A multi-light-bead driving circuit

Abstract

The utility model relates to a kind of multi-lamp bead driving circuit, comprising: SPI signal interface piece and LED matrix drive chip;SPI signal interface piece is provided with SPI communication interface, enable interface and power interface;The clock pin of each LED matrix drive chip, master device input / slave device output pin, master device output / slave device input pin and the enable pin EN of lamp drive IC are respectively connected with the corresponding interface on SPI signal interface piece;Each chip selection interface is connected with the chip selection pin of corresponding LED matrix drive chip;The sync pin between each LED matrix drive chip is connected with each other;Each LED matrix drive chip is powered by power interface.It is realized to the efficient control of multi-lamp bead driving by the scheme of serial cascade and high-speed digital interface multi-lamp bead chip+single master control (integrated SPI), solve the problem of large PCB area, complex wiring, high cost in prior art multi-channel constant current driving scheme, applicable to the scene with requirement of integration, cost, refresh rate.

Description

Technical Field

[0001] This utility model relates to the field of LED control, specifically to a multi-LED driving circuit. Background Technology

[0002] In LED lighting (such as RGB ambient lighting, car taillights, and display backlights) or programmable light source systems, it is usually necessary to control multiple LED beads (tens to hundreds of beads) and achieve: independent dimming (PWM or analog dimming), color mixing (RGB / RGBW control), low-latency refresh (e.g., >1kHz, to avoid visible flicker), and a balance between high integration and low cost.

[0003] Traditional solutions, such as multi-channel constant current driver IC + MCU solutions, have complex PCB routing and consume a lot of MCU GPIO resources; the disadvantage of serial LED driver solutions is that a single point of failure affects the whole system and has high voltage requirements; the disadvantage of ordinary matrix scanning solutions is that the refresh rate is low, it is prone to flickering, and the brightness is uneven. Utility Model Content

[0004] This utility model addresses the technical problems existing in the prior art by providing a multi-LED driving circuit.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: SPI signal interface device and LED matrix driver chip; The SPI signal interface device is provided with an SPI communication interface, an enable interface, and a power interface LED_VBAT; The SPI communication interface includes: a clock interface LED_SPI_SCK, a master input / slave output interface LED_SPI_MISO, a master output / slave input interface LED_SPI_MOSI, and a chip select interface LED_SPI_CSN; each SPI communication interface receives input control signals through the SPI bus. The enabling interface includes: the enabling interface HWEN of the LED matrix driver chip; The clock interface LED_SPI_SCK, master input / slave output interface LED_SPI_MISO, master output / slave input interface LED_SPI_MOSI, and the enable pin interface HWEN of the lamp driver IC are respectively connected to the clock pin SCK, master input / slave output pin MISO, master output / slave input pin MOSI of each LED matrix driver chip, and the enable pin EN of the lamp driver IC. The number of chip select interfaces LED_SPI_CSN corresponds to the number of LED matrix driver chips, and each chip select interface LED_SPI_CSN is connected to the chip select pin CSN of the corresponding LED matrix driver chip. The sync pins of each LED matrix driver chip are interconnected. The LED matrix driver chip is powered through the power interface LED_VBAT.

[0006] The beneficial effects of this utility model are: by using a multi-LED chip with serial cascading and high-speed digital interface + single master controller (integrated SPI) scheme, efficient control of multi-LED drive is achieved, solving the problems of large PCB area, complex wiring and high cost in the existing multi-channel constant current drive scheme, and is suitable for scenarios with requirements for integration, cost and refresh rate.

[0007] Based on the above technical solution, the present invention can be further improved as follows.

[0008] Furthermore, the SPI signal interface device is an FPC socket; The LED matrix driver chip is model AW20144S.

[0009] Furthermore, the multi-LED driving circuit also includes: a lamp board power isolation circuit; the lamp board power isolation circuit includes: a power isolation chip; The inputs of the power driver chip include: input power supply VCC_BAT and enable signal LED_POWER_EN, and the outputs include: output power supply LED_VBAT; the output power supply LED_VBAT is connected to the power interface LED_VBAT. The on / off state of the output power supply LED_VBAT is controlled under the control of the enable signal LED_POWER_EN.

[0010] Furthermore, the multi-LED driver circuit also includes an LED power supply circuit; the enable interface also includes a power enable interface LED_DC_EN. The LED lamp driver power supply circuit includes: a DC-DC power chip; The DC-DC power chip, under the control of the enable signal sent by the lamp driver power enable interface LED_DC_EN, converts the input power LED_VBAT into a 3.3V power supply VLED and outputs it. The power supply VLED is connected to the power supply pins VCC and PVCC of each of the LED matrix driver chips.

[0011] Furthermore, the model number of the DC-DC power supply chip is JW5250.

[0012] Furthermore, the multi-LED driving circuit also includes a charging circuit; The charging circuit includes: a linear charging chip, a rechargeable battery, and a load switch chip; the externally input power is stored in the rechargeable battery after passing through the linear charging chip; The rechargeable battery supplies power to the multi-LED drive circuit under the control of the load switch chip.

[0013] Furthermore, the charging circuit also includes an overvoltage protection chip; The externally input power passes through the overvoltage protection chip before entering the linear charging chip.

[0014] Furthermore, the multi-LED driving circuit also includes: an MCU; The MCU is used to generate PMW control signals; the MCU model is GR5331.

[0015] Furthermore, the multi-LED driving circuit also includes a switching chip; After receiving the control command sent by the user via the button, the switch chip sends it to the MCU.

[0016] Furthermore, the multi-LED driving circuit also includes: an acceleration sensor; The acceleration sensor collects the vehicle's acceleration information and sends it to the MCU via IIC.

[0017] Furthermore, the multi-LED driving circuit also includes: a FLASH storage circuit; The FLASH storage circuit communicates with the MCU, and the FLASH storage circuit stores various preset patterns composed of multiple LED beads.

[0018] The advantages of adopting the above-mentioned further solutions are as follows: The cascaded topology of the LED matrix driver chips, using a serial shift register structure, allows data to be transmitted step-by-step, requiring only 3-4 signal lines (CLK / DATA / STB+GND) to control hundreds of LEDs, reducing wiring and resulting in a more compact PCB layout. A single chip drives two LEDs, reducing the number of chips by 50% and mitigating parasitic effects. A power isolation circuit for the LED board is implemented, controlling the output power supply based on the enable signal. The LED board is only powered on when the control signal board is turned on, preventing the risk of misalignment during FPC insertion, which could lead to a high-level signal reaching the SPI port and causing a short circuit. Adding this DC-DC power supply chip to the multi-LED driver circuit ensures the operating voltage of each LED matrix driver chip, improving its efficiency. A linear charging IC is provided, offering an 800mA charging current to ensure the product is fully charged within 2 hours. The main controller sends LED brightness and lighting position data packets via SPI, and the driver chip automatically parses and outputs PWM signals. The main controller sends 16-bit grayscale data via SPI for PWM dimming, achieving 0~65535 levels of dimming (e.g., WS2815 supports 0.1% accuracy). SPI communication speeds can reach over 10MHz, supporting refresh rates >1kHz (flicker-free, suitable for camera environments). The dual LED chips have built-in constant current sources, automatically adapting to voltage fluctuations and avoiding energy waste from resistor voltage division. Firmware upgrades via SPI batch update of drive parameters (such as current values ​​and Gamma correction tables) require no hardware replacement. Attached Figure Description

[0019] Figure 1 A structural diagram of an embodiment of an SPI signal interface device in a multi-LED bead driving circuit provided by this utility model; Figure 2 A wiring diagram illustrating an embodiment of an LED matrix driver chip in a multi-LED bead driving circuit provided by this utility model; Figure 3 A wiring diagram illustrating an embodiment of multiple LED matrix driver chips in a multi-LED bead driver circuit provided by this utility model; Figure 4 A circuit diagram illustrating an embodiment of a lamp board power isolation circuit in a multi-LED driver circuit provided by this utility model; Figure 5 A circuit diagram illustrating an embodiment of an LED lamp driver power supply circuit in a multi-LED bead driving circuit provided by this utility model; Figure 6 A schematic diagram illustrating the principle of an embodiment of the charging circuit in a multi-LED bead driving circuit provided by this utility model; Figure 7 A schematic diagram of an embodiment of a multi-LED bead driving circuit provided by this utility model; Figure 8 A circuit schematic diagram of an embodiment of the FLASH storage circuit in a multi-LED bead driving circuit provided by this utility model; Figure 9 This utility model provides a wiring diagram of the MCU in a multi-LED driver circuit. Detailed Implementation

[0020] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0021] like Figure 1 The diagram shown is a structural diagram of an embodiment of the SPI signal interface device in a multi-LED driver circuit provided by this utility model. Figure 2 This is a wiring diagram illustrating an embodiment of an LED matrix driver chip in a multi-LED driver circuit provided by this utility model. Figure 3 This is a wiring diagram illustrating an embodiment of multiple LED matrix driver chips in a multi-LED bead driver circuit provided by this utility model, in conjunction with... Figures 1-3 As can be seen, the multi-LED driving circuit provided by this utility model includes: an SPI signal interface device and an LED matrix driving chip.

[0022] The SPI signal interface device is equipped with an SPI communication interface, an enable interface, and a power interface LED_VBAT.

[0023] The SPI communication interface includes: clock interface LED_SPI_SCK, master input / slave output interface LED_SPI_MISO, master output / slave input interface LED_SPI_MOSI, and chip select interface LED_SPI_CSN; each SPI communication interface receives input control signals through the SPI bus.

[0024] The enable interface includes: HWEN, the enable interface for the LED matrix driver chip.

[0025] The clock interface LED_SPI_SCK, master input / slave output interface LED_SPI_MISO, master output / slave input interface LED_SPI_MOSI, and the enable pin interface HWEN of the lamp driver IC are respectively connected to the clock pin SCK, master input / slave output pin MISO, master output / slave input pin MOSI of each LED matrix driver chip, and the enable pin EN of the lamp driver IC.

[0026] The number of chip select interfaces LED_SPI_CSN corresponds to the number of LED matrix driver chips, and each chip select interface LED_SPI_CSN is connected to the corresponding chip select pin CSN of the LED matrix driver chip.

[0027] The sync pins of each LED matrix driver chip are interconnected.

[0028] Power is supplied to each LED matrix driver chip via the power interface LED_VBAT.

[0029] The number of LED matrix driver chips can be set according to requirements. This embodiment of the invention includes two chips, such as... Figure 1 The diagram shows two chip select interfaces, LED_SPI_CSN: LED_SPI_CSN1 and LED_SPI_CSN2.

[0030] In practice, control signals for the brightness and lighting position of the LED beads are sent to the LED matrix driver chip via the SPI communication interface. The LED matrix driver chip automatically parses the control signal and outputs a PWM signal to control the state of each corresponding LED bead.

[0031] The control signals for the brightness and lighting position of the LED can be generated manually according to requirements and the usage rules of the LED matrix driver chip, or they can be generated by the MCU.

[0032] This invention provides a multi-LED driver circuit that achieves efficient control of multiple LEDs through a multi-LED chip configuration using serial cascading and a high-speed digital interface, combined with a single master controller (integrated SPI). This solves the problems of large PCB area, complex wiring, and high cost in existing multi-channel constant current driver solutions, making it suitable for scenarios with requirements for integration, cost, and refresh rate. Examples include multi-terminal interconnected speedometers, headlights, and taillights.

[0033] Example 1 Embodiment 1 provided by this utility model is an embodiment of a multi-LED bead driving circuit provided by this utility model, combined with Figures 1-3 It is known that the embodiment of this multi-LED driver circuit includes: an SPI signal interface device and an LED matrix driver chip.

[0034] The SPI signal interface device is equipped with an SPI communication interface, an enable interface, and a power interface LED_VBAT.

[0035] The SPI communication interface includes: clock interface LED_SPI_SCK, master input / slave output interface LED_SPI_MISO, master output / slave input interface LED_SPI_MOSI, and chip select interface LED_SPI_CSN; each SPI communication interface receives input control signals through the SPI bus.

[0036] The enable interface includes: HWEN, the enable interface for the LED matrix driver chip.

[0037] The clock interface LED_SPI_SCK, master input / slave output interface LED_SPI_MISO, master output / slave input interface LED_SPI_MOSI, and the enable pin interface HWEN of the lamp driver IC are respectively connected to the clock pin SCK, master input / slave output pin MISO, master output / slave input pin MOSI of each LED matrix driver chip, and the enable pin EN of the lamp driver IC.

[0038] The number of chip select interfaces LED_SPI_CSN corresponds to the number of LED matrix driver chips, and each chip select interface LED_SPI_CSN is connected to the corresponding chip select pin CSN of the LED matrix driver chip.

[0039] The sync pins of each LED matrix driver chip are interconnected.

[0040] Power is supplied to each LED matrix driver chip via the power interface LED_VBAT.

[0041] In one possible embodiment, the SPI signal interface device is an FPC socket.

[0042] The LED matrix driver chip is model AW20144S.

[0043] The AW20144S is an LED matrix driver IC that can adjust the brightness of LED lighting and the lighting coordinates of 274 LED beads.

[0044] In one possible embodiment, the multi-LED driving circuit further includes: a lamp board power isolation circuit; such as Figure 4 The diagram shown is a circuit schematic of an embodiment of the lamp board power isolation circuit in a multi-LED driver circuit provided by this utility model. Figure 4 It can be seen that the power isolation circuit of the lamp board includes: a power isolation chip; in specific implementation, the power control chip can be an SGM2571.

[0045] The inputs of the power driver chip include: input power supply VCC_BAT and enable signal LED_POWER_EN, and the outputs include: output power supply LED_VBAT; the output power supply LED_VBAT is connected to the power interface LED_VBAT.

[0046] The output power LED_VBAT is switched on and off under the control of the enable signal LED_POWER_EN.

[0047] In practice, the control signal board and the LED matrix driver chip board are connected by an FPC connector. During assembly, there is a risk of misalignment when inserting the FPC connector, which could cause a short circuit due to a high-level signal being connected to the SPI port. Therefore, by setting up a power isolation circuit for the LED board, the power supply is controlled based on the enable signal LED_POWER_EN. The LED_VBAT power supply is only powered on when the control signal board is powered on.

[0048] In one possible embodiment, the multi-LED driver circuit further includes: an LED power supply circuit; the enable interface further includes: a power supply enable interface LED_DC_EN.

[0049] like Figure 5 This is a circuit schematic diagram of an embodiment of an LED lamp driver power supply circuit in a multi-LED bead driver circuit provided by this utility model, combined with... Figure 5 It can be seen that the LED lamp driver power supply circuit includes: DC-DC power supply chip.

[0050] Under the control of the enable signal sent by the LED_DC_EN interface of the lamp driver, the DC-DC power chip converts the input power LED_VBAT into a 3.3V power supply VLED and outputs it.

[0051] The power supply VLED is connected to the power supply pins VCC and PVCC of each LED matrix driver chip.

[0052] By adding this DC-DC power supply chip to the multi-LED driver circuit, the operating voltage of each LED matrix driver chip can be guaranteed, making it more efficient.

[0053] The backend LED driver IC voltage is 2.7-5.5V, and the LED operating voltage is 1.9V-2.3V (driver port voltage drop is 0.2V, 3.3-0.2=3.1V, which meets the requirements). Considering the battery voltage is between 3.0V and 4.2V, and the SPI communication MCU voltage is 3.3V, the backend output is designed to be 3.3V. The EN enable pin needs to be in a closed steady state by default, so a pull-down resistor R3 is added.

[0054] In one possible embodiment, the DC-DC power supply chip is model number JW5250.

[0055] In one possible embodiment, the multi-LED driving circuit further includes: a charging circuit; such as Figure 6 The diagram shown is a schematic representation of an embodiment of the charging circuit in a multi-LED driver circuit provided by this utility model. Figure 6It can be seen that the charging circuit includes: a linear charging chip, a rechargeable battery, and a load switch chip; the externally input power is stored in the rechargeable battery after passing through the linear charging chip.

[0056] The rechargeable battery supplies power to the multi-LED driver circuit under the control of the load switch chip.

[0057] In practice, the linear charging chip can be AW32006L444, which provides an 800mA charging current to ensure the product is fully charged within 2 hours. The load switch chip can be AW35132.

[0058] In one possible embodiment, the charging circuit further includes an overvoltage protection chip.

[0059] The externally input power passes through the overvoltage protection chip before entering the linear charging chip.

[0060] In practice, the overvoltage protection chip can be AW3291; the external power input passes through the overvoltage protection chip AW3291 and then enters the linear charging chip AW32006L444, which supplies power to the MCU and LED matrix driver chip under the control of the load switch chip AW35132.

[0061] Example 2 Embodiment 2 of this utility model provides an embodiment of a multi-LED bead driving circuit. The PWM control signal for controlling the brightness and lighting position of the LED matrix driver chip can be manually generated according to requirements and the usage rules of the LED matrix driver chip, or it can be generated by an MCU. In this embodiment, the PWM format control signal is generated by an MCU; the MCU model is GR5331.

[0062] Specifically, such as Figure 7 The diagram shown is a schematic diagram of an embodiment of a multi-LED driving circuit provided by this utility model. Figure 7 It is known that the embodiment of this multi-LED driver circuit includes: MCU, SPI signal interface device and LED matrix driver chip.

[0063] The MCU generates control signals in PMW format.

[0064] The SPI signal interface device is equipped with an SPI communication interface, an enable interface, and a power interface LED_VBAT.

[0065] The SPI communication interface includes: clock interface LED_SPI_SCK, master input / slave output interface LED_SPI_MISO, master output / slave input interface LED_SPI_MOSI, and chip select interface LED_SPI_CSN; each SPI communication interface receives control signals from the MCU through the SPI bus.

[0066] The enable interface includes: HWEN, the enable interface for the LED matrix driver chip.

[0067] The clock interface LED_SPI_SCK, master input / slave output interface LED_SPI_MISO, master output / slave input interface LED_SPI_MOSI, and the enable pin interface HWEN of the lamp driver IC are respectively connected to the clock pin SCK, master input / slave output pin MISO, master output / slave input pin MOSI of each LED matrix driver chip, and the enable pin EN of the lamp driver IC.

[0068] The number of chip select interfaces LED_SPI_CSN corresponds to the number of LED matrix driver chips, and each chip select interface LED_SPI_CSN is connected to the corresponding chip select pin CSN of the LED matrix driver chip.

[0069] The sync pins of each LED matrix driver chip are interconnected.

[0070] Power is supplied to each LED matrix driver chip via the power interface LED_VBAT.

[0071] The number of LED matrix driver chips can be set according to requirements. This embodiment of the invention includes two chips, such as... Figure 1 The diagram shows two chip select interfaces, LED_SPI_CSN1 and LED_SPI_CSN2. The Bluetooth MCU controls the LED driver via SPI to control the on / off state of 18×8=144 streetlights. In the embodiment provided in this invention, 274 LEDs are used, therefore two 144-chip interfaces are employed, cascaded using a sync pin. The software controls the light driver via SPI and corresponding coordinate definitions to implement the UI-designed emojis, ultimately achieving a unified lighting effect.

[0072] In one possible embodiment, the multi-LED driver circuit further includes a switching chip.

[0073] After receiving the control command sent by the user via the button, the switch chip sends it to the MCU.

[0074] In practice, the switching chip can be an SGM4075.

[0075] In one possible embodiment, the multi-LED driving circuit further includes an acceleration sensor.

[0076] After the accelerometer collects the vehicle's acceleration information, it sends it to the MCU via IIC.

[0077] In practice, the accelerometer sensor model can be SC7A20.

[0078] In one possible embodiment, the multi-LED driving circuit further includes a FLASH storage circuit.

[0079] like Figure 8 The diagram shown is a circuit schematic of an embodiment of the FLASH storage circuit in a multi-LED bead driving circuit provided by this utility model. Figure 8 It can be seen that the FLASH storage circuit communicates with the MCU, and the FLASH storage circuit stores various preset patterns composed of multiple LED beads.

[0080] In practice, an emoji pattern composed of multiple LED beads can be pre-stored in the FLASH storage circuit and then sent to the MCU. The MCU then sends a corresponding control signal to make the LED beads form the corresponding emoji pattern.

[0081] like Figure 9 The diagram shows the wiring diagram of the MCU in a multi-LED driver circuit provided by this utility model. Table 1 below shows the pin connection relationship and function correspondence of the MCU in the multi-LED driver circuit.

[0082]

[0083] Table 1: Pin Connections and Functional Correspondences of the MCU in a Multi-LED Driver Circuit Combination Figures 1-9 As shown in Table 1, the specific implementation process includes: the MCU controls the power switch via PSHOLD, and the SPI communication illuminates the LED beads to achieve emoji mode switching. The SC7A20 accelerometer confirms the driving status and converts it into a signal, communicating with the GR5331 Bluetooth chip via IIC; the MCU controls the corresponding operations, including braking response. The AW20144S is an LED matrix driver IC used to adjust the brightness of LED lighting and the coordinate position of 274 LED beads. The AW32006L444 linear charging IC provides an 800mA charging current, ensuring the product is fully charged within 2 hours. The 2.4G onboard antenna is responsible for transmitting and receiving electromagnetic radiation from the air to achieve wireless Bluetooth connectivity. Ultimately, the product is made intelligent, such as the APP allowing users to select their favorite emojis or customize emojis, and the headlights and speedometers controlling the taillights' on / off status and mode adjustment.

[0084] In one embodiment of the multi-LED driver circuit provided by this utility model, a dual-LED driver chip + single master controller (integrated SPI) architecture design is used. Each of the dual LED driver chips drives 144 LEDs and supports PWM dimming. Built-in current calibration ensures consistent brightness across multiple LEDs (±1% error). The driver chip incorporates a constant current source to adapt to different LED specifications.

[0085] A single-master controller (integrated SPI) chip cascades multiple dual-LED driver ICs via the SPI bus. The SPI protocol enables high-speed data transmission.

[0086] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0087] It is understood that spatial relation terms such as "below," "under," "below," "below," "above," "above," etc., can be used here to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as "below" or "below" of the other element or feature will be oriented "above" the other element or feature. Therefore, the exemplary terms "below" and "below" can include both upper and lower orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0088] It should be noted that when one element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediary element. In the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have the transmission of electrical signals or data between them.

[0089] When used here, the singular forms of “a,” “an,” and “ / the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “including / contains” or “having” specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0090] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A multi-LED bead driving circuit, characterized in that, The multi-LED driving circuit includes: an SPI signal interface and an LED matrix driving chip; The SPI signal interface device is provided with an SPI communication interface, an enable interface, and a power interface LED_VBAT; The SPI communication interface includes: a clock interface LED_SPI_SCK, a master input / slave output interface LED_SPI_MISO, a master output / slave input interface LED_SPI_MOSI, and a chip select interface LED_SPI_CSN; each SPI communication interface receives input control signals through the SPI bus. The enabling interface includes: the enabling interface HWEN of the LED matrix driver chip; The clock interface LED_SPI_SCK, master input / slave output interface LED_SPI_MISO, master output / slave input interface LED_SPI_MOSI, and the enable pin interface HWEN of the lamp driver IC are respectively connected to the clock pin SCK, master input / slave output pin MISO, master output / slave input pin MOSI of each LED matrix driver chip, and the enable pin EN of the lamp driver IC. The number of chip select interfaces LED_SPI_CSN corresponds to the number of LED matrix driver chips, and each chip select interface LED_SPI_CSN is connected to the chip select pin CSN of the corresponding LED matrix driver chip. The sync pins of each LED matrix driver chip are interconnected. The LED matrix driver chip is powered through the power interface LED_VBAT.

2. The multi-LED driving circuit according to claim 1, characterized in that, The SPI signal interface device is an FPC socket; The LED matrix driver chip is model AW20144S.

3. The multi-LED driving circuit according to claim 1, characterized in that, The multi-LED driving circuit further includes: a lamp board power isolation circuit; the lamp board power isolation circuit includes: a power isolation chip; The inputs of the power driver chip include: input power supply VCC_BAT and enable signal LED_POWER_EN, and the outputs include: output power supply LED_VBAT; the output power supply LED_VBAT is connected to the power interface LED_VBAT. The on / off state of the output power supply LED_VBAT is controlled under the control of the enable signal LED_POWER_EN.

4. The multi-LED driving circuit according to claim 1, characterized in that, The multi-LED driver circuit further includes: an LED lamp driver power supply circuit; the enable interface further includes: a lamp driver power enable interface LED_DC_EN; The LED lamp driver power supply circuit includes: a DC-DC power chip; The DC-DC power chip, under the control of the enable signal sent by the lamp driver power enable interface LED_DC_EN, converts the input power LED_VBAT into a 3.3V power supply VLED and outputs it. The power supply VLED is connected to the power supply pins VCC and PVCC of each of the LED matrix driver chips; The model number of the DC-DC power supply chip is JW5250.

5. The multi-LED driving circuit according to claim 1, characterized in that, The multi-LED driving circuit also includes: a charging circuit; The charging circuit includes: a linear charging chip, a rechargeable battery, and a load switch chip; the externally input power is stored in the rechargeable battery after passing through the linear charging chip; The rechargeable battery supplies power to the multi-LED drive circuit under the control of the load switch chip.

6. The multi-LED driving circuit according to claim 5, characterized in that, The charging circuit also includes: an overvoltage protection chip; The externally input power passes through the overvoltage protection chip before entering the linear charging chip.

7. The multi-LED driving circuit according to claim 1, characterized in that, The multi-LED driver circuit also includes: an MCU; The MCU is used to generate PMW control signals; the MCU model is GR5331.

8. The multi-LED driving circuit according to claim 7, characterized in that, The multi-LED driver circuit also includes: a switching chip; After receiving the control command sent by the user via the button, the switch chip sends it to the MCU.

9. The multi-LED driving circuit according to claim 7, characterized in that, The multi-LED driving circuit also includes: an acceleration sensor; The acceleration sensor collects the vehicle's acceleration information and sends it to the MCU via IIC.

10. The multi-LED driving circuit according to claim 7, characterized in that, The multi-LED driving circuit also includes: a FLASH storage circuit; The FLASH storage circuit communicates with the MCU, and the FLASH storage circuit stores various preset patterns composed of multiple LED beads.

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