Capacitive microswitch

CN224721866UActive Publication Date: 2026-09-04HENAN HOZEL ELECTRONICS CO LTD KUNSHAN BRANCH OFFICE
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Patent Information

Application Number
CN202521658905.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-05
Publication Date
2026-09-04
Estimated Expiration
2035-08-05

AI Technical Summary

Technical Problem

[0003]现有技术中的微动开关通常采用机械力触发电路通断的结构原理,缺少采用电容结构实现触发的现有结构

Benefits of technology

[0027] Beneficial effects: This utility model monitors the change in capacitance between the capacitor structure formed by the transmitting and receiving plates by changing the relative area between the transmitting and receiving plates. The pressure applied at the spring end is determined by the change in capacitance, so as to achieve the purpose of controlling the opening and closing state of the capacitor micro switch through the capacitor structure.

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Abstract

The utility model belongs to the technical field of electronic products, concretely relates to a capacitor microswitch, including base and shell, be provided with in the hollow cavity that base and shell connect form: spring piece, one end is fixed end and the other end is the bended plate, spring piece has the pressure end, the pressure end is located between fixed end and bended plate, emitter plate, top and spring piece are connected, make spring piece as the extension of emitter plate, first receiving plate, the first vertical part is first vertical part and bended plate between forming first capacitance structure. The utility model discloses through the relative area between emitter plate and receiving plate is changed, to monitor the capacitance value change situation between the capacitance structure that emitter plate and receiving plate constitute, through this capacitance value change situation to judge the pressure situation of spring piece pressure end, to realize through the control purpose of capacitor microswitch opening and closing state of capacitance structure.
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Description

Technical Field

[0001] This utility model belongs to the field of electronic product technology, and specifically relates to a capacitive micro switch. Background Technology

[0002] Microswitches are widely used in various electronic products such as electrical appliances, machinery, communications, digital audio-visual equipment, and building automation due to their advantages such as compact structure, flexible operation, and fast response speed.

[0003] Existing microswitches typically employ a mechanical force-triggered circuit switching principle, lacking existing structures that utilize capacitors for triggering. Utility Model Content

[0004] The present invention addresses the aforementioned technical problems by providing a capacitive micro switch.

[0005] A capacitive micro switch includes a base and a housing, the base and the housing being connected to form a hollow cavity, and the following is disposed within the hollow cavity:

[0006] A spring sheet, the spring sheet being horizontally arranged, one end of the spring sheet being a fixed end and the other end being a vertically structured bent plate, the fixed end being fixed in the hollow cavity, the spring sheet having a pressure-applying end, the pressure-applying end being located between the fixed end and the bent plate;

[0007] The emitter plate has its bottom end serving as a power-on pin connected to an external circuit for power supply, and its top end connected to the spring contact, which serves as an extension of the emitter plate.

[0008] The first receiving plate has its bottom end serving as a power-on pin connected to an external circuit for power supply. The upper part of the first receiving plate is a first vertical section of a vertical structure, located on the side of the bent plate. A first capacitor structure is formed between the first vertical section and the bent plate.

[0009] When a downward force is applied to the pressure end, the spring is moved downward, which in turn moves the bending plate downward. During the downward movement of the bending plate, the relative area between it and the first vertical part changes, and the capacitance value of the first capacitor structure changes. The activation state of the capacitor micro switch is determined by monitoring the capacitance value of the first capacitor structure.

[0010] Optionally, one of the base and the housing is provided with a snap-fit ​​hole and the other is provided with a snap-fit ​​protrusion, and the snap-fit ​​connection between the base and the housing is achieved by snapping the snap-fit ​​hole with the snap-fit ​​protrusion.

[0011] Optionally, the transmitting electrode and the first receiving electrode are both embedded in the base, and the first vertical part extends out of the top surface of the base and is located on one side of the bent plate.

[0012] Optionally, a support plate is integrally formed at the top of the emitting electrode plate, and a support groove is provided on the support plate, with the fixed end of the spring piece embedded in the support groove.

[0013] Optionally, an abutment plate is integrally formed on the top of the emitting electrode, and an abutment groove is provided on one side of the abutment plate;

[0014] The spring sheet has a relief groove in the middle, and an arc-shaped elastic plate is provided in the relief groove. One end of the elastic plate is integrally connected to the spring sheet, and the other end of the elastic plate abuts in the abutment groove.

[0015] Optionally, the first vertical portion and the bent plate are staggered in the vertical direction.

[0016] Optionally, the hollow cavity may further include:

[0017] The second receiving plate has its bottom end connected to an external circuit as a power-on pin. The upper part of the second receiving plate is a second vertical part of a vertical structure. The second vertical part and the first vertical part are located on the two sides of the bent plate, and a second capacitor structure is formed between the second vertical part and the bent plate.

[0018] When a downward force is applied to the pressure end, the spring is moved downward, which in turn moves the bending plate downward. During the downward movement of the bending plate, the relative area between it and the second vertical part changes, and the capacitance value of the second capacitor structure changes. The activation state of the capacitor micro switch is determined by monitoring the capacitance values ​​of the first capacitor structure and the second capacitor structure.

[0019] Optionally, the second receiving electrode is embedded in the base, and the second vertical part extends out of the top surface of the base and is located on the other side of the bent plate.

[0020] Optionally, the second vertical portion and the bent plate are staggered in the vertical direction.

[0021] Optionally, the second vertical portion, the bent plate, and the first vertical portion are staggered in the vertical direction.

[0022] Optionally, the top end of the second vertical part, the top end of the bent plate, and the top end of the first vertical part are arranged from high to low, and the bottom end of the second vertical part, the bottom end of the bent plate, and the bottom end of the first vertical part are arranged from high to low.

[0023] When a downward force is applied to the pressure end, the spring is moved downward, which in turn moves the bending plate downward. During the downward movement of the bending plate, the relative area between it and the first vertical part increases, and the capacitance value of the first capacitor structure increases. At the same time, during the downward movement of the bending plate, the relative area between it and the second vertical part decreases, and the capacitance value of the second capacitor structure decreases. The activation state of the capacitor micro switch is determined by monitoring the capacitance values ​​of the first and second capacitor structures.

[0024] Optionally, the top end of the second vertical part, the top end of the bent plate, and the top end of the first vertical part are arranged from low to high, and the bottom end of the second vertical part, the bottom end of the bent plate, and the bottom end of the first vertical part are arranged from low to high;

[0025] When a downward force is applied to the pressure end, the spring is moved downward, which in turn moves the bending plate downward. During the downward movement of the bending plate, the relative area between it and the first vertical part decreases, and the capacitance value of the first capacitor structure decreases. At the same time, during the downward movement of the bending plate, the relative area between it and the second vertical part increases, and the capacitance value of the second capacitor structure increases. The activation state of the capacitor micro switch is determined by monitoring the capacitance values ​​of the first and second capacitor structures.

[0026] Optionally, the outer periphery of the first vertical portion and the second vertical portion has an adhesive layer.

[0027] Beneficial effects: This utility model monitors the change in capacitance between the capacitor structure formed by the transmitting and receiving plates by changing the relative area between the transmitting and receiving plates. The pressure applied at the spring end is determined by the change in capacitance, so as to achieve the purpose of controlling the opening and closing state of the capacitor micro switch through the capacitor structure. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of a structure according to Embodiment 1 of the present utility model;

[0029] Figure 2 for Figure 1 Exploded view;

[0030] Figure 3 for Figure 1 Partial structural diagram;

[0031] Figure 4 for Figure 3 Internal structure diagram;

[0032] Figure 5 This is an exploded view of Embodiment 2 of the present invention;

[0033] Figure 6 for Figure 5 A partial internal structure diagram;

[0034] Figure 7 for Figure 6 Exploded view. Detailed Implementation

[0035] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so as to better understand the purpose, features and advantages of the present invention. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the present invention, but are only for illustrating the essential spirit of the technical solution of the present invention.

[0036] In the following description, certain specific details are set forth for the purpose of illustrating various disclosed embodiments in order to provide a thorough understanding of the various disclosed embodiments. However, those skilled in the art will recognize that embodiments may be practiced without one or more of these specific details. In other instances, well-known apparatuses, structures, and techniques associated with this application may not have been shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0037] Throughout this specification, references to "an embodiment" or "an embodiment" indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Therefore, the appearance of "in an embodiment" or "an embodiment" in various places throughout the specification does not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic may be combined in any manner in one or more embodiments.

[0038] In the following description, in order to clearly demonstrate the structure and working method of this utility model, a number of directional terms will be used. However, terms such as "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", and "down" should be understood as convenient terms and not as limiting terms.

[0039] Example 1:

[0040] Reference Figure 1 Figure 4 This embodiment provides a capacitive micro switch to control the opening and closing states of pressure-applying components such as buttons or switches through a capacitor structure. The capacitive micro switch of this embodiment includes a base 10, a housing 20, a spring contact 30, and a capacitor structure assembly, which includes a transmitting electrode 50, a first receiving electrode 60, and a second receiving electrode 70.

[0041] The base 10 and the outer shell 20 are connected to form a hollow cavity, and the spring 30, the transmitting electrode 50, the first receiving electrode 60 and the second receiving electrode 70 are all disposed in the hollow cavity.

[0042] The spring piece 30 is horizontally positioned within the hollow cavity, meaning its length is horizontal, and it possesses elastic deformation and restoring capabilities in the vertical direction (up and down). One end of the spring piece 30 is a fixed end 30a, and the other end is a vertically oriented bent plate 30b. In practice, the other end of the spring piece 30 can be bent downwards by 90 degrees to form the bent plate 30b. The fixed end 30a is fixed within the hollow cavity, meaning it remains stationary, while the bent plate 30b can move with the spring piece 30. The spring piece 30 has a pressure-applying end located between the fixed end 30a and the bent plate 30b. A pressure-applying component, such as a button 40, can apply a downward force or release the pressure-applying end; other pressure-applying components can also be used to achieve this.

[0043] When the pressure-applying component is a button 40, the button 40 is confined within the hollow cavity, with its top protruding from the outer casing 20 to allow for external downward pressure. The bottom end of the button 40 abuts against the pressure-applying end of the spring 30. When downward pressure is applied to the top of the button 40, the spring 30 moves downward, with one fixed end 30a of the spring 30 remaining stationary, while the bending plate 30b moves downward accordingly. When the pressure is removed, the bending plate 30b and the button 40 return to their initial positions due to the reset action of the spring 30.

[0044] Of course, the pressure-applying component can also be other devices located below the pressure-applying end. In this case, the pressure-applying component applies a downward pulling force to the pressure-applying end, causing the spring 30 to move downward. One end of the spring 30, the fixed end 30a, remains stationary, while the bending plate 30b moves downward accordingly. When the pulling force is removed, the bending plate 30b returns to its initial position under the reset action of the spring 30.

[0045] The bottom end of the emitting plate 50 serves as a power-on pin, connecting to an external circuit for power supply. In specific implementations, the bottom end of the power-on pin of the emitting plate 50 extends outside the hollow cavity to facilitate connection with the external circuit. The top end of the emitting plate 50 is connected to the spring 30, making the spring 30 an extension of the emitting plate 50. In this case, the spring is a metal structure spring, so that after power is applied, the bending plate 30b can form a first capacitor structure with the first receiving plate 60 and a second capacitor structure with the second receiving plate 70.

[0046] The bottom end of the first receiving plate 60 serves as a power-on pin, connecting to an external circuit for power supply. Similarly, in a specific implementation, the bottom end of the power-on pin of the first receiving plate 60 extends out of the hollow cavity to facilitate connection with an external circuit. The upper part of the first receiving plate 60 is a vertically oriented first vertical section 60a, located on the side of the bent plate 30b. A first capacitor structure is formed between the first vertical section 60a and the bent plate 30b.

[0047] The bottom end of the second receiving plate 70 serves as a power-on pin, connecting to an external circuit for power supply. Similarly, in a specific implementation, the bottom end of the power-on pin of the second receiving plate 70 extends out of the hollow cavity to facilitate connection with an external circuit. The upper part of the second receiving plate 70 is a vertically structured second vertical section 70a. The second vertical section 70a and the first vertical section 60a are located on the two sides of the bent plate 30b, respectively, and a second capacitor structure is formed between the second vertical section 70a and the bent plate 30b.

[0048] When a downward force is applied to the pressure end, the spring 30 moves downward, which in turn moves the bending plate 30b downward. During the downward movement of the bending plate 30b, the relative area between it and the first vertical part 60a changes, and the capacitance value of the first capacitor structure changes. At the same time, during the downward movement of the bending plate 30b, the relative area between it and the second vertical part 70a changes, and the capacitance value of the second capacitor structure changes. The activation state of the capacitor micro switch is determined by monitoring the capacitance value of the first capacitor structure.

[0049] In specific implementation, the first vertical part 60a is disposed on one side of the bending plate 30b. In the initial state or the reset state of the bending plate 30b, there may be no relative area (spatial overlapping area or directly opposite area) between the first vertical part 60a and the bending plate 30b. However, during the movement of the bending plate 30b, a changing relative area should be generated between the first vertical part 60a and the bending plate 30b so as to determine the start-up state of the capacitor micro switch by monitoring the change in the capacitance value of the first capacitor structure.

[0050] Similarly, in a specific implementation, the second vertical part 70a is located on the other side of the bent plate 30b. In the initial or reset state of the bent plate 30b, there may be no relative area (projected area or facing area) between the second vertical part 70a and the bent plate 30b. However, during the movement of the bent plate 30b, a changing relative area should be generated between the second vertical part 70a and the bent plate 30b so as to determine the start-up state of the capacitor micro switch by monitoring the change in the capacitance value of the second capacitor structure.

[0051] The working principle of this embodiment is as follows:

[0052] A capacitor structure is formed by setting up an energized transmitting plate and a corresponding energized receiving plate. The opening and closing state of the capacitor microswitch is determined by changing the capacitance value of the capacitor structure.

[0053] The specific operation is as follows: The capacitance value of the capacitor structure is monitored by a capacitance detection chip. This chip can be a directly adopted capacitor detection chip used in existing technology for detecting the capacitance value between two electrode plates. When the capacitance value of the capacitor structure increases / decreases to a set threshold, the capacitance detection chip determines that the capacitor microswitch is in the activated state. It sends a switch activation signal to the device using the microswitch. After receiving the switch activation signal, the device using the microswitch connects its own circuit, causing the device to become activated. The principle is similar when turning it off. When used on a computer host or mouse, it can also be automatically turned off by the computer system or by default after a period of inactivity.

[0054] The factors that alter the capacitor structure include the facing area between the emitter and receiver plates, the distance between the emitter and receiver plates, and the dielectric constant between the emitter and receiver plates (i.e., the conductivity of the material between the emitter and receiver plates). The specific calculation formulas are as follows:

[0055]

[0056] Where C represents the capacitance, ε represents the dielectric constant between the two plates, S represents the effective area of ​​the two plates facing each other, D represents the distance between the two plates, and K represents the electrostatic constant (approximately 8.99 x 10⁹ N·m). 2 / C 2 )

[0057] As can be seen from the above formula, the larger the effective area facing the capacitor, the larger the capacitance value of the capacitor structure; the smaller the distance between the two plates, the larger the capacitance value of the capacitor structure; and the larger the dielectric constant, the larger the capacitance value of the capacitor structure.

[0058] If other parameters remain constant, a change in the effective area of ​​the capacitor structure will alter its capacitance. In this embodiment, the capacitance detection chip is connected to the emitting plate 50, the first receiving plate 60, and the second receiving plate 70. The capacitance detection chip detects the first capacitance value between the emitting plate 50 and the first receiving plate 60, and the second capacitance value between the emitting plate 50 and the second receiving plate 70. When the effective area (relative area) between the emitting plate 50 and the first receiving plate 60 or the second receiving plate 70 changes, the capacitance value of the first capacitor structure or the capacitance value of the second capacitor structure also changes. When the first capacitance value increases / decreases to a first set threshold, the capacitor microswitch is considered to be in the activated state. To avoid misjudgment, the detection accuracy is improved by detecting the second capacitance value; that is, the capacitor microswitch is only considered to be in the activated state when the second capacitance value decreases / increases to a second set threshold. When the first capacitance value recovers to the first initial threshold, the capacitor micro switch is considered to be in the closed state. Similarly, to avoid misjudgment, the capacitor micro switch is only considered to be in the closed state when the second capacitance value recovers to the second initial threshold.

[0059] The aforementioned first set threshold, second set threshold, first initial threshold, and second initial threshold can be a set value or a set threshold range.

[0060] In one embodiment, one of the base 10 and the outer shell 20 is provided with a snap-fit ​​hole and the other is provided with a snap-fit ​​protrusion. The snap-fit ​​connection between the base 10 and the outer shell 20 is achieved by snapping the snap-fit ​​hole with the snap-fit ​​protrusion.

[0061] Reference Figure 2 The buckle protrusions 11 at both ends of the base 10 engage with the buckle holes 21 at both ends of the outer shell 20 to connect the base 10 and the outer shell 20.

[0062] In one embodiment, reference is made to Figure 2 The outer casing 20 is provided with a pressure hole 22 that is connected vertically, and the pressure-applying component, such as the top of the button 40, extends out from the pressure hole 22.

[0063] In one embodiment, the transmitting electrode 50, the first receiving electrode 60, and the second receiving electrode 70 are all embedded in the base 10. The top surface of the first vertical part 60a extends out of the top surface of the base 10 and is located on one side of the bent plate 30b, and the second vertical part 70a extends out of the top surface of the base 10 and is located on the other side of the bent plate 30b.

[0064] In one embodiment, reference is made to Figures 3 to 4A support plate 51 is integrally formed at the top of the emitting electrode plate 50, and a support groove 52 is provided on the support plate 51. The fixed end 30a of the spring piece 30 is embedded in the support groove 52. The design of the support plate 51 can both fix the fixed end 30a and ensure that the spring piece 30 and the emitting electrode plate 50 remain connected.

[0065] In one embodiment, reference is made to Figures 3 to 4 The top of the emitting electrode plate 50 is integrally formed with an abutment plate 53, and an abutment groove 54 is provided on one side of the abutment plate 53.

[0066] A clearance groove is provided in the middle of the spring piece 30, and an arc-shaped elastic plate 31 is provided in the clearance groove. One end of the elastic plate 31 is integrally connected to the spring piece 30, and the other end of the elastic plate 31 abuts in the abutment groove 54, so that the bending plate 30b of the spring piece 30 has a preset height difference between the first vertical part 60a and the second vertical part 70a in the normal state (i.e., the initial state or after reset).

[0067] In practice, a U-shaped cut can be made in the middle of the spring piece 30 to cut out an avoidance groove and an elastic plate 31 integrally connected with the spring piece 30. Then, the elastic plate 31 is bent downward and the other end abuts against the abutment groove 54. That is to say, the abutment groove 54 is preferably located inside or below the avoidance groove.

[0068] The design of the abutment plate 53 also ensures that the spring 30 and the launching plate 50 remain connected.

[0069] When a downward force is applied to the pressing end of the spring sheet 30, the bending plate 30b of the spring sheet 30 will move downward, and the elastic plate 31 will be squeezed. After the downward force is removed, under the elastic action of the elastic plate 31, the bending plate 30b of the spring sheet 30 returns to its original position, waiting for the next pressing operation.

[0070] In one embodiment, the spring sheet 30 between the fixed end 30a and the bending plate 30b has an abutment surface, which serves as a pressure-applying end for contacting the pressure-applying component. In addition to the abutment surface, one or more vertically connected spring sheet slots can be provided on the spring sheet 30 between the fixed end 30a and the bending plate 30b to increase the elastic deformation capability of the spring sheet 30.

[0071] Of course, the clearance groove also serves as one of the spring clip through grooves.

[0072] In one embodiment, the first vertical portion 60a and the bent plate 30b are offset in the vertical direction. The second vertical portion 70a and the bent plate 30b are also offset in the vertical direction.

[0073] Alternatively, the second vertical part 70a, the bent plate 30b, and the first vertical part 60a are staggered in the vertical direction.

[0074] By staggering the positions, the bending plate 30b can ensure that the capacitance value of the first capacitor structure formed with the first vertical part 60a and the capacitance value of the second capacitor structure formed with the second vertical part 70a both change during the downward movement of the bending plate 30b.

[0075] In one embodiment, reference is made to Figure 4 One arrangement in which the second vertical part 70a, the bent plate 30b, and the first vertical part 60a are staggered in the vertical direction is as follows:

[0076] The tops of the second vertical section 70a, the bent plate 30b, and the first vertical section 60a are arranged from high to low, and the bottoms of the second vertical section 70a, the bent plate 30b, and the first vertical section 60a are also arranged from high to low. When a downward force is applied to the pressure end, the spring 30 moves downward, which in turn moves the bent plate 30b downward. During the downward movement of the bent plate 30b, the relative area between it and the first vertical section 60a increases, and the capacitance value of the first capacitor structure increases. At the same time, during the downward movement of the bent plate 30b, the relative area between it and the second vertical section 70a decreases, and the capacitance value of the second capacitor structure decreases. The activation state of the capacitor microswitch is determined by monitoring the capacitance values ​​of the first and second capacitor structures.

[0077] Of course, in the above arrangement, the positional relationship between the second vertical part 70a and the first vertical part 60a can be interchanged. That is, another arrangement in which the second vertical part 70a, the bent plate 30b, and the first vertical part 60a are staggered in the vertical direction is as follows:

[0078] The tops of the second vertical section 70a, the top of the bent plate 30b, and the top of the first vertical section 60a are arranged from low to high, and the bottoms of the second vertical section 70a, the bottom of the bent plate 30b, and the bottom of the first vertical section 60a are also arranged from low to high. When a downward force is applied to the pressure end, the spring 30 moves downward, which in turn moves the bent plate 30b downward. During the downward movement of the bent plate 30b, the relative area between it and the first vertical section 60a decreases, and the capacitance value of the first capacitor structure decreases. Simultaneously, during the downward movement of the bent plate 30b, the relative area between it and the second vertical section 70a increases, and the capacitance value of the second capacitor structure increases. The activation state of the capacitor microswitch is determined by monitoring the capacitance values ​​of the first and second capacitor structures.

[0079] In one embodiment, the outer periphery of the first vertical portion 60a and the second vertical portion 70a has an adhesive layer.

[0080] In a capacitor structure, direct contact between the transmitting plate and the receiving plate must be avoided, as this would prevent the formation of a capacitor. Therefore, direct contact between the bent plate 30b of the spring 30 and the first receiving plate 60 and the second receiving plate 70 must be avoided. This embodiment avoids this direct contact problem by providing an adhesive layer around the outer periphery of both the first vertical portion 60a and the second vertical portion 70a.

[0081] In the capacitor structure of Embodiment 1 above, the positions of the emitting plate and the receiving plate can be interchanged without affecting the formation of the capacitor structure.

[0082] Example 2:

[0083] Reference Figures 5 to 7 This embodiment provides a capacitive micro switch, which is the same as that in embodiment 1 except for the following differences, and will not be described again here.

[0084] This embodiment omits the second receiving electrode 70, instead forming a first capacitor structure between the bent plate 30b of the transmitting electrode 50 and the first vertical portion 60a of the first receiving electrode 60. The activation state of the capacitive microswitch is determined using this first capacitor structure. This embodiment is simpler in structure as it lacks a receiving electrode.

[0085] The preferred embodiments of this utility model have been described in detail above. However, it should be understood that after reading the above teachings, those skilled in the art can make various alterations or modifications to this utility model. These equivalent forms also fall within the scope defined by the appended claims.

Claims

1. A capacitive micro switch, characterized in that, The system includes a base and a housing, which are connected to form a hollow cavity. Within the hollow cavity, the following components are disposed: A spring sheet, the spring sheet being horizontally arranged, one end of the spring sheet being a fixed end and the other end being a vertically structured bent plate, the fixed end being fixed in the hollow cavity, the spring sheet having a pressure-applying end, the pressure-applying end being located between the fixed end and the bent plate; The emitter plate has its bottom end serving as a power-on pin connected to an external circuit for power supply, and its top end connected to the spring contact, which serves as an extension of the emitter plate. The first receiving plate has its bottom end serving as a power-on pin connected to an external circuit for power supply. The upper part of the first receiving plate is a first vertical section of a vertical structure located on the side of the bent plate. A first capacitor structure is formed between the first vertical section and the bent plate.

2. The capacitive micro switch as described in claim 1, characterized in that, One of the base and the outer shell is provided with a snap-fit ​​hole and the other is provided with a snap-fit ​​protrusion. The snap-fit ​​connection between the base and the outer shell is achieved by snapping the snap-fit ​​hole with the snap-fit ​​protrusion.

3. The capacitive micro switch as described in claim 1, characterized in that, The transmitting electrode and the first receiving electrode are both embedded in the base, and the first vertical part extends out of the top surface of the base and is located on one side of the bent plate.

4. The capacitive micro switch as described in claim 1, characterized in that, The top of the emitting electrode plate is integrally formed with a support plate, and the support plate is provided with a support groove, and the fixed end of the spring is embedded in the support groove.

5. The capacitive micro switch as described in claim 1, characterized in that, The top of the emitting electrode is integrally formed with an abutment plate, and an abutment groove is provided on one side of the abutment plate; The spring sheet has a relief groove in the middle, and an arc-shaped elastic plate is provided in the relief groove. One end of the elastic plate is integrally connected to the spring sheet, and the other end of the elastic plate abuts in the abutment groove.

6. The capacitive micro switch as described in claim 1, characterized in that, The first vertical part and the bent plate are offset in the vertical direction.

7. The capacitive micro switch as described in any one of claims 1 to 6, characterized in that, The hollow cavity is also provided with: The second receiving plate has its bottom end serving as a power-on pin connected to an external circuit for power supply. The upper part of the second receiving plate is a second vertical section with a vertical structure. The second vertical section and the first vertical section are located on the two sides of the bent plate, respectively. A second capacitor structure is formed between the second vertical section and the bent plate.

8. The capacitive micro switch as described in claim 7, characterized in that, The second receiving electrode is embedded in the base, and the second vertical part extends out of the top surface of the base and is located on the other side of the bent plate.

9. The capacitive micro switch as described in claim 7, characterized in that, The second vertical section and the bent plate are offset in the vertical direction.

10. The capacitive micro switch as described in claim 9, characterized in that, The second vertical part, the bent plate, and the first vertical part are staggered in the vertical direction.

11. The capacitive micro switch as described in claim 10, characterized in that, The top of the second vertical part, the top of the bent plate, and the top of the first vertical part are arranged from high to low, and the bottom of the second vertical part, the bottom of the bent plate, and the bottom of the first vertical part are arranged from high to low. Alternatively, the top of the second vertical part, the top of the bent plate, and the top of the first vertical part are arranged from low to high, and the bottom of the second vertical part, the bottom of the bent plate, and the bottom of the first vertical part are arranged from low to high.

12. The capacitive micro switch as described in claim 7, characterized in that, The outer periphery of the first vertical part and the second vertical part has an adhesive layer.