An equivalent architecture of hybrid dsp and equalizer immersed liquid-cooled active cable

Abstract

The application relates to a mixed DSP and equalizer equivalent architecture immersion liquid cooling active cable. The mixed DSP and equalizer equivalent architecture immersion liquid cooling active cable comprises a cable, a circuit board assembly and a separation assembly, and the circuit board assembly is electrically connected with the cable. The separation assembly comprises a shell and a first sealing piece. The shell seals the circuit board assembly, and the cable passes through the shell to be connected with the circuit board assembly. The first sealing piece is arranged between the cable and the shell to seal the connection position of the cable and the shell. The circuit board assembly is sealed by the shell, and the connection position of the cable and the shell is further sealed by the first sealing piece, so that the sealing property of the shell to the circuit board assembly is not reduced due to the cable passing through the shell, the circuit board assembly is isolated from the cooling liquid in the liquid cooling environment, and the deterioration problem of signal integrity of the active cable in the liquid cooling environment is relieved.

Description

Technical Field

[0001] This application relates to the field of active cable technology, and in particular to an equivalent architecture of a hybrid DSP and equalizer immersed liquid-cooled active cable. Background Technology

[0002] Liquid cooling refers to a technology that uses liquid as a cooling medium to exchange and dissipate heat from heat-generating components. The liquid used in the process is called coolant. Immersion liquid cooling is a cooling technology that uses liquid as a heat transfer medium, with the entire heat-generating component immersed in the coolant, exchanging heat through direct contact and the flow of the coolant. With the surge in transmission rates and computing power demands of 400G / 800G AI data centers, the introduction of various optical and electrical signal compensation technologies has led to increasingly higher power densities in single racks. Traditional air-cooling technology has gradually become insufficient to meet heat dissipation requirements. In recent years, 400G / 800G AI data centers have introduced high-efficiency liquid cooling technology.

[0003] Active cables have internal chips with compensation functions, which can increase the transmission distance to 5 meters or more, and can better meet the short-distance interconnection application scenarios such as cabling within data center cabinets, adjacent cross-cabinet cabling, and TOR (Top Of Rack, switch) cabling.

[0004] However, due to the difference in dielectric constant between air and coolant, high-speed signal transmission of active cables in liquid-cooled environments will directly face the problem of signal integrity degradation. Utility Model Content

[0005] Therefore, it is necessary to provide an equivalent architecture of a hybrid DSP and equalizer immersed liquid-cooled active cable to address the above problems.

[0006] This application provides an equivalent architecture of a hybrid DSP and equalizer immersed liquid-cooled active cable, including:

[0007] Cables;

[0008] Circuit board assembly, electrically connected to the cable; and

[0009] An isolation assembly includes a housing and a first seal, the housing sealingly covering the circuit board assembly, the cable passing through the housing to connect to the circuit board assembly; the first seal is provided between the cable and the housing to seal the cable to the housing.

[0010] In one embodiment, the housing includes a bottom shell and a top cover, the bottom shell and the top cover being fastened together, and a second seal is provided at the connection between the bottom shell and the top cover.

[0011] In one embodiment, the cable includes:

[0012] The wire core is electrically connected to the circuit board assembly;

[0013] A protective layer is wrapped around the outer surface of the wire core.

[0014] In one embodiment, the protective layer includes:

[0015] A diaphragm is wrapped around the outer surface of the wire core;

[0016] A shielding mesh is wrapped around the outer surface of the cylindrical membrane; and

[0017] A woven mesh is wrapped around the outer surface of the shielding mesh.

[0018] In one embodiment, the tubular membrane and the woven mesh are constructed of plastic; and / or

[0019] The shielding mesh is made of metal.

[0020] In one embodiment, the outer surface of the end of the cable connected to the circuit board assembly is injection molded with a rubber block, which can be engaged with the inner wall of the housing to form the first seal.

[0021] In one embodiment, a sealant is applied between the adhesive block and the inner wall of the housing.

[0022] In one embodiment, the circuit board assembly includes:

[0023] The circuit board is electrically connected to the cable.

[0024] A digital signal processor is connected to the circuit board; the digital signal processor is used to process signals received by the circuit board.

[0025] In one embodiment, the circuit board assembly further includes:

[0026] An equalizer is connected to the circuit board; the equalizer is used to compensate for the signal transmitted by the cable.

[0027] In one embodiment, the circuit board portion extends to the outside of the housing, and the connection between the circuit board and the housing is coated with sealant.

[0028] The aforementioned hybrid DSP and equalizer equivalent architecture is immersed in a liquid-cooled active cable. A circuit board assembly is electrically connected to the cable, and this assembly processes and compensates for the information transmitted through the cable, thereby increasing the transmission distance. A housing seals the circuit board assembly, and a first sealing element further seals the connection point between the cable and the housing. This prevents the cable's penetration through the housing from reducing the housing's sealing performance over the circuit board assembly, thus isolating the circuit board assembly from the coolant in the liquid-cooled environment and mitigating the signal integrity degradation problem faced by active cables in high-signal transmission within a liquid-cooled environment. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the equivalent architecture of the hybrid DSP and equalizer provided in one embodiment of this application, submerged in a liquid-cooled active cable.

[0030] Figure 2 for Figure 1 Sectional view at EE;

[0031] Figure 3 This is a schematic diagram of the equivalent architecture of the hybrid DSP and equalizer provided in one embodiment of this application, with the housing removed from the liquid-cooled active cable.

[0032] Figure 4 for Figure 3 Sectional view at FF;

[0033] Figure 5 This is a schematic diagram of the structure of a circuit board assembly provided in one embodiment of this application;

[0034] Figure 6 This is a schematic diagram of another circuit board assembly provided in one embodiment of this application.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1. Cable; 11. Wire core; 12. Protective layer; 121. Tube membrane; 122. Shielding mesh; 123. Braided mesh;

[0037] 2. Circuit board assembly; 21. Circuit board; 22. Digital signal processor; 23. Equalizer; 24. Heat sink;

[0038] 3. Isolation assembly; 31. Housing; 311. Bottom shell; 312. Top cover; 32. First seal;

[0039] 4. Pull ring. Detailed Implementation

[0040] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0041] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0042] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0043] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0044] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0045] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0046] Liquid cooling refers to a technology that uses liquid as a cooling medium to exchange and dissipate heat from heat-generating components. The liquid used in the process is called coolant. Immersion liquid cooling is a cooling technology that uses liquid as a heat transfer medium, with the entire heat-generating component immersed in the coolant, exchanging heat through direct contact and the flow of the coolant. With the surge in transmission rates and computing power demands of 400G / 800G data centers, the introduction of various optical and electrical signal compensation technologies has led to increasingly higher power densities per rack. The PUE (Power Usage Effectiveness) of traditional air-cooling technology is generally above 1.8, which is gradually failing to meet heat dissipation requirements. In recent years, 400G / 800G data centers have introduced high-efficiency liquid cooling technology, and immersion liquid cooling technology can further improve the PUE to below 1.1, representing the development direction of green and energy-saving data centers.

[0047] High-speed direct-connect copper cables are a copper-based transmission solution, primarily consisting of a fixed-length cable with an outer sheath, connectors at both ends, and a housing. They offer advantages such as low latency, low cost, low power consumption, and low failure rate, and are widely used in network storage, data centers, and high-performance computer connections. High-speed direct-connect cables are available in passive and active types. With the SerDes (Serializer / Deserializer, high-speed serial transceiver module) speeds on the device side reaching as high as 112Gbps PAM4 (4-Level Pulse Amplitude Modulation), and even approaching 224Gbps PAM4, high-speed signals face significant losses in copper cables. For example, passive copper cables at 112G PAM4 speeds can only support a maximum transmission distance of 2 meters, while active copper cables, with their internal chips having compensation functions, can extend the transmission distance to 5 meters or more, better meeting the needs of short-distance interconnection applications such as within data center cabinets, adjacent cross-cabinet connections, and TOR cabling.

[0048] The dielectric constant (Dk) is a physical quantity that describes a material's ability to be polarized in an electric field. The lower the dielectric constant of a material, the less suppression and attenuation it has on high-frequency and high-speed signal transmission. The Dk of air is approximately 1, while the Dk of coolant is generally between 1.7 and 2.3. The dielectric constant and dielectric loss factor of insulating coolant are quite different from those of air, and high-speed signal transmission in a liquid-cooled environment will directly face the deterioration of signal integrity.

[0049] The inventors simulated the signal integrity (SI) of active cable products in a liquid-cooled environment, and performed simulation modeling of connectors and active cable solder joints in air and coolant environments respectively. They simulated and analyzed return loss, insertion loss, and impedance (TDR), and concluded that the signal integrity of active cables deteriorates in coolant.

[0050] Simulation Model 1: Fluorinated coolant was used. Simulations were performed on the connector in air and in coolant. Fluorinated coolant caused degradation in return loss, insertion loss, and impedance. Return loss degraded from -16.28dB to -12.9dB at 26.56GHz, insertion loss degraded from -1.14dB to -2.09dB at 26.56GHz, and impedance decreased from 95.98ohms to 87.89ohms at the connector-PCB pad contact point.

[0051] Simulation Model 2: Fluorinated coolant was used. Simulations were performed on the cable weld joints in air and in coolant. Fluorinated coolant caused degradation in return loss, insertion loss, and impedance. Return loss degraded from -22.26dB to -18.31dB at 26.56GHz, insertion loss degraded from -1.09dB to -1.87dB at 26.56GHz, and impedance at the cable weld joint decreased from 99.13 ohms to 89.43 ohms.

[0052] Based on the above simulation analysis results, please refer to... Figure 1 and Figure 2 , Figure 1 This illustration shows a schematic diagram of the equivalent architecture of the hybrid DSP and equalizer provided in one embodiment of this application, submerged in a liquid-cooled active cable. Figure 2 It shows Figure 1 A cross-sectional view at the EE section. This application provides an equivalent architecture immersion liquid-cooled active cable integrating a hybrid DSP and equalizer, including a cable 1, a circuit board assembly 2, and an isolation assembly 3. The circuit board assembly 2 is electrically connected to the cable 1. The isolation assembly 3 includes a housing 31 and a first seal 32. The housing 31 seals over the circuit board assembly 2, and the cable 1 passes through the housing 31 to connect to the circuit board assembly 2. The first seal 32 is provided between the cable 1 and the housing 31 to ensure a sealed connection between the cable 1 and the housing 31.

[0053] The equivalent architecture of the hybrid DSP and equalizer provided in this application, using a liquid-cooled active cable immersed in liquid cooling, involves an electrical connection between a circuit board assembly 2 and a cable 1. The circuit board assembly 2 processes and compensates for the information transmitted by the cable 1, thereby improving the transmission distance. A housing 31 is used to seal the circuit board assembly 2, and a first sealing element 32 is further used to seal the connection between the cable 1 and the housing 31. This prevents the cable 1 from passing through the housing 31 and reducing the sealing performance of the housing 31 over the circuit board assembly 2, thus isolating the circuit board assembly 2 from the coolant in the liquid-cooled environment and mitigating the signal integrity degradation problem faced by active cables in high-signal transmission within a liquid-cooled environment.

[0054] Specifically, circuit board assemblies 2 are provided at both ends of the cable 1, and both circuit board assemblies 2 are covered by isolation components 3.

[0055] In some embodiments, the liquid-cooled active cable immersed in the equivalent architecture of the hybrid DSP and equalizer also includes a pull ring 4, which is disposed on the outside of the housing 31. The pull ring 4 facilitates the insertion and removal of the liquid-cooled active cable immersed in the equivalent architecture of the hybrid DSP and equalizer.

[0056] In some embodiments, please refer to... Figure 1 and Figure 2The housing 31 includes a bottom shell 311 and a top cover 312, which are interlocked. A second sealing element is provided at the connection between the bottom shell 311 and the top cover 312. By providing a second sealing element at the connection between the bottom shell 311 and the top cover 312, the sealing performance of the connection between the bottom shell 311 and the top cover 312 is improved. During assembly, the cable 1 and the circuit board assembly 2 are connected first, then the circuit board assembly 2 is installed into the bottom shell 311, and finally the top cover 312 is fastened to the bottom shell 311 to complete the assembly.

[0057] Specifically, the second seal can be a sealing adhesive. Before the bottom shell 311 and the top cover 312 are fastened together, the sealing adhesive is applied to the mating surfaces of the bottom shell 311 and the top cover 312. After fastening, the sealing adhesive is allowed to cure, achieving a good sealing effect. In other embodiments, the second seal can also be a sealing ring, sandwiched between the bottom shell 311 and the top cover 312, which can also achieve a good sealing effect. The specific structural form of the second seal is not limited here, as long as it can achieve the sealing effect on the mating surfaces of the bottom shell 311 and the top cover 312.

[0058] Optionally, the mating surfaces of the bottom shell 311 and the top cover 312 are configured as a Z-shaped structure, and the communication path between the inside and outside of the shell 31 is a Z-shaped tortuous structure, which is beneficial to improving the sealing performance of the inside of the shell 31.

[0059] Optionally, the bottom shell 311 and the top cover 312 are fixed together by bolts or screws to further improve the firmness of the connection between the bottom shell 311 and the top cover 312.

[0060] Please see Figure 2 and Figure 3 , Figure 3 This diagram illustrates the equivalent architecture of the hybrid DSP and equalizer provided in one embodiment of the present application, with the liquid-cooled active cable having its housing 31 removed.

[0061] In some embodiments, the circuit board assembly 2 includes a circuit board 21 and a digital signal processor 22, with the circuit board 21 electrically connected to the cable 1. The digital signal processor 22 is connected to the circuit board 21 and is used to process signals received by the circuit board 21. The specific structure of the digital signal processor 22 will be described in detail later.

[0062] In some embodiments, the circuit board assembly 2 further includes an equalizer 23 connected to the circuit board 21 for signal compensation of the signal transmitted by the cable 1.

[0063] In some embodiments, the circuit board 21 extends to the outside of the housing 31, and the connection between the circuit board 21 and the housing 31 is coated with sealant to improve the sealing of the connection between the circuit board 21 and the housing 31, thereby improving the sealing effect inside the housing 31. The digital signal processor 22 and the equalizer 23 are located on the portion of the circuit board 21 inside the housing 31.

[0064] In some embodiments, the digital signal processor 22 and the equalizer 23 are respectively disposed on two surfaces of the circuit board 21 along the thickness direction. A heat sink 24 is disposed on the side of the digital signal processor 22 away from the circuit board 21 to improve the heat dissipation effect of the digital signal processor 22. Specifically, the heat sink 24 may be made of copper to provide good heat dissipation.

[0065] Please see Figure 4 , Figure 4 It shows Figure 3 Cross-sectional view at point FF. In some embodiments, cable 1 includes a conductor 11 and a protective layer 12. The conductor 11 is electrically connected to circuit board 21, and the protective layer 12 wraps around the outer surface of the conductor 11. By providing the protective layer 12, insulation and protection are provided for the conductor 11.

[0066] Optionally, the conductor 11 is generally made of copper, and the protective layer 12 is made of insulating material.

[0067] In some embodiments, the protective layer 12 includes a cylindrical membrane 121, a shielding mesh 122, and a braided mesh 123. The cylindrical membrane 121 wraps around the outer surface of the core 11, the shielding mesh 122 wraps around the outer surface of the cylindrical membrane 121, and the braided mesh 123 wraps around the outer surface of the shielding mesh 122. By sequentially wrapping the cylindrical membrane 121, the shielding mesh 122, and the braided mesh 123 around the outside of the core 11, the structural strength of the cable 1 is improved, and the problem of expansion and hardening caused by long-term high-temperature immersion in coolant in traditional cables 1 is solved.

[0068] Specifically, the tubular membrane 121 and the woven mesh 123 are made of plastic; and / or the shielding mesh 122 is made of metal.

[0069] In some embodiments, combined with Figure 2 and Figure 4A rubber block is injection molded onto the outer surface of the end of cable 1 that connects to circuit board assembly 2. This rubber block can be secured to the inner wall of housing 31 to form a first sealing element 32. Through injection molding, the rubber block and cable 1 are processed into an integral structure, facilitating the assembly of the rubber block between cable 1 and housing 31. Furthermore, the rubber block injection molding onto the outer surface of cable 1 ensures a seal between the rubber block and cable 1. Moreover, after the rubber block is fixed inside housing 31, it also serves to position cable 1, preventing cable 1 from moving relative to housing 31. This improves the connection strength between cable 1 and circuit board 21, preventing cable 1 from detaching from the solder joint.

[0070] Optionally, a sealant is applied between the rubber block and the inner wall of the housing 31 to improve the sealing between the rubber block and the housing 31, thereby improving the sealing effect of the rubber block at the connection between the housing 31 and the cable 1.

[0071] It is understandable that the first sealing element 32 can also be configured in other structural forms. For example, it can be configured as a sealing ring, which is fitted onto the cable 1 so that the housing 31 and the inner wall surface clamp the sealing ring with the cable 1, thereby achieving the purpose of sealing the housing 31 and the cable 1.

[0072] Please see Figure 5 , Figure 5 A schematic diagram of the structure of a circuit board assembly 2 provided in one embodiment of this application is shown.

[0073] In some embodiments, cable 1 uses only the line-side or host-side capability of digital signal processor 22 (DSP) for signal compensation and processing. This can halve the number of DSP compensation channels (i.e., the number of chips) required by the product, greatly improving heat dissipation while optimizing the product's power consumption and cost by nearly half.

[0074] Specifically, the circuit board assemblies 2 at both ends can use 26AWG or other smaller diameter 16-pair copper cables to achieve 8-channel electrical connection and high-speed full-duplex signal transmission. After the circuit board 21 is electrically connected to the host, the high-speed differential signal from the host on the left is introduced through the gold fingers TX5~TX8 on the left. The high-speed differential signal is input to the digital signal processor 22 on the left through the microstrip lines and vias of the circuit board 21. After corresponding algorithm compensation and signal recovery processing, it is output and further extended to the TX5~TX8 pads of the left circuit board 21. The high-speed differential signal is connected to the RX5~RX8 pads of the right circuit board 21 through soldered 4-pair copper cables, and transmitted to the gold fingers through the microstrip lines and vias of the right circuit board 21. Here, AWG stands for American Wire Gauge, which refers to the standard for cable thickness. The larger the number, the thinner the cable. Pairs copper cable refers to copper cable with two pairs of wires. 16 pairs copper cable refers to 16-pair copper cable, and 4 pairs copper cable refers to 4-pair copper cable. TX refers to the Transmit terminal, and TX5~TX8 means pins 5 to 8 for transmitting signals; RX refers to the Receive terminal, and RX5~RX8 means pins 5 to 8 for receiving signals.

[0075] Simultaneously, the high-speed differential signal from the left-side host is introduced through the gold fingers TX1~TX4 on the left side. After the high-speed differential signal is synchronously amplified by the equalizer 23, it extends to the pads via the microstrip lines and vias of the left-side circuit board 21. It is then connected to the RX1~RX4 pads of the right-side circuit board 21 via soldered 4-pair copper cables, input to the right-side digital signal processor 22, where it undergoes corresponding algorithm compensation and signal recovery processing before being output to and further extended to the gold fingers of the right-side circuit board 21, thus achieving high-speed interconnection between the left-side TX1~TX4 and the right-side RX1~RX4. Correspondingly, it can be connected using the method described above... Figure 5 As shown, high-speed interconnection and interoperability are achieved between the left end RX5~RX8 and the right end TX5~TX8, and between the left end RX1~RX4 and the right end TX1~TX4.

[0076] See Figure 6 , Figure 6 A schematic diagram of another circuit board assembly 2 provided in one embodiment of this application is shown. In other embodiments, if the dielectric constant and dielectric loss factor of the coolant are low or the transmission distance is short in the operating environment, it can be... Figure 5 The removal of equalizer 23 shown can further reduce the cost and power consumption of the product.

[0077] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An equivalent architecture of a hybrid DSP and equalizer immersed liquid-cooled active cable, characterized in that, include: Cable (1); The circuit board assembly (2) is electrically connected to the cable (1); as well as The isolation component (3) includes a housing (31) and a first seal (32). The housing (31) seals the circuit board assembly (2). The cable (1) passes through the housing (31) to connect with the circuit board assembly (2). The first seal (32) is provided between the cable (1) and the housing (31) to make the cable (1) and the housing (31) sealed together.

2. The equivalent architecture of the hybrid DSP and equalizer in the liquid-cooled active cable according to claim 1, characterized in that, The housing (31) includes a bottom shell (311) and a top cover (312), the bottom shell (311) and the top cover (312) are fastened together, and a second sealing element is provided at the connection between the bottom shell (311) and the top cover (312).

3. The equivalent architecture of the hybrid DSP and equalizer in the liquid-cooled active cable according to claim 1, characterized in that, The cable (1) includes: The wire core (11) is electrically connected to the circuit board assembly (2); A protective layer (12) is wrapped around the outer surface of the core (11).

4. The equivalent architecture of the hybrid DSP and equalizer as described in claim 3, characterized in that, The protective layer (12) includes: A cylindrical membrane (121) is wrapped around the outer surface of the wire core (11); Shielding mesh (122) is wrapped around the outer surface of the cylindrical membrane (121); and A woven mesh (123) is wrapped around the outer surface of the shielding mesh (122).

5. The equivalent architecture of the hybrid DSP and equalizer as described in claim 4, characterized in that, The tubular membrane (121) and the woven mesh (123) are constructed of plastic material; and / or The shielding mesh (122) is made of metal.

6. The equivalent architecture of the hybrid DSP and equalizer as described in any one of claims 1 to 5, characterized in that, The outer surface of the end of the cable (1) connected to the circuit board assembly (2) is injection molded with a rubber block, which can be stuck on the inner wall of the housing (31) to form the first seal (32).

7. The equivalent architecture of the hybrid DSP and equalizer as described in claim 6, characterized in that, The adhesive block is coated with sealant between itself and the inner wall of the housing (31).

8. The equivalent architecture of the hybrid DSP and equalizer according to any one of claims 1 to 5, characterized in that, The circuit board assembly (2) includes: Circuit board (21) is electrically connected to the cable (1); A digital signal processor (22) is connected to the circuit board (21); the digital signal processor (22) is used to process the signals received by the circuit board (21).

9. The equivalent architecture of the hybrid DSP and equalizer in the liquid-cooled active cable according to claim 8, characterized in that, The circuit board assembly (2) also includes: An equalizer (23) is connected to the circuit board (21); the equalizer (23) is used to compensate for the signal transmitted by the cable (1).

10. The equivalent architecture of the hybrid DSP and equalizer as described in claim 8, characterized in that, The circuit board (21) extends to the outside of the housing (31), and the connection between the circuit board (21) and the housing (31) is coated with sealant.

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