Conductor assembly and coil structure

Abstract

The utility model discloses an embodiment of a kind of conductor assembly and coil structure. Among them, conductor assembly includes protective film, wire and two positioning components, protective film includes bearing part and positioning part, wire two ends form first wire outlet end, two positioning components are correspondingly set with two first wire outlet end, and each positioning component includes superimposed second adhesive layer, heat insulation layer and third adhesive layer. By setting positioning component connection positioning part and first wire outlet end, the influence of heating on second adhesive layer and third adhesive layer is reduced using heat insulation layer, effectively positioning wire and avoiding the influence of heating on wire positioning, improve yield.

Description

Technical Field

[0001] This utility model relates to the field of coil equipment technology, specifically to a conductor assembly and a coil structure. Background Technology

[0002] Most wireless chargers operate based on the principles of electromagnetic induction or magnetic resonance, typically using a coil to achieve wireless energy transfer between the charger and the device being charged. To meet requirements such as shielding against external interference or providing lead terminals, a wire is often placed around the coil during the manufacturing process. In the manufacturing process, the wire and coil are separately mounted on pads before assembly. However, due to the low structural strength of the wire, the bond between the wire and the pad is easily affected by the high temperatures during the process, resulting in a significant risk of wire deformation. Furthermore, errors can easily accumulate during repeated assembly and transportation, ultimately leading to a high product defect rate. Utility Model Content

[0003] In view of this, the purpose of this utility model is to provide a conductor assembly and coil structure that effectively positions the wire and avoids the influence of heating on the wire positioning, thereby improving the yield.

[0004] In a first aspect, embodiments of the present invention provide a conductor assembly, comprising:

[0005] The protective film includes a carrier part and a positioning part, with the positioning part connected to one end of the carrier part;

[0006] The wire is connected to the bearing part through the first adhesive layer, and the two ends of the wire extend to the positioning part to form two first outgoing ends;

[0007] Two positioning components are provided, corresponding to two first outgoing terminals. Each positioning component includes a stacked second adhesive layer, a heat insulation layer, and a third adhesive layer. The second adhesive layer is connected to the first outgoing terminal, and the third adhesive layer is connected to the positioning part.

[0008] Optionally, a first gap is formed between the positioning part and the bearing part, and the positioning component is disposed on the side of the positioning part away from the bearing part.

[0009] Optionally, a solder portion is formed on each first output terminal, and two second gaps are formed on the carrier portion at positions corresponding to the two solder portions.

[0010] Optionally, a third gap is provided between the two second gaps, and a support portion is formed between the second gap and the third gap.

[0011] Optionally, the wire and the first adhesive layer are formed in a C-shape, and the width of the first adhesive layer is greater than the diameter of the wire.

[0012] Optionally, the thickness of the insulation layer ranges from 0.5 mm to 10 mm, and the thickness of the first adhesive layer, the second adhesive layer, and the third adhesive layer ranges from 0.02 mm to 0.2 mm.

[0013] Secondly, this utility model embodiment provides a coil structure, including:

[0014] As before, conductor components;

[0015] The coil assembly is fixed to the conductor assembly and covers the wires by a fourth adhesive layer.

[0016] Optionally, the coil assembly includes a substrate and a coil body, a fourth adhesive layer is disposed corresponding to and has the same shape as the first adhesive layer, the coil body is fixed on the substrate, and the fourth adhesive layer surrounds the outside of the coil body.

[0017] Optionally, one end of the coil body extends into the third gap of the protective film to form a second lead end.

[0018] Optionally, the second lead is located between the two first leads, and the substrate is configured to cover the coil body and expose the second lead.

[0019] Optionally, a through hole is formed on the substrate, and one end of the coil body away from the second lead-out end extends into the through hole to form a third lead-out end.

[0020] Optionally, the width of the fourth adhesive layer is the same as the width of the first adhesive layer, and the thickness of the fourth adhesive layer after bonding with the first adhesive layer is the same as the diameter of the coil body.

[0021] This utility model provides a conductor assembly and a coil structure. The conductor assembly includes a protective film, a wire, and two positioning components. The protective film includes a carrier portion and a positioning portion. The two ends of the wire form first lead-out terminals. The two positioning components are correspondingly arranged with the two first lead-out terminals. Each positioning component includes a stacked second adhesive layer, a heat insulation layer, and a third adhesive layer. By setting the positioning components to connect the positioning portion and the first lead-out terminals, and utilizing the heat insulation layer to reduce the impact of heating on the second and third adhesive layers, the wire is effectively positioned and the impact of heating on wire positioning is avoided, thereby improving the yield. Attached Figure Description

[0022] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which:

[0023] Figure 1 This is a three-dimensional structural schematic diagram of a conductor assembly according to an embodiment of the present invention;

[0024] Figure 2 This is an enlarged cross-sectional schematic diagram of the positioning component according to an embodiment of the present invention;

[0025] Figure 3 This is a front view of the conductor assembly according to an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the back of a conductor assembly according to an embodiment of the present invention;

[0027] Figure 5 This is a perspective view of a conductor assembly and a coil assembly according to an embodiment of the present invention;

[0028] Figure 6 This is a side view of the coil structure after assembly according to an embodiment of the present invention;

[0029] Figure 7 This is a three-dimensional structural schematic diagram of a coil assembly according to an embodiment of the present invention;

[0030] Figure 8 This is a front view of a conductor assembly after cutting, according to one embodiment of the present invention;

[0031] Figure 9 This is a front view of the assembled coil structure according to one embodiment of the present invention.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1-Protective film; 11-Carrier part; 12-Positioning part; 13-First gap; 14-Second gap; 15-Third gap; 16-Supporting part; 21-Wire; 22-First lead-out end; 23-Soldering part; 3-First adhesive layer; 4-Positioning component; 41-Second adhesive layer; 42-Heat insulation layer; 43-Third adhesive layer; 5-Substrate; 61-Coil body; 62-Second lead-out end; 63-Fourth adhesive layer; 64-Through hole; 65-Third lead-out end. Detailed Implementation

[0034] The present application is described below based on embodiments, but it is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without these details. To avoid obscuring the substance of the present application, well-known methods, processes, flows, elements, and circuits are not described in detail.

[0035] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0036] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] For ease of explanation, spatially related terms such as “inside,” “outside,” “below,” “below,” “lower,” “above,” “upper,” etc., are used herein to describe the relationship between one element or feature illustrated in the figure and another. It will be understood that spatially related terms may be intended to encompass different orientations of the device in use or operation besides those depicted in the figure. For example, if the device in the figure is flipped, an element described as “below” or “below” another element or feature would then be positioned “above” that other element or feature. Thus, the exemplified term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially related descriptive terms used herein should be interpreted accordingly.

[0038] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".

[0039] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0040] The main body of the coil structure consists of conductors and coils. The conductors and coils are each formed on their respective supporting structures, and then combined through a process to ultimately form a complete coil structure. The conductors are adhered to the supporting structure by an adhesive layer. During the conductor formation process, the lead-out ends of the conductors need to be de-coated and tinned to facilitate direct electrical connection to external components during use. During de-coating and tinning, the instantaneous high temperature generated at the lead-out ends is conducted to the adhesive layer at approximately 200°C. At this temperature, the adhesive layer experiences a brief decrease in adhesion, failing to effectively fix the conductor, i.e., adhesive separation. The conductor then experiences stress release, resulting in severe deformation, affecting subsequent processes and product yield.

[0041] Reference Figure 1The conductor assembly of this embodiment includes a protective film 1, a wire 21, and two positioning components 4. Since the protective film 1 needs to be peeled off in subsequent processes, it is typically made of a material that is easy to peel off, such as release paper. The protective film 1 includes a supporting portion 11 and a positioning portion 12. The positioning portion 12 is connected to one end of the supporting portion 11, forming a first gap 13 between the positioning portion 12 and the supporting portion 11. The positioning components 4 are disposed on the side of the positioning portion 12 away from the supporting portion 11. The positioning portion 12 and the positioning components 4 are separately added structures for positioning the first lead-out end 22, and will be removed by laser cutting in subsequent processes. The first gap 13 reduces material usage, achieving positioning only through the small area of ​​the positioning portion 12, saving material and reducing costs. Depending on the actual situation, the size of the positioning portion 12 can be set to be the same length as the supporting portion 11, or only slightly longer than the formed length of the first lead-out end 22. The width of the positioning portion 12 can be adjusted as needed to better position the first lead-out end 22. Furthermore, the distance between the positioning part 12 and the bearing part 11 can be adjusted as needed to facilitate subsequent cutting processes.

[0042] like Figure 1 As shown, the support portion 11 provides a support structure for positioning the wire 21. The wire 21 is connected to the support portion 11 via a first adhesive layer 3, which is typically made of pressure-sensitive adhesive. Depending on the specific requirements, other adhesives may also be used. The wire 21 works in conjunction with the coil to provide auxiliary functions. Depending on the actual needs, the wire 21 can serve as part of a grounding loop to improve electromagnetic interference, or directly shield external interference. It can also provide solder points or lead-out terminals and play a certain positioning role with the coil. Both ends of the wire 21 extend to the positioning portion 12 to form two first lead-out terminals 22. These first lead-out terminals 22 are used to form a structure for electrical connection with external components in subsequent processes. Specifically, the wire 21 and the first adhesive layer 3 are C-shaped to effectively surround the coil. The width of the first adhesive layer 3 is greater than the diameter of the wire 21, better fixing the position of the wire 21. Depending on the specific requirements, the first adhesive layer 3 can be a single-layer pressure-sensitive adhesive layer or a multi-layer structure similar to the positioning component 4. Depending on the specific requirements, other adhesives may also be used as bonding materials.

[0043] Figure 2 It shows Figure 1 A locally enlarged structure of structure A in the middle. For example... Figures 1-4As shown, the positioning part 12 is used to position the first output terminal 22. The positioning part 12 is connected to the two first output terminals 22 through two positioning components 4, which are correspondingly arranged with the two first output terminals 22. By using the positioning part 12 to position the first output terminals 22 through the positioning components 4, it is easier to remove the excess part of the first output terminal 22 along with the positioning part 12 in subsequent processes, thereby improving production efficiency. After removing the positioning part 12, the structure of the protective film 1 can be simplified.

[0044] Reference Figure 2 Each positioning component 4 includes a stacked second adhesive layer 41, a heat insulation layer 42, and a third adhesive layer 43. The second adhesive layer 41 is connected to the first lead-out terminal 22, and the third adhesive layer 43 is connected to the positioning part 12. Specifically, pressure-sensitive adhesive is typically used as the material for the second adhesive layer 41 and the first adhesive layer 3 to achieve positioning. Depending on the actual situation, other adhesives can also be used as bonding materials for connection. The heat insulation layer 42 can slow down the heat transfer rate and disperse heat to achieve a certain degree of temperature uniformity, thereby reducing the impact of high temperature on the positioning of the first lead-out terminal 22 during the soldering and tinning of the wire 21, enabling the positioning component 4 to withstand a high temperature of approximately 250°C. Depending on the actual situation, the heat insulation layer 42 is typically made of materials such as silicone, mica sheets, ceramic fibers, or polyimide films, and a high-temperature resistant pressure-sensitive adhesive is used as the second adhesive layer 41 to improve heat insulation performance. Depending on the actual situation, other adhesives can also be used as bonding materials for connection. Furthermore, the number of first outgoing terminals 22 can be adjusted according to actual needs, and the number of positioning components 4 is the same as the number of first outgoing terminals 22 to achieve corresponding positioning. Depending on the actual situation, the first adhesive layer 3 can also adopt a structure of adhesive layer and heat insulation layer 42 stacked together, as with positioning component 4, to further improve heat insulation performance.

[0045] Reference Figure 3 , Figure 4When the enamel is removed and soldered, a momentary high temperature of approximately 200°C is generated on one side of the first lead-out terminal 22 and the positioning part 12. The temperature is first conducted along the first lead-out terminal 22 to the second adhesive layer 41. Subsequently, due to the barrier and buffering effect of the heat insulation pad, the heat is conducted to the third adhesive layer 43 at a slower rate, forming a temperature gradient and preventing concentrated heat rise. By using a high-temperature resistant pressure-sensitive adhesive for the second adhesive layer 41 and a heat insulation pad, the temperature rise of the third adhesive layer 43 is slower and the maximum temperature is lower, avoiding the viscosity reduction caused by the momentary high temperature. This allows for stable and reliable positioning of the first lead-out terminal 22 during enamel removal and soldering, preventing deformation and improving yield. Depending on the actual situation, other high-temperature resistant adhesives can also be used as the bonding material for the second adhesive layer 41. By positioning the first lead-out terminals 22, the two first lead-out terminals 22 can be in independent spaces, forming constraints and preventing mutual interference, ensuring their solderability. It should be understood that this embodiment and the accompanying drawings are merely examples. The solution of using the stacked structure of the positioning component 4 to achieve heat insulation is not limited to the process of removing varnish and tinning, but can also be applied to any scenario that will cause the wire 21 or coil to generate high temperature, such as welding.

[0046] Depending on the actual situation, the appropriate thickness of the heat insulation pad and adhesive layer can be selected. Specifically, the common thickness of the heat insulation pad is 0.5 mm to 10 mm. Thicker heat insulation pads have better heat insulation performance and can adapt to high-temperature environments, but they occupy more space, which is not conducive to ultra-thin electronic products, and the cost is higher and materials are wasted. Thinner heat insulation pads are lighter and save space, but the heat insulation effect is poor, the durability is low, and they are easily worn and torn. Based on the actual situation, the preferred thickness of the heat insulation pad in this embodiment is 2 mm to 5 mm, so as to achieve effective heat insulation while saving space. The common thickness of the pressure-sensitive adhesive layer is 0.02 mm to 0.2 mm. Thicker adhesive layers have stronger adhesion and are suitable for rough surfaces, but the flexibility is reduced, which can easily affect the appearance, cause the edges to peel off, and increase costs. Thinner adhesive layers are more invisible and can be suitable for precise bonding, but the adhesion is insufficient, they are easy to fall off, and the shear resistance is poor, which may lead to failure after long-term use. Based on actual conditions, the thickness of the first adhesive layer 3, the second adhesive layer 41, and the third adhesive layer 43 in this embodiment is preferably 0.05 mm to 0.1 mm to facilitate precise bonding and effective positioning. Different thicknesses can also be selected for different adhesive layers.

[0047] After completing the paint removal and tinning process, refer to Figure 1 , Figures 3-4Each first lead-out terminal 22 has a solder portion 23 formed thereon to facilitate the formation of a structure for electrical connection with external components in subsequent processes. Two second gaps 14 are cut out on the carrier portion 11 at positions corresponding to the two solder portions 23. Specifically, the second gaps 14 are formed when the carrier portion 11 is formed, to provide space for subsequent processes such as paint removal and tinning, while preventing adhesion of the first lead-out terminals 22. The formation of the second gaps 14 also facilitates the exposure of the solder portions 23 after the first lead-out terminals 22 are cut. Since the carrier portion 11 needs to be removed in the later stages of the process, exposing the solder portions 23 avoids the problem of the solder portions 23 and the first lead-out terminals 22 being lifted up during removal.

[0048] In some embodiments, refer to Figures 3-4 A third gap 15 is formed between the two second gaps 14, and a support portion 16 is formed between the second gap 14 and the third gap 15. The arrangement of the second gap 14 and the third gap 15 further reduces material usage and lowers costs. The support portion 16 can effectively guide the direction of the first outgoing terminal 22, allowing it to be exposed within the second gap 14. At the same time, since the support portion 16 is formed by hollowing out the second gap 14 and the third gap 15, the support portion 16 is actually a structure with the same thickness as the supporting portion 11, further reducing the weight and thickness of the conductor assembly.

[0049] Reference Figure 5 , Figure 6 , Figure 7 The coil structure of this embodiment includes a conductor assembly and a coil assembly as described above. The coil assembly is fixed to the conductor assembly by a fourth adhesive layer 63, which covers the wire 21, thus assembling the coil and conductor. The fourth adhesive layer 63 corresponds to and has the same shape as the first adhesive layer 3. The fourth adhesive layer 63 can be a pressure-sensitive adhesive or other materials that are easy to bond with pressure-sensitive adhesives. Through the combination of the first adhesive layer 3 and the fourth adhesive layer 63, the wire 21 can be more firmly connected to the substrate 5, facilitating the removal of the protective film 1 in subsequent processes without lifting the wire 21. Preferably, the width of the fourth adhesive layer 63 is the same as the width of the first adhesive layer 3 to facilitate better bonding and save material. Depending on the actual situation, the width of the fourth adhesive layer 63 can also be changed to better match the first adhesive layer 3, such as by using a wider or narrower fourth adhesive layer 63. Preferably, the thickness of the fourth adhesive layer 63 after bonding with the first adhesive layer 3 is the same as the diameter of the coil body 61 to ensure the stability of the internal structure. Depending on the actual situation and cost control, the fourth adhesive layer 63 can also be made slightly thinner.

[0050] It should be understood that this embodiment and the accompanying drawings are merely examples to illustrate the structural relationship between the conductor assembly and the coil assembly. In actual manufacturing processes, the positioning portion 12 and the positioning component 4 of the conductor assembly should have been removed after the tinning and soldering process, forming the structure shown below.Figure 6 , Figure 8 , Figure 9 The structure shown has a first lead-out terminal 22 with its top cut off to a solder portion 23 for easy electrical connection to external components in subsequent processes. By connecting different circuits, the conductor assembly can achieve different functions, such as shielding interference or enhancing induction intensity.

[0051] Reference Figures 5-7 The coil assembly includes a substrate 5 and a coil body 61. The coil body 61 is fixed to the substrate 5, and a fourth adhesive layer 63 surrounds the outside of the coil body 61. The substrate 5 is configured to cover the coil body 61 and expose a second lead end 62, providing a support structure for the coil body 61. A through-hole 64 is formed on the substrate 5. The coil body 61 is spirally formed on the substrate 5, with one end extending into the third gap 15 of the protective film 1 to form the second lead end 62, and the other end extending away from the second lead end 62 extending into the through-hole 64 to form a third lead end 65. Since the fourth adhesive layer 63 is disposed outside the coil body 61 and corresponds to the first adhesive layer 3, the wire 21 effectively surrounds the coil body 61, thus enabling the positioning of the coil body 61 and achieving effects such as shielding interference or enhancing induction after connection with external circuits.

[0052] like Figure 6 , Figure 9 As shown, the second output terminal 62 is located between the two first output terminals 22 and is independent of them. Since the first output terminal 22 is located within the second gap 14 and the second output terminal 62 is located within the third gap 15, the first output terminal 22 and the second output terminal 62 are actually separated by the support portion 16. The second output terminal 62 and the third output terminal 65 can be connected to an external circuit. Specifically, when the coil body 61 acts as a receiving component, the coil body 61 senses an external magnetic field and generates current; when the coil body 61 acts as a transmitting end, the coil body 61 generates an alternating magnetic field after being energized. In practice, since the substrate 5 also needs to be peeled off in subsequent processes, the connection between the substrate 5 and the coil body 61 is not fixed. The substrate 5 is typically made of a material that is easy to peel off.

[0053] This application provides a conductor assembly and a coil structure. The conductor assembly includes a protective film, a conductor, and two positioning components. The protective film includes a carrier portion and a positioning portion. The conductor has two first lead-out ends at both ends. The two positioning components are correspondingly disposed with the two first lead-out ends. Each positioning component includes a stacked second adhesive layer, a heat insulation layer, and a third adhesive layer. By using positioning components to connect the positioning portion and the first lead-out ends, and utilizing the heat insulation layer to reduce the impact of heating on the second and third adhesive layers, the conductor is effectively positioned, and the influence of heating on conductor positioning is avoided, thereby improving yield.

[0054] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A conductor assembly, characterized in that, The conductor assembly includes: The protective film includes a support portion and a positioning portion, wherein the positioning portion is connected to one end of the support portion; A wire is connected to the bearing portion through a first adhesive layer, and both ends of the wire extend to the positioning portion to form two first outgoing ends; Two positioning components are provided corresponding to the two first outgoing terminals. Each positioning component includes a stacked second adhesive layer, a heat insulation layer, and a third adhesive layer. The second adhesive layer is connected to the first outgoing terminal, and the third adhesive layer is connected to the positioning part.

2. The conductor assembly according to claim 1, characterized in that, A first gap is formed between the positioning part and the supporting part, and the positioning component is disposed on the side of the positioning part away from the supporting part.

3. The conductor assembly according to claim 1, characterized in that, A solder portion is formed on each of the first outgoing terminals, and two second gaps are formed on the bearing portion at positions corresponding to the two solder portions.

4. The conductor assembly according to claim 3, characterized in that, A third gap is provided between the two second gaps, and a support portion is formed between the second gap and the third gap.

5. The conductor assembly according to claim 1, characterized in that, The wire and the first adhesive layer are formed in a C-shape, and the width of the first adhesive layer is greater than the diameter of the wire.

6. The conductor assembly according to any one of claims 1-5, characterized in that, The thickness of the heat insulation layer ranges from 0.5 mm to 10 mm, and the thickness of the first adhesive layer, the second adhesive layer, and the third adhesive layer ranges from 0.02 mm to 0.2 mm.

7. A coil structure, characterized in that, The coil structure includes: The conductor assembly as described in any one of claims 1-6; The coil assembly is fixed to the conductor assembly and covers the wire by a fourth adhesive layer.

8. The coil structure according to claim 7, characterized in that, The coil assembly includes a substrate and a coil body. The fourth adhesive layer is disposed corresponding to the first adhesive layer and has the same shape. The coil body is fixed on the substrate, and the fourth adhesive layer surrounds the outside of the coil body.

9. The coil structure according to claim 8, characterized in that, One end of the coil body extends into the third gap of the protective film to form a second lead end.

10. The coil structure according to claim 9, characterized in that, The second lead-out terminal is located between the two first lead-out terminals, and the substrate is configured to cover the coil body and expose the second lead-out terminal.

11. The coil structure according to claim 9, characterized in that, A through hole is formed on the substrate, and one end of the coil body away from the second output end extends into the through hole to form a third output end.

12. The coil structure according to claim 8, characterized in that, The width of the fourth adhesive layer is the same as the width of the first adhesive layer, and the thickness of the fourth adhesive layer after bonding with the first adhesive layer is the same as the diameter of the coil body.

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