A crystal resonator assembly and a circuit substrate

Abstract

The utility model discloses a crystal resonator assembly and circuit substrate belong to the heat preservation technical field of crystal resonator. Including heat preservation fixed box, heat preservation fixed box can be set on the circuit substrate, and heat preservation fixed box includes the box, and the inside of box is equipped with the installation cavity, crystal resonator, and crystal resonator includes crystal resonator body and pin, crystal resonator body installs the cavity wall of installation cavity, and crystal resonator body at least partially is located in the installation cavity to make heat preservation fixed box to the heat preservation of crystal resonator body, and pin is located the outside of box, and is used for with circuit substrate electricity is connected. Heat preservation fixed box is surrounded and is protected to crystal resonator alone, makes crystal resonator with outside isolation and carries out the heat preservation to internal crystal resonator, and circuit substrate does not occupy the inside space of box, and guarantees that crystal resonator body will not be influenced by the heat of other elements on the circuit substrate, and then guarantees the temperature stability of product.

Description

Technical Field

[0001] This utility model relates to the field of thermal insulation technology for crystal resonators, and in particular to a crystal resonator assembly and circuit board. Background Technology

[0002] Cryogenic crystal resonators, through their unique structural design and operating principle, can maintain stable performance under various environmental conditions. The core of their performance lies in the design of the cryogenic bath, which, through precise temperature control, ensures that the quartz crystal operates under optimal temperature conditions, thereby providing high-precision and stable frequency signals. Currently, most cryogenic bath designs employ a combination of a heating bath and a bath cover.

[0003] However, in practical use, the traditional design of heating tanks and covers often results in the heating tank being large in size and containing multiple circuit boards (such as PCBs) and electronic components (such as resistors and capacitors). In other words, existing technology usually accommodates multiple circuit boards, quartz crystals, and electronic components within the heating tank and cover for overall heat preservation. This causes the heat generated by the circuit boards (such as PCBs) and electronic components (resistors and capacitors) to affect the temperature stability of the quartz crystal itself, which is not conducive to maintaining a constant operating temperature for the crystal resonator. Utility Model Content

[0004] The purpose of this invention is to provide a crystal resonator assembly and circuit board that can improve the structural rationality and heat preservation effect of the crystal resonator assembly.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A crystal resonator assembly includes: a heat-insulating fixing box, which can be disposed on a circuit board, the heat-insulating fixing box including a box body, and a mounting cavity provided inside the box body; a crystal resonator, the crystal resonator including a crystal resonator body and pins; the crystal resonator body is mounted on the cavity wall of the mounting cavity, and the crystal resonator body is at least partially located inside the mounting cavity so that the heat-insulating fixing box insulates the crystal resonator body; the pins are located outside the box body and are used for electrical connection with the circuit board.

[0007] As an optional solution for the crystal resonator assembly provided by this utility model, the inner surface of the mounting cavity is adapted to the shape of the outer surface of the crystal resonator body located in the mounting cavity.

[0008] As an optional solution for the crystal resonator assembly provided by this utility model, the side wall of the housing is provided with an opening, the mounting cavity is connected to the outside through the opening, and the crystal resonator passes through the opening and is installed on the cavity wall of the mounting cavity.

[0009] As an optional solution for the crystal resonator assembly provided by this utility model, a limiting groove is provided at the opening extending from the outside to the inside along the side wall of the housing; a limiting platform is provided at the end of the crystal resonator body near the pin, the limiting platform is accommodated in the limiting groove, and the limiting platform abuts against the bottom of the limiting groove.

[0010] As an optional solution for the crystal resonator assembly provided by this utility model, the interior of the main body of the housing is a hollow cavity, and the cavity wall of the hollow cavity is provided with heat insulation material, which surrounds and forms an installation cavity.

[0011] As an optional solution for the crystal resonator assembly provided by this utility model, the depth of the limiting groove is the same as the thickness of the limiting stage, and the end face of the crystal resonator body near the pin is flush with the outer wall of the housing.

[0012] As an optional solution for the crystal resonator assembly provided by this utility model, the heat-insulating fixing box is made of copper.

[0013] Secondly, this utility model also provides a circuit board, including a circuit board and a crystal resonator assembly, wherein the crystal resonator assembly is fixed on the circuit board.

[0014] As an optional solution for the circuit board provided by this utility model, the circuit board has a mounting area with solder pads, and the heat preservation fixing box is fixed on the solder pads in the mounting area.

[0015] As an optional solution for the circuit board provided by this utility model, the circuit board is provided with pin holes, and the pins of the crystal resonator are connected to the pin holes.

[0016] The beneficial effects of this utility model are:

[0017] This invention provides a crystal resonator assembly, including a heat-insulating fixing box that can be mounted on a circuit board. The box includes a housing with an internal mounting cavity; a crystal resonator comprising a crystal resonator body and pins; the crystal resonator body is mounted on the cavity wall, at least partially within the cavity, to insulate it; and the pins are located outside the housing for electrical connection to the circuit board. The heat-insulating fixing box isolates and protects the crystal resonator body, isolating it from the outside environment. This allows for heat insulation of only the internal crystal resonator body. The pins, located outside the housing for electrical connection to the external circuit board, do not occupy internal space, thus reducing the overall size of the housing. Furthermore, it ensures that the crystal resonator body is not affected by heat from other components on the circuit board while being insulated, maintaining a constant operating temperature and ensuring product temperature stability. This meets customer requirements and is cost-effective. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the crystal resonator assembly provided in a specific embodiment of this utility model;

[0019] Figure 2 A top view of the circuit board provided in the specific embodiment of this utility model;

[0020] Figure 3 This is a schematic diagram of a crystal resonator assembly and a crystal resonator assembly provided in a specific embodiment of this utility model;

[0021] Figure 4 This is a side view of the heat-insulating fixing box provided in a specific embodiment of the present utility model, showing a side wall with an opening.

[0022] Figure 5 This is a utility model Figure 4 A cross-sectional view of the heat-insulating fixing box along the AA direction provided in the specific embodiment;

[0023] Figure 6 This is a schematic diagram of the installation of the insulated fixing box and the crystal resonator of the crystal resonator assembly provided in a specific embodiment of this utility model;

[0024] Figure 7 This is a utility model Figure 6 The enlarged view at point B of the schematic diagram of the installation of the crystal resonator assembly in the specific implementation method, showing the insulation and fixing box of the crystal resonator assembly and the crystal resonator.

[0025] In the picture:

[0026] 1. Insulated mounting box; 2. Circuit board; 3. Crystal resonator;

[0027] 11. Enclosure; 12. Limiting groove; 13. Insulation material;

[0028] 21. Mounting area; 22. Pin hole;

[0029] 31. Pin; 32. Limiting stage. Detailed Implementation

[0030] To make the technical problems solved by this utility model, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0031] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0032] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0033] like Figures 1 to 7 As shown, the crystal resonator assembly provided in this embodiment includes a heat-insulating fixing box 1, which can be disposed on a circuit board 2. The heat-insulating fixing box 1 includes a box body 11, and a mounting cavity is provided inside the box body 11. The crystal resonator 3 includes a crystal resonator body and pins 31. The crystal resonator body is mounted on the cavity wall of the mounting cavity, and the crystal resonator body is at least partially located inside the mounting cavity so that the heat-insulating fixing box 1 insulates the crystal resonator body. The pins 31 are located outside the box body 11 and are used for electrical connection with the circuit board 2.

[0034] It is understood that the crystal resonator assembly of this utility model is used to surround and protect the crystal resonator 3. Since the heat preservation device includes a box 11 with an internal mounting cavity, the box 11 with the internal mounting cavity realizes the installation of the crystal resonator 3, thereby realizing the heat preservation of the crystal resonator 3 in the mounting cavity. In addition, the heat preservation box 1 is set on the circuit board 2, which also makes the circuit board 2 located outside the heat preservation box 1. At the same time, the pins 31 of the crystal resonator 3 are also located outside the box 11, which is used to electrically connect with the circuit board 2. That is to say, the heat preservation box 1 (more specifically the receiving cavity in the box 11) of this utility model is used to accommodate the crystal resonator 3, and the circuit board 2 and the electronic components on the circuit board 2 are all located outside the heat preservation box 1. This design allows the insulation box 1 to independently surround and protect the crystal resonator 3, isolating it from the outside environment. This enables insulation of only the internal crystal resonator 3, while also serving as a protective shell to prevent damage. Furthermore, it ensures that other electronic components, such as the crystal resonator 3's pins 31 and the circuit board 2, are located outside the insulation box 1. The electrical connection between the crystal resonator 3's pins 31 and the circuit board 2 also occurs outside the insulation box 1, preventing the circuit board 2 and pins 31 from occupying internal space. This reduces the volume of the insulation box 1 and ensures that the crystal resonator 3 is not affected by the heat from other components on the circuit board 2 during insulation, thus maintaining a constant operating temperature and ensuring product temperature stability. This meets customer requirements and is also more cost-effective.

[0035] It should be noted that the specific type of crystal resonator 3 is not limited here. For example, it can be a quartz crystal resonator, a silicon crystal resonator, a ceramic crystal resonator, etc., and all of them can be surrounded and protected by the heat-insulating fixing box 1 of this utility model.

[0036] Alternatively, in this embodiment, such as Figure 5 , Figure 6 , Figure 7As shown, the inner surface of the mounting cavity is adapted to the shape of the outer surface of the crystal resonator body located within the mounting cavity. This adaptation allows the mounting cavity in the housing 11 to better fit the outer surface of the crystal resonator 3, improving the fit between the outer surface of the crystal resonator 3 and the insulation box 1. This, in turn, ensures better thermal insulation of the internal crystal resonator 3 by the insulation box 1. Furthermore, the adaptation of the inner surface of the mounting cavity to the outer surface of the crystal resonator 3 also ensures better fixation of the internal crystal resonator 3. This means that in actual transportation, handling, and use scenarios, the internal crystal resonator 3 can be restrained by the mounting cavity to prevent shaking or damage.

[0037] Alternatively, in this embodiment, such as Figure 1 , Figures 3 to 7 As shown, the insulation and fixing box 1 is made of copper. Copper has strong thermal conductivity, a high safety factor, and is also corrosion-resistant, high-temperature resistant, and high-pressure resistant. This ensures that the crystal resonator 3 meets the environmental temperature requirements for storage, transportation, and operation, thus guaranteeing its long-term reliability. In other embodiments, the insulation and fixing box 1 can be made of other materials, such as stainless steel or ceramics. This embodiment does not impose further limitations on these materials.

[0038] Alternatively, in this embodiment, such as Figure 1 , Figures 3 to 7 As shown, the interior of the main body of the housing 11 is a hollow cavity, and the cavity wall is provided with thermal insulation material 13, which surrounds and forms the mounting cavity. It can be understood that the side wall of the thermal insulation fixing box 1 has an opening that allows the mounting cavity to communicate with the outside. The crystal resonator 3 passes through the opening to be installed in the mounting cavity, enabling easy insertion and removal of the crystal resonator 3, thus improving the ease of assembly and disassembly. Most importantly, the opening on the side wall of the thermal insulation fixing box 1 ensures that after insertion, the pins 31 of the crystal resonator 3 can be electrically connected to the circuit board 2. The pins 31 and the circuit board 2 connected to them are located in the space outside the thermal insulation fixing box 1, ensuring that the crystal resonator 3 is not affected by the heat of the pins 31 and the circuit board 2 when it is insulated, thereby ensuring a constant temperature during operation and thus guaranteeing product stability.

[0039] Alternatively, in this embodiment, such as Figure 5As shown, the main body of the box 11 has a hollow cavity inside. The cavity wall of the hollow cavity is provided with thermal insulation material 13. The thermal insulation material 13 surrounds and forms an installation cavity. It can be understood that the main body of the box 11 has a hollow structure inside and a hollow cavity exists. The hollow cavity is filled with thermal insulation material 13. At the same time, the hollow cavity and the internal thermal insulation material 13 surround and form an installation cavity to realize the installation of the crystal resonator 3. At the same time, the filling of the thermal insulation material 13 can ensure that the crystal resonator 3 is completely surrounded and insulated to the greatest extent while the outer surface shape of the crystal resonator 3 is adapted to the inner surface of the installation cavity, thereby improving the thermal insulation effect of the thermal insulation fixing box 1 for the crystal resonator 3.

[0040] Optionally, in this embodiment, the specific type of insulation material 13 filling the hollow cavity is existing technology in the field and is not limited herein. For example, it can be polyurethane foam, fiberglass wool, aerogel felt, etc. In this embodiment, the main body of the box 11 has a hollow cavity inside, which is filled with insulation material 13. The insulation material 13 surrounds and forms an installation cavity, allowing the hollow cavity to be adaptively selected according to actual usage needs, cost requirements, etc. Different types of insulation materials can be filled into the hollow cavity, which improves the actual use effect and the adaptability of the insulation fixing box 1.

[0041] Alternatively, in this embodiment, such as Figure 1 , Figures 4 to 7 As shown, the side wall of the housing 11 is provided with an opening, and the mounting cavity is connected to the outside through the opening. The crystal resonator 3 passes through the opening and is installed on the cavity wall of the mounting cavity. A limiting groove 12 is provided at the opening along the side wall of the housing 11 from the outside to the inside. A limiting platform 32 is provided at the end of the crystal resonator body near the pin 31. The limiting platform 32 is accommodated in the limiting groove 12 and abuts against the bottom of the limiting groove 12.

[0042] It is understood that the heat preservation and fixing box 1 has an opening in the side wall, and a limiting groove 12 is provided at the opening along the side wall from the outside to the inside. Correspondingly, the end of the crystal resonator 3 near the pin 31 is provided with a limiting platform 32. In this embodiment, the limiting groove 12 and the limiting platform 32 are racetrack-shaped structures. Since the pin 31 is electrically connected to the circuit board 2 on the outside, the racetrack-shaped limiting platform 32 near the end of the pin 31 can be correspondingly limited by the racetrack-shaped limiting groove 12 on the side wall. The racetrack-shaped limiting groove 12, which extends from the outside to the inside along the side wall at the opening in the above-mentioned setting, ensures that the opening size is larger than the actual installation cavity (i.e., the hollow cavity and the internal insulation material 13 forming the installation cavity) where the crystal resonator 3 is installed. This ensures the convenience and accuracy of inserting the crystal resonator 3, and improves the installation effect of the crystal resonator 3 and the insulation fixing box 1. At the same time, the cooperation between the racetrack-shaped limiting groove 12 and the racetrack-shaped limiting platform 32, and the fact that the limiting platform 32 abuts against the bottom of the limiting groove 12, can also improve the installation effect of the crystal resonator 3 and the insulation fixing box 1. It can also accurately determine whether the crystal resonator 3 is fully inserted into the installation cavity of the insulation fixing box 1, and avoid problems such as excessive insertion of the crystal resonator 3, which may cause wear between the crystal resonator 3 and the installation cavity and thus damage the crystal resonator 3. It should be noted that during the installation process of the crystal resonator 3 being inserted into the mounting cavity of the insulation fixing box 1, since the limiting platform 32 abuts against the bottom of the limiting groove 12, the gap between the limiting platform 32 and the limiting groove 12 can be pre-filled with fixing adhesive. That is, before the crystal resonator 3 is fully inserted, the gap between the limiting platform 32 and the limiting groove 12 is pre-filled with fixing adhesive, and then fully inserted, making the connection of the crystal resonator 3 into the insulation fixing box 1 more stable. In other embodiments, during the installation process of the crystal resonator 3 being inserted into the mounting cavity of the insulation fixing box 1, fixing adhesive can also be filled between the inner surface of the mounting cavity and the outer surface of the crystal resonator 3, making the connection of the crystal resonator 3 into the insulation fixing box 1 more stable. Fixing adhesive is existing technology and is not limited here. It should be noted that the inner surface of the mounting cavity and the outer surface of the crystal resonator 3 can also be bonded with fixing adhesive, further improving the connection effect between the insulation fixing box 1 and the crystal resonator 3.

[0043] In other embodiments, the limiting groove 12 extending from the outside to the inside along the side wall of the insulation box 1 at the opening and the limiting platform 32 at the end of the crystal resonator 3 near the pin 31 can also be other structures, such as rectangles, squares, circles, etc., which are not limited here, as long as they can achieve the above-mentioned convenient and precise insertion. It should be noted that, because the crystal resonator 3 in the prior art is usually an elliptical structure with a racetrack-shaped cross-section, in this embodiment, the limiting groove 12 extending from the outside to the inside along the side wall of the insulation box 1 at the opening and the limiting platform 32 at the end of the crystal resonator 3 near the pin 31 are both racetrack-shaped.

[0044] Alternatively, in this embodiment, such as Figure 1 , Figure 6 , Figure 7 As shown, the depth of the limiting groove 12 is the same as the thickness of the limiting platform 32, and the end face of the crystal resonator body near the pin 31 is flush with the outer wall of the housing 11. That is to say, in this embodiment, the depth of the racetrack-shaped limiting groove 12 and the thickness of the racetrack-shaped limiting platform 32 are the same, so that when the limiting platform 32 abuts against the bottom of the limiting groove 12 (i.e., after the crystal resonator 3 is installed in the mounting cavity), the surface of the crystal resonator 3 near the pin 31 is flush with the outer wall of the insulation fixing box 1. The fact that the surface of the crystal resonator 3 near the pin 31 is flush with the outer wall of the insulation fixing box 1 ensures that there is no protrusion on the side wall of the insulation fixing box 1 (more specifically, the side wall with an opening for the installation of the crystal resonator 3) after actual installation. Therefore, when the insulation fixing box 1 is installed on the circuit board 2, interference with other electronic components can be avoided, ensuring the structural rationality and operational stability of the insulation fixing box 1, while also saving the actual space occupied by the insulation fixing box 1 and improving space utilization.

[0045] This utility model also provides a circuit board that can ensure the heat preservation effect of the crystal resonator 3 and the structural rationality of the crystal resonator assembly.

[0046] Specifically, such as Figure 2 , Figure 3 As shown, a circuit board includes a circuit board 2 and a crystal resonator assembly, the crystal resonator assembly being fixed on the circuit board.

[0047] Alternatively, in this embodiment, such as Figure 2 , Figure 3As shown, the circuit board 2 has a mounting area 21, and the insulation fixing box 1 is fixed on the mounting area 21. This allows the insulation fixing box 1 to be installed on the circuit board 2 after completing the insulation and protection of the crystal resonator 3, thus ensuring the normal fixed installation of the insulation fixing box 1. Consequently, the crystal resonator 3 is installed on the circuit board 2 through the insulation fixing box 1, achieving mechanical fixation between the crystal resonator 3 and the circuit board 2, resulting in a stable and reliable connection. At the same time, the separate mounting area 21 on the circuit board 2 can also ensure that the insulation fixing box 1 is installed without interfering with other electronic components on the circuit board 2, improving the structural rationality of the insulation fixing box 1 after installation.

[0048] Alternatively, in this embodiment, such as Figure 2 , Figure 3 As shown, mounting area 21 is provided with solder pads, and the insulation fixing box 1 is placed on the solder pads of mounting area 21. The insulation fixing box 1 is soldered to the solder pads of mounting area 21. The soldering method can further ensure the connection stability between the insulation fixing box 1 and the circuit board 2. Furthermore, in the actual soldering, a scraper is used to spread solder paste evenly on the solder pads of mounting area 21 of circuit board 2. The amount of solder paste used is carefully considered according to the actual soldering requirements before soldering. A mature SMT surface mount technology is adopted, which is simple to operate, convenient and quick to install, easy to mass produce, and also convenient for maintenance. This improves the installation efficiency of the insulation fixing box 1 and the circuit board 2.

[0049] It should be noted that, since the insulation device for the crystal resonator of this utility model is used to surround and protect the crystal resonator 3, and since the insulation fixing box 1 of the insulation device includes a box 11 with an internal mounting cavity, the mounting cavity can accommodate the installation of the crystal resonator 3, thereby achieving the insulation of the crystal resonator 3 within the mounting cavity by the insulation fixing box 1. Furthermore, the insulation fixing box 1 is disposed on the circuit board 2, which also places the circuit board 2 in the external space of the insulation fixing box 1. Simultaneously, the pins 31 of the crystal resonator 3 are also located outside the box 11, for electrical connection with the circuit board 2. Therefore, the insulation fixing box 1 of this utility model, besides accommodating the crystal resonator 3, does not contain any other components inside. This means that, for example, the pins 31 of the crystal resonator 3, the circuit board 2, and other electronic components are all located in the external space of the insulation box 1, and the electrical connection between the pins 31 of the crystal resonator 3 and the circuit board 2 also occurs in the external space of the insulation box 1. This ensures that the circuit board 2 and the pins 31 do not occupy the internal space of the insulation box 1. As a result, this invention can adaptively optimize the structure of the circuit board 2 outside the insulation box 1. For example, in the actual design process, the electronic components on the circuit board 2 can be adaptively changed to improve the rationality of the circuit board 2 structure. At the same time, most importantly, because the circuit board 2 is not located inside the insulation box 1, it can use other types of materials to further improve the insulation effect of the insulation box 1 on the circuit board 2. For example, the circuit board 2 of this utility model is made of a PCB substrate with a low coefficient of thermal expansion. The PCB substrate with a low coefficient of thermal expansion can reduce the mechanical stress deformation of the circuit board 2 itself caused by temperature changes. At the same time, the circuit board 2 is made of a material with a stable temperature coefficient of dielectric constant, which further reduces the influence of temperature on the phase of electrical signals. It should be noted that the circuit boards in the prior art generally use two circuit boards, one above the other, and the upper circuit board needs to be located in a constant temperature bath. The crystal resonator 3 is placed in the center of the upper circuit board, away from the edges and heat-generating components, in order to reduce the influence of temperature gradient. The upper circuit board includes an oscillation circuit, a compensation circuit, a voltage reference circuit, etc., while the lower circuit board includes a heating control circuit, a low-noise power supply circuit, a frequency selective amplifier circuit, etc. Because this invention encloses and protects the crystal resonator 3 separately, it can effectively ensure that the circuits and heating elements on the circuit board 2 will not affect the temperature of the crystal resonator 3 inside the insulation box 1. At the same time, since the circuit board 2 needs to achieve a fine-tuning effect through existing temperature control circuits or compensation circuits, and a thermistor is connected to the feedback, the circuit parameters can be adjusted in real time to offset the temperature drift, further ensuring the insulation efficiency of the crystal resonator 3 inside the insulation box 1.The circuit board 2 of this utility model is located outside the heat preservation and fixing box 1 and the two are electrically connected. This allows the circuit board 2 to adapt to different electronic component layouts and different types of materials, and it can fully take into account the frequency and temperature stability brought about by hysteresis effect and fine-tuning effect.

[0050] Alternatively, in this embodiment, such as Figure 2 , Figure 3 As shown, the circuit board 2 is provided with pin holes 22. The pins 31 of the crystal resonator 3 are connected to the pin holes 22. It can be understood that the pin holes 22 on the circuit board 2 can ensure that after the crystal resonator 3 is housed in the insulation box 1, its outwardly extending pins 31 can be connected to the pin holes 22, thereby realizing the electrical connection between the crystal resonator 3 and the circuit board 2, realizing core functions such as electrical connection and signal transmission, and thus ensuring the frequency accuracy and circuit compatibility of the crystal resonator 3. At the same time, the pins 31 are connected to the pin holes 22 on the circuit board 2, so that while the crystal resonator 3 is housed in the insulation box 1, the connection between the pins 31 and the pin holes 22 can also be used to achieve further mechanical fixation, thereby ensuring the working stability of the crystal resonator 3.

[0051] It should be noted that, in this embodiment, as Figure 2 , Figure 3 As shown, the side wall with the opening in the insulation fixing box 1 is the adjacent side wall of the connection surface between the insulation fixing box 1 and the circuit board 2. This can be understood as... Figure 3 For example, the connection surface between the insulation box 1 and the circuit board 2 is the bottom surface of the insulation box 1. In this case, the side wall with the opening in the insulation box 1 is the circumferential side surface of the insulation box 1. This embodiment does not specify which side wall the opening should be located on; it can be adapted to the space requirements and the orientation requirements of the crystal resonator 3 and the insulation box 1 during actual assembly. The arrangement of the side wall with the opening in the insulation box 1 being adjacent to the connection surface between the insulation box 1 and the circuit board 2 ensures that after the crystal resonator 3 is installed in the insulation box 1, the pin 31 can be bent downwards after extending from the opening and connect to the pin hole 22 of the circuit board 2. This results in a shorter distance between the pin 31 and the pin hole 22, further reducing manufacturing costs in actual production and lowering the cost of replacing the pin 31.

[0052] In other embodiments, the side wall with the opening in the insulation box 1 may not be the adjacent side wall of the connection surface between the insulation box 1 and the circuit board 2. For example, the side wall with the opening in the insulation box 1 may be the side wall opposite to the connection surface between the insulation box 1 and the circuit board 2. It is understood that... Figure 3For example, the connection surface between the insulation fixing box 1 and the circuit board 2 is the bottom surface of the insulation fixing box 1. At this time, the side wall with the opening of the insulation fixing box 1 is the top surface of the insulation fixing box 1. This setting can be used when there are many electronic components above the circuit board 2, and there is insufficient space for the crystal resonator 3 to be inserted into the insulation fixing box 1 for installation, or to be removed from the insulation fixing box 1 for disassembly or maintenance. The side wall with the opening of the insulation fixing box 1 as the top surface of the insulation fixing box 1 can ensure that the crystal resonator 3 can be inserted, installed, removed, disassembled or maintained normally, which ensures the actual use effect of the crystal resonator 3 and the insulation fixing box 1.

[0053] As an option, such as Figures 1 to 7 As shown, this embodiment also includes an installation method for the insulation fixing box 1, specifically including the following steps:

[0054] S1, install the crystal resonator 3 into the mounting cavity through the opening in the side wall of the heat-insulating fixing box 1;

[0055] S2, use a scraper to spread solder paste evenly on the pads of the mounting area 21 of the circuit board 2;

[0056] S3, install the heat preservation fixing box 1 on the solder pad of the mounting area 21 of the circuit board 2;

[0057] S4, insert the pin 31 of the crystal resonator 3 into the pin hole 22 of the circuit board 2;

[0058] S5, Welding is performed between the heat preservation fixing box 1 and the solder pads of the mounting area 21 of the circuit board 2;

[0059] S6, solder the pin 31 and the pin hole 22 of the circuit board 2.

[0060] In step S1, the side wall of the insulation fixing box 1 is provided with an opening, and the mounting cavity is connected to the outside through the opening. The crystal resonator 3 passes through the opening to be installed in the mounting cavity. The racetrack-shaped limiting groove 12 and the racetrack-shaped limiting platform 32 cooperate so that after the crystal resonator 3 enters the mounting cavity, it abuts against the bottom of the limiting groove 12 through the limiting platform 32, so that the surface of the crystal resonator 3 near the pin 31 is flush with the outer side wall of the insulation fixing box 1, thereby achieving precise installation of the crystal resonator 3.

[0061] In step S2, a squeegee is used to spread solder paste evenly on the pads of the mounting area 21 of the circuit board 2, and the amount of solder paste used is adjusted according to the actual soldering requirements.

[0062] In step S3, the heat preservation fixing box 1 is installed on the solder paste already laid on the pad of the corresponding mounting area 21 on the circuit board 2, and waits for soldering.

[0063] In step S4, the pins 31 of the crystal resonator 3 are inserted into the pin holes 22 of the circuit board 2, and then wait for soldering.

[0064] In step S5, the insulation fixing box 1 is soldered to the pads of the mounting area 21 of the circuit board 2. Specifically, a hot air gun is used to fix the insulation fixing box 1 to the pads of the mounting area 21 of the circuit board 2, thus completing the soldering between the insulation fixing box 1 and the circuit board 2.

[0065] In step S6, the pins 31 of the crystal resonator 3 are soldered into the pin holes 22 of the circuit board 2 using an electroplating iron, thus completing the soldering of the crystal resonator 3 and the pins 31 relative to the circuit board 2.

[0066] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A crystal resonator assembly, characterized in that, include: Insulation fixing box (1), the insulation fixing box (1) can be set on circuit board (2), the insulation fixing box (1) includes box body (11), the box body (11) is provided with mounting cavity inside; A crystal resonator (3) includes a crystal resonator body and pins (31); the crystal resonator body is mounted on the cavity wall of the mounting cavity, and the crystal resonator body is at least partially located inside the mounting cavity so that the heat-insulating fixing box (1) insulates the crystal resonator body; the pins (31) are located outside the box (11) and are used for electrical connection with the circuit board (2).

2. The crystal resonator assembly according to claim 1, characterized in that, The inner surface of the mounting cavity is adapted to the shape of the outer surface of the crystal resonator body located within the mounting cavity.

3. The crystal resonator assembly according to claim 1, characterized in that, The side wall of the housing (11) is provided with an opening, the mounting cavity is connected to the outside through the opening, and the crystal resonator (3) passes through the opening and is installed on the cavity wall of the mounting cavity.

4. The crystal resonator assembly according to claim 3, characterized in that, A limiting groove (12) is provided at the opening, extending from the outside to the inside along the side wall of the housing (11); a limiting platform (32) is provided at the end of the crystal resonator body near the pin (31), the limiting platform (32) is housed in the limiting groove (12), and the limiting platform (32) abuts against the bottom of the limiting groove (12).

5. The crystal resonator assembly according to claim 1, characterized in that, The main body of the box (11) has a hollow cavity inside, and the cavity wall of the hollow cavity is provided with thermal insulation material (13), which surrounds the installation cavity.

6. The crystal resonator assembly according to claim 4, characterized in that, The depth of the limiting groove (12) is the same as the thickness of the limiting stage (32), and the end face of the crystal resonator body near the pin (31) is flush with the outer wall of the box (11).

7. The crystal resonator assembly according to any one of claims 1-6, characterized in that, The heat-insulating fixing box (1) is made of copper.

8. A circuit board, characterized in that, It includes a circuit board (2) and a crystal resonator assembly as claimed in any one of claims 1-7, the crystal resonator assembly being fixed on the circuit board.

9. The circuit board according to claim 8, characterized in that, The circuit board (2) has a mounting area (21) with solder pads, and the heat preservation fixing box (1) is fixed on the solder pads of the mounting area (21).

10. The circuit board according to claim 9, characterized in that, The circuit board (2) is provided with a pin hole (22), and the pin (31) of the crystal resonator (3) is connected to the pin hole (22).

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