A PFC circuit board structure for a sensor

Abstract

The utility model relates to sensor circuit board technical field, concretely is a kind of PFC circuit board structure for sensor, including up and down the upper connecting part and lower connecting part, and the upper connecting part and lower connecting part are connected by the elastic flanging setting in same side;Upper connecting part is provided with upper connecting part jack;The upper surface of lower connecting part is provided with electronic component installation site, and the lower connecting part jack that can penetrate lower connecting part;Lower connecting part further includes symmetrical flexible support arm setting in two sides, and flexible support arm's end is provided with support arm jack;Upper connecting part, lower connecting part and elastic flanging are integrally formed.This structure can realize the reliable electrical connection of ceramic condenser pressure sensing component, NTC temperature sensing component and external terminal, through flexible support arm, elastic flanging adaptation installation deviation, reliably grounded using flexible ground support arm and sleeve foot, improve sensor signal precision and assembly stability, applicable to the multi-component integrated connection of ceramic condenser type temperature and pressure sensor.

Description

Technical Field

[0001] This utility model relates to the field of sensor circuit board technology, and in particular to a PFC circuit board structure for sensors. Background Technology

[0002] As a key component combining pressure measurement and temperature compensation, the ceramic capacitive temperature and pressure sensor requires the integration of a ceramic capacitive pressure sensing component and an NTC temperature sensing component. It also needs to establish a stable electrical connection with external terminals to achieve signal transmission. However, traditional circuit board structures used for this type of sensor have many technical defects, making it difficult to meet practical application requirements. On the one hand, traditional circuit board connection structures are relatively rigid, while the internal installation space of sensors is usually small and requires fine-tuning during assembly. Rigid structures are not only difficult to adapt to such spatial characteristics, but also prone to loosening of component connections due to stress generated during installation, affecting the stability of signal transmission. On the other hand, the grounding structure design is imperfect and the electromagnetic interference protection capability is weak. When the sensor is working, it is easily affected by external electromagnetic signals, which leads to a decrease in the accuracy of pressure and temperature detection signals and cannot meet the high-precision measurement requirements. In addition, traditional structures lack integrated and highly adaptable design for pressure sensing components, temperature sensing components and external terminals. Each component connection requires separate operation, the assembly process is cumbersome and inefficient, and the reliability of each connection node is difficult to guarantee, which can easily lead to problems such as poor contact.

[0003] Therefore, there is an urgent need for a circuit board structure that can efficiently integrate multi-component connection functions, has flexible adaptability to cope with installation deviations, and can reliably ground, in order to solve the shortcomings of traditional structures and meet the performance and assembly requirements of ceramic capacitive temperature and pressure sensors. Utility Model Content

[0004] The purpose of this invention is to overcome the problems of the prior art and provide a PFC circuit board structure for sensors. This structure addresses the technical issues of traditional sensor circuit boards, such as high rigidity making them difficult to adapt to small spaces requiring fine-tuning, inadequate grounding, and low efficiency and reliability due to the lack of integration among multiple components. The aim is to achieve reliable electrical connection between the ceramic capacitor pressure sensing component and the NTC temperature sensing component within the ceramic capacitive temperature and pressure sensor, while optimizing external terminal connections and grounding performance, thereby improving assembly convenience and signal stability.

[0005] The above objectives are achieved through the following technical solutions: A PFC circuit board structure for sensors includes an upper connecting part and a lower connecting part arranged vertically, connected by an elastic flange on the same side; the elastic flange is made of flexible material and has elastic deformation capability to adapt to position adjustment during installation; the upper connecting part is provided with an upper connecting part insertion hole; the upper surface of the lower connecting part is provided with an electronic component mounting position and a lower connecting part insertion hole that can pass through the lower connecting part; the lower connecting part also includes flexible support arms symmetrically arranged on both sides, and the ends of the flexible support arms are provided with support arm insertion holes; the upper connecting part, the lower connecting part, and the elastic flange are integrally formed.

[0006] Furthermore, the upper connecting part (1) also includes a flexible grounding arm (102), which is used to contact the inner wall of the sensor housing to achieve grounding.

[0007] Furthermore, the end of the flexible grounding arm (102) is provided with a sleeve (103), which is used to sleeve the lower edge of the connector with external pins.

[0008] Furthermore, when the sleeve (103) engages with the pressure port, it can press the end of the flexible grounding arm (102) against the inner wall of the metal pressure port.

[0009] Furthermore, there are two flexible grounding arms (102), which are symmetrically arranged on both sides of the elastic flange (3).

[0010] Furthermore, the flexible grounding arm (102) is disposed on the symmetrical side of the upper connecting part (1) corresponding to the elastic flange (3).

[0011] Furthermore, the upper connecting part socket (101) is used to facilitate the insertion of external pins.

[0012] Furthermore, the lower connection hole (202) is used to facilitate the insertion of the pressure-sensing component pin.

[0013] Furthermore, the electronic component mounting position (201) is used to mount chip-type electronic components.

[0014] Furthermore, the arm socket (204) is used to facilitate the insertion of the temperature sensing component pin below it.

[0015] This utility model provides a PFC circuit board structure for sensors, featuring an integrally formed upper and lower connecting part and an elastic flange structure, which significantly simplifies the assembly process and improves production efficiency. The flexible support arm and elastic flange have elastic deformation capabilities, which can adapt to the narrow space inside the sensor and installation deviations, avoiding pin misalignment or circuit board damage, and enhancing connection reliability. The flexible grounding support arm, together with the end sleeve, can achieve reliable grounding when the connector is engaged with the pressure port, effectively shielding electromagnetic interference and ensuring the accuracy of the sensor signal. Furthermore, the partitioned sockets and electronic component mounting positions can simultaneously realize the electrical connection of the ceramic capacitor pressure sensing component, the NTC temperature sensing component, and the external terminals, meeting the multi-parameter detection requirements of the sensor. Attached Figure Description

[0016] Figure 1 This is a first-view structural schematic diagram of a PFC circuit board structure for a sensor according to the present invention. Figure 2 This is a second-view structural schematic diagram of a PFC circuit board structure for a sensor according to the present invention; Figure 3 This is a third-view structural diagram of a PFC circuit board structure for a sensor according to the present invention. Figure 4 This is a schematic diagram of the second form of the flexible grounding arm in the PFC circuit board structure for sensors described in this utility model.

[0017] Illustration markings: 1-Upper connecting part, 101-Upper connecting part socket, 102-Flexible grounding support arm, 103-Sleeve foot; 2-Lower connecting part, 201-Electronic component mounting position, 202-Lower connecting part socket, 203-Flexible support arm, 204-Support arm socket; 3- Flexible flanging. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. The described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0019] A PFC circuit board structure for a sensor is provided, applied to a ceramic capacitive temperature and pressure sensor, for realizing the electrical connection of the internal ceramic capacitive pressure sensing component and NTC temperature sensing component, as well as the connection between the sensor and external terminals. It should be noted that this solution only provides the PFC circuit board structure, and the specific structure and electrical connection function of its internal circuit can be implemented using technologies known in the art, so they will not be described in detail in this solution.

[0020] like Figures 1-3 As shown, the present invention provides a PFC circuit board structure for a sensor, including an upper connecting part 1 and a lower connecting part 2 arranged vertically, wherein the upper connecting part 1 and the lower connecting part 2 are connected by an elastic flange 3 arranged on the same side. The upper connecting part 1 is provided with an upper connecting part socket 101 for convenient insertion of external pins to realize signal transmission with external devices; The upper surface of the lower connecting part 2 is provided with an electronic component mounting position 201 and a lower connecting part insertion hole 202 that can pass through the lower connecting part 2. The lower connecting part insertion hole 202 is used to facilitate the insertion of the pressure sensing component pins so that the signal of the pressure sensing component can be transmitted to the circuit board. The electronic component mounting position 201 is used to install electronic components such as signal conditioning chips and calibration chips to process the sensor signal. The lower connecting part 2 also includes flexible support arms 203 symmetrically arranged on both sides. The end of the flexible support arm 203 is provided with a support arm insertion hole 204. The support arm insertion hole 204 is used to facilitate the insertion of the temperature sensing component pin below it, thereby realizing the electrical connection between the temperature sensing component and the circuit board. In this embodiment, the upper connecting part 1, the lower connecting part 2, and the elastic flange 3 are integrally formed and made of a flexible conductive material (such as silver-plated copper foil substrate), which ensures both conductivity and elastic deformation capability to accommodate fine-tuning of the position during installation.

[0021] As an optimization of this solution, the upper connecting part 1 also includes a flexible grounding support arm 102. The flexible grounding support arm 102 is used to facilitate contact with the inner wall of the sensor housing to achieve grounding, thereby effectively shielding electromagnetic interference and improving the accuracy of the sensor signal.

[0022] The flexible grounding support arm 102 is provided with a sleeve 103 at its end, which is used to facilitate the connection of the lower edge of the connector with external pins. When the lower edge of the connector is engaged with the pressure port, the end of the flexible grounding support arm 102 is pressed against the inner wall of the metal pressure port to ensure the reliability and stability of grounding.

[0023] The flexible grounding arm 102 has two structural forms: The first type has two flexible grounding arms 102, symmetrically arranged on both sides of the elastic flange 3, such as... Figure 1 As shown; In the second type, the flexible grounding arm 102 is disposed on the symmetrical side of the upper connecting part 1 corresponding to the elastic flange 3, such as... Figure 4 As shown.

[0024] The circuit board structure provided in this solution mainly consists of an upper connecting part 1, a lower connecting part 2, and an elastic flange 3. The three are integrally molded and use flexible conductive materials (such as silver-plated copper foil with a thickness of 0.2mm and an insulating protective layer on the surface), which have both conductivity and elastic deformation capabilities.

[0025] In this embodiment, the upper connecting part 1 has a plate-like structure and is provided with an upper connecting part socket 101 for inserting external pins. The external pins can come from the external connector of the sensor, and the signal interaction between the external device and the circuit board is realized through the socket.

[0026] In addition, the upper connecting part 1 is also equipped with a flexible grounding arm 102, which is used to contact the inner wall of the sensor housing (such as the pressure port, which is made of metal and has grounding conditions) to achieve grounding and reduce the impact of electromagnetic interference on the sensor signal. The end of the flexible grounding arm 102 is provided with a sleeve 103, which is a ring or U-shaped structure, used to fit the lower edge of the connector with external pins; when the lower edge of the connector is engaged with the metal pressure port of the sensor, the sleeve 103 is squeezed, causing the end of the flexible grounding arm 102 to fit tightly against the inner wall of the pressure port, ensuring reliable grounding.

[0027] The flexible grounding arm 102 described in this embodiment can be arranged in two ways: Layout 1: Two flexible grounding arms 102 are symmetrically arranged on both sides of the elastic flange 3 to evenly distribute the grounding pressure, such as... Figure 1 As shown; Layout 2: The flexible grounding arm 102 is positioned symmetrically on the upper connecting part 1 corresponding to the elastic flange 3, adapting to the specific spatial layout inside the sensor, such as... Figure 4 As shown.

[0028] In this embodiment, the lower connecting part 2 is located below the upper connecting part 1, and the upper surface is provided with an electronic component mounting position 201 for mounting chip-type electronic components (such as signal amplification chips, temperature compensation chips, etc.). The electronic components are fixed to the mounting position by soldering or surface mount technology to realize functions such as conditioning and calibration of sensor signals.

[0029] The lower connecting part 2 is also provided with a lower connecting part insertion hole 202, which passes through the lower connecting part 2 and is used for the insertion of the ceramic capacitor pressure sensing component pins, so that the pressure signal detected by the pressure sensing component can be transmitted to the circuit board for processing.

[0030] Flexible support arms 203 are symmetrically arranged on both sides of the lower connecting part 2. The flexible support arms 203 are long strips with elastic structure. Support arm insertion holes 204 are opened at their ends for the insertion of NTC temperature sensing component pins, thereby introducing temperature signals into the circuit board and realizing temperature and pressure joint detection and compensation in conjunction with pressure signals.

[0031] In this embodiment, the elastic flange 3 connects the upper connecting part 1 and the lower connecting part 2 on the same side. It is a flexible and deformable folding structure, which allows the upper and lower connecting parts to be adjusted in angle and position to accommodate spatial deviations during sensor installation and avoid pin misalignment or circuit board damage caused by rigid connection.

[0032] During assembly: Component connection: The pins of the ceramic capacitor pressure sensing component are inserted into the lower connection part socket 202, and the pins of the NTC temperature sensing component are inserted into the support arm socket 204 to realize the electrical connection between the internal components and the circuit board; the external pins are inserted into the upper connection part socket 101 to establish the signal path between the sensor and the external device.

[0033] Grounding is achieved by inserting the lower edge of the connector with external pins into the sleeve 103, and then snapping the connector into the metal pressure port. The sleeve 103 is compressed, causing the end of the flexible grounding arm 102 to be tightly attached to the inner wall of the pressure port, thus completing reliable grounding and shielding electromagnetic interference.

[0034] Position adaptation: The flexible deformation capability of the elastic flange 3 can make itself elastically adjust when there are slight deviations in the installation of the upper and lower connecting parts, ensuring precise docking of each pin, improving the assembly success rate and connection stability.

[0035] The above description is only for illustrating the embodiments of this utility model and is not intended to limit this utility model. For those skilled in the art, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A PFC circuit board structure for a sensor, characterized in that, It includes an upper connecting part (1) and a lower connecting part (2) arranged vertically, and the upper connecting part (1) and the lower connecting part (2) are connected by an elastic flange (3) arranged on the same side; The upper connecting part (1) is provided with an upper connecting part insertion hole (101); The upper surface of the lower connecting part (2) is provided with an electronic component mounting position (201) and a lower connecting part insertion hole (202) that can pass through the lower connecting part (2). The lower connecting part (2) also includes flexible support arms (203) symmetrically arranged on both sides, and the end of the flexible support arm (203) is provided with a support arm insertion hole (204). The upper connecting part (1), the lower connecting part (2) and the elastic flange (3) are integrally formed.

2. The PFC circuit board structure for a sensor according to claim 1, characterized in that, The upper connecting part (1) further includes a flexible grounding arm (102), which is used to contact the inner wall of the sensor housing to achieve grounding.

3. The PFC circuit board structure for a sensor according to claim 2, characterized in that, The flexible grounding arm (102) is provided with a sleeve (103) at its end, which is used to sleeve the lower edge of a connector with external pins.

4. The PFC circuit board structure for a sensor according to claim 3, characterized in that, When the sleeve (103) engages with the pressure port, it can press the end of the flexible grounding arm (102) against the inner wall of the pressure port.

5. A PFC circuit board structure for a sensor according to claim 2, characterized in that, The number of flexible grounding arms (102) is two, and they are symmetrically arranged on both sides of the elastic flange (3).

6. The PFC circuit board structure for a sensor according to claim 2, characterized in that, The flexible grounding arm (102) is located on the symmetrical side of the upper connecting part (1) corresponding to the elastic flange (3).

7. The PFC circuit board structure for a sensor according to claim 1, characterized in that, The upper connecting part socket (101) is used to facilitate the insertion of external pins.

8. The PFC circuit board structure for a sensor according to claim 1, characterized in that, The lower connection hole (202) is used to facilitate the insertion of the pressure-sensing component pin.

9. A PFC circuit board structure for a sensor according to claim 1, characterized in that, The electronic component mounting position (201) is used to mount chip-type electronic components.

10. A PFC circuit board structure for a sensor according to claim 1, characterized in that, The arm socket (204) is used to facilitate the insertion of the temperature sensing component pin below it.

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