged at the center of the transformer housing, copper strips are wound inside the winding, a heat-conducting plate is fixed to the bottom of the copper strips, and a liquid storage plate is welded to one end of the heat-conducting plate.
[0012] Preferably, the copper strip is connected to the liquid storage plate via a heat-conducting sheet, and an insulating film is wound around the surface of the copper strip.
[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. This utility model enables a micro water pump to drive a circulating cooling process through the liquid storage chamber inside the liquid storage plate and the connection between the liquid cooling channels on both sides. This, together with the heat dissipation fins attached to one side of the fan frame and the fan frame, forms a continuous heat dissipation process. This, in conjunction with the heat conduction process of the internal windings, achieves effective internal and external synchronous heat dissipation and cooling, reducing potential safety hazards.
[0014] 2. This high-frequency transformer transfers heat to the heat-conducting plates by winding and embedding copper strips in multiple windings. The heat-conducting plates are connected to the liquid storage plate. As the heat conduction process continues, the heat is continuously transferred to the liquid storage plate and then dissipated again, realizing the internal high-temperature conduction. Externally, it cooperates with the liquid cooling channel opened inside the transformer shell to connect with the coolant in the liquid storage plate to form a circulating liquid cooling process.
[0015] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained by means of the structures pointed out in the description, claims, and drawings. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of the main body of this utility model; Figure 2 This is a top view of the internal structure of the transformer body of this utility model; Figure 3 This is a three-dimensional structural diagram of the integrated heat dissipation mechanism of this utility model; Figure 4 This is a top view of the internal structure of the liquid storage plate in the integrated heat dissipation mechanism of this utility model.
[0017] In the diagram: 1. Transformer body; 101. Transformer shell; 102. Base frame; 103. Liquid cooling channel; 104. Connecting pipe; 105. Winding; 106. Copper strip; 107. Heat-conducting plate; 2. Integrated heat dissipation mechanism; 201. Liquid storage plate; 202. Liquid outlet pipe; 203. Liquid inlet pipe; 204. Miniature water pump; 205. Liquid storage chamber; 206. Silicon grease layer; 207. Semiconductor cooling chip; 208. Heat dissipation fins; 209. Fan frame. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0019] Please see Figure 1-4This embodiment of a multi-winding interleaved high-frequency transformer includes a transformer body 1. An integrated heat dissipation mechanism 2 is connected to one side of the transformer body 1. The transformer body 1 includes a transformer housing 101. A base frame 102 is fixed to the bottom of the transformer housing 101. A liquid cooling channel 103 is opened inside the transformer housing 101. Connecting pipes 104 are connected to both sides of the liquid cooling channel 103. A winding 105 is arranged at the center of the transformer housing 101. A copper strip 106 is wound inside the winding 105. A heat-conducting plate 107 is fixed to the bottom of the copper strip 106. A liquid storage plate 201 is welded to one end of the heat-conducting plate 107.
[0020] like Figure 1-4 As shown, the high-frequency transformer in this invention is similar in structure to existing high-frequency transformers. The main improvement of this invention lies in the fact that heat is transferred to the liquid storage plate 201 by the copper strips 106 wound and embedded in the multi-winding 105, and then dissipated again, achieving internal high-temperature conduction. Externally, the liquid cooling channel 103 inside the transformer housing 101 is connected to the coolant in the liquid storage plate 201 to form a circulating liquid cooling process, which is combined with the continuous cooling of the semiconductor cooling chip 207 to achieve effective internal and external synchronous heat dissipation and cooling, reducing potential safety hazards. In this invention, the semiconductor cooling chip 207 and the fan frame 209 are both existing technologies. When using this high-frequency transformer, the user can solder and fix the base frame 102 at the bottom of the transformer housing 101 with the pins and the mounting circuit board, and fix the semiconductor cooling chip 207 and the fan frame 209. 09 and the micro water pump 204 are connected to the power supply. After installation, they can be put into use. During operation, the heat generated by the internal multi-layer winding 105 structure is transferred to the three sets of copper strips 106. The copper strips 106 transfer the heat to the heat-conducting plate 107, and then to the liquid storage plate 201 for heat dissipation, reducing the heat accumulation in the internal winding 105 and achieving the purpose of lowering the temperature. The heat is transferred to the heat-conducting plate 107 by the copper strips 106 wound and embedded in the multi-winding 105. The heat-conducting plate 107 is connected to the liquid storage plate 201. As the heat conduction process continues, the heat is continuously transferred to the liquid storage plate 201 and then dissipated again, realizing the internal high temperature conduction. Externally, it cooperates with the liquid cooling channel 103 opened inside the transformer shell 101 to connect with the coolant in the liquid storage plate 201 to form a circulating liquid cooling process.
[0021] like Figure 2-3As shown, the integrated heat dissipation mechanism 2 includes a liquid storage plate 201. An outlet pipe 202 is fixed to one side of the liquid storage plate 201, and an inlet pipe 203 is fixed to the other side. A micro water pump 204 is connected to the middle of the inlet pipe 203. A liquid storage chamber 205 is formed inside the liquid storage plate 201. A silicone grease layer 206 is attached to the other side of the liquid storage plate 201. A semiconductor cooling chip 207 is attached to one side of the silicone grease layer 206, and a heat dissipation device is fixed to one side of the semiconductor cooling chip 207. The heat sink fins 208 have a fan frame 209 attached to one side. During operation, the high-frequency transformer is driven by a micro water pump 204. The inlet pipe 203 is connected to the liquid cooling channel 103 inside the transformer housing 101, allowing coolant to be drawn from the liquid cooling channel 103, cooled through the storage chamber 205, and then returned to the liquid cooling channel 103 via the outlet pipe 202 on the other side, forming a circulation process. When the coolant is in the liquid... After the cold channel 103 absorbs the heat from the main body, it circulates into the liquid storage chamber 205. At this time, the liquid storage plate 201 and the semiconductor cooling chip 207 remain in contact. The continuous cooling of the semiconductor cooling chip 207 lowers the temperature of the contacted liquid storage plate 201, thereby rapidly reducing the temperature of the incoming coolant. It continues to dissipate heat during the circulation process. The heating surface on the other side of the semiconductor cooling chip 207 is connected to the distributed heat dissipation fins 208. Together with the fan frame 209, the heat stored in the heat dissipation fins 208 is continuously discharged and cooled, completing the heat dissipation process. This structure, through the liquid storage chamber 205 inside the liquid storage plate 201 and the connection between the two sides and the liquid cooling channel 103, enables the micro water pump 204 to drive a circulating cooling process. Together with the heat dissipation fins 208 attached to one side of the fan frame 209 and the fan frame 209, a continuous heat dissipation process is formed. This, in conjunction with the heat conduction process of the internal windings, achieves effective internal and external synchronous heat dissipation and cooling, reducing potential safety hazards.
[0022] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A multi-winding interleaved high-frequency transformer, comprising a transformer body (1), characterized in that, An integrated heat dissipation mechanism (2) is connected to one side of the transformer body (1). The integrated heat dissipation mechanism (2) includes a liquid storage plate (201). An outlet pipe (202) is fixed to one side of the liquid storage plate (201). An inlet pipe (203) is fixed to the other side of the liquid storage plate (201). A micro water pump (204) is connected to the middle of the inlet pipe (203). A liquid storage chamber (205) is opened inside the liquid storage plate (201). A silicone grease layer (206) is attached to the other side of the liquid storage plate (201). A semiconductor cooling chip (207) is attached to one side of the silicone grease layer (206). A heat dissipation fin (208) is fixed to one side of the semiconductor cooling chip (207). A fan frame (209) is attached to one side of the heat dissipation fin (208).
2. A high-frequency transformer with multiple interleaved windings according to claim 1, characterized in that, The fan frame (209) is fixedly connected to both sides of the semiconductor cooling chip (207), and the heat dissipation fins (208) are arranged at equal intervals along one side of the outer wall of the semiconductor cooling chip (207).
3. A high-frequency transformer with multiple interleaved windings according to claim 1, characterized in that, The semiconductor cooling chip (207) is attached to one side of the liquid storage plate (201), and the silicone grease layer (206) is evenly distributed along the gap between the liquid storage plate (201) and the semiconductor cooling chip (207).
4. A high-frequency transformer with multiple interleaved windings according to claim 1, characterized in that, The liquid storage chamber (205) is evenly opened along the inside of the liquid storage plate (201), and the liquid storage plate (201) is fixed to both sides of the transformer body (1) through the liquid inlet pipe (203) and liquid outlet pipe (202) on both sides.
5. A high-frequency transformer with multiple interleaved windings according to claim 1, characterized in that, The micro water pump (204) is connected to the liquid storage chamber (205) through the liquid inlet pipe (203), and the liquid storage chamber (205) is connected to both sides of the transformer body (1) through the liquid inlet pipe (203) and the liquid outlet pipe (202).
6. A high-frequency transformer with multiple interleaved windings according to claim 1, characterized in that, The transformer body (1) includes a transformer housing (101), a base frame (102) is fixed at the bottom of the transformer housing (101), a liquid cooling channel (103) is opened inside the transformer housing (101), connecting pipes (104) are connected to both sides of the liquid cooling channel (103), a winding (105) is arranged at the center of the transformer housing (101), a copper strip (106) is wound inside the winding (105), a heat-conducting plate (107) is fixed at the bottom of the copper strip (106), and a liquid storage plate (201) is welded to one end of the heat-conducting plate (107).
7. A multi-winding interleaved high-frequency transformer according to claim 6, characterized in that, The copper strip (106) is connected to the liquid storage plate (201) through a heat-conducting sheet (107), and an insulating film is wound on the surface of the copper strip (106).