Circuit substrate, electronic component, power module, and vehicle

Abstract

The utility model discloses a kind of circuit substrate, electronic component, power module and vehicle, it is related to vehicle technical field, it aims at solving in relevant technology, DBC substrate is assembled into electronic component, weight is relatively big, and the problem of complex assembly process. The embodiment of the application provides a kind of circuit substrate, circuit substrate includes circuit layer and heat exchange layer. Heat exchange layer is laminated with circuit layer, heat exchange layer is laminated on the side of circuit layer, and contact with circuit layer.

Description

Technical Field

[0001] This utility model relates to the field of vehicle technology, and in particular to circuit boards, electronic components, power modules, and vehicles. Background Technology

[0002] Common circuit boards mainly include DBC (Direct Bonding Copper) boards, which are widely used in high-power power electronic modules, aerospace, military electronics and other products.

[0003] However, in related technologies, DBC substrates are relatively heavy after being assembled into electronic components, and the assembly process is complex. Utility Model Content

[0004] The purpose of this disclosure is to provide a circuit board, electronic components, power modules, and vehicles, aiming to solve the problem that in the related art, the DBC board, after being assembled into electronic components, has a relatively large weight and a complex assembly process.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] This application provides a circuit board, which includes a circuit layer and a heat exchange layer. The heat exchange layer is stacked on the circuit layer and in contact with the circuit layer.

[0007] This application provides a circuit board that integrates a heat exchange layer into the circuit board by including a circuit layer and a heat exchange layer. This eliminates the need for a separate heat exchange structure in the electronic components and for connecting the circuit board to the heat exchange structure of the electronic components. This simplifies the connection process between the circuit board and the heat exchange structure of the electronic components and eliminates the need for a connection layer between the circuit board and the heat exchange structure. As a result, the assembled electronic components can be lighter, the cost can be reduced, and the structure can be more compact.

[0008] In some embodiments, the heat exchange layer includes a heat exchange body and a heat exchange protrusion. The heat exchange body is stacked on and in contact with the circuit layer, and the heat exchange protrusion is mounted on the side of the heat exchange body away from the circuit layer.

[0009] This application provides a circuit board in which the heat exchange layer, including a heat exchange body and heat exchange protrusions, can have a good heat exchange level, thus ensuring the reliability of the circuit board during operation.

[0010] In some embodiments, the heat exchange protrusion includes one or more of a heat exchange column or a heat exchange fin.

[0011] This application provides a circuit board in which the heat exchange protrusion can be provided to further improve the heat exchange effect of the heat exchange protrusion.

[0012] In some embodiments, at least a portion of the heat exchange layer is a metal element.

[0013] This application provides a circuit board in which at least part of the heat exchange layer is made of metal, so that the heat exchange body has good support and thermal conductivity.

[0014] In some embodiments, the circuit board includes a thermally conductive insulating layer located between the circuit layer and the heat exchange layer.

[0015] This application provides a circuit board in which a thermally conductive insulating layer is provided, which enables insulation between the circuit layer and the heat exchange layer and facilitates the transfer of heat from the circuit layer to the heat exchange layer.

[0016] In some embodiments, the thermally conductive insulating layer includes an insulating adhesive, and the heat exchange layer is connected to the circuit layer through the insulating adhesive.

[0017] This application provides a circuit board in which the connection between the circuit layer and the thermally conductive insulating layer, as well as the connection between the heat exchange layer and the thermally conductive insulating layer, is made simpler and the connection process is simplified by the application of insulating adhesive.

[0018] In some embodiments, the peel strength of the insulating adhesive is greater than or equal to 1 N / mm.

[0019] This application provides a circuit board in which the peel strength of the insulating adhesive is set to achieve better adhesion, thereby reducing the risk of connection failure between the circuit layer and the thermally conductive insulating layer, and between the heat exchange layer and the thermally conductive insulating layer.

[0020] In some embodiments, the breakdown voltage of the insulating adhesive is greater than or equal to 20 kV / mm.

[0021] This application provides a circuit board in which the breakdown voltage of the insulating adhesive is set to ensure good insulation effect, reduce the risk of insulation failure between the circuit layer and the heat exchange layer, and ensure the reliability of the circuit board.

[0022] In some embodiments, the thermal conductivity of the insulating adhesive is greater than or equal to 3 W / mK and less than or equal to 25 W / mK.

[0023] This application provides a circuit board in which the thermal conductivity of the insulating adhesive is set so that the insulating adhesive has a good thermal conductivity while keeping the cost of the insulating adhesive within a suitable range.

[0024] In some embodiments, the thickness of the insulating adhesive is greater than or equal to 50 μm and less than or equal to 350 μm.

[0025] This application provides a circuit board in which the thickness of the insulating adhesive is set to ensure good insulation properties, reduce the risk of insulation failure, and ensure the thermal conductivity of the insulating adhesive.

[0026] In some embodiments, there are multiple thermally conductive insulating layers, and the multiple thermally conductive insulating layers are connected to one or more circuit layers.

[0027] This application provides a circuit board in which multiple thermally conductive insulating layers are connected to a single circuit layer, which can save on the material cost of the thermally conductive insulating layers and also allows for flexible adjustment of the number of thermally conductive insulating layers.

[0028] In some embodiments, the number of thermally conductive insulating layers is a single layer, and the single thermally conductive insulating layer is located between the circuit layer and the heat exchange layer.

[0029] This application provides a circuit board in which the thermally conductive insulating layer is set to be one, which facilitates the installation of the thermally conductive insulating layer.

[0030] In some embodiments, the number of line layers is multiple.

[0031] This application provides a circuit board with multiple circuit layers, allowing different electronic devices to be mounted on each circuit layer. This enables the formation of multiple electronic components on a single circuit board, which reduces the packaging cost of electronic components and increases power density compared to related technologies that form one electronic component on a single circuit board.

[0032] In some embodiments, the heat exchange layer includes a connecting portion and an enclosing portion. The connecting portion is stacked on top of the thermally conductive insulating layer. The enclosing portion encloses the connecting portion.

[0033] This application provides a circuit board with a connecting part and a surrounding part. The surrounding part is used to connect with the covering part. After the covering part is connected with the heat exchange layer, it can encapsulate the circuit board. The covering part facilitates the encapsulation of the circuit board.

[0034] In some embodiments, the thickness of the circuit layer is greater than or equal to 0.2 mm and less than or equal to 5 mm.

[0035] This application provides a circuit board in which the electrical connection function of the circuit layer is guaranteed by setting the thickness of the circuit layer, while having a low impact on the overall thickness of the circuit board.

[0036] This application provides an electronic component, including a circuit board as described above.

[0037] This application provides an electronic component that, through the arrangement of a circuit board, reduces the process of connecting the circuit board to the heat exchange structure of the electronic component, and can reduce costs and weight, making the structure of the electronic component more compact.

[0038] In some embodiments, the electronic component includes a device body connected to the circuit layer.

[0039] This application provides an electronic component whose structure is more complete by including a component body.

[0040] In some embodiments, the device body includes a chip and connection terminals. The connection terminals are connected to the circuit layer and electrically connected to the chip.

[0041] This application provides an electronic component that facilitates signal transmission by including a chip and connection terminals in the component body.

[0042] In some embodiments, the chip includes a semiconductor device.

[0043] This application provides an electronic component that, through a chip including a semiconductor device, can better meet usage requirements.

[0044] In some embodiments, the semiconductor device includes one or more of diodes, MOSFETs, and IGBTs.

[0045] This application provides an electronic component that, through the above-described configuration, allows for more flexible circuit design.

[0046] In some embodiments, the device body further includes a thermistor, which is mounted on the circuit layer and electrically connected to the connection terminal.

[0047] This application provides an electronic component that, through the setting of a thermistor, can detect the temperature of the electronic component, which is beneficial for monitoring the electronic component.

[0048] In some embodiments, the device body further includes a gate resistor, which is mounted on the circuit layer and electrically connected to the chip.

[0049] This application provides an electronic component that enables current sharing among chips by setting a gate resistor.

[0050] In some embodiments, there are multiple device bodies, and the multiple device bodies are connected to one or more of the line layers.

[0051] This application provides an electronic component that, by having multiple component bodies, can integrate more circuit functions within a limited space, thereby improving the performance and integration of the electronic component.

[0052] In some embodiments, the electronic components include charging circuit components and / or converter circuit components.

[0053] This application provides an electronic component that may include at least one of a charging circuit assembly and a converter circuit assembly, thereby enabling the circuit board of at least one of the charging circuit assembly and the converter circuit assembly to have higher integration, reduce weight and cost, and simplify the installation process.

[0054] In some embodiments, the charging circuit assembly includes a PFC circuit and / or an LLC resonant circuit.

[0055] This application provides an electronic component that, through the above-described configuration, can improve power conversion efficiency and provide a stable output voltage.

[0056] In some embodiments, the converter circuit components include a DC primary side and / or a DC secondary side.

[0057] This application provides an electronic component that, through the above-described configuration, can improve the working efficiency of the electronic component, reduce costs, enhance reliability, and improve dynamic response capabilities.

[0058] In some embodiments, the electronic component includes a cover portion connected to and enclosing a heat exchange layer to form a mounting cavity, and at least a portion of the component body is located in the mounting cavity.

[0059] This application provides an electronic component that, through the above-described configuration, protects the circuit board and the component body, thereby improving the reliability of the electronic component.

[0060] This application provides an electronic component. The heat exchange layer includes a connecting portion and a surrounding portion, which facilitates the connection between the surrounding portion and the heat exchange layer. This protects the circuit board and the device body, thereby improving the reliability of the electronic component.

[0061] In some embodiments, the cover portion includes a frame and a cover plate. The frame is located between the cover plate and the heat exchange layer, and the frame and the cover plate together form an installation cavity.

[0062] This application provides an electronic component, which, through the arrangement of a cover portion including a frame and a cover plate, facilitates the assembly, transportation, and disassembly of the cover portion.

[0063] In some embodiments, the electronic component further includes a packaging section located in the mounting cavity and connected between the cover section and the circuit board.

[0064] This application provides an electronic component, which also includes a packaging section to provide a buffering effect inside the electronic component.

[0065] In some embodiments, the cushioning portion includes cushioning rubber.

[0066] This application provides an electronic component that facilitates the potting of buffer material by including buffer adhesive in the buffer section.

[0067] This application provides a power module, including a circuit board and electronic components from any of the above embodiments, wherein the electronic components are mounted on the circuit board.

[0068] This application provides a power module that, through the arrangement of circuit boards and electronic components, can reduce the installation process of the power module and reduce the cost and weight of the power module.

[0069] This application provides a vehicle that includes the power module of any of the above embodiments.

[0070] This application provides a vehicle that, through the above-described configuration, reduces the vehicle's installation steps and lowers assembly costs. Attached Figure Description

[0071] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0072] Figure 1 This is a planar schematic diagram of a circuit board according to an embodiment of this application;

[0073] Figure 2 for Figure 1 A side view of a circuit board is shown.

[0074] Figure 3 This is a schematic diagram of the structure of an electronic component in an embodiment of this application;

[0075] Figure 4 for Figure 3 The diagram shows an exploded view of an electronic component.

[0076] Figure 5 for Figure 3The diagram shows a structural schematic of an electronic component from another perspective.

[0077] Figure 6 for Figure 3 A cross-sectional schematic diagram of an electronic component is shown.

[0078] Figure 7 for Figure 3 The diagram shows a partial structure of an electronic component.

[0079] Figure 8 for Figure 3 The diagram shows a top view of a portion of the structure of an electronic component.

[0080] Figure 9 This is a plan view of a vehicle according to an embodiment of this application.

[0081] Figure label:

[0082] 1. Vehicle; 11. Vehicle body; 12. Wheel;

[0083] 100. Electronic components;

[0084] 110. Circuit board; 111. Circuit layer; 112. Thermally conductive insulating layer; 113. Heat exchange layer; 113a. Heat exchange body; 113b. Heat exchange protrusion; 1131. Connecting part; 1132. Enclosing part;

[0085] 120. Device body; 121. Chip; 122. Connecting terminal;

[0086] 130. Cover section; 131. Enclosure frame; 132. Cover plate;

[0087] A1, Charging circuit assembly; A11, PFC circuit; A111, PFC fast transistor; A112, PFC slow transistor; A12, LLC resonant circuit; A121, LLC primary side; A122, LLC secondary side;

[0088] B1, Converter circuit components; B11, DC primary side; B12, DC secondary side. Detailed Implementation

[0089] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0090] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0091] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "communication" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a direct connection or an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0092] In embodiments of this invention, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, article, or apparatus that includes that element.

[0093] In this embodiment of the invention, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in this embodiment of the invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0094] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0095] Common circuit boards mainly include DBC (Digital Circuit Board) boards, which are widely used in high-power power electronic modules, aerospace, and military electronics products. However, in related technologies, DBC boards primarily consist of a three-layer structure: a circuit layer, an insulating layer, and a metal layer stacked sequentially. The circuit layer is mainly used for connecting to components such as chips and resistors; the insulating layer provides insulation between the circuit layer and the metal layer; and the metal layer connects to external heat exchange devices. During the assembly of electronic components from DBC boards, the metal layer needs to connect to external heat exchange devices. Therefore, after assembly, the DBC structure is complex, resulting in significant weight and a complex assembly process due to the need for the metal layer to connect to external heat exchange devices.

[0096] Please refer to Figures 1 to 2 As shown, this application embodiment provides a circuit board 110, which includes a circuit layer 111 and a heat exchange layer 113. The heat exchange layer is stacked on the circuit layer and in contact with the circuit layer.

[0097] This application provides a circuit board 110. By including a circuit layer 111 and a heat exchange layer 113 in the circuit board 110, the heat exchange layer 113 is integrated into the circuit board 110. There is no need to set a heat exchange structure in the electronic component 100, nor is it necessary to connect the circuit board 110 with the heat exchange structure of the electronic component 100. This simplifies the connection process between the circuit board 110 and the heat exchange structure of the electronic component 100, and eliminates the need for a connection layer between the circuit board 110 and the heat exchange structure. Therefore, the assembled electronic component 100 can be lighter, the cost can be reduced, and the structure can be more compact.

[0098] In some embodiments, the heat exchange layer 113 includes a heat exchange body 113a and a heat exchange protrusion 113b. The heat exchange body 113a is stacked on and in contact with the circuit layer 111, and the heat exchange protrusion 113b is installed on the side of the heat exchange body 113a away from the circuit layer 111.

[0099] This application provides a circuit board 110. By providing a heat exchange layer 113 including a heat exchange body 113a and a heat exchange protrusion 113b, the heat exchange layer 113 can have a good heat exchange level, which can ensure the reliability of the circuit board 110 during operation.

[0100] In some embodiments, the heat exchange protrusion 113b includes one or more of a heat exchange column or a heat exchange fin.

[0101] This application provides a circuit board 110, which can further improve the heat exchange effect of the heat exchange protrusion 113b by setting the heat exchange protrusion 113b.

[0102] In some embodiments, at least a portion of the heat exchange layer 113 is made of metal.

[0103] This application provides a circuit board 110, in which at least a portion of the heat exchange layer 113 is made of metal, so that the heat exchange body 113a has good support and thermal conductivity.

[0104] In some embodiments, the circuit board 110 includes a thermally conductive insulating layer 112, which is located between the circuit layer 111 and the heat exchange layer 113.

[0105] This application provides a circuit board 110. By including a thermally conductive insulating layer 112 in the circuit board 110, insulation can be achieved between the circuit layer 111 and the heat exchange layer 113, and the heat of the circuit layer 111 can be transferred to the heat exchange layer 113 for heat exchange.

[0106] In some embodiments, the thermally conductive insulating layer 112 includes insulating adhesive, and the heat exchange layer 113 is connected to the circuit layer 111 through the insulating adhesive.

[0107] This application provides a circuit board 110, which, through the application of insulating adhesive, makes the connection between the circuit layer 111 and the thermally conductive insulating layer 112, as well as the connection between the heat exchange layer 113 and the thermally conductive insulating layer 112, simpler and the connection process more streamlined.

[0108] In some embodiments, the peel strength of the insulating adhesive is greater than or equal to 1 N / mm.

[0109] The peel strength of insulating adhesives includes 1N / mm, 2N / mm, 3N / mm, 4N / mm, 5N / mm, etc.

[0110] If the peel strength of the insulating adhesive is less than 1 N / mm, it cannot meet the connection requirements of the insulating adhesive for the heat exchange layer 113 and the circuit layer 111, resulting in poor reliability of the circuit board 110.

[0111] This application provides a circuit board 110. By setting the peel strength of the insulating adhesive, the insulating adhesive can have a better bonding effect, reducing the risk of connection failure between the circuit layer 111 and the thermally conductive insulating layer 112, and between the heat exchange layer 113 and the thermally conductive insulating layer 112.

[0112] In some embodiments, the breakdown voltage of the insulating adhesive is greater than or equal to 20 kV / mm.

[0113] The breakdown voltage of insulating adhesives includes 20kV / mm, 30kV / mm, 40kV / mm, 50kV / mm, 60kV / mm, etc.

[0114] If the breakdown voltage of the insulating adhesive is less than 20kV / mm, the insulating performance of the adhesive is poor, which can easily cause the signal of the line layer 111 to be transmitted to the external circuit, affecting the signal transmission effect.

[0115] This application provides a circuit board 110. By setting the breakdown voltage of the insulating adhesive, the insulating adhesive has a good insulation effect, which reduces the risk of insulation failure between the circuit layer 111 and the heat exchange layer 113 and ensures the reliability of the circuit board 110.

[0116] In some embodiments, the thermal conductivity of the insulating adhesive is greater than or equal to 3 W / mK and less than or equal to 25 W / mK.

[0117] The thermal conductivity of insulating adhesives includes 3W / mK, 10W / mK, 15W / mK, 20W / mK, 25W / mK, etc.

[0118] If the thermal conductivity of the insulating adhesive is less than 3 W / mK, its thermal conductivity cannot meet the thermal requirements of the circuit layer 111, which can easily cause heat accumulation in the circuit layer 111 and affect its service life. If the thermal conductivity of the insulating adhesive is greater than 25 W / mK, its thermal conductivity is too strong, which can easily cause the circuit layer 111 to lose temperature in low-temperature environments.

[0119] In some embodiments, the thickness of the insulating adhesive is greater than or equal to 50 μm and less than or equal to 350 μm.

[0120] The thickness of the insulating adhesive includes 50μm, 100μm, 200μm, 300μm, and 350μm.

[0121] If the thickness of the insulating adhesive is less than 50 μm, the connection strength may not meet the requirements; if the thickness of the insulating adhesive is greater than 350 μm, the thermal conductivity of the insulating adhesive may not meet the requirements.

[0122] This application provides a circuit board 110. By setting the thickness of the insulating adhesive, the insulating adhesive can be guaranteed to have good insulation properties, reduce the risk of insulation failure, and ensure the thermal conductivity of the insulating adhesive.

[0123] This application provides a circuit board 110. By setting the thermal conductivity of the insulating adhesive, it is possible to ensure that the insulating adhesive has a good thermal conductivity while keeping the cost of the insulating adhesive within a suitable range.

[0124] In some embodiments, there are multiple thermally conductive insulating layers 112, and the multiple thermally conductive insulating layers 112 are connected to one or more circuit layers 111.

[0125] This application provides a circuit board 110. If multiple thermally conductive insulating layers 112 are connected to a circuit layer 111, the material cost of the thermally conductive insulating layers 112 can be saved, and the number of thermally conductive insulating layers 112 can be flexibly adjusted.

[0126] In some embodiments, the number of thermally conductive insulating layers 112 is a single layer, and the single thermally conductive insulating layer 112 is located between the circuit layer 111 and the heat exchange layer 113.

[0127] This application provides a circuit board 110, which facilitates the installation of the thermally conductive insulating layer 112 by setting the number of thermally conductive insulating layers 112 to one.

[0128] In some embodiments, the number of line layers 111 is multiple.

[0129] This application provides a circuit board 110. By setting the number of circuit layers 111 to be multiple, different device bodies 120 can be installed on each circuit layer 111, thereby forming multiple electronic components 100 on a single circuit board 110. Compared with related technologies that form one electronic component 100 on a single circuit board 110, this can reduce the packaging cost of the electronic component 100 and increase the power density.

[0130] In some embodiments, the number of line layers 111 is four, and the four line layers 111 are arranged in the same direction.

[0131] This application provides a circuit board 110, which can better meet installation needs by setting the number of circuit layers 111.

[0132] Optionally, there are four circuit layers 111. One circuit layer 111 houses the device body 120, which together with the circuit layer 111 forms the PFC fast transistor and PFC slow transistor. Another circuit layer 111 houses the device body 120, which together with the circuit layer 111 forms the LLC primary side. A third circuit layer 111 houses the device body 120, which together with the circuit layer 111 forms the LLC secondary side and DC primary side. A fourth circuit layer 111 houses the device body 120, which together with the circuit layer 111 forms the DC secondary side. The PFC fast transistor, PFC slow transistor, LLC primary side, and LLC secondary side together form the charger circuit assembly. The DC primary side and DC secondary side together form the DC / DC circuit assembly. The charger circuit assembly converts AC power to DC power to charge the power battery. The DC / DC circuit assembly converts the high-voltage DC power output from the battery pack to low-voltage DC power to charge the vehicle's low-voltage electrical appliances.

[0133] In some embodiments, the heat exchange layer 113 includes a connecting portion 1131 and an enclosing portion 1132. The connecting portion 1131 is stacked with the thermally conductive insulating layer 112. The enclosing portion 1132 is disposed around the connecting portion 1131.

[0134] This application provides a circuit board 110. By providing a connecting part 1131 and a surrounding part 1132, the surrounding part 1132 is used to connect with the covering part 130. After the covering part 130 is connected to the heat exchange layer 113, it can encapsulate the circuit board 110. The provision of the covering part 130 facilitates the encapsulation of the circuit board 110.

[0135] In some embodiments, the thickness of the circuit layer 111 is greater than or equal to 0.2 mm and less than or equal to 5 mm.

[0136] The thickness of the circuit layer 111 includes 0.2mm, 1mm, 2mm, 3mm, 4mm, and 5mm.

[0137] This application provides a circuit board 110. By setting the thickness of the line layer 111, the electrical connection function of the line layer 111 can be guaranteed, while the overall thickness of the circuit board 110 is minimally affected.

[0138] Please refer to Figures 3 to 8 As shown, this application provides an electronic component 100, including the circuit board 110 of any of the above.

[0139] This application provides an electronic component 100. By setting up a circuit board 110, the process of connecting the circuit board 110 and the heat exchange structure of the electronic component 100 can be reduced, and the cost and weight can be reduced, making the structure of the electronic component 100 more compact.

[0140] In some embodiments, the electronic component 100 includes a device body 120, which is connected to the circuit layer 111.

[0141] The device body 120 includes, but is not limited to, chip 121, connection terminal 122, connection line 123, resistor, etc. The connection terminal 122 is connected to the circuit layer 111 and electrically connected to the chip 121.

[0142] Optionally, chip 121 is connected to circuit layer 111 by soldering or sintering. One end of connecting line 123 is connected to circuit layer 111, and the other end is connected to chip 121. Connecting line 123 includes, but is not limited to, structures such as aluminum wire, copper wire, and copper strip. Connecting terminal 122 includes, but is not limited to, DC positive terminal and DC negative terminal.

[0143] This application provides an electronic component 100, which makes the structure of the electronic component 100 more complete by including a device body 120.

[0144] In some embodiments, the device body 120 includes a chip 121 and a connection terminal 122. The connection terminal 122 is connected to the circuit layer 111 and electrically connected to the chip 121.

[0145] This application provides an electronic component 100, which facilitates signal transmission by including a chip 121 and a connection terminal 122 in the component body 120.

[0146] In some embodiments, chip 121 includes a semiconductor device.

[0147] This application provides an electronic component 100, which, through the chip 121 including semiconductor devices, can better meet usage requirements.

[0148] In some embodiments, the semiconductor device includes one or more of the following: diode, MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), and IGBT (Insulated-Gate Bipolar Transistor).

[0149] Optionally, the diode includes an FRD (Fast Recovery Diode).

[0150] This application provides an electronic component 100, which, through the above-described configuration, allows for more flexible circuit design of the electronic component 100.

[0151] Optionally, the resistor includes at least one of a thermistor and a gate resistor. The thermistor is mounted on the circuit layer 111 and electrically connected to the connection terminal 122. The gate resistor is mounted on the circuit layer 111 and electrically connected to the chip 121.

[0152] The electronic component 100 provided in this application embodiment can detect the temperature of the electronic component 100 by setting a thermistor, which is beneficial for monitoring the electronic component 100. By setting a gate resistor, current sharing among the chips 121 can be achieved.

[0153] In some embodiments, there are multiple device bodies 120, and the multiple device bodies 120 are connected to one or more of the line layers 111.

[0154] This application provides an electronic component 100. By arranging multiple component bodies 120, more circuit functions can be integrated within a limited space, thereby improving the performance and integration of the electronic component 100.

[0155] In some embodiments, electronic component 100 includes charging circuit assembly A1 and / or converter circuit assembly B1.

[0156] This application provides an electronic component 100, which may include at least one of a charging circuit assembly A1 and a converter circuit assembly B1, so that the circuit board 110 of at least one of the charging circuit assembly A1 and the converter circuit assembly B1 has a higher degree of integration, reduces weight and cost, and simplifies the installation process.

[0157] In some embodiments, the charging circuit assembly A1 includes a PFC circuit A11 and / or an LLC resonant circuit A12.

[0158] The PFC circuit A11 includes at least one of the PFC fast transistor A111 and the PFC slow transistor A112. The LLC resonant circuit A12 includes at least one of the LLC primary side A121 and the LLC secondary side A122.

[0159] Optionally, the PFC circuit A11 includes a PFC fast transistor A111 and a PFC slow transistor A112, and the LLC resonant circuit A12 includes an LLC primary side A121 and an LLC secondary side A122.

[0160] This application provides an electronic component 100, which, through the above-described configuration, can improve power conversion efficiency and provide a stable output voltage.

[0161] In some embodiments, converter circuit component B1 includes a DC primary side B11 and / or a DC secondary side B12.

[0162] This application provides an electronic component 100, which, through the above-described configuration, can improve the working efficiency of the electronic component 100, reduce costs, enhance reliability, and improve dynamic response capabilities.

[0163] In some embodiments, the electronic component 100 includes a cover portion 130, which is connected to and encloses a heat exchange layer 113 to form a mounting cavity, and at least a portion of the thermally conductive insulating layer 112, the circuit layer 111, and the device body 120 are located in the mounting cavity.

[0164] Optionally, the cover 130 may be made of plastic.

[0165] This application provides an electronic component 100, which facilitates connection with the heat exchange layer 113 through the provision of the cover portion 130, and plays a protective role for the circuit board 110 and the device body 120, thereby improving the reliability of the electronic component 100.

[0166] Optionally, the cover portion 130 is disposed on the side of the circuit board away from the heat exchange protrusion.

[0167] In some embodiments, the heat exchange layer 113 includes a connecting portion 1131 and an enclosure portion 1132. The connecting portion 1131 and the thermally conductive insulating layer 112 are stacked together, and the enclosure portion 1132 is disposed around the connecting portion 1131.

[0168] In some embodiments, the cover portion 130 includes a frame 131 and a cover plate 132. The cover plate 132 and the frame 131 are located between the cover plate 132 and the heat exchange layer 113, and the frame 131 and the cover plate 132 enclose a mounting cavity.

[0169] The connection methods between the frame 131 and the heat exchange layer 113 include, but are not limited to, detachable connection and adhesive bonding. The connection methods between the frame 131 and the cover plate 132 include, but are not limited to, snap-fit ​​connection and bolt connection.

[0170] This application provides an electronic component 100, which, through the arrangement of a cover portion 130 including a frame 131 and a cover plate 132, facilitates the assembly, transportation, and disassembly of the cover portion 130.

[0171] In some embodiments, the electronic component 100 further includes a packaging section located in the mounting cavity and connected between the cover section 130 and the circuit board 110.

[0172] This application provides an electronic component 100, which also includes a packaging section, so that the electronic component 100 has a buffering function.

[0173] In some embodiments, the cushioning portion includes cushioning rubber.

[0174] Buffering adhesives include, but are not limited to, silicone gels, epoxy resins, etc.

[0175] This application provides an electronic component 100, which facilitates the potting of buffer material by including buffer adhesive in the buffer section.

[0176] This application provides a power module, including a circuit board and electronic components 100 of any of the above embodiments, wherein the electronic components 100 are mounted on the circuit board.

[0177] This application provides a power module that, through the arrangement of circuit boards and electronic components 100, can reduce the installation process of the power module and reduce the cost and weight of the power module.

[0178] Please refer to Figure 9 As shown, this application provides a vehicle that includes the power module of any of the above embodiments.

[0179] This application provides a vehicle that, through the above-described configuration, reduces the vehicle's installation steps and lowers assembly costs.

[0180] Vehicle 1 can be a pure electric vehicle, a hybrid electric vehicle, a plug-in hybrid electric vehicle, a range-extended electric vehicle, or a gasoline-powered vehicle. Vehicle 1 can also be a sedan, truck, bus, lorry, trailer, etc. Vehicle 1 includes a body 11 and wheels 12, with the wheels 12 supporting the body 11, and the power module installed in vehicle 1.

[0181] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A circuit board (110), characterized in that, include: Line layer (111); as well as A heat exchange layer (113) is stacked on the circuit layer (111) and in contact with the circuit layer (111); The heat exchange layer (113) includes: The heat exchange body (113a) is stacked on the circuit layer (111) and in contact with the circuit layer (111); A heat exchange protrusion (113b) is installed on the side of the heat exchange body (113a) away from the circuit layer (111).

2. The circuit board (110) according to claim 1, characterized in that, The heat exchange protrusion (113b) includes one or more of a heat exchange column or a heat exchange fin.

3. The circuit board (110) according to claim 1, characterized in that, At least a portion of the heat exchange layer (113) is made of metal.

4. The circuit board (110) according to claim 1, characterized in that, The circuit board (110) further includes a thermally conductive insulating layer (112), which is located between the circuit layer (111) and the heat exchange layer (113).

5. The circuit board (110) according to claim 4, characterized in that, The thermally conductive insulating layer (112) includes insulating adhesive, and the heat exchange layer (113) is connected to the circuit layer (111) through the insulating adhesive.

6. The circuit board (110) according to claim 5, characterized in that, The peel strength of the insulating adhesive is greater than or equal to 1 N / mm.

7. The circuit board (110) according to claim 5, characterized in that, The breakdown voltage of the insulating adhesive is greater than or equal to 20kV / mm.

8. The circuit board (110) according to claim 5, characterized in that, The thermal conductivity of the insulating adhesive is greater than or equal to 3 W / mK and less than or equal to 25 W / mK.

9. The circuit board (110) according to claim 5, characterized in that, The thickness of the insulating adhesive is greater than or equal to 50 μm and less than or equal to 350 μm.

10. The circuit board (110) according to claim 4, characterized in that, There are multiple thermally conductive insulating layers (112), and the multiple thermally conductive insulating layers (112) are connected to one or more circuit layers (111).

11. The circuit board (110) according to claim 4, characterized in that, The number of thermally conductive insulating layers (112) is one, and the single thermally conductive insulating layer (112) is located between the circuit layer (111) and the heat exchange layer (113).

12. The circuit board (110) according to any one of claims 1 to 11, characterized in that, The number of line layers (111) is multiple.

13. The circuit board (110) according to any one of claims 1 to 11, characterized in that, The circuit board (110) further includes a thermally conductive insulating layer (112), which is located between the circuit layer (111) and the heat exchange layer (113). The heat exchange layer (113) includes: The connecting portion (1131) is stacked with the thermally conductive insulating layer (112); and Enclosing portion (1132), enclosing the connecting portion (1131).

14. The circuit board (110) according to any one of claims 1 to 11, characterized in that, The thickness of the line layer (111) is greater than or equal to 0.2 mm and less than or equal to 5 mm.

15. An electronic component (100), characterized in that, The circuit board (110) includes any one of claims 1 to 14.

16. The electronic component (100) according to claim 15, characterized in that, The electronic component (100) includes a device body (120), which is connected to the circuit layer (111).

17. The electronic component (100) according to claim 16, characterized in that, The device body (120) includes: Chip (121); The connection terminal (122) is connected to the line layer (111) and electrically connected to the chip (121).

18. The electronic component (100) according to claim 17, characterized in that, The chip (121) includes a semiconductor device.

19. The electronic component (100) according to claim 18, characterized in that, The semiconductor device includes one or more of diodes, MOSFETs, and IGBTs.

20. The electronic component (100) according to claim 17, characterized in that, The device body (120) also includes a thermistor, which is mounted on the circuit layer (111) and electrically connected to the connection terminal (122).

21. The electronic component (100) according to claim 17, characterized in that, The device body (120) also includes a gate resistor, which is mounted on the line layer (111) and electrically connected to the chip (121).

22. The electronic component (100) according to claim 16, characterized in that, There are multiple device bodies (120), and multiple device bodies (120) are connected to one or more of the line layers (111).

23. The electronic component (100) according to claim 22, characterized in that, The electronic components (100) include a charging circuit assembly (A1) and / or a converter circuit assembly (B1).

24. The electronic component (100) according to claim 23, characterized in that, The charging circuit assembly (A1) includes a PFC circuit (A11) and / or an LLC resonant circuit (A12).

25. The electronic component (100) according to claim 23, characterized in that, The converter circuit assembly (B1) includes a DC primary side (B11) and / or a DC secondary side (B12).

26. The electronic component (100) according to claim 18, characterized in that, The electronic component (100) includes a cover (130). The cover portion (130) is connected to the heat exchange layer (113) and encloses it to form an installation cavity, at least a portion of the device body (120) is located in the installation cavity.

27. The electronic component (100) according to claim 26, characterized in that, The cover (130) includes: Frame (131); and The cover plate (132) and the frame (131) are located between the cover plate (132) and the heat exchange layer (113), and the frame (131) and the cover plate (132) enclose the mounting cavity.

28. The electronic component (100) according to claim 26, characterized in that, The electronic component (100) further includes a packaging section located in the mounting cavity and connected between the cover section (130) and the circuit board (110).

29. The electronic component (100) according to claim 28, characterized in that, The encapsulation section includes a cushioning adhesive.

30. A power supply module, characterized in that, include: Circuit board; as well as The electronic component (100) according to any one of claims 15 to 29, wherein the electronic component (100) is mounted on the circuit board.

31. A vehicle (1), characterized in that, Includes the power module as described in claim 30.

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